CN112198682B - Attaching device of liquid crystal panel - Google Patents
Attaching device of liquid crystal panel Download PDFInfo
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- CN112198682B CN112198682B CN202010624565.2A CN202010624565A CN112198682B CN 112198682 B CN112198682 B CN 112198682B CN 202010624565 A CN202010624565 A CN 202010624565A CN 112198682 B CN112198682 B CN 112198682B
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The volatilization of volatile components in liquid crystal is suppressed when substrates are bonded. A liquid crystal panel bonding device (10) for bonding a second substrate (22) to a first substrate (21) having liquid crystal (24) dropped on the inner side of a sealing material (23) is provided with: a vacuum chamber (11); a pair of bonding tables (14, 15) for bonding the first substrate (21) and the second substrate (22) by moving the holding surfaces (14A, 15A) in a relatively approaching direction in a holding state in a vacuum chamber (11) so that the first substrate (21) and the second substrate (22) face each other; and a surrounding wall (16) which surrounds the outer surfaces of the attaching tables (14, 15) except the holding surfaces (14A, 15A) in the vacuum chamber (11), wherein the surrounding wall (16) is composed of a pair of divided bodies (17, 18) and is provided with an opening (19) for communicating the inside and the outside of the surrounding wall (16).
Description
Technical Field
The present invention relates to a bonding device for a liquid crystal panel.
Background
As a method for manufacturing a liquid crystal panel, a vacuum injection process and a liquid crystal dropping process (ODF process) have been generally known. The liquid crystal dripping process comprises the following steps: for example, an ultraviolet-curable sealing material is applied in a frame shape to one of a pair of substrates, liquid crystal is dropped on the inside thereof, the sealing material is bonded to the other substrate in vacuum, and after the other substrate is subjected to atmospheric pressure press, ultraviolet rays are irradiated to cure the sealing material. This liquid crystal dropping process is excellent in productivity as compared with the vacuum injection process.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2005-62501 patent document 2: japanese patent application laid-open No. 2011-203285
Disclosure of Invention
The invention aims to solve the technical problems
However, the liquid crystal dropping method has the following problems: when the vacuum is drawn in the vacuum chamber during the panel bonding, the volatile components in the liquid crystal hardly change under the atmospheric pressure volatilize. It is considered that volatilization of volatile components in such liquid crystal is accelerated by particularly abrupt pressure changes. In addition, it is known that volatilization of volatile components in liquid crystals is particularly remarkable in the vicinity of the outer periphery of the substrate.
In order to suppress volatilization of volatile components in such liquid crystals, the following technique has been proposed (patent document 2): further, liquid crystal is dropped on the outer side of the sealing material surrounding the liquid crystal, and the volatile components of the liquid crystal on the outer side are volatilized in advance. However, in such a configuration, since the cost tends to be increased due to excessive dropping of the liquid crystal, further improvement is desired.
The present invention has been made in view of the above circumstances, and an object of the present invention is to suppress volatilization of volatile components in liquid crystal at the time of vacuum bonding of substrates.
Solution to the problem
(1) In one embodiment of the present invention, a bonding apparatus for a liquid crystal panel, which bonds a second substrate to a first substrate, to which liquid crystal is dropped, on an inner side of a sealing material that is annularly coated, so as to sandwich the dropped liquid crystal, the bonding apparatus comprising: a vacuum chamber that can form a vacuum environment; a pair of bonding tables each having a pair of holding surfaces for holding the first substrate and the second substrate, the pair of holding surfaces being configured to move the first substrate and the second substrate in a direction toward each other in a state of being opposed to each other in the vacuum chamber, the first substrate and the second substrate being bonded to each other via the sealing material; and a surrounding wall that surrounds the outer surfaces of the pair of bonding tables except the holding surface in the vacuum chamber, wherein the surrounding wall is composed of a pair of divided bodies and has an opening communicating the inside and the outside of the surrounding wall.
(2) In the bonding device for a liquid crystal panel according to the embodiment of the present invention, in addition to the configuration of (1), the opening is formed by the pair of split bodies being arranged to face each other.
(3) In the bonding device for a liquid crystal panel according to the embodiment of the present invention, in addition to the configuration of (1) or (2), the surrounding wall is formed of the pair of divided bodies, and the pair of divided bodies are divided in the bonding direction of the first substrate and the second substrate.
(4) In the bonding device for a liquid crystal panel according to an embodiment of the present invention, in addition to the configuration of (3), the opening is a slit provided along the extending direction of the first substrate and the second substrate.
(5) In the bonding device for a liquid crystal panel according to one embodiment of the present invention, in addition to the configuration of (1) or (2), the surrounding wall is formed of the pair of divided bodies, and the divided bodies are divided in a direction intersecting with a bonding direction of the first substrate and the second substrate.
(6) In the bonding device for a liquid crystal panel according to an embodiment of the present invention, in addition to the configuration of (5), the opening is a slit provided in a direction intersecting with and along the extending direction of the first substrate and the second substrate.
Advantageous effects
According to the present invention, volatilization of volatile components in liquid crystal at the time of substrate bonding can be suppressed.
Drawings
Fig. 1 is a schematic cross-sectional view in the vertical direction of the bonding apparatus of example 1.
Fig. 2 is a schematic cross-sectional view of the bonding apparatus of example 1 in the horizontal direction.
Fig. 3 is a schematic cross-sectional view in the vertical direction of the bonding apparatus according to the modification of embodiment 1.
Fig. 4 is a schematic cross-sectional view in the vertical direction of the bonding apparatus according to the modification of embodiment 1.
Fig. 5 is a schematic cross-sectional view in the vertical direction of the bonding apparatus of example 1.
Fig. 6 is a schematic cross-sectional view in the horizontal direction of the bonding apparatus of example 2.
Fig. 7 is a schematic cross-sectional view in the vertical direction of the bonding apparatus according to the modification of embodiment 2.
Fig. 8 is a schematic cross-sectional view in the horizontal direction of the bonding apparatus according to the modification of embodiment 2.
Fig. 9 is a schematic cross-sectional view in the vertical direction of the bonding apparatus according to the modification of embodiment 2.
Fig. 10 is a schematic cross-sectional view in the horizontal direction of the bonding apparatus according to the modification of embodiment 2.
Detailed Description
Example 1
The bonding apparatus 10 of embodiment 1 is described with reference to fig. 1 and 2. Note that, regarding the vertical direction, fig. 1 is used to refer to one member for a plurality of identical members, and reference numerals are omitted for other members.
First, a method for manufacturing a liquid crystal panel will be briefly described. In manufacturing a liquid crystal panel, first, a sealing material 23 containing an ultraviolet curing component is annularly applied so as to surround the CF layer of the first substrate 21 in which the CF layer is formed, of the pair of substrates 21,22 (sealing material application step). As the ultraviolet curing component, a known photocurable resin can be used, and examples thereof include (meth) acrylate-based photocurable resins, imide-based photocurable resins, silicone-based photocurable resins, and the like.
Next, the liquid crystal 24 is dropped in the annular region surrounded by the sealing material 23 (liquid crystal dropping step). The dropped liquid crystal 24 is arranged in a matrix on the first substrate 21 in a substantially spherical state (see fig. 2).
Next, the first substrate 21 and the second substrate 22 on which the TFT layer is formed are carried into the vacuum chamber 11, the first substrate 21 is sucked and held on the holding surface 14A of the first bonding stage 14 of the bonding apparatus 10 described later, and the second substrate 22 is sucked and held on the holding surface 15A of the second bonding stage 15 of the same bonding apparatus 10, and the CF layer and the TFT layer are aligned so as to be in a relative positional relationship. Then, the vacuum chamber 11 is evacuated to a vacuum state, the first bonding stage 14 and the second bonding stage 15 are moved in a relatively close direction, and the first substrate 21 and the second substrate 22 are bonded to each other via the sealing material 23 in a vacuum environment (vacuum bonding step). The liquid crystal 24 in this state is sandwiched between the pair of substrates 21 and 22, and is spread from the dropped position to the peripheral region inside the annular sealing member 23. Further, vacuum refers to reduced pressure air containing near vacuum.
Next, the vacuum environment of the vacuum chamber 11 is opened, and the two substrates 21 and 22 in the bonded state are pressed at atmospheric pressure (atmospheric pressure pressing step). By pressing under atmospheric pressure, the entirety of the two substrates 21,22 can be pressed with equal pressure (atmospheric pressure). At this time, a constant distance is maintained between the pair of substrates 21 and 22 by a photo spacer, not shown, provided on the first substrate 21. Thereby, the liquid crystal 24 fills the entire inner region of the annular seal member 23.
Then, in this state, ultraviolet rays are irradiated to the sealing material 23 by the ultraviolet irradiation device, and the sealing material 23 is cured (sealing material curing step). Thus, a bonded substrate (in this embodiment, a liquid crystal panel) is completed in which the two substrates 21 and 22 are fixed at a predetermined distance with a sealing material 23 interposed therebetween and filled with liquid crystal. When the bonded substrate is a mother substrate including a plurality of liquid crystal panels, the bonded substrate is cut into a predetermined size.
However, in the vacuum chamber 11 of the bonding apparatus 10, there is a problem in that the liquid crystal 24 coated on the first substrate 21 is exposed to a vacuum environment at the time of vacuum evacuation before bonding, and a part of volatile components in the liquid crystal 24 volatilize. It is known that the volatilization of the volatile components in the liquid crystal 24 is accelerated when the vacuum is formed at a high speed and the pressure is rapidly changed.
In order to solve this problem, in the present embodiment, a surrounding wall 16 surrounding the substrates 21 and 22 is provided in the vacuum chamber 11 of the bonding apparatus 10. The following describes the bonding apparatus 10 in detail.
The bonding apparatus 10 of the present embodiment includes: a vacuum chamber 11; a pair of bonding stages 14,15 for bonding a pair of substrates 21,22 in the vacuum chamber 11; and a surrounding wall 16 surrounding the pair of bonding tables 14,15 in the vacuum chamber 11.
The vacuum chamber 11 is formed in a box shape capable of forming a closed space, and includes an exhaust port 13 for exhausting air from the inside to vacuum the inside and connected to a vacuum pump 12, and an air supply port for supplying air to the inside and returning the inside to the atmospheric pressure. The exhaust port 13 and the air supply port are provided together at a central portion in the height direction of one side surface (right side surface in fig. 1) of the vacuum chamber 11 formed in a box shape. The vacuum includes a state close to vacuum.
The pair of bonding stages 14,15 is provided in the vacuum chamber 11, and includes a first bonding stage 14 disposed on a lower side in the vacuum chamber 11 and a second bonding stage 15 disposed above the first bonding stage 14. The first bonding stage 14 has a holding surface 14A extending in the horizontal direction, and the first substrate 21 coated with the sealing material 23 and the liquid crystal 24 is sucked and held on the holding surface 14A. The second bonding stage 15 has a holding surface 15A, the holding surface 15A is disposed so as to face the holding surface 14A of the first bonding stage 14, and the second substrate 22 is sucked and held on the holding surface 15A so as to face the first substrate 21. The second bonding stage 15 is configured to be liftable by a stage lifting device, and is movable in a direction approaching the fixed first bonding stage 14, whereby the first substrate 21 and the second substrate 22 can be bonded via the sealing material 23.
Further, the bonding apparatus 10 of the present embodiment is provided with a surrounding wall 16 formed in a box shape, and the surrounding wall 16 surrounds the outer surfaces of the first bonding stage 14 and the second bonding stage 15, except for the holding surfaces 14a and 15a, in the vacuum chamber 11. Specifically, the surrounding wall 16 is constituted by a rectangular box-shaped first divided body 17 having an upper surface open and a rectangular box-shaped second divided body 18 having a lower surface open, which are arranged so as to face each other in the direction in which the respective divided body side opening portions 17a,18a are abutted against each other. That is, in the present embodiment, the respective divided body side openings 17a,18a of the pair of divided bodies 17,18 are provided together in the direction extending in the horizontal direction, and the surrounding wall 16 is constituted by the pair of divided bodies 17,18, the pair of divided bodies 17,18 being divided in the bonding direction of the first substrate 21 and the second substrate 22.
In the present embodiment, the first divided body 17 and the second divided body 18 are formed in the shape of a box of the same shape and the same size. The second divided body 18 is provided so as to be displaceable by the divided body moving means in a state of approaching and separating from the first divided body 17, so that the substrates 21,22 can be set or taken out with respect to the holding surfaces 14a,15a of the first bonding stage 14 and the second bonding stage 15 in a state of separating from each other. On the other hand, in a state where the pair of divided bodies 17,18 are close to each other, the divided body side opening portions 17a,17b are not completely abutted against each other, but are set to be apart from each other by a predetermined distance. That is, in a state where the first divided body 17 and the second divided body 18 are closest to each other, a slit (an example of an opening) 19 (see fig. 1) extending in the horizontal direction is formed between the divided bodies 17, 18. The width of the slit 19 is set to about 0.1mm to 5.0mm, and is set to extend over the entire circumference of the surrounding wall 16. In addition, at least a part of the slit 19 is formed with a height opposite to at least a part of the exhaust port 13. The first divided body 17 is fixed in the vacuum chamber 11 together with the first bonding stage 14.
The second dividing body 18 is configured to avoid a stage lifting device for lifting the second bonding stage 15, and thus is a member that does not hinder the lifting operation of the second bonding stage 15. That is, the second bonding stage 15 and the second divided body 18 are individually movable. In addition, the second divided body 18 and the stage lifting device are kept sealed.
The above-described bonding apparatus 10 according to the present embodiment will be described below. The liquid crystal panel bonding apparatus 10 of the present embodiment is a bonding apparatus 10 for bonding a second substrate 22 to a first substrate 21, on which liquid crystal 24 is dropped on the inner side of a sealing material 23 that is annularly coated, so as to sandwich the dropped liquid crystal 24, the liquid crystal panel bonding apparatus 10 including: a vacuum chamber 11 which can form a vacuum environment; a first bonding stage 14 and a second bonding stage 15 each having a pair of holding surfaces 14a,15a for holding the first substrate 21 and the second substrate 22, respectively, and in the vacuum chamber 11, the first substrate 21 and the second substrate 22 are moved in a direction approaching each other by the pair of holding surfaces 14a,15a in a state of being held by suction so as to oppose each other, and the first substrate 21 and the second substrate 22 are bonded via a sealing material 23; and a surrounding wall 16 that surrounds the outer surfaces of the first bonding stage 14 and the second bonding stage 15, except for the holding surfaces 14a and 15a, in the vacuum chamber 11, wherein the surrounding wall 16 is composed of a first divided body 17 and a second divided body 18, and is provided with a slit 19 that communicates the inside and outside of the surrounding wall 16.
According to the bonding apparatus 10 of the present embodiment, the inside of the surrounding wall 16 is set in a state in which the change in air pressure is gentle compared with the surrounding of the surrounding wall 16 in the vacuum chamber 11. Specifically, although the vacuum degree is increased by exhausting the periphery of the surrounding wall 16 at a predetermined speed by the vacuum pump 12 connected to the vacuum chamber 11, the inside of the surrounding wall 16 does not exhaust at the same speed as the periphery of the surrounding wall 16, and air leaks little by little from the slit 19 to the periphery of the surrounding wall 16, so that the increase in the vacuum degree is relaxed as compared with the periphery of the surrounding wall 16. That is, since the periphery of the liquid crystal 24 disposed on the first substrate 21 inside the surrounding wall 16 is set to a state in which the change in air pressure is gentle as compared with the periphery of the surrounding wall 16, the speed of volatilization of the volatile components from the liquid crystal 24 can be suppressed from being accelerated, and deterioration of the liquid crystal 24 can be suppressed as compared with the case where the surrounding wall 16 is not provided.
The surrounding wall 16 is constituted by a first divided body 17 and a second divided body 18, the first divided body 17 and the second divided body 18 are divided in a direction (up-down direction) in which the first substrate 21 and the second substrate 22 are bonded, and the slit 19 extending along the extending direction of the substrates 21,22 is formed by arranging the respective divided body side openings 17a,18a of the first divided body 17 and the second divided body 18 to face each other.
According to this configuration, since the openings such as the slits 19 are not formed in advance in either of the divided bodies 17,18, the configuration of the divided bodies 17,18 can be made simple. The width of the slit 19 can be adjusted in accordance with the type of the liquid crystal 24 used, and the pressure change in the surrounding wall 16 can be controlled.
[ modification of example 1 ]
In the above embodiment 1, the first divided body 17 and the second divided body 18 are formed as the same shape and the same size, and the slit 19 extending along the plate surfaces of the substrates 21 and 22 is formed, but the position of the slit 19 is not limited to the above embodiment and can be changed appropriately. For example, as shown in fig. 3, the bonding device 110 may be configured as follows: by forming the first divided body 117 into a box shape having a shallower depth than that of embodiment 1, and forming the second divided body 118 into a box shape having a deeper depth than that of embodiment 1, the two box-shaped first divided bodies 117 and second divided bodies 118 having different heights up to the divided body side opening portions 117a,118a constitute the surrounding wall 116, and the height of the slit 119 is formed at a position lower than the exhaust port 13.
In contrast, as shown in fig. 4, the bonding device 210 may be configured as follows: by forming the first divided body 217 into a box shape deeper than the depth of embodiment 1 and forming the second divided body 218 into a box shape shallower than the depth of embodiment 1, the two box-shaped first divided bodies 217 and 218 having different heights up to the divided body side openings 217a,218a constitute the enclosing wall 216, and the height of the slit 219 is located higher than the exhaust port 13 and higher than the holding surface 15A of the second bonding stage 15.
Example 2
Next, embodiment 2 of the present invention will be described with reference to fig. 5 and 6. In the following, only the configuration different from that of embodiment 1 will be described, and the same reference numerals are given to the same configuration as that of embodiment 1, and redundant description will be omitted.
In the bonding apparatus 310 of the present embodiment, the dividing direction of the surrounding wall 316 is different from that of embodiment 1 described above. Specifically, the surrounding wall 316 of the present embodiment is constituted as follows: the first split member 317 having a rectangular box shape with one side surface open and the second split member 318 having a rectangular box shape with the same side surface open are arranged so as to face each other in the direction in which the split member side openings 317a,318a are abutted against each other. That is, the split body side openings 317a,318a of the pair of split bodies 317,318 are arranged in a direction extending in the vertical direction. In other words, the pair of substrates 21,22 are disposed in a direction intersecting the pair of substrates. Hereinafter, among the pair of divided bodies 317,318, a divided body disposed on the exhaust port 13 side (a divided body on the right side in fig. 5) close to the vacuum chamber 11 is referred to as a first divided body 317, and a divided body disposed on the exhaust port 13 side (a divided body on the left side in fig. 5) far from the vacuum chamber 11 is referred to as a second divided body 318.
In the present embodiment, the first divided body 317 and the second divided body 318 are formed in a box shape having the same shape and the same size. The divided bodies 317 and 318 are provided so as to be displaceable in a state of approaching and separating from each other by the divided body moving means, and so that the substrates 21 and 22 can be set or taken out with respect to the holding surfaces 14a and 15a of the first bonding stage 14 and the second bonding stage 15 in a state of separating from each other. On the other hand, in a state where the pair of divided bodies 317,318 are close to each other, the respective opening portions 317a,318a are not completely abutted against each other, but are set to be apart from each other by a predetermined distance. That is, in a state where the first divided body 317 and the second divided body 318 are closest to each other, a slit 319 is formed between the divided bodies 317 and 318 (see fig. 5 and 6). The slit 319 extends in a direction intersecting the substrates 21,22 and in a direction along the substrates 21,22, and is provided throughout the entire periphery of the surrounding wall 316.
The surrounding wall 316 (the pair of divided bodies 317, 318) is configured to avoid a stage lifting device for lifting the second bonding stage 15, and thus is a member that does not hinder the lifting of the second bonding stage 15. In addition, the enclosure wall 316 and the table lifting device are kept sealed.
According to the bonding apparatus 310 of the present embodiment, as in the case of embodiment 1, since the inside of the surrounding wall 316 is set in a state in which the change in air pressure is relaxed as compared with the surrounding of the surrounding wall 316 in the vacuum chamber 11, the speed of volatilization of the volatile components from the liquid crystal 24 can be suppressed from being accelerated, and deterioration of the liquid crystal 24 can be suppressed as compared with the case where the surrounding wall 316 is not provided.
The surrounding wall 316 is composed of a first divided body 317 and a second divided body 318, the first divided body 317 and the second divided body 318 are divided in a direction intersecting a direction (up-down direction) in which the first substrate 21 and the second substrate 22 are bonded, and the slit 319 is formed in a direction intersecting an extending direction of the substrates 21,22 and along the extending direction of the substrates 21,22.
According to this configuration, since the openings such as slits are not formed in advance in either of the divided bodies 317 and 318, the divided bodies 317 and 318 can be formed in a simple configuration. The width of the slit 319 can be adjusted according to the type of the liquid crystal 24 used.
[ modification of example 2 ]
In the above-described embodiment 2, the first divided body 317 and the second divided body 318 are formed in the same shape and the same size as each other, and the slit 319 is formed, and the slit 319 extends in the direction intersecting the plate surfaces of the substrates 21 and 22 and extends in the plate surface direction of the substrates 21 and 22, but the position of the slit 319 is not limited to the above-described embodiment. For example, as shown in fig. 7 and 8, the bonding device 410 may be configured as follows: by forming the first divided body 417 into a box shape deeper than the depth of embodiment 2 and forming the second divided body 418 into a box shape shallower than the depth of embodiment 2, the two box-shaped first divided bodies 417 and the second divided body 418 having different heights up to the openings 417a,418a constitute the surrounding wall 416, and the slit 419 is formed at a position farther from the exhaust port 13 than embodiment 2.
As shown in fig. 9 and 10, the bonding device 510 may be configured as follows: the first divided body 517 and the second divided body 518 are each in the shape of a triangular prism having a point-symmetrical shape and having one surface opening extending in the height direction, and the slit 519 is not disposed at a position facing the side surface opposite to the surrounding wall 516.
(other examples)
The present invention is not limited to the embodiments described by the above description and drawings, and, for example, embodiments such as the following are also included in the technical scope of the present invention.
(1) In the above embodiment, the configuration was described in which the respective segment side openings of the first segment and the second segment are separated by a predetermined distance with the slit formed therebetween, but the configuration may be such that the edge of at least one of the segment side openings of the first segment and the second segment is formed in a concave-convex shape, and the edge is partially abutted and partially opened. In this case, a plurality of holes are formed in the surrounding wall instead of slits.
(2) In the above embodiment, the constitution in which the pair of divided bodies are formed in the box shape and the slit-shaped opening is formed by the relative movement of the pair of divided bodies is shown, but the constitution of the pair of divided bodies is not limited to the above embodiment. For example, the following structure may be adopted: the side surface of the divided body is formed in a corrugated shape capable of changing the length of the side surface, and only the length of the side surface is changed while the whole divided body is kept fixed.
(3) In addition, in the above-described embodiment 2, the outer periphery of the substrate may be a divided body configured to be rotatable in the circumferential direction.
(4) Although the second bonding stage and the second split body are individually movable in the above-described embodiment 1, the second bonding stage and the second split body may be integrally formed and simultaneously movable by one moving device.
(5) The first bonding stage and the first divided body may be movable.
(6) In the above embodiment, the configuration in which the first divided body and the second divided body are arranged to face each other to form the opening such as the slit is shown, but the opening may be provided in at least one divided body in advance.
Description of the reference numerals
10, 110, 210, 310, 410, 510: attaching device
11: vacuum chamber
13: exhaust port
14: first laminating and placing table
15: second laminating and placing table
14a,15a: holding surface
16, 116, 216, 316, 416, 516: surrounding wall
17, 117, 217, 317, 417, 517: first division body
18, 118, 218, 318, 418, 518: second division body
17A，18A
117a,118a,217a,218a,317a,318a,417a,418a, 127 a,518a: side opening of the divided body
19, 119, 219, 319, 419, 519: slit (opening)
21: first substrate
22: second substrate
23: sealing material
24: liquid crystal
Claims (6)
1. A bonding apparatus for a liquid crystal panel, which bonds a second substrate to a first substrate, to which liquid crystal is dropped, on an inner side of a sealing material that is annularly coated, so as to sandwich the dropped liquid crystal, the bonding apparatus comprising:
a vacuum chamber that can form a vacuum environment;
a pair of bonding tables each having a pair of holding surfaces for holding the first substrate and the second substrate, the pair of holding surfaces being configured to move the first substrate and the second substrate in a direction toward each other in a state of being opposed to each other in the vacuum chamber, the first substrate and the second substrate being bonded to each other via the sealing material;
a surrounding wall surrounding the pair of bonding stages in the vacuum chamber,
the surrounding wall is formed by a pair of divided bodies, and is provided with an opening part which communicates the inside and the outside of the surrounding wall.
2. The bonding device of a liquid crystal panel according to claim 1, wherein the opening is formed by the pair of split bodies being arranged to face each other.
3. The bonding device of a liquid crystal panel according to claim 1 or 2, wherein the surrounding wall is constituted by the pair of divided bodies, and the pair of divided bodies are divided in a bonding direction of the first substrate and the second substrate.
4. The bonding device of liquid crystal panel according to claim 3, wherein the opening is a slit provided along an extending direction of the first substrate and the second substrate.
5. The bonding device of a liquid crystal panel according to claim 1 or 2, wherein the surrounding wall is constituted by the pair of divided bodies, the divided bodies being divided in a direction intersecting a bonding direction of the first substrate and the second substrate.
6. The bonding device of a liquid crystal panel according to claim 5, wherein the opening is a slit provided in a direction intersecting an extending direction of the first substrate and the second substrate.
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| US201962871631P | 2019-07-08 | 2019-07-08 | |
| US62/871631 | 2019-07-08 |
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