JP2002261193A5 - - Google Patents

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Publication number
JP2002261193A5
JP2002261193A5 JP2001061600A JP2001061600A JP2002261193A5 JP 2002261193 A5 JP2002261193 A5 JP 2002261193A5 JP 2001061600 A JP2001061600 A JP 2001061600A JP 2001061600 A JP2001061600 A JP 2001061600A JP 2002261193 A5 JP2002261193 A5 JP 2002261193A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001061600A
Other languages
Japanese (ja)
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JP2002261193A (ja
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Publication date
Application filed filed Critical
Priority to JP2001061600A priority Critical patent/JP2002261193A/ja
Priority claimed from JP2001061600A external-priority patent/JP2002261193A/ja
Publication of JP2002261193A publication Critical patent/JP2002261193A/ja
Publication of JP2002261193A5 publication Critical patent/JP2002261193A5/ja
Pending legal-status Critical Current

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JP2001061600A 2001-03-06 2001-03-06 半導体装置の製造方法 Pending JP2002261193A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001061600A JP2002261193A (ja) 2001-03-06 2001-03-06 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001061600A JP2002261193A (ja) 2001-03-06 2001-03-06 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010086837A Division JP2010177692A (ja) 2010-04-05 2010-04-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002261193A JP2002261193A (ja) 2002-09-13
JP2002261193A5 true JP2002261193A5 (enExample) 2008-04-17

Family

ID=18920869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001061600A Pending JP2002261193A (ja) 2001-03-06 2001-03-06 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2002261193A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851214B2 (ja) * 2006-03-24 2012-01-11 株式会社ディスコ パッケージ基板の分割方法
JP5214911B2 (ja) * 2006-12-27 2013-06-19 株式会社デンソー モールドパッケージの製造方法
JP4627775B2 (ja) * 2007-12-27 2011-02-09 Okiセミコンダクタ株式会社 半導体装置の製造方法。
JP5610673B2 (ja) * 2008-04-15 2014-10-22 新日本無線株式会社 リードフレームの設計方法
WO2015111623A1 (ja) * 2014-01-22 2015-07-30 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN208805652U (zh) * 2018-10-30 2019-04-30 惠科股份有限公司 一种引脚组件及显示面板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769246A (en) * 1980-10-18 1982-04-27 Sumitomo Metal Ind Ltd Eddy current type method for judging abnormal quality of material
JPH0982833A (ja) * 1995-09-20 1997-03-28 Fujitsu Ltd 半導体装置の入出力電極形成方法と半導体装置
JP3611463B2 (ja) * 1998-10-27 2005-01-19 松下電器産業株式会社 電子部品の製造方法
JP2000286377A (ja) * 1999-03-30 2000-10-13 Sanyo Electric Co Ltd 半導体装置
JP2001077279A (ja) * 1999-09-01 2001-03-23 Matsushita Electronics Industry Corp リードフレームとそれを用いた樹脂封止型半導体装置の製造方法

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