JP2002296601A - Method for laminating liquid crystal substrates - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for laminating liquid crystal substrate allowing for liquid crystal substrates with the lower part and the upper part to be matched in position in a reliable and productive manner without much operation. SOLUTION: The lamination method for liquid crystal substrates is as follows: liquid crystal material 4 is dropped in the space surrounded by an annular seal-line 3 on the lower substrate 1 which is laid out inside a vacuum chamber 5. A rough positioning of the lower substrate 1 and upper substrate 2 is conducted by vacuum-chacking the upper substrate 2 in the vacuum chamber 5 to arrange it above facing the lower substrate 1. The inside of the vacuum chamber 5 is evacuated to a predetermined pressure and at least one of the substrates is moved toward the other substrate and pressure is applied. Afterwards the precise positioning of the lower substrate 1 and upper substrate 2 is conducted while making the inside of the chamber 5 the atmospheric pressure Pa, both the substrates 1, and 2 are stuck together.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding a liquid crystal substrate for bonding substrates constituting a liquid crystal panel in a liquid crystal display device.

[0002]

2. Description of the Related Art A liquid crystal panel in a liquid crystal display device is provided between a lower substrate made of a light-transmitting material such as a glass substrate and an upper substrate through an annular seal line made of an ultraviolet curing adhesive or the like. For example, they are arranged facing each other with a predetermined gap of about 5 μm, and a gap surrounded by the seal line is filled with a liquid crystal material.

As a method of bonding the lower substrate and the upper substrate with the liquid crystal material filled in the gap between the lower substrate and the upper substrate, one or more adhesives are applied to the lower substrate by applying an adhesive. An annular seal line is formed, a liquid crystal material is dropped into a space surrounded by the seal line, and then an upper substrate is disposed thereon to perform alignment (alignment) between the upper substrate and the lower substrate. A method of dropping a liquid crystal in which an upper substrate and a lower substrate are overlapped and pressed until the distance between the upper substrate and the lower substrate becomes a predetermined gap, and ultraviolet light is applied to cure the adhesive in the seal line is disclosed in, for example, 33
No. 3157, for example.

With respect to a specific example of such a liquid crystal substrate bonding method, a method disclosed in JP-A-2000-137235 will be described with reference to FIG. First, FIG.
As shown in (a), a sealing material made of an ultraviolet curable adhesive is applied on the upper surface in an annular shape with a thickness of, for example, 30 μm to form an annular sealing line 23, and a liquid crystal material is filled in a space surrounded by the sealing line 23. The lower substrate 21 on which 24 has been dropped is
The upper substrate 22 is placed and fixed on a positioning table 26 in a vacuum chamber 25 via an elastic spacer 27, while the upper substrate 22 is vacuum-sucked by a suction disk 28 and spaced above the lower substrate 21 by, for example, about 0.5 mm. The lower substrate 21 and the upper substrate 22 are aligned by adjusting the position of the positioning table 26 in the horizontal direction in this state.

Next, the inside of the vacuum chamber 25 is evacuated to a vacuum of, for example, 100 to prevent air bubbles from entering the gap.
While maintaining the atmospheric pressure of Pa or less, the pressing means 29
The suction board 28 is moved downward to move the upper substrate 22 to the lower substrate 2.
1 and the gap g between the lower substrate 21 and the upper substrate 22 is 5 μm as shown in FIG.
And the lower substrate 21 and the upper substrate 22 are bonded together. After that, the sealing line 23 is cured by irradiating ultraviolet rays to complete the bonding.

The gap g between the lower substrate 21 and the upper substrate 22, which requires submicron precision, is
The lower substrate 2 is regulated by a bead interposed between the upper substrate 22 and a post spacer protruding from the lower substrate 21 or a fiber filled in the adhesive of the seal line 23.
1, regardless of the flatness of the upper substrate 22, the positioning table 26, and the suction disk 28, the predetermined gap g
The elastic spacer 27 contributes to ensuring the accuracy of the above.

[0007]

The lower substrate 21
The alignment accuracy of the upper substrate 22 and the upper substrate 22 is required to be high accuracy of about 1 μm or less. However, since the alignment is performed with an interval of about 0.5 mm between the two substrates 21 and 22, the two substrates 21 and 22 are pressed. In addition, the relative displacement between the substrates 21 and 22 during the pressing process cannot be avoided, and there is a problem that it is difficult to secure desired alignment accuracy.

Therefore, after both substrates 21 and 22 are pressed,
It is conceivable that the fine positioning of the two substrates 21 and 22 is performed again. However, the upper substrate 22 is suction-fixed by the suction disk 28 having a pressure of about 20 to 30 Pa in an atmosphere of about 100 Pa in the vacuum chamber 25. Therefore, the suction force due to the pressure difference is small, and the suction board 28 and the upper substrate 2
There is a problem that a slip may occur between the two and the upper substrate 22 and the lower substrate 21 may not be aligned.

Further, since the lower substrate 21 is installed and fixed on the positioning table 26 via the elastic spacer 27, even if the position adjustment of about several μm to several tens μm is attempted by the adjustment movement of the positioning table 26, The elastic spacer 27 is absorbed by the deformation due to the elasticity and the elastic after-effect, so that the adjusting operation is repeated many times, so that it takes a long time for the adjusting and there is a problem that the productivity is remarkably reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a method of bonding liquid crystal substrates which can perform alignment of a lower substrate and an upper substrate reliably and with a small number of adjustment operations with high productivity. I have.

[0011]

According to a method of bonding a liquid crystal substrate of the present invention, a liquid crystal material is dropped into a space surrounded by an annular seal line on a lower substrate, and the lower substrate is placed in a vacuum chamber. In a vacuum chamber, the upper substrate is vacuum-adsorbed and placed on the lower substrate so as to face the lower substrate. The lower substrate and the upper substrate are roughly aligned, and the inside of the vacuum chamber is evacuated to a predetermined pressure to at least one of the substrates. And then pressurize, then raise the pressure in the vacuum chamber to finely align the lower and upper substrates, and bond the two substrates together. After removing the air bubbles in the gap between both substrates by pressing the lower substrate, the pressure in the vacuum chamber is increased, so that the differential pressure between the suction pressure of the upper substrate and the atmospheric pressure can be increased, and the suction force can be increased. After pressurizing There is no possibility of slippage in the suction surface of the upper substrate during the alignment, it is possible to align the upper and lower substrates reliably.

Further, a liquid crystal material is dropped into a space surrounded by an annular seal line on the lower substrate, the lower substrate is placed in a vacuum chamber, and the upper substrate is vacuum-adsorbed in the vacuum chamber to remove the upper substrate. The lower substrate and the upper substrate are roughly aligned, the inside of the vacuum chamber is evacuated to a predetermined pressure, and at least one of the substrates is moved toward the other side and pressurized. In the method of laminating the liquid crystal substrates for bonding the two substrates, the elastic alignment and the elastic after-effect of the elastic spacers interposed between at least one of the substrates and the support thereof during the rough alignment. Performs positioning at a position displaced by an amount larger than the sum of the backlash and the mechanical backlash of the position adjustment mechanism, and positions only in one direction toward the specified position during fine positioning. An elastic spacer is interposed between the substrate and its support to ensure the gap accuracy between the lower and upper substrates during pressurization even when the flatness of the substrate and its support surface is low. Since the position adjustment can be performed only in one direction and the backlash of the elastic spacer and the position adjustment mechanism is absorbed by the first position adjustment operation, a small position adjustment operation is performed without backlash. Thus, highly accurate positioning can be completed in a short time, and productivity can be improved.

Note that the one direction does not mean one direction in a straight line, but means a direction having no component in the return direction with respect to the first position adjustment direction.

After the lower substrate and the upper substrate are pressurized, it is preferable to increase the pressure in the vacuum chamber as described above before the fine alignment of the lower substrate and the upper substrate is performed.

Further, a liquid crystal material is dropped into a space surrounded by an annular seal line on the lower substrate, and the lower substrate is placed in a vacuum chamber. The lower substrate and the upper substrate are roughly aligned, the inside of the vacuum chamber is evacuated to a predetermined pressure, and at least one of the substrates is moved toward the other side and pressurized. In the method of laminating the liquid crystal substrates, both substrates are adhered to each other, and during the fine alignment, the backlash due to the elasticity of the elastic spacers interposed between the substrate and its support and the elastic aftereffect is generated. The position adjustment amount is calculated by adding the mechanical backlash of the position adjustment mechanism as a correction term, and the position is adjusted toward the specified position. By eliminating the influence of the shoe, can complete a high precision alignment in a short time with a small position adjustment operation, the productivity can be improved.

In this case, after pressing the lower substrate and the upper substrate,
Before the fine alignment of the lower substrate and the upper substrate is performed, it is preferable to increase the pressure in the vacuum chamber as described above.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the method for bonding liquid crystal substrates according to the present invention will be described below with reference to FIGS.

FIGS. 1 and 2 show a process of manufacturing a liquid crystal substrate in which a space surrounded by a seal line 3 formed in a gap g between a lower substrate 1 and an upper substrate 2 is filled with a liquid crystal material 4. Show. First, as shown in FIG. 1A, an annular seal line 3 is formed by applying a sealing material made of an ultraviolet curable adhesive in an annular shape on the upper surface of the lower substrate 1, and the annular sealing line 3 is formed.
The liquid crystal material 4 is dropped into the space surrounded by the circle, and the lower substrate 1 is placed and fixed on the positioning table 6 in the vacuum chamber 5 via the elastic spacer 7 made of hard rubber or the like. The positioning table 6 positions the lower substrate 1 in the horizontal direction.

The lower substrate 1 and the upper substrate 2 are, for example, 550 mm ×
The lower substrate 1 and the upper substrate 2 each have a size of 670 mm, and one or a plurality of image display areas (hereinafter, referred to as display cells) according to the number of liquid crystal panels to be manufactured on the substrates 1 and 2.
Is formed, and the annular seal line 3 is formed by application so as to surround the periphery of each display cell.

The amount of liquid crystal material 4 to be dropped is precisely controlled so that the filling depth of each liquid crystal cell is equal to a predetermined gap g, for example, 5 μm. The liquid crystal material 4
In a state where is dropped, it has a mountain shape due to its viscosity as shown in FIG. When the lower substrate 1 and the upper substrate 2 are pressurized, the seal line 3 must be applied at an appropriate height so that the liquid crystal material 4 does not unexpectedly run over the lower substrate 1 and the upper substrate 2. 30 with plenty of time
In this embodiment, the height is set as low as possible within a range where the liquid crystal material 4 does not protrude. Specifically, assuming that the filling depth of the liquid crystal material 4 is t and the height of the seal line 3 is T, t <T <4
t, preferably 2t <T <3T. That is, the filling depth of the liquid crystal material 4 is set to 5 μm, and the height of the seal line 3 is set to 5 to 20 μm, preferably 10 to 15 μm, whereby the liquid crystal material 4 is confined in a space surrounded by the seal line 3. The amount of air can be reduced, and air bubbles can be prevented from entering the gap.

Next, the upper substrate 2 is vacuum-sucked by the suction disk 8 and inserted and arranged in the vacuum chamber 5, and the inside of the vacuum chamber 5 is filled with 50 to 400 Pa, preferably 150 P
evacuated to a pressure P ₁ of about a. The suction pressure of the suction disk 8 is a pressure range of 20 to 3 which can be achieved in a short time without particularly improving the flatness of the suction surface of the upper substrate 2 or the suction disk 8.
It is set to 0 Pa. As a result, the upper substrate 2 can be sucked and held in a short time, and a sufficient pressure difference of about 100 Pa is obtained between the pressure of 50 to 400 Pa in the evacuated vacuum chamber 5. It is possible to eliminate the risk of accidental drop and damage.

Next, the upper substrate 2 sucked and held by the suction disk 8 is moved to the upper portion of the lower substrate 1 by, for example, 0.5 to 0.5 mm by a moving pressurizing means 9 for vertically moving the suction disk 8 and applying a pressing force. The upper substrate 1 which is opposed to each other at an interval D of about 1 mm,
And the positioning marks provided on the lower substrate 2 (see 12 and 13 in FIG. 4) are image-recognized, and the positioning table 6 is indicated by an arrow A so that the positioning marks substantially match according to the recognition result. To adjust the coarse position by moving in the horizontal direction.

At the time of the coarse positioning, the position is not adjusted so that both positioning marks are completely coincident with each other.
As will be described later in detail, an amount larger than the sum of the backlash due to the elasticity and elastic aftereffect of the elastic spacer 7 interposed between the lower substrate 1 and the positioning table 6 and the mechanical backlash of the position adjusting mechanism, for example, Positioning is intentionally performed at a position displaced by about 20 to 30 μm.

At four corners of the suction cup 8, height regulating members 10 are arranged. At four corners of the positioning table 6 opposed to the height regulating members 10, vertical actuators 11 are arranged. Then, as shown in FIG. 1B, the suction disk 8 is lowered until each height regulating member 10 comes into contact with the linear actuator 11. Each height regulating member 1
0, the upper substrate 2 is inclined such that one end of the upper substrate 2 contacts the seal line 3 and the other end of the upper substrate 2 is spaced from the lower substrate 1 by a predetermined distance d of, for example, about 500 μm or more. The length dimension is adjusted and set so that the linear actuator 11 abuts in each state.

Next, the inside of the vacuum chamber 5 is evacuated,
The pressure state from P ₁ of 50~400Pa 10~50
Increase the degree of vacuum until the P ₂ of Pa. Further, all the linear actuators 11 are moved down at a predetermined speed V of about 30 to 300 μm / sec, and the lower substrate 1 is moved together with the suction plate 8 while the upper substrate 2 is removed from the above-mentioned inclined posture.
, And then, as shown in FIG.
Subsequently, pressure is applied by a predetermined pressure until the gap between the lower substrate 1 and the upper substrate 2 reaches a predetermined gap g. As a result, the lower substrate 1 and the upper substrate 2 are bonded together while extruding bubbles that may be mixed into the gap g between them from one end to the other end, thereby preventing the mixing of bubbles into the gap. it can.

Next, as shown in FIG. 2, after the inside of the vacuum chamber 5 is released to a pressure higher than P ₁ , for example, the atmosphere and returned to the atmospheric pressure Pa, the positioning table 6 is moved horizontally as indicated by an arrow B. Then, as shown in FIGS. 3 and 4, fine positioning is performed so that the positioning marks 12 on the lower substrate 1 and the positioning marks 13 on the upper substrate 2 completely match. In the illustrated example, the positioning mark 12 has a small square shape,
The positioning mark 13 has a rectangular frame shape.
Are positioned so that the positioning mark 12 is positioned at the center of the position.

At the time of this fine alignment, as shown in FIG. 3A, when the gap g between the lower substrate 1 and the upper substrate 2 is regulated by the beads 14 fixed to the lower substrate 1, Since the frictional force between the beads 14 and the upper substrate 2 is small,
As shown by the arrow a, there is a high possibility that positioning can be performed by relatively moving relatively easily during this time. However, as shown in FIG. 3B, the positioning is performed by the post spacer 15 protruding from the lower substrate 1. In such a case, since the frictional force between the post spacer 15 and the upper substrate 2 is large, there is a high possibility that the relative movement between the upper substrate 2 and the suction plate 8 as shown by the arrow b makes the positioning impossible.

Therefore, in this embodiment, the pressure in the vacuum chamber 5 is increased as described above. Thus, the pressure difference between the suction pressure of the suction plate 8 and the suction pressure of 20 to 30 Pa becomes large, and the upper substrate 2 is fixed to the suction plate 8 by suction with a large force, whereby the relative movement between the lower substrate 1 and the upper substrate 2 after the pressing is performed. Even if the resistance force is large, it is possible to surely perform the alignment without causing a slip between the suction plate 8 and the upper substrate 2.

In the rough positioning prior to the fine positioning, the position is shifted by an amount larger than the sum of the backlash due to the elasticity and elastic aftereffect of the elastic spacer 7 and the mechanical backlash of the position adjusting mechanism as described above. Since the alignment is intentionally performed, there is an adjustment distance C of about 20 to 30 μm between the positioning mark 12 of the lower substrate 1 and the positioning mark 13 of the upper substrate 2 as shown in FIG. .

Here, since the backlash is the same, the mechanical backlash of the position adjusting mechanism is included in the backlash of the elastic spacer 7, and the elastic spacer 7
The fine positioning operation will be described on the assumption that only the backlash exists.

In the first position adjustment operation, the position is adjusted by the adjustment command distance C corresponding to the detection distance between the positioning marks 12 and 13. Then, since the elastic spacer 7 such as a hard rubber has a small elastic coefficient and a very large elastic after-effect compared to a metal or the like, as shown in FIGS. Positioning table 6 is B
Even if the position is adjusted in the direction, it is absorbed by the distance D by the elastic deformation of the elastic spacer 7. It should be noted that the elastic spacer 7 hardly deforms further in the same direction of movement within the time required for the subsequent position adjustment. In this specification, the amount of elastic deformation D of the elastic spacer 7 is called backlash of the elastic spacer 7.

Therefore, when the position is adjusted by the adjustment command distance C in the first position adjustment operation as described above, the lower substrate 1
Is adjusted by (CD) = E. Then, the distance between the two positioning marks 12 and 13 is detected next (the detection distance is substantially equal to D), and the next adjustment command distance F is set within a range not exceeding the detection distance, and the second position is determined. When the adjustment operation is performed, the position can be adjusted with high accuracy because it is not affected by the backlash, and the detection distance between the two positioning marks 12 and 13 is very small and becomes a positive value G in the same direction.
If the value of G is 1 μm or less of the predetermined alignment accuracy, the fine alignment operation is completed by these two operations,
If it is more than that, the fine positioning operation can be almost completed by performing the adjusting operation again. In this manner, by performing position adjustment in only one direction without performing position adjustment in the opposite direction, the position is not affected by backlash after the second position adjustment operation, and high-accuracy position adjustment is performed with a small adjustment operation. be able to.

After the lower substrate 1 and the upper substrate 2 are pressurized and finely aligned as described above, the bonding of the lower substrate 1 and the upper substrate 2 is completed by irradiating ultraviolet rays to cure the seal line 3. .

As described above, according to the present embodiment, the amount of backlash caused by the elasticity and elastic aftereffect of the elastic spacer 7 and the mechanical backlash of the moving mechanism of the positioning table 6 during the coarse positioning are larger than the sum of the backlash. Positioning is performed at the displaced position, and the position is adjusted only in one direction toward the designated position at the time of fine positioning. Therefore, the elastic spacer 7 is interposed between the lower substrate 1 and the positioning table 6. Thus, even if the flatness of the substrates 1 and 2 and the supporting surfaces thereof is low, the gap accuracy between the lower substrate 1 and the upper substrate 2 can be ensured at the time of pressing and the position adjustment is performed only in one direction. After the backlash of the moving mechanism of the positioning table 6 is absorbed by the first position adjustment operation, the position adjustment operation is performed in a short time in a state where there is almost no backlash. Can complete the alignment precision, the productivity can be improved.

In the above embodiment, the position is adjusted to a position displaced by an amount larger than the backlash of the elastic spacer 7 and the position adjusting mechanism at the time of the coarse position adjustment.
Although an example in which the position is adjusted only in one direction toward the designated position at the time of the fine alignment has been described, the rough alignment of the lower substrate 1 and the upper substrate 2 is appropriately performed, and the lower substrate 1 and the upper substrate 2 after pressing are adjusted. An elastic spacer 7 interposed between the lower substrate 1 and its positioning table 6 when the lower substrate 1 and the upper substrate 2 are finely aligned.
The backlash due to the elasticity and the elastic aftereffect and the mechanical backlash of the moving mechanism of the positioning table 6 are measured in advance, and the results are added as a correction term to calculate a position adjustment amount, and the position is adjusted toward the designated position. May be.

Even if the positioning is performed in this manner, the influence of backlash during the adjustment operation is eliminated in the same manner as described above.
High-precision alignment can be completed in a short time with a small number of position adjustment operations, and productivity can be improved.

In the above embodiment, the upper substrate 2 is moved and pressurized with respect to the lower substrate 1. However, if the lower substrate 1 is moved and pressurized with respect to the upper substrate 2, It goes without saying that both may be moved and pressurized. Although the example in which the elastic spacer 7 is interposed between the lower substrate 1 and the positioning table 6 is shown, even if the elastic spacer is interposed between the upper substrate 2 and the suction plate 8, the elastic spacer is interposed in both. May be worn. Also, when positioning, the positioning table 6
Although the lower substrate 1 is moved and adjusted in the above, the suction plate 8 may be moved and adjusted.

[0038]

According to the liquid crystal substrate bonding method of the present invention, after the upper substrate and the lower substrate are pressurized in the evacuated vacuum chamber to eliminate bubbles in the gap between the two substrates,
Since the pressure in the vacuum chamber is increased, the suction force can be increased by increasing the differential pressure between the suction pressure of the upper substrate and the ambient pressure, and there is no danger of slipping on the suction surface of the upper substrate during fine positioning after pressing. Thus, the alignment between the upper substrate and the lower substrate can be reliably performed.

Also, at the time of rough positioning, the backlash due to the elasticity and elastic aftereffect of the elastic spacer interposed between at least one substrate and its support and the mechanical backlash of the position adjusting mechanism are larger than the sum. The position is adjusted to the position displaced by the amount, and the position is adjusted in only one direction toward the specified position at the time of fine alignment, so the elastic spacer interposed between the substrate and its support supports the substrate and its support Even if the flatness of the surface is low, the gap accuracy between the lower substrate and the upper substrate can be secured during pressurization, and the backlash of the elastic spacer and the position adjustment mechanism is absorbed by the first position adjustment operation. In a state where there is no positioning operation, high-precision positioning can be completed in a short time with a small number of position adjustment operations, and productivity can be improved.

Further, at the time of fine positioning, the backlash due to the elasticity and elastic aftereffect of the elastic spacer interposed between the substrate and its support and the mechanical backlash of the position adjusting mechanism are added as correction terms to obtain the position. By calculating the amount of adjustment and adjusting the position toward the specified position, the effects of backlash during the adjustment operation are eliminated in the same way as described above, and highly accurate alignment is completed in a short time with a small amount of position adjustment operation And productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a liquid crystal substrate bonding step in one embodiment of the present invention.

FIG. 2 is a sectional view showing a fine positioning operation step after pressing in the embodiment.

FIG. 3 is a cross-sectional view illustrating an example of behavior in a gap setting spacer different from the fine positioning operation.

FIG. 4 is an explanatory diagram of a positioning operation in the embodiment.

FIG. 5 is an explanatory diagram of a behavior characteristic of the elastic spacer at the time of an alignment operation in the embodiment.

FIG. 6 is a sectional view showing a conventional liquid crystal substrate bonding step.

[Explanation of symbols]

 Reference Signs List 1 lower substrate 2 upper substrate 3 seal line 4 liquid crystal material 5 vacuum chamber 6 positioning table 7 elastic spacer 8 suction disk

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takanori Funabashi 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Norihiko Egami 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 2H089 LA41 NA22 NA38 NA49 NA60 QA12 QA14

Claims (4)

[Claims] 1. A liquid crystal material is dropped into a space surrounded by an annular seal line on a lower substrate, the lower substrate is placed in a vacuum chamber, and the upper substrate is vacuum-adsorbed in the vacuum chamber to form a liquid crystal material on the lower substrate. The lower substrate and the upper substrate are roughly aligned, and the inside of the vacuum chamber is evacuated to a predetermined pressure, and at least one of the substrates is moved toward the other side and pressurized. A liquid crystal substrate bonding method, wherein the lower substrate and the upper substrate are finely aligned with each other, and the two substrates are bonded together. 2. A liquid crystal material is dropped into a space surrounded by an annular seal line on the lower substrate, and the lower substrate is placed in a vacuum chamber, and the upper substrate is vacuum-adsorbed in the vacuum chamber and The lower substrate and the upper substrate are roughly aligned, the inside of the vacuum chamber is evacuated to a predetermined pressure, and at least one of the substrates is moved toward the other side and pressurized. In the method of laminating the liquid crystal substrates, in which the two substrates are bonded together, in the rough positioning, the elasticity and elastic aftereffect of the elastic spacers interposed between at least one of the substrates and the support thereof Performs position adjustment to a position displaced by an amount greater than the sum of the backlash and the mechanical backlash of the position adjustment mechanism, and adjusts the position only in one direction toward the specified position during fine alignment. A method for bonding a liquid crystal substrate. 3. A liquid crystal material is dropped into a space surrounded by an annular seal line on the lower substrate, the lower substrate is placed in a vacuum chamber, and the upper substrate is vacuum-adsorbed in the vacuum chamber to form a liquid crystal material on the lower substrate. The lower substrate and the upper substrate are roughly aligned, the inside of the vacuum chamber is evacuated to a predetermined pressure, and at least one of the substrates is moved toward the other side and pressurized. In the method of bonding a liquid crystal substrate for bonding the two substrates together, the fine alignment is performed by the elasticity and elastic after-effect of an elastic spacer interposed between at least one of the substrates and its support. A method of attaching a liquid crystal substrate, wherein a backlash and a mechanical backlash of a position adjustment mechanism are added as correction terms to calculate a position adjustment amount, and the position is adjusted toward a specified position. Law. 4. The method according to claim 2, wherein after the lower substrate and the upper substrate are pressurized, the pressure in the vacuum chamber is increased before fine alignment of the lower substrate and the upper substrate is performed. A method for bonding liquid crystal substrates.