JP2013030639A - Die, imprint device using the same, imprint method and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die which is advantageous for minimizing occurrence of defects of a pattern formed in a resin on a substrate.SOLUTION: The die 7 has a pattern 7a to be formed for a processed body 9. The die 7 comprises: a first flat plate 20 located on the side opposite from the side facing the processed body 9, and having a pattern 7a protruding in the center of the surface facing the processed body 9; and a second flat plate 22 located on the side facing the processed body 9, and having an aperture 7c penetrating so that the pattern 7a formed on the first flat plate 20 faces the processed body 9. The first flat plate 20 and the second flat plate 22 are superimposed with each other via a first space 21, i.e., the internal space, and the first flat plate 20 is deformable in the direction of pressing the pattern 7a against the processed body 9.

Description

  The present invention relates to a mold, an imprint apparatus using the mold, an imprint method, and an article manufacturing method.

  The demand for miniaturization of semiconductor devices has advanced, and in addition to conventional photolithography technology, microfabrication technology that forms uncured resin on a substrate with a mold and forms a resin pattern on the substrate attracts attention. Yes. This technique is also called an imprint technique, and can form a fine structure on the order of several nanometers on a substrate. For example, as one of imprint techniques, there is a photocuring method. In an imprint apparatus employing this photocuring method, first, an ultraviolet curable resin (imprint material, photocurable resin) is applied to a shot which is an imprint region on a substrate (wafer). Next, this resin (uncured resin) is molded by a mold. Then, the resin pattern is formed on the substrate by irradiating ultraviolet rays to cure the resin and then separating the resin.

  In this imprint apparatus, when the mold and the resin applied on the substrate are pressed, bubbles may be mixed inside the resin. When the resin is cured in a state where the bubbles are mixed, the resin pattern is not normally formed in the portion where the bubbles are present. Therefore, as a technique for reducing the mixture of bubbles, Patent Document 1 discloses that the mold is bent convexly toward the substrate while the center of the mold (printing plate) is pressed against the resin on the substrate, and the entire surface of the pattern is sequentially resinized. Discloses a transfer printing machine that extrudes gas between a mold and a resin to the outside by being pressed against the outside.

Japanese Patent No. 44441675

  However, as shown in Patent Document 1, when the mold is pressed against the resin on the substrate with the center of the mold bent into a convex shape, the mold may be deformed into a concave shape due to a reaction force from the substrate. . FIG. 5 is a view showing the mold 40 in a state of being deformed into a concave mold when the mold 40 and the resin 42 on the substrate 41 are pressed by the conventional imprint apparatus. In order to deform the mold 40 more easily (for example, with a smaller differential pressure P), the thickness of the mold 40 in the deformation direction, that is, the thickness of the pattern forming portion 40a of the mold 40 is reduced. Prone to occur in some cases. When the mold 40 is deformed into a concave shape in this manner, pattern defects due to unfilled resin in the pattern forming portion 40a are likely to occur.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a mold that is advantageous in suppressing the occurrence of pattern defects generated in a resin on a substrate.

  In order to solve the above-mentioned problems, the present invention is a mold having a pattern portion in which a pattern to be molded with respect to a target object is formed, and is located on the side opposite to the side toward the target object, A first flat plate having a pattern portion protruding at the center of the surface facing the object to be processed and a pattern portion formed on the first flat plate facing the object to be processed are opposed to the object to be processed. A first flat plate and a second flat plate that overlap each other via the first space that is an internal space, and the first flat plate presses the pattern portion against the object to be processed. It is possible to deform | transform into.

  ADVANTAGE OF THE INVENTION According to this invention, the type | mold advantageous in suppressing generation | occurrence | production of the defect of the pattern produced | generated by resin on a board | substrate can be provided.

It is a figure which shows the structure of the imprint apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the structure of the mold holding | maintenance apparatus which concerns on 1st Embodiment. It is a figure which shows the shape of the mold before pressing operation and at the time of pressing operation start. It is a figure which shows the structure of the mold holding apparatus which concerns on 2nd Embodiment. It is a figure which shows the mold at the time of the pressing operation by the conventional imprint apparatus.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(First embodiment)
First, the imprint apparatus according to the first embodiment of the present invention will be described. FIG. 1 is a diagram illustrating a configuration of an imprint apparatus 1 according to the present embodiment. The imprint apparatus 1 according to the present embodiment is used for manufacturing articles such as semiconductor devices, and forms an uncured resin on a wafer (substrate), which is an object to be processed, with a mold (mold). An apparatus for forming a pattern. Here, an imprint apparatus employing a photocuring method is used. In the following figure, the Z axis is taken in parallel to the optical axis of the illumination system for irradiating the resin on the wafer with ultraviolet rays, and the X axis and the Y axis perpendicular to each other are taken in a plane perpendicular to the Z axis. Yes. The imprint apparatus 1 includes a light irradiation unit 2, a mold holding device 3, a wafer stage 4, a coating unit 5, and a control unit 6.

  The light irradiation unit 2 irradiates the mold 7 with ultraviolet rays 8 during the imprint process. Although not shown, the light irradiation unit 2 includes a light source and an optical element for adjusting the ultraviolet light 8 emitted from the light source to light suitable for imprinting. The mold 7 includes a pattern portion (for example, a fine uneven pattern such as a circuit pattern) 7 a that protrudes in a convex shape so as to face the wafer 9 and is formed in a three-dimensional shape. The outer shape of the mold 7 is, for example, about 150 mm square and a thickness of about 6 mm, and the material thereof is a material that can transmit ultraviolet rays 8 such as quartz. The shape of the mold 7 will be described in detail below.

  The mold holding device (mold holding unit) 3 includes a mold chuck 10 that attracts and holds the mold 7 by vacuum suction force or electrostatic force, a magnification correction mechanism 11 that corrects the shape of the pattern portion 7a in advance during the imprint operation, And a mold driving mechanism shown in the figure. The mold holding device 3 (mold chuck 10) has an opening region 12 in the center of the inside so that the ultraviolet rays 8 emitted from the light source of the light irradiation unit 2 are irradiated toward the wafer 9. Although not shown, the mold chuck 10 includes a suction portion that attracts the outer edge (outer peripheral surface) of the mold 7 located on the outer periphery of the opening region 12. In this case, the adsorption unit is connected to, for example, an evacuation apparatus (not shown) installed outside, and the adsorption pressure is adjusted by this evacuation apparatus, and the adsorption ON / OFF is switched. The magnification correction mechanism 11 deforms and corrects the shape of the pattern portion 7a by adjusting the pressure applied to the side surface of the mold 7, for example. Specifically, the mold driving mechanism moves the mold 7 in the Z-axis direction so as to selectively perform pressing or separation between the mold 7 and the resin on the wafer 9. For example, a linear motor, an air cylinder, or the like can be employed as an actuator employed in the mold drive mechanism. Note that the pressing and pulling operation in the imprint apparatus 1 may be realized by moving the mold 7 in the Z-axis direction as described above, but is realized by moving the wafer stage 4 in the Z-axis direction. Or both may be moved relatively.

  Here, the shape of the mold 7 of this embodiment and the mechanism for holding the mold 7 in the mold holding device 3 will be described. FIG. 2 is a schematic view showing the mold 7 held by the mold chuck 10. 2A is a cross-sectional view showing the shape of the mold 7 before deformation, and FIG. 2B is a cross-sectional view taken along the line AA ′ in FIG. 2A from the pattern forming surface side. FIG. As shown in FIG. 2A, the mold 7 includes a deformable first flat plate 20 and a second flat plate 20 that overlaps the first flat plate 20 with a first space 21 in the transmission direction through which the ultraviolet rays 8 are transmitted. And a flat plate 22.

  First, the first flat plate 20 is a deformation region formed by the second space 23 dug in the central portion on the suction holding surface side of the mold 7. Although the digging depth of the second space 23 will be described later, the digging depth is such a depth that the first flat plate 20 can be suitably deformed by application of pressure, and the digging area is the mold chuck 10 (and the mold). The opening area of the opening region 12 in the central part of the holding device 3) is substantially the same. Here, the outer peripheral surface 7 b in which the second space 23 is not formed among the surfaces on the suction holding side is sucked by the mold chuck 10 and the mold 7 is held. In addition, the first flat plate 20 has a pattern portion 7 a at the center of the surface opposite to the second space 23. The planar shape of the pattern portion 7a is rectangular as shown in FIG. 2B, and the planar dimension is, for example, 33 × 26 mm. In addition, when the thickness of the mold 7 is very thin, it is not necessary to form a digging like the second space 23 described above.

  On the other hand, the second flat plate 22 is on the side facing the wafer 9 during the imprinting operation, and the pattern portion 7a formed on the first flat plate 20 faces the outside, that is, toward the wafer 9 at the center. And has an opening 7c so as to penetrate through. The opening shape of the opening portion 7c is suitable for adjusting the internal pressure of the first space 21, so that the opening portion 7c is shaped along the rectangular shape of the pattern portion 7a, and a gap between the side surface of the opening portion 7c and the side surface of the pattern portion 7a. The (slit) is preferably 0.5 mm or less.

  The first space 21 is an internal space having a circular shape with a larger diameter than the second space 23. The first space 21 communicates with a space (third space) 24 between the mold 7 and the wafer 9 through a gap between the opening 7 c and the pattern portion 7 a. The mold 7 has a plurality of intake holes 25 that communicate with the first space 21 and are located near the outer periphery of the first space 21. For example, as shown in FIG. 2 (b), a total of four intake holes 25 are installed along the two axes XY from the center point of the first space 21, and each has a diameter of several millimeters. The intake holes 25 pass through the outer peripheral surface 7b, are connected to a flow path 26 penetrating the inside of the mold chuck 10 corresponding to the installation position, and are connected to a pressure adjusting device 17 described later. The intake hole 25 may be connected to the pressure adjusting device 17 from any position as long as it is not connected to the third space 24 without being connected through the inside of the mold chuck 10.

  Note that the rigidity of the first flat plate 20 is preferably lower than the rigidity of the second flat plate 22. In particular, in the present embodiment, the thickness of the first flat plate 20 is thinner than the thickness of the second flat plate 22. As will be described later, when the inside of the first space 21 is depressurized by the pressure adjusting device 17, only the first flat plate 20 is deformed into a convex shape (flexed) toward the wafer 9, and one of the second spaces is deformed. This is because the flat plate 22 is not deformed toward the inside of the mold 7. Further, as another configuration in which the rigidity of the first flat plate 20 is made lower than the rigidity of the second flat plate 22, for example, when the inside of the first space 21 is decompressed, the distance in the pressing direction of the third space 24 is set to 10. There is also a method of setting it to several mm or less. By reducing the distance in this way, the pressure difference between the first space 21 and the third space 24 is reduced. Therefore, even if the rigidity of the first flat plate 20 and the second flat plate 22 is substantially the same, or even if the rigidity of the second flat plate 22 is smaller than the rigidity of the first flat plate 20, the deformation of the second flat plate 22 is suppressed. Only one flat plate 20 can be deformed. Furthermore, as another configuration, for example, there is a method in which the first flat plate 20 and the second flat plate 22 are made of different materials, and the second flat plate 22 is formed of a material having a Young's modulus smaller than that of the first flat plate 20. obtain.

  Furthermore, the mold holding device 3 is connected to the air intake hole 25 of the mold 7 through one flow path (first flow path) 26 and is connected through the other flow path (second flow path) 27 (see FIG. 1). And a pressure adjusting device (pressure adjusting unit) 17 connected to the opening region 12 (second space 23). Although not shown, the pressure adjusting device 17 is configured by a vacuum exhaust device such as a vacuum pump, a pressure sensor, and the like, and includes a pressure P1 in the first space 21 (or a pressure P3 in the third space) and a second space. The pressure P2 of 23 can be adjusted individually and adjusted. Here, in order to suitably adjust the pressure of the second space 23 (opening region 12), it is desirable to seal this space. Therefore, the mold holding device 3 may be provided with a sealing glass plate in the opening region 12 so that only the second space 23 or the second space 23 and a part of the opening region 12 are sealed. Or it is good also as sealing by the connection of the mold holding apparatus 3 and the light irradiation part 2 located in the upper part.

  The wafer 9 is an object to be processed (processed substrate) made of, for example, single crystal silicon, and an ultraviolet curable resin (hereinafter referred to as “resin”) formed on the surface to be processed by a pattern portion 7 a formed on the mold 7. ) Is applied. Further, the wafer stage (substrate holding unit) 4 holds the wafer 9 by, for example, vacuum suction, and can move in the X, Y, Z, and ωZ axial directions. As an actuator for driving the wafer stage 4, for example, a linear motor can be employed. The application unit (dispenser) 5 applies a resin 13 (uncured resin) on the wafer 9. Here, the resin 13 is a photocurable resin (imprint material) having a property of being cured by receiving the ultraviolet light 8 and is appropriately selected according to various conditions such as a semiconductor device manufacturing process.

  The control unit 6 can control operation and adjustment of each component of the imprint apparatus 1. The control unit 6 is configured by, for example, a computer and is connected to each component of the imprint apparatus 1 via a line, and can control each component according to a program or the like. In the present embodiment, the control unit 6 controls at least the operation of the mold holding device 3 including the pressure adjusting device 17. The control unit 6 may be configured integrally with other parts of the imprint apparatus 1 or may be installed at a place different from other parts of the imprint apparatus 1.

  Further, the imprint apparatus 1 includes a surface plate 14 installed on the floor, and a frame 16 supported on the surface plate 14 via a vibration isolation mechanism 15. The surface plate 14 supports the components of the entire imprint apparatus 1 and forms a reference plane for driving the wafer stage 4. The frame 16 supports the mold holding device 3, the application unit 5, and the like, and the vibration isolation mechanism 15 is configured by an air spring or the like, and suppresses transmission of vibration from the floor surface.

  Next, imprint processing by the imprint apparatus 1 will be described. First, the control unit 6 places and fixes the wafer 9 on the wafer stage 4 by a substrate transfer device (not shown), and moves the wafer stage 4 to the coating position of the coating unit 5. Thereafter, the application unit 5 applies the resin 13 to a predetermined shot (processed region) of the wafer 9 as an application process. Next, the control unit 6 moves the wafer stage 4 so that the shot on the wafer 9 is located immediately below the mold 7. Next, the controller 6 aligns the mold 7 with the shot on the wafer 9 and corrects the magnification of the mold 7 by the magnification correction mechanism 11. The mold 7 is pressed against the resin 13 (molding process). By this pressing, the resin 13 is filled in the uneven portion of the pattern portion 7 a formed in the mold 7. In this state, the light irradiation unit 2 irradiates the ultraviolet rays 8 from the back surface (upper surface) of the mold 7 as a curing process, and cures the resin 13 by the ultraviolet rays 8 transmitted through the mold 7. And after resin 13 hardens | cures, the control part 6 redrives a mold drive mechanism, and separates the mold 7 from the wafer 9 (mold release process). As a result, a pattern (layer) of the three-dimensional resin 13 is formed on the surface of the shot on the wafer 9 so as to follow the uneven portion of the pattern portion 7a. By performing such a series of imprint operations a plurality of times while changing shots by driving the wafer stage 4, a pattern of a plurality of resins 13 can be formed on one wafer 9.

  Here, in the conventional imprint apparatus, when the mold 7 and the resin 13 on the wafer 9 are pressed, bubbles may be mixed inside the resin 13. Therefore, in order to reduce the mixing of bubbles, the mold 7 is bent convexly toward the wafer 9 while being pressed against the resin 13 on the wafer 9, and the entire pattern portion 7a is sequentially pressed against the resin 13. The gas between the pattern portion 7a and the resin 13 is pushed out. At this time, in the imprint apparatus 1 of the present embodiment, after application of the resin 13, the pressure adjusting device 17 makes the pressure P1 in the first space 21 smaller than the pressure P2 in the second space 23, and the difference caused by this pressure difference. Using the pressure, the pattern portion 7 a is deformed into a convex shape toward the wafer 9. Hereinafter, the pressure control by the pressure adjusting device 17 will be described in detail.

  FIG. 3 is a cross-sectional view showing the shape of the mold 7 before the pressing operation and at the start of the pressing operation corresponding to FIG. 2A. In particular, FIG. 3A shows the shape of the mold 7 before the pressing operation. Indicates. At this time, the distance H1 between the mold 7 (second flat plate 22) and the wafer 9 in the third space 24 is about several mm. Here, the control unit 6 evacuates the first space 21 (including the third space 24 via the opening 7c) by the pressure adjusting device 17, so that the pressure P1 of the first space 21 becomes the second space 23. It controls so that it may become lower than the pressure P2. A differential pressure ΔP1 is generated due to the pressure difference between the first space 21 and the second space 23, and the first flat plate 22 (pattern portion 7a) is centered toward the wafer 9 by the differential pressure ΔP1. Deflection by the amount of δ1.

  In the conventional imprint apparatus, the pressure of the opening region 12 (second space 23) in the present embodiment cannot be increased beyond the holding force of the mold due to the suction pressure of the mold chuck. On the other hand, since the mold 7 of the present embodiment has the two-layer structure of the first flat plate 20 and the second flat plate 22 through the first space 21 as described above, even if the differential pressure ΔP1 is increased, the mold 7 The mold 7 does not come off from the chuck 10. Specifically, in the conventional imprint apparatus, for example, when the pressure in the opening region 12 is increased to about 60 kPa, there is a high possibility that the mold 7 is detached from the mold chuck. On the other hand, in the imprint apparatus 1 of the present embodiment, for example, when the pressure P1 of the first space 21 is evacuated to 1 kPa and the pressure P2 of the second space 23 is atmospheric pressure, 100 kPa (about 1 atmosphere) The differential pressure can be generated. In addition, if the control unit 6 pressurizes the pressure P2 in the second space 23 to such an extent that the mold 7 does not come off from the mold chuck 10 by the pressure adjusting device 17, the amount of deflection δ1 before the pressing operation is increased. It can be made larger than the case where the mold is used.

  On the other hand, FIG. 3B shows the shape of the mold 7 at the start of the pressing operation. At this time, the distance H2 between the mold 7 (second flat plate 22) and the wafer 9 in the third space 24 is about several μm. Due to the decrease from the distance H1 to the distance H2, the pressure P1 in the first space 21 communicating with the third space 24 through the opening 7c also decreases, so that the pressure difference between the first space 21 and the second space 23 is reduced. As the pressure increases, the differential pressure also increases from ΔP1 to ΔP2. At the same time, since the pressure P3 in the third space 24 is approximately the same as the pressure P1 in the first space P1, a differential pressure is also generated on the opposite surface of the first flat plate 20 via the pattern portion 7a. The deflection amount δ2 of 20 is larger than the deflection amount δ1.

  Thus, since the mold 7 has the above-described configuration and can increase the differential pressure ΔP2, the imprint apparatus 1 receives the reaction from the wafer 9 side during pressing as shown in FIG. The influence of force R can be suppressed. Therefore, it is possible to suppress the possibility that the mold 7 is deformed into a concave shape during the pressing. Moreover, since the 3rd space 24 can be pressure-reduced via the opening part 7c by pressure_reduction | reduced_pressure of the 1st space 21 at the time of pressing, the gas used as a bubble generation | occurrence | production can be reduced. As a result, it is possible to suppress the occurrence of pattern defects generated in the resin 13 on the wafer 9 as a result. Moreover, according to the imprint apparatus 1, since generation | occurrence | production of the bubble mixed in the resin 13 is suppressed, pressing time can be shortened compared with the conventional imprint apparatus. Furthermore, if the mold is bent into a convex shape, if the gas pressure difference between the upper and lower surfaces is increased so that the amount of bending of the mold is increased, the force for holding the mold may be reduced. However, according to the configuration of the mold 7 of the present embodiment, the holding force does not decrease.

  If the suction (exhaust) from the opening 7c is not stopped after the pressing is completed, the pressure P3 in the third space 24 is further reduced, and a force to pull the wafer stage 4 toward the mold 7 is applied. Positioning accuracy may be affected. Therefore, in this case, the control unit 6 stops the exhaust of the first space 21 by the pressure adjusting device 17, and reduces the load on the wafer stage 4 by returning the pressure around the pattern unit 7a to the atmospheric pressure. The influence on the positioning accuracy of the wafer stage 4 can be suppressed.

  As described above, according to the present embodiment, it is possible to provide the mold 7 that is advantageous in suppressing the occurrence of pattern defects generated in the resin 13 on the wafer 9 and the imprint apparatus 1 using the mold 7. it can.

(Second Embodiment)
Next, an imprint apparatus according to the second embodiment of the present invention will be described. FIG. 4 is a schematic view showing the mold 30 according to this embodiment held by the mold chuck 31. Here, FIG. 4A corresponds to FIG. 2A according to the first embodiment, and FIG. 4B corresponds to BB in FIG. 4A corresponding to FIG. It is a schematic plan view showing a cross section. Also, in FIG. 3, the same reference numerals are given to the same configurations or the same spaces as those in FIG. First, the first feature of the imprint apparatus according to the present embodiment is that the gap between the side surface of the opening 30c and the side surface of the pattern portion 30a in the mold 30 is 0.1 mm or less, which is narrower than in the first embodiment. . By narrowing the gap in this way, the area of the region where the first space 21 and the third space 24 communicate with each other in the opening 30c is reduced. Therefore, since the pressure adjusting device can easily reduce the pressure P1 of the first space 21 as compared with the first embodiment, the pressure difference between the first space 21 and the second space 23 can be made larger than that of the first embodiment. Can also be increased. As a result, the pressure adjustment device 17 can adjust the deflection amount δ1 (δ2) as shown in FIGS. 3A and 3B according to the first embodiment to a greater extent. Alternatively, the pressure adjusting device 17 can also achieve the same deflection amount δ1 (δ2) as in the first embodiment with a small exhaust flow rate.

  Next, the second feature of the imprint apparatus according to the present embodiment is that a plurality of molds 30 pass through the interior of the imprint apparatus from the pressure regulator 17 side to the third space 24 in addition to the configuration of the first embodiment. This is in that the through-hole 32 is provided. In this case, the mold chuck 31 (mold holding device) has a third flow path 33 that passes through the inside thereof and communicates with the pressure adjustment device 17, and the plurality of through holes 32 are respectively connected to the third flow path 33. Connected. For example, as shown in FIG. 4 (b), a total of eight through holes 32 are installed at equal intervals in the region along the outer periphery of the first space 21. Here, in the present embodiment, the pressure adjusting device 17 can adjust the pressure P3 of the third space 24 via the through hole 32 independently of the pressure P1 of the first space 21. Therefore, the controller 6 can control the pressure P3 in the third space 24 to be smaller than the pressure P2 in the second space 23 at the start of the pressing operation. Thus, according to the present embodiment, the pressure difference between the first space 21 and the second space 23 can be made larger than that in the first embodiment, and the pressure P3 in the third space 24 can be reduced more easily. Can be made. In addition, the said 1st and 2nd characteristic of this embodiment may be employ | adopted in combination, respectively, and may be employ | adopted independently.

(Product manufacturing method)
A method for manufacturing a device (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) using the above-described imprint apparatus. Furthermore, the manufacturing method may include a step of etching the substrate on which the pattern is formed. In the case of manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Imprint apparatus 3 Mold holding apparatus 7 Mold 7a Pattern part 7c Opening part 9 Wafer 17 Pressure adjusting apparatus 20 1st flat plate 21 1st space 22 2nd flat plate 23 2nd space

Claims (18)

A mold having a pattern portion on which a pattern to be molded is formed on a workpiece,
A first flat plate having the pattern portion located at a side opposite to the side toward the object to be processed and protruding at a center portion of a surface toward the object to be processed;
A second flat plate located on the side facing the object to be processed and having an opening through which the pattern portion formed on the first flat plate faces the object to be processed;
The first flat plate and the second flat plate overlap with each other through a first space that is an internal space,
The mold according to claim 1, wherein the first flat plate is deformable in a direction in which the pattern portion is pressed against the object to be processed.   The first flat plate is deformed by changing a pressure of the first space and a pressure of a region in contact with a surface of the first flat plate opposite to a side facing the object to be processed. The mold according to claim 1.   3. The mold according to claim 1, wherein the planar shape of the opening has a shape along the planar shape of the pattern portion.   The mold according to any one of claims 1 to 3, wherein the rigidity of the first flat plate is lower than the rigidity of the second flat plate.   The rigidity of the first flat plate is lower than the rigidity of the second flat plate by making the thickness of the first flat plate thinner than the thickness of the second flat plate. Type.   The mold according to claim 4, wherein the rigidity of the first flat plate is made lower than the rigidity of the second flat plate by making the material of the first flat plate different from the material of the second flat plate. . The planar shapes of the first space and the region are each a circle, and the diameter of the first space is larger than the diameter of the region,
The mold according to any one of claims 1 to 6, wherein a plurality of air intake holes that enable vacuum evacuation of the first space are provided on an outer periphery of the first space. An imprint apparatus for forming a cured resin pattern on the substrate by molding and curing an uncured resin on the substrate with a mold,
A mold holding unit that holds the mold according to any one of claims 1 to 7,
A pressure adjusting unit that individually adjusts the pressure of the first space and the pressure of the second space that is in the inner region of the mold holding unit and includes the region in contact with the first flat plate;
An imprint apparatus comprising:   The pressure adjusting unit adjusts the pressure in the first space to be smaller than the pressure in the second space when the mold and the resin are pressed, and uses a differential pressure generated by the pressure difference. The imprint apparatus according to claim 8, wherein the pattern portion is deformed into a convex shape toward the substrate.   The pressure adjusting unit adjusts the pressure in the third space between the second flat plate and the substrate communicating with each other through the opening by adjusting the pressure in the first space. The imprint apparatus according to claim 8 or 9. The mold is adsorbed and held on the outer peripheral surface not corresponding to the second space by the mold holding unit,
The imprint apparatus according to claim 8, wherein the intake hole communicates with the pressure adjusting unit from the outer peripheral surface. The mold has a plurality of through holes that enable vacuum evacuation of the third space between the second flat plate and the substrate,
12. The imprint apparatus according to claim 1, wherein the through hole penetrates a surface of the second flat plate that faces the third space without intersecting with the first space. . The mold is adsorbed and held on the outer peripheral surface not corresponding to the second space by the mold holding unit,
The imprint apparatus according to claim 12, wherein the through hole communicates with the pressure adjusting unit from the outer peripheral surface. An imprint method in which an uncured resin on a substrate is molded and cured by a mold to form a cured resin pattern on the substrate,
In the pressing direction against the resin, the pressure in the first space, which is the internal space between the first flat plate and the second flat plate constituting the mold, and the inner area of the mold holding portion holding the mold, The pattern portion formed on the first flat plate through the opening formed in the second flat plate using the differential pressure generated by the pressure difference with the pressure of the second space in contact with the first flat plate is the substrate. And an imprinting method characterized by comprising a step of deforming into a convex shape.   The imprint method according to claim 14, wherein in the step, the second space is pressurized.   The said process WHEREIN: The 3rd space between the said 2nd flat plate and the said board | substrate which communicates through the said opening part is pressure-reduced by depressurizing the 1st space, The said 1st space is characterized by the above-mentioned. Imprint method.   In the step, the third space is decompressed through a through-hole penetrating the surface of the second flat plate toward the third space between the second flat plate and the substrate without intersecting with the first space. The imprint method according to claim 14, wherein: A step of forming a resin pattern on a substrate using the imprint apparatus according to any one of claims 8 to 13 or the imprint method according to any one of claims 14 to 17,
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

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