KR101469966B1 - Surface pressure measurement device in apparatus for bonding substrates and method for bonding substrates using the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate pressure measuring apparatus for a substrate cementing apparatus and a substrate bonding method using the same, (A) interposing the surface pressure measuring device between an upper surface plate and a lower surface plate; (b) measuring the surface pressure of the upper and lower bases by lowering the upper bases and bringing them into close contact with the lower bases; (c) when the surface pressure of the entire surface area measured by the surface pressure measuring device is equal to or less than the reference value, removing the surface pressure measuring device and then performing a lapping process of the two substrates, The adhesion process is performed only when the total surface area pressure of the lower surface plate and the upper surface plate is constant and when the surface pressure of the entire area does not coincide due to the inclination of a certain site or the like, It is possible to minimize the occurrence of defects due to cementation and thus improve the efficiency of the cementation process.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a surface pressure measuring apparatus for bonding a substrate,

More particularly, the present invention relates to a substrate cohesion apparatus and a substrate cohesion method. More particularly, the present invention relates to a substrate cohesion apparatus and a substrate cohesion method which measure the total area surface pressure of an upper surface plate and a lower surface plate before coalescing two substrates, A substrate pressure measuring apparatus for a substrate cementing apparatus and a substrate cementing apparatus using the same.

2. Description of the Related Art Flat panel displays (FDPs) generally include a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED) And organic light emitting diodes (OLED) have been developed and used.

Such display panels are generally provided with image display elements capable of realizing images between two substrates (for example, glass substrates). In order to have such a structure, a process of attaching and attaching two substrates mutually do.

For example, a TFT (Thin Film Transistor) substrate and a color filter (CF) substrate on which phosphors are coated are respectively fabricated, and liquid crystal is injected therebetween. Then, the two substrates are bonded together to form an LCD Panel.

Here, the substrate bonding process for manufacturing the LCD panel uses a substrate bonding apparatus capable of bonding two substrates in a vacuum state.

FIG. 1 and FIG. 2 are schematic views showing a conventional substrate bonding apparatus applicable to the present invention, and a substrate bonding apparatus will be described with reference to FIG.

The substrate laminating apparatus includes a base frame 10 and a joining chamber 20 supported by the base frame 10 and including an upper chamber 22 and a lower chamber 24, The upper and lower bases 30 and 32 and the upper chamber 22 or the lower chamber 24 that are fixedly installed in the chamber 24 and keep the substrates S1 and S2 to be attached to each other in a fixed state, And a chamber opening / closing mechanism (40) that separates or brings the opposing distance between the upper chamber (22) and the lower chamber (24) apart.

Each of the chamber opening and closing mechanisms 40 is installed at each corner of the lapping chamber 20 and each of the chamber opening and closing mechanisms 40 is supported by the base frame 10 and passes through the lower chamber 24 to receive the upper chamber 22 And a jack unit 42 or the like for raising.

The jack unit 42 is provided with a lifting rod 44 moving up and down in a state of passing through the lower chamber 24. The lifting rod 44 is in contact with the bottom surface of the upper chamber 22, ) To push up.

Therefore, the upper chamber 22 is spaced apart from or in close contact with the lower chamber 24 by the lifting and lowering of the lifting rod 44 by the operation of the jack unit 42 as the chamber opening / closing mechanism 40, It is possible to make the inside of the ligation chamber 20 in a vacuum state at the time of closing. Here, a sealing member 50 such as an O-ring is provided around the upper surface of the lower chamber 24 to completely seal the interior of the adhesion chamber 20.

A process of attaching two substrates using the substrate bonding apparatus having the above-described structure will be described below.

1, the upper chamber 22 is raised by the chamber opening / closing mechanism 40 so that the upper chamber 22 and the lower chamber 24 are spaced apart from each other and the first substrate S1 And the second substrate S2 are drawn into the adhesion chamber 20 and then the first substrate S1 and the second substrate S2 are adsorbed on the lower surface plate 32 and the upper surface plate 30, .

2, the upper chamber 22 is lowered by the lowering of the lifting rod 44 by the operation of the jack unit 42 as the chamber opening / closing mechanism 40, so that the upper chamber 22 The lower chamber 24 may be brought into close contact with each other, and the inside of the adhesion chamber 20 may be evacuated, and then the two substrates S1 and S2 may be bonded together.

The airtightness of the upper chamber 22 and the lower chamber 24 closely contacted by the sealing member 50 such as an O-ring or the like provided around the upper surface of the lower chamber 24 is maintained at this time, Vacuum formation becomes possible.

When the upper substrate 22 is lifted up by the operation of the jack unit 42 as the chamber opening and closing mechanism 40, the upper chamber 22 is moved upward The two chambers 22 and 24 are separated from each other, and then the two bonded substrates are discharged to the outside.

Meanwhile, when two substrates S1 and S2 are to be bonded together using the above-described conventional substrate bonding apparatus, the spacing between the two substrates S1 and S2 is required to be very precisely aligned. That is, the first substrate S1 sucked by the upper platen 30 of the upper chamber 22 and the second substrate S2 sucked by the lower platen 32 of the lower chamber 24 are separated by the chamber opening / The first substrate S1 that is attracted to the upper surface plate 30 in a state of being as close as possible to the upper surface of the upper surface plate 30 or the lower surface plate 32 The two substrates S1 and S2 are adhered to each other by pressurization of the substrates S1 and S2 so that the intervals between the two substrates S1 and S2 are required to be very precisely aligned in parallel.

The upper chamber 22 is lifted and lowered by the chamber opening / closing mechanism 40 at any time. Such a chamber opening / closing mechanism 40 is provided at each corner of the lapping chamber 20, When the mechanism exhibits a difference in operation with other chamber opening / closing mechanisms, the parallelism of the upper chamber 22 can be displaced.

When the parallelism of the upper chamber 22 is deviated as described above, the upper surface of the upper substrate 30 is also displaced in parallel. Thus, the first substrate S1 attracted to the upper surface of the upper substrate 30 is also parallel The first substrate S1 is not accurately aligned with the second substrate S2 in a precise alignment state. When the first substrate S1 and the second substrate S2 are attached together, the surface pressure of the first substrate S1 is not constant So that the sequential adhesion is performed partly, not at the time of simultaneous full-joining, and the joining efficiency is very low.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a surface pressure measuring apparatus for measuring a surface pressure of an upper surface plate and a lower surface plate for adhering a first substrate and a second substrate, The purpose is to provide.

That is, the surface pressure of the lower surface plate and the surface of the upper surface plate are measured so that the lapping process is performed only when the surface pressure of the entire surface is constant. If the surface pressure of the entire surface does not match due to the inclination of a specific surface, The present invention provides a substrate pressure measuring apparatus for a substrate cementing apparatus and a substrate holding method using the same, which can minimize the occurrence of defects due to cementation, thereby improving the efficiency of the cementation process.

According to another aspect of the present invention, there is provided an apparatus for measuring surface pressure for a substrate cementing apparatus, comprising: an upper surface plate on which a first substrate is adsorbed and a lower surface plate on which a second substrate is adsorbed, And a surface pressure measuring device for measuring the surface pressure of the entire area in accordance with the close contact between the upper surface plate and the lower surface plate.

In this case, the surface pressure measuring apparatus may include: a plurality of load cells; And a central control unit electrically connected to the load cells to measure the surface pressure deviation when the upper and lower bases are in close contact with each other.

Here, the lower plate may support the plurality of load cells.

The upper plate may further include an upper plate mounted on the upper portion of the load cells and transmitting a contact load caused by the lowering of the upper plate to the load cells.

A gel layer having a predetermined thickness may be formed at the tip of the load cells to absorb a shock caused by a load.

The surface pressure measuring apparatus having such a configuration may be interposed between the upper and lower bases before the coalescing process of the two substrates, and may be stacked inside the lower bases, It may be possible to measure the surface pressure of the entire area in accordance with the adherence of the lower surface plate.

According to another aspect of the present invention, there is provided a substrate cohesion method using a substrate pressure measuring apparatus for a substrate cohesion apparatus, comprising the steps of: (a) interposing the surface pressure measuring apparatus between an upper surface plate and a lower surface plate; (b) measuring the surface pressure of the upper and lower bases by lowering the upper bases and bringing them into close contact with the lower bases; (c) if the surface pressure of the entire area measured by the surface pressure measuring apparatus is equal to or less than the reference deviation, removing the surface pressure measuring apparatus, and then performing a lapping process of the two substrates.

In this case, in the step (c), if the surface pressure of the total area according to the measurement of the surface pressure measuring apparatus is equal to or greater than the reference deviation, the height of the upper or lower surface plate is readjusted, , It is preferable to perform the laminating process of the two substrates.

As described above, according to the substrate pressure measuring apparatus for a substrate bonding apparatus and the substrate bonding method using the substrate pressure measuring apparatus according to the present invention, it is possible to measure the surface pressures of the upper and lower bases for bonding the first substrate and the second substrate to each other / RTI >

That is, when the surface pressure of the lower surface plate and the upper surface surface is measured, the adhesion process is performed only when the surface pressure of the entire surface is constant, and if the surface pressure of the entire surface is not coincident due to inclination of a specific surface, The adhesion process is performed at a later time, so that the occurrence of defects due to adhesion is minimized, and as a result, the efficiency of the adhesion process is improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a substrate adhering apparatus according to the present invention. FIG.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate adhering apparatus.
3A and 3B are perspective views illustrating an apparatus for measuring a surface pressure for a substrate cementing apparatus according to a first embodiment of the present invention.
4 is a cross-sectional view showing a state in which a surface pressure of a substrate adhering apparatus is measured using a surface pressure measuring apparatus for a substrate adhering apparatus according to a first embodiment of the present invention.
5 is a perspective view showing a surface pressure measuring apparatus for a substrate cementing apparatus according to a second embodiment of the present invention.
6 is a cross-sectional view showing a state in which a surface pressure of a substrate adhering apparatus is measured using a surface pressure measuring apparatus for a substrate adhering apparatus according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view illustrating a substrate adhering apparatus according to the present invention. FIG. 2 is a cross-sectional view illustrating a process of adhering a substrate using the substrate adhering apparatus shown in FIG. The laminating apparatus comprises a base frame 10 and a joining chamber 20 supported by the base frame 10 and composed of an upper chamber 22 and a lower chamber 24, Upper and lower bases 30 and 32 that are fixedly installed on the upper and lower chambers 24 and 24 to keep the substrates S1 and S2 to be adhered to each other in a fixed state, And a chamber opening / closing mechanism (40) for separating or bringing an opposed gap between the upper chamber (22) and the lower chamber (24) apart.

Each of the chamber opening and closing mechanisms 40 is installed at each corner of the lapping chamber 20 and each of the chamber opening and closing mechanisms 40 is supported by the base frame 10 and passes through the lower chamber 24 to receive the upper chamber 22 And a jack unit 42 or the like for raising.

The jack unit 42 is provided with a lifting rod 44 moving up and down in a state of passing through the lower chamber 24. The lifting rod 44 is in contact with the bottom surface of the upper chamber 22, ) To push up.

Therefore, the upper chamber 22 is spaced apart from or in close contact with the lower chamber 24 by the lifting and lowering of the lifting rod 44 by the operation of the jack unit 42 as the chamber opening / closing mechanism 40, It is possible to make the inside of the ligation chamber 20 in a vacuum state at the time of closing. Here, a sealing member 50 such as an O-ring is provided around the upper surface of the lower chamber 24 to completely seal the interior of the adhesion chamber 20.

A process of attaching two substrates using the substrate bonding apparatus having the above-described structure will be described below.

1, the upper chamber 22 is raised by the chamber opening / closing mechanism 40 so that the upper chamber 22 and the lower chamber 24 are spaced apart from each other and the first substrate S1 And the second substrate S2 are drawn into the adhesion chamber 20 and then the first substrate S1 and the second substrate S2 are adsorbed on the lower surface plate 32 and the upper surface plate 30, .

2, the upper chamber 22 is lowered by the lowering of the lifting rod 44 by the operation of the jack unit 42 as the chamber opening / closing mechanism 40, so that the upper chamber 22 The lower chamber 24 may be brought into close contact with each other, and the inside of the adhesion chamber 20 may be evacuated, and then the two substrates S1 and S2 may be bonded together.

The airtightness of the upper chamber 22 and the lower chamber 24 closely contacted by the sealing member 50 such as an O-ring or the like provided around the upper surface of the lower chamber 24 is maintained at this time, Vacuum formation becomes possible.

When the upper substrate 22 is lifted up by the operation of the jack unit 42 as the chamber opening and closing mechanism 40, the upper chamber 22 is moved upward The two chambers 22 and 24 are separated from each other, and then the two bonded substrates are discharged to the outside.

Meanwhile, when two substrates S1 and S2 are to be bonded together using the above-described substrate bonding apparatus, the spacing between the two substrates S1 and S2 is required to be very precisely aligned. That is, the first substrate S1 sucked by the upper platen 30 of the upper chamber 22 and the second substrate S2 sucked by the lower platen 32 of the lower chamber 24 are separated by the chamber opening / The first substrate S1 that is attracted to the upper surface plate 30 in a state of being as close as possible to the upper surface of the upper surface plate 30 or the lower surface plate 32 The two substrates S1 and S2 are adhered to each other by pressurization of the substrates S1 and S2 so that the intervals between the two substrates S1 and S2 are required to be very precisely aligned in parallel.

3A to 4, the surface pressure of the upper surface plate 30 and the lower surface plate 32 is first measured by using the surface pressure measuring apparatus 100 before the two substrates are bonded by using the substrate sticking apparatus. Measure.

3A and 3B are perspective views illustrating a surface pressure measuring apparatus according to a first embodiment of the present invention. As shown in the figure, the surface pressure measuring apparatus 100 includes a lower plate 120, A load cell 130 installed on the upper surface at regular intervals and an upper plate 110 installed on the upper portion of the load cell 130.

Here, it is preferable that the height of the upper plate 110 and the lower plate 120 is such that no height deviation is caused by precision machining.

In the drawings supporting the first embodiment of the present invention, the upper plate 110 and the lower plate 120 are shown as triangular plates, and the load cell 130 interposed between the plates 110 and 120 has three points However, the shape of the plates and the number of the load cells are not limited.

It is preferable that a plurality of the surface pressure measuring apparatuses 100 according to the second embodiment of the present invention as described above are provided as shown in FIG.

Here, each load cell 130 is electrically connected to a central control unit (not shown), so that each load is individually transmitted to the central control unit, which is displayed on the display or the like can do.

A process of attaching a substrate using the apparatus for measuring a surface pressure for a substrate bonding apparatus according to the first embodiment of the present invention will now be described.

The upper substrate 30 on which the first substrate S1 is adsorbed and the upper substrate 30 on which the second substrate S2 is adsorbed are bonded to the lower substrate 32 are measured.

That is, a plurality of the surface pressure measuring apparatuses 100 are placed on the upper surface of the lower table 32 and the upper chamber 22 to which the upper table 30 is fixed is lowered to the set position by using the chamber opening / closing mechanism 40 .

The upper surface plate 30 is lowered in conjunction with the lowering of the upper chamber 22 so that the upper surface plate 30 presses the surface pressure measuring device 100 placed on the upper surface of the lower surface plate 32. [

In other words, the surface pressure measuring apparatus 100 interposed between the upper and lower bases 30 and 32 is pressed and pressurized by the close contact between the upper surface plate 30 and the lower surface plate 32, Each load cell 130 of the load cells 100 is also subjected to a load, and each load received at that time is individually transmitted to the central control unit.

The central control device displays the load value transmitted from each of the load cells 130 through a display or the like so that the administrator can confirm the surface pressure of the upper and lower bases 30 and 32. [

At this time, when the load values transmitted from the load cells 130 are equal to each other or deviate within the reference value, it is determined that the surface pressure across the entire surface of the upper table 30 and the lower table 32 is satisfactory. The substrate pressure measuring apparatus 100 may be removed after the substrate holder 22 is raised as the chamber opening and closing mechanism 40 and then the process of laminating the two substrates S1 and S2 may be performed.

If the load value transmitted from each of the load cells 130 shows a deviation of more than the reference value, the manager confirms that the surface pressure is excessive or insufficient, By adjusting the height, the parallelism can be readjusted.

If the surface pressure of the upper surface plate 30 and the lower surface plate 32 are the same or the deviation is within the reference value, the lapping process may be performed thereafter.

≪ Embodiment 2 >

FIG. 5 is a perspective view illustrating a substrate pressure measuring apparatus for a substrate adherence apparatus according to a second embodiment of the present invention, FIG. 6 is a sectional view of a substrate adherence apparatus using a substrate pressure measuring apparatus for a substrate adherence apparatus according to a second embodiment of the present invention, Fig. 5 is a cross-sectional view showing a state in which the surface pressure of the substrate is measured.

 As shown in the drawing, the surface pressure measuring apparatus 200 according to the second embodiment of the present invention includes a lower plate 210, a load cell 220 installed at a predetermined interval on the upper surface of the lower plate 210, ).

Here, it is preferable that a gel layer 230 having a predetermined thickness is formed on the end portion of the load cell 220 which is in close contact with the upper surface plate 22 to absorb a shock due to a load.

Here, each of the load cells 220 is electrically connected to the central control unit so that each load is individually transmitted to the central control unit, and the central control unit can display the load through the display or the like.

A process for attaching a substrate using the apparatus for measuring a surface pressure for a substrate bonding apparatus according to a second embodiment of the present invention will now be described.

First, before the two substrates are bonded together by using the substrate bonding apparatus, the surface pressure of the upper surface plate 30 on which the first substrate is adsorbed and the lower surface plate 32 on which the second substrate is adsorbed is measured.

That is, the surface pressure measuring apparatus 200 is placed on the upper surface of the lower table 32 and the upper chamber 22 to which the upper table 30 is fixed is lowered to the set position by using the chamber opening / closing mechanism 40.

The upper surface plate 30 is lowered in conjunction with the lowering of the upper chamber 22 so that the upper surface plate 30 presses the surface pressure measuring device 200 placed on the upper surface of the lower surface plate 32. [

A gel layer 230 is formed on the front ends of the load cells 220 to be in direct contact with the bottom surface of the upper surface plate 30 of the surface pressure measuring apparatus 200. Thereby preventing damage and absorbing the impact.

In other words, the surface pressure measuring apparatus 200 interposed between the upper and lower bases 30 and 32 is pressed and subjected to pressure in accordance with the close contact between the upper surface plate 30 and the lower surface plate 32, Each load cell 220 of each load cell 200 is also subjected to a load, and each load received at that time is individually transmitted to the central control unit.

The central control device displays the load value transmitted from each of the load cells 220 through a display or the like so that the administrator can confirm the surface pressure of the upper table 30 and the lower table 32.

At this time, when the load values transmitted from the load cells 220 are equal to each other or deviate within a reference value, it is determined that the surface pressure across the entire surface of the upper table 30 and the lower table 32 is satisfactory. The surface pressure measuring device 200 may be removed after the substrate 22 is raised as the chamber opening / closing mechanism 40, and then the process of laminating the two substrates may be performed.

When the load value transmitted from each of the load cells 220 shows a deviation of more than the reference value, the manager confirms that the surface pressure of the part is excessive or insufficient, and then the upper table 30 or the lower table 32 By adjusting the height, the parallelism can be readjusted.

If the surface pressure of the upper surface plate 30 and the lower surface plate 32 are the same or the deviation is within the reference value, the lapping process may be performed thereafter.

For example, in the first embodiment of the present invention, the upper plate 110 is provided on the upper portion of the load cell 130. In the second embodiment, Layer 230 is formed on the top surface of the load cell 130. However, the present invention may be applied to the surface pressure measuring apparatus 100 according to the first embodiment in which the gel layer is formed on the tip of the load cell 130, In contrast, in the surface pressure measuring apparatus 200 according to the second embodiment, the gel layer 230 formed at the tip of the load cell 220 may be excluded and a configuration in which the upper plate is installed may be used.

Further, the surface pressure measuring apparatus may be provided in a configuration in which the configurations of the first embodiment and the second embodiment are combined. For example, in the first embodiment, a gel layer having a predetermined thickness may be formed at the tip of the load cell and an upper plate may be formed thereon. In the second embodiment, a gel layer having a predetermined thickness is formed at the tip of the load cell A separate upper plate may be provided thereon.

Meanwhile, in the embodiments of the present invention, the surface pressure measuring device is separately provided, and the surface pressure is measured between the upper and lower surfaces of the two substrates using the substrate cohesion device. However, The surface pressure measuring device according to the present invention may be arranged so as to be laminated inside the lower surface plate so that the surface pressure may be measured from time to time even during the process of the two substrates.

The technical ideas described in the embodiments of the present invention as described above may be independently performed, or may be implemented in combination with each other. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. It is possible. Accordingly, the technical scope of the present invention should be determined by the appended claims.

10: base frame 20: lapping chamber
22: upper chamber 24: lower chamber
30: upper plate 32: lower plate
40: chamber opening / closing mechanism 42: jack unit
44: lifting rod 50: sealing member
100, 200: surface pressure measuring apparatus 110: upper plate
120, 210: lower plate 130, 220: rod shell
230: Gel layer S1: First substrate
S2: second substrate

Claims (9)

1. A substrate adhering apparatus comprising an upper table and a lower table on which a first substrate is adsorbed and a lower table on which a second substrate is adsorbed,
And a surface pressure measuring device including a plurality of load cells for measuring the surface pressure of the entire area in accordance with the close contact between the upper and lower bases,
And a jell layer having a predetermined thickness is formed at the tip of the load cells to absorb an impact caused by a load.
The method according to claim 1,
The surface pressure measuring apparatus includes:
Further comprising a central control unit electrically connected to each of the load cells to measure the surface pressure deviation when the upper and lower bases are in close contact with each other.
3. The method of claim 2,
Further comprising a lower plate for supporting the plurality of load cells.
3. The method of claim 2,
And an upper plate which is seated on the upper portion of the load cells and transmits a contact load due to the lowering of the upper plate to each of the load cells.
delete 5. The method according to any one of claims 1 to 4,
Wherein the surface pressure measuring apparatus is interposed between the upper and lower bases before the coalescing process of the two substrates.
5. The method according to any one of claims 1 to 4,
Wherein the surface pressure measuring device is provided so as to be stacked in the lower table and measures the surface pressure of the entire area in accordance with the close contact between the upper and lower bases during the cohesion process of the two substrates. Device.
A method for attaching a substrate using the surface pressure measuring apparatus according to claim 6,
(a) interposing the surface pressure measuring device between an upper surface plate and a lower surface plate;
(b) measuring the surface pressure of the upper and lower bases by lowering the upper bases and bringing them into close contact with the lower bases;
(c) removing the surface pressure measuring device and performing a lapping process of the two substrates when the surface pressure of the entire surface area measured by the surface pressure measuring device is equal to or less than a reference deviation, A method of cementing a substrate using a surface pressure measuring apparatus.
9. The method of claim 8,
In the step (c)
When the surface pressure of the total area according to the measurement of the surface pressure measuring apparatus is equal to or more than the reference deviation, the height of the upper or lower surface plate is readjusted so that the surface pressure of the entire surface is equal to or less than the reference deviation, Wherein the substrate is attached to the substrate.

Images