CN112198682A

CN112198682A - Liquid crystal panel attaching device

Info

Publication number: CN112198682A
Application number: CN202010624565.2A
Authority: CN
Inventors: 松本昌之
Original assignee: Sharp Corp
Current assignee: Sharp Corp
Priority date: 2019-07-08
Filing date: 2020-07-01
Publication date: 2021-01-08
Anticipated expiration: 2040-07-01
Also published as: CN112198682B

Abstract

Volatilization of volatile components in the liquid crystal is suppressed when the substrates are bonded. A bonding device (10) for bonding a liquid crystal panel of a second substrate (22) to a first substrate (21) on which a liquid crystal (24) is dripped inside a sealing material (23), comprising: a vacuum chamber (11); a pair of bonding tables (14, 15) which are used for bonding the first substrate (21) and the second substrate (22) in a vacuum chamber (11) by moving the first substrate (21) and the second substrate (22) in a mutually opposite mode in a direction of relatively approaching through the holding surfaces (14A, 15A) under a holding state; and a surrounding wall (16) which surrounds the surfaces of the outer surfaces of the bonding tables (14, 15) except for the holding surfaces (14A, 15A) in the vacuum chamber (11), wherein the surrounding wall (16) is composed of a pair of divided bodies (17, 18), and is provided with an opening (19) for communicating the inside and the outside of the surrounding wall (16).

Description

Liquid crystal panel attaching device

Technical Field

The present invention relates to a bonding apparatus for a liquid crystal panel.

Background

As a method for manufacturing a liquid crystal panel, a vacuum injection process and a liquid crystal dropping process (ODF process) are generally known. The liquid crystal dropping process comprises the following steps: for example, an ultraviolet-curable sealing material is applied to one of a pair of substrates in a frame shape, liquid crystal is dropped inside the frame, the frame is bonded to the other substrate in vacuum, and after atmospheric pressure pressing, the frame is irradiated with ultraviolet rays to cure the sealing material. This liquid crystal dropping process is excellent in productivity as compared with the vacuum injection process.

Documents of the prior art

Patent document

Patent document 1: japanese patent application laid-open No. 2005-62501 patent document 2: japanese patent application laid-open No. 2011-

Disclosure of Invention

Technical problem to be solved by the invention

However, the liquid crystal dropping method has the following problems: when the vacuum chamber is evacuated during the attachment of the panel, volatile components in the liquid crystal which hardly change under atmospheric pressure volatilize. It is considered that the volatilization of volatile components in such liquid crystals is accelerated by a particularly rapid pressure change. In addition, it is known that volatilization of volatile components in liquid crystals is particularly significant in the vicinity of the outer periphery of the substrate.

In order to suppress the volatilization of volatile components in such a liquid crystal, the following technique is proposed (patent document 2): liquid crystal is further dropped on the outside of the sealing material surrounding the liquid crystal, and the volatile component of the liquid crystal on the outside is volatilized in advance. However, in such a configuration, since the cost tends to increase due to excessive dropping of the liquid crystal, further improvement is desired.

The present invention has been made in view of the above circumstances, and an object thereof is to suppress volatilization of volatile components in a liquid crystal during vacuum bonding of substrates.

Means for solving the problems

(1) A liquid crystal panel bonding apparatus according to an embodiment of the present invention is a liquid crystal panel bonding apparatus that bonds a second substrate to a first substrate on which liquid crystal is dropped inside a seal material that is applied in an annular shape, so as to sandwich the dropped liquid crystal, the liquid crystal panel bonding apparatus including: a vacuum chamber which can form a vacuum environment; a pair of bonding tables each having a pair of holding surfaces for holding the first substrate and the second substrate, the pair of holding surfaces moving in a direction of relatively approaching each other in a held state so that the first substrate and the second substrate face each other in the vacuum chamber, and the first substrate and the second substrate being bonded to each other through the sealing material; and an enclosure wall that encloses, within the vacuum chamber, the surface of the pair of bonding tables other than the holding surface, the enclosure wall being formed of a pair of divided bodies and having an opening portion that communicates the inside and the outside of the enclosure wall.

(2) In the liquid crystal panel bonding apparatus according to an embodiment of the present invention, in addition to the configuration of (1), the opening is formed by arranging the pair of divided bodies to face each other.

(3) In the liquid crystal panel bonding apparatus according to one embodiment of the present invention, in addition to the configuration (1) or (2), the surrounding wall is formed of the pair of divided bodies divided in the bonding direction of the first substrate and the second substrate.

(4) In the liquid crystal panel bonding apparatus according to an embodiment of the present invention, in addition to the configuration of (3), the opening is a slit provided along an extending direction of the first substrate and the second substrate.

(5) In the liquid crystal panel bonding apparatus according to one embodiment of the present invention, in addition to the configuration (1) or (2), the surrounding wall is formed of the pair of divided bodies, and the divided bodies are divided in a direction intersecting a bonding direction of the first substrate and the second substrate.

(6) In the liquid crystal panel bonding apparatus according to an embodiment of the present invention, in addition to the configuration of (5), the opening is a slit provided in a direction intersecting with and along the extending direction of the first substrate and the second substrate.

Advantageous effects

According to the present invention, volatilization of volatile components in the liquid crystal can be suppressed when the substrates are bonded.

Drawings

Fig. 1 is a schematic cross-sectional view in the vertical direction of a bonding apparatus of example 1.

Fig. 2 is a schematic cross-sectional view of the bonding apparatus of example 1 in the horizontal direction.

Fig. 3 is a schematic cross-sectional view in the vertical direction of a bonding apparatus according to a modification of example 1.

Fig. 4 is a schematic cross-sectional view in the vertical direction of a bonding apparatus according to a modification of example 1.

Fig. 5 is a schematic cross-sectional view in the vertical direction of the bonding apparatus of example 1.

Fig. 6 is a schematic cross-sectional view of the bonding apparatus of example 2 in the horizontal direction.

Fig. 7 is a schematic cross-sectional view in the vertical direction of a bonding apparatus according to a modification of example 2.

Fig. 8 is a schematic cross-sectional view in the horizontal direction of a bonding apparatus according to a modification of example 2.

Fig. 9 is a schematic cross-sectional view in the vertical direction of a bonding apparatus according to a modification of example 2.

Fig. 10 is a schematic cross-sectional view in the horizontal direction of a bonding apparatus according to a modification of example 2.

Detailed Description

(example 1)

A bonding apparatus 10 according to example 1 will be described with reference to fig. 1 and 2. In the vertical direction, fig. 1 is used as a standard, and reference numerals are given to one member and omitted for the other members in the plural members that are the same.

First, a method of manufacturing the liquid crystal panel will be briefly described. In manufacturing a liquid crystal panel, first, a sealing material 23 containing an ultraviolet curing component is annularly coated so as to surround the CF layer of the first substrate 21 of the pair of

substrates

21,22 on which the CF layer is formed (sealing material coating step). As the ultraviolet curing component, a known photocurable resin can be used, and examples thereof include a (meth) acrylate-based photocurable resin, an imide-based photocurable resin, and a silicone-based photocurable resin.

Next, the liquid crystal 24 is dropped into the annular region surrounded by the sealing material 23 (liquid crystal dropping step). The dropped liquid crystal 24 is arranged in a matrix on the first substrate 21 in a substantially spherical state (see fig. 2).

Next, the first substrate 21 and the second substrate 22 having the TFT layer formed thereon are carried into the vacuum chamber 11, the first substrate 21 is sucked and held on the holding surface 14A of the first bonding stage 14 of the bonding apparatus 10 described later, and the second substrate 22 is sucked and held on the holding surface 15A of the second bonding stage 15 of the same bonding apparatus 10, and alignment is performed so that the CF layer and the TFT layer are in a relative positional relationship. Then, the vacuum chamber 11 is evacuated to a vacuum state, the first bonding stage 14 and the second bonding stage 15 are moved in a relatively close direction, and the first substrate 21 and the second substrate 22 are bonded together via the sealing material 23 in a vacuum environment (vacuum bonding step). The liquid crystal 24 in this state is sandwiched between the pair of

substrates

21 and 22, and spreads from the position of dropping toward the peripheral region inside the annular sealing material 23. Further, vacuum is meant to include reduced pressure air that is close to vacuum.

Next, the vacuum atmosphere in the vacuum chamber 11 is opened, and the

substrates

21 and 22 in the bonded state are pressed at atmospheric pressure (atmospheric pressure pressing step). By performing the pressing at the atmospheric pressure, the

entire substrates

21 and 22 can be pressed at a uniform pressure (atmospheric pressure). At this time, a fixed distance is maintained between the pair of

substrates

21 and 22 by a photo spacer, not shown, provided on the first substrate 21. Thereby, the liquid crystal 24 fills the entire inner region of the annular sealing material 23.

Then, in this state, the ultraviolet irradiation device irradiates ultraviolet rays to the sealing material 23 to cure the sealing material 23 (sealing material curing step). This completes the bonded substrate (liquid crystal panel in this embodiment) in which the

substrates

21 and 22 are fixed at a predetermined distance from each other with the sealant 23 interposed therebetween and liquid crystal is filled. When the bonded substrate is a mother substrate including a plurality of liquid crystal panels, the bonded substrate is cut into a predetermined size.

However, in the vacuum chamber 11 of the bonding apparatus 10, there is a problem that, when evacuation is performed before bonding, the liquid crystal 24 coated on the first substrate 21 is exposed to a vacuum environment, and a part of volatile components in the liquid crystal 24 volatilize. It is known that the volatilization of volatile components in the liquid crystal 24 is accelerated in the case where the speed of forming the vacuum is high and the pressure is drastically changed.

In order to solve such a problem, in the present embodiment, a surrounding wall 16 surrounding the

substrates

21,22 is provided in the vacuum chamber 11 of the bonding apparatus 10. The bonding apparatus 10 will be described in detail below.

The bonding apparatus 10 of the present embodiment includes: a vacuum chamber 11; a pair of bonding tables 14,15 for bonding a pair of

substrates

21,22 in the vacuum chamber 11; and a surrounding wall 16 surrounding the pair of bonding tables 14 and 15 in the vacuum chamber 11.

The vacuum chamber 11 is formed in a box shape that can form a closed space that forms a vacuum environment, and includes an exhaust port 13 that is connected to the vacuum pump 12 for exhausting air from the inside to form a vacuum therein, and an air supply port that supplies air to the inside to return the inside to atmospheric pressure. The exhaust port 13 and the air supply port are both provided at the center in the height direction of one side surface (the right side surface in fig. 1) of the box-shaped vacuum chamber 11. The vacuum includes a state close to vacuum.

The pair of bonding tables 14 and 15 are provided in the vacuum chamber 11, and include a first bonding table 14 disposed on a lower side in the vacuum chamber 11 and a second bonding table 15 disposed above the first bonding table 14. The first bonding stage 14 has a holding surface 14A extending in the horizontal direction, and the first substrate 21 coated with the sealant 23 and the liquid crystal 24 is sucked and held on the holding surface 14A. The second bonding stage 15 has a holding surface 15A, the holding surface 15A is disposed so as to face the holding surface 14A of the first bonding stage 14, and the second substrate 22 is sucked and held on the holding surface 15A so as to face the first substrate 21. The second bonding stage 15 is configured to be movable up and down by the stage lifting and lowering device and to be movable in a direction to approach the fixed first bonding stage 14, thereby bonding the first substrate 21 and the second substrate 22 via the sealing material 23.

Further, in the bonding apparatus 10 of the present embodiment, a surrounding wall 16 formed in a box shape is provided, and the surrounding wall 16 surrounds the outer surfaces of the first bonding stage 14 and the second bonding stage 15 except for the holding

surfaces

14A and 15A in the vacuum chamber 11. Specifically, the surrounding wall 16 is configured by a rectangular box-shaped first divided body 17 having an open upper surface and a rectangular box-shaped second divided body 18 having an open lower surface being disposed to face each other in a direction in which the divided

body side openings

17A,18A are butted against each other. That is, in the present embodiment, the split

body side openings

17A and 18A of the pair of

split bodies

17 and 18 are provided together in the direction extending in the horizontal direction, and the surrounding wall 16 is constituted by the pair of

split bodies

17 and 18, and the pair of

split bodies

17 and 18 are split in the bonding direction of the first substrate 21 and the second substrate 22.

In the present embodiment, the first and second divided

bodies

17 and 18 are box-shaped and have the same shape and the same size. The second divided body 18 is displaceable by the divided body moving means in a state of being close to and away from the first divided body 17, so that the

substrates

21,22 can be set on or taken out from the holding surfaces 14A, 15A of the first bonding stage 14 and the second bonding stage 15 in a state of being away from each other. On the other hand, when the pair of divided

bodies

17 and 18 are close to each other, the respective divided body side openings 17A and 17B are not completely abutted to each other, but are separated from each other by a predetermined distance. That is, in a state where the first divided body 17 and the second divided body 18 are closest to each other, a slit (an example of an opening) 19 (see fig. 1) extending in the horizontal direction is formed between the divided

bodies

17 and 18. The width of the slit 19 is set to about 0.1mm to 5.0mm and is provided over the entire circumference of the surrounding wall 16. In addition, at least a part of the slit 19 is formed with a height facing at least a part of the exhaust port 13. The first divided body 17 is fixed in the vacuum chamber 11 together with the first bonding stage 14.

The second separating body 18 is configured to avoid a mounting table lifting device for lifting the second bonding mounting table 15, and thus is a member that does not hinder the lifting operation of the second bonding mounting table 15. That is, the second bonding stage 15 and the second divided body 18 are provided to be movable independently. Further, the second segment 18 and the table lifting device are kept in a sealed state.

The above is the bonding apparatus 10 of the present embodiment, and the operation and effects will be described below. The liquid crystal panel bonding apparatus 10 of the present embodiment is a bonding apparatus 10 for bonding a second substrate 22 to a first substrate 21 on which a liquid crystal 24 is dropped inside a seal material 23 that is applied annularly, so as to sandwich the dropped liquid crystal 24, and the liquid crystal panel bonding apparatus 10 includes: a vacuum chamber 11 which can form a vacuum environment; a first bonding stage 14 and a second bonding stage 15 each having a pair of holding

surfaces

14A and 15A for holding a first substrate 21 and a second substrate 22, respectively, and moving the first substrate 21 and the second substrate 22 in a vacuum chamber 11 in a direction of approaching each other through the pair of holding

surfaces

14A and 15A so as to face each other, in a state of being held by suction, and bonding the first substrate 21 and the second substrate 22 via a sealing material 23; and a surrounding wall 16 surrounding the outer surfaces of the first bonding stage 14 and the second bonding stage 15 except for the holding

surfaces

14A and 15A in the vacuum chamber 11, the surrounding wall 16 being composed of a first divided body 17 and a second divided body 18, and having a slit 19 communicating the inside and the outside of the surrounding wall 16.

According to bonding apparatus 10 of the present embodiment, inside vacuum chamber 11, surrounding wall 16 is set in a state in which the change in air pressure is gradual as compared with the surrounding of surrounding wall 16. Specifically, although the vacuum degree is increased by exhausting the air around the surrounding wall 16 at a predetermined speed by the vacuum pump 12 connected to the vacuum chamber 11, the air does not escape from the inside of the surrounding wall 16 at the same speed as the surrounding wall 16, and the air leaks little by little from the slit 19 to the surrounding wall 16, so that the increase in the vacuum degree is more gradual than the surrounding wall 16. That is, since the periphery of the liquid crystal 24 on the first substrate 21 disposed inside the surrounding wall 16 is in a state in which the change in the atmospheric pressure is relaxed as compared with the periphery of the surrounding wall 16, the speed of volatilization of the volatile component from the liquid crystal 24 can be suppressed from increasing, and deterioration of the liquid crystal 24 can be suppressed as compared with the case where the surrounding wall 16 is not provided.

The surrounding wall 16 is constituted by a first divided body 17 and a second divided body 18, the first divided body 17 and the second divided body 18 are divided in a direction (vertical direction) in which the first substrate 21 and the second substrate 22 are bonded, and slits 19 extending along the extending direction of the

substrates

21,22 are formed by disposing the respective divided

body side openings

17A,18A of the first divided body 17 and the second divided body 18 so as to face each other.

According to this configuration, since it is not necessary to form an opening such as the slit 19 in any one of the

split members

17,18 in advance, the

split members

17,18 can be formed in a simple configuration. Further, the width of the slit 19 can be adjusted in accordance with the kind of the liquid crystal 24 to be used, and the pressure change in the surrounding wall 16 can be controlled.

[ modification of embodiment 1 ]

In the above embodiment 1, the first and second divided

bodies

17 and 18 are formed as the same-shaped and same-sized cases, and the slits 19 extending along the plate surfaces of the

substrates

21 and 22 are formed, but the positions of the slits 19 are not limited to the above embodiment, and can be changed as appropriate. For example, as shown in fig. 3, the bonding apparatus 110 may be configured as follows: by making the first divided body 117 into a box shape shallower than the depth of example 1 and making the second divided body 118 into a box shape deeper than the depth of example 1, the two box-shaped first divided bodies 117 and second divided bodies 118 different in height to the divided

body side openings

117A, 118A constitute the surrounding wall 116, and the slit 119 is formed at a position lower than the exhaust port 13.

On the contrary, as shown in fig. 4, the bonding apparatus 210 may be configured as follows: by making the first divided body 217A box-like shape deeper than the depth of example 1 and making the second divided body 218A box-like shape shallower than the depth of example 1, the two box-like first divided bodies 217 and second divided bodies 218 having different heights up to the divided body side openings 217A, 218A constitute the surrounding wall 216, and the slit 219 is located higher than the exhaust port 13 and above the holding surface 15A of the second bonding stage 15.

(example 2)

Next, embodiment 2 of the present invention will be described with reference to fig. 5 and 6. In the following, only the configurations different from embodiment 1 will be described, and the same configurations as those of embodiment 1 will be denoted by the same reference numerals, and redundant description thereof will be omitted.

The bonding apparatus 310 of the present embodiment is different from that of embodiment 1 in the dividing direction of the surrounding wall 316. Specifically, the surrounding wall 316 of the present embodiment is configured as follows: a rectangular box-shaped first divided body 317 whose one side surface is open and a rectangular box-shaped second divided body 318 whose same side surface is open are disposed so as to face each other in a direction in which the divided

body side openings

317A, 318A are butted to each other. That is, the split

body side openings

317A, 318A of the pair of split bodies 317,318 are arranged in a direction extending in the vertical direction. In other words, is disposed in a direction intersecting the pair of

substrates

21, 22. Hereinafter, of the pair of divided

bodies

317 and 318, the divided body disposed on the side closer to the exhaust port 13 of the vacuum chamber 11 (the divided body on the right side in fig. 5) is referred to as a first divided body 317, and the divided body disposed on the side farther from the exhaust port 13 of the vacuum chamber 11 (the divided body on the left side in fig. 5) is referred to as a second divided body 318.

In the present embodiment, the first and second divided

bodies

317 and 318 are box-shaped and have the same shape and the same size. These divided bodies 317,318 are displaceable by the divided body moving means in a state of being brought close to and separated from each other, so that the

substrates

21,22 can be set on and taken out from the holding surfaces 14A, 15A of the first bonding stage 14 and the second bonding stage 15 in a state of being separated from each other. On the other hand, when the pair of divided

bodies

317 and 318 are close to each other, the

openings

317A and 318A are not completely abutted to each other, but are separated from each other by a predetermined distance. That is, in a state where the first divided body 317 and the second divided body 318 are closest to each other, a slit 319 is formed between the divided bodies 317,318 (see fig. 5 and 6). The slit 319 extends in a direction intersecting the

substrates

21,22 and in a direction along the

substrates

21,22, and is provided over the entire circumference of the surrounding wall 316.

The surrounding wall 316 (the pair of divided bodies 317 and 318) is configured to avoid a stage lifting device for lifting the second bonding stage 15, and thus is a member that does not hinder the lifting of the second bonding stage 15. Further, a sealed state is maintained between the surrounding wall 316 and the table lifting device.

According to the bonding apparatus 310 of the present embodiment, similarly to the above-described embodiment 1, since the inside of the surrounding wall 316 is set to a state in which the change in the atmospheric pressure is relaxed in comparison with the surrounding wall 316 in the vacuum chamber 11, the speed of volatilization of the volatile component from the liquid crystal 24 can be suppressed from being accelerated, and the deterioration of the liquid crystal 24 can be suppressed in comparison with the case where the surrounding wall 316 is not provided.

The surrounding wall 316 is composed of a first divided body 317 and a second divided body 318, the first divided body 317 and the second divided body 318 are divided in a direction intersecting with a direction (vertical direction) in which the first substrate 21 and the second substrate 22 are bonded, and slits 319 are formed in a direction intersecting with an extending direction of the

substrates

21,22 and along the extending direction of the

substrates

21, 22.

According to this configuration, since it is not necessary to form an opening such as a slit in any of the split members 317,318 in advance, the split members 317,318 can be formed in a simple configuration. The width of the slit 319 can be adjusted according to the type of the liquid crystal 24 to be used.

[ modification of embodiment 2 ]

In the above embodiment 2, the first and second divided

bodies

317 and 318 are formed as the same-shaped and same-sized cases, and the slits 319 are formed, and the slits 319 extend in the direction intersecting the plate surfaces of the

substrates

21 and 22 and in the plate surface direction of the

substrates

21 and 22, but the position of the slit 319 is not limited to the above embodiment. For example, as shown in fig. 7 and 8, the bonding apparatus 410 may be configured as follows: by making the first divided body 417A box shape deeper than the depth of example 2 and making the second divided body 418A box shape shallower than the depth of example 2, the two box-shaped first divided bodies 417 and second divided bodies 418 having different heights up to the

openings

417A, 418A constitute the surrounding wall 416, and the slit 419 is formed at a position farther from the exhaust port 13 than in example 2.

As shown in fig. 9 and 10, the bonding apparatus 510 may be configured as follows: the first and

second segments

517 and 518 are each a point-symmetric triangular column shape having one open side extending in the height direction, and the slit 519 is not disposed at a position facing the side face of the surrounding wall 516.

(other embodiments)

The present invention is not limited to the embodiments described above and illustrated in the drawings, and for example, the following embodiments are also included in the technical scope of the present invention.

(1) In the above embodiment, the first and second segments have the respective segment-side openings spaced apart by a predetermined distance and the slits are formed therebetween, but at least one of the first and second segments may have an opening edge portion with an uneven shape, and the first and second segments may partially abut against each other and be partially opened. In this case, a plurality of holes are formed in the surrounding wall instead of the slits.

(2) In the above embodiment, the pair of divided bodies are formed in a box shape, and the slit-shaped opening is formed by relatively moving the pair of divided bodies, but the configuration of the pair of divided bodies is not limited to the above embodiment. For example, the following configuration is also possible: the side surface of the divided body is formed into a corrugated shape capable of changing the length of the side surface, and only the length of the side surface is changed while the whole divided body is kept fixed.

(3) In example 2, the outer periphery of the substrate may be a split body configured to be rotatable in the circumferential direction.

(4) Although the second bonding stage and the second divided body are configured to be movable independently in embodiment 1, the second bonding stage and the second divided body may be integrally formed and may be configured to be moved simultaneously by one moving device.

(5) Further, the first bonding stage and the first divided body may be movable.

(6) In the above embodiment, the first and second split bodies are arranged to face each other to form an opening such as a slit, but the opening may be provided in at least one split body.

Description of the reference numerals

10, 110, 210, 310, 410, 510: laminating device

11: vacuum chamber

13: exhaust port

14: first bonding stage

15: second bonding stage

14A, 15A: retaining surface

16, 116, 216, 316, 416, 516: enclosing wall

17, 117, 217, 317, 417, 517: first division body

18, 118, 218, 318, 418, 518: second divided body

17A，18A

117A, 118A, 217A, 218A, 317A, 318A, 417A, 418A, 517A, 518A: side opening part of split body

19, 119, 219, 319, 419, 519: narrow slit (opening part)

21: first substrate

22: second substrate

23: sealing material

24: liquid crystal display device

Claims

1. A bonding apparatus for a liquid crystal panel, which bonds a second substrate to a first substrate on which liquid crystal is dripped inside a sealing material that is annularly coated, so as to sandwich the dripped liquid crystal, the bonding apparatus for a liquid crystal panel comprising:

a vacuum chamber which can form a vacuum environment;

a pair of bonding tables each having a pair of holding surfaces for holding the first substrate and the second substrate, the pair of holding surfaces moving in a direction of relatively approaching each other in a held state so that the first substrate and the second substrate face each other in the vacuum chamber, and the first substrate and the second substrate being bonded to each other through the sealing material;

a surrounding wall surrounding, in the vacuum chamber, a surface of the pair of bonding tables other than the holding surface,

the surrounding wall is formed of a pair of divided bodies and has an opening portion that communicates the inside and outside of the surrounding wall.

2. A bonding apparatus for a liquid crystal panel according to claim 1, wherein the opening is formed by arranging the pair of divided bodies to face each other.

3. The bonding apparatus for liquid crystal panels according to claim 1 or 2, wherein the surrounding wall is formed by the pair of divided bodies divided in the bonding direction of the first substrate and the second substrate.

4. The bonding apparatus for liquid crystal panels according to claim 3, wherein the opening is a slit provided along a direction in which the first substrate and the second substrate extend.

5. The bonding apparatus for liquid crystal panels according to claim 1 or 2, wherein the surrounding wall is formed by the pair of divided bodies, and the divided bodies are divided in a direction intersecting a bonding direction of the first substrate and the second substrate.

6. The bonding apparatus for liquid crystal panels according to claim 5, wherein the opening is a slit provided in a direction intersecting with and along the extending direction of the first substrate and the second substrate.