JP2002261156A - 基板処理装置 - Google Patents

基板処理装置

Info

Publication number
JP2002261156A
JP2002261156A JP2001057711A JP2001057711A JP2002261156A JP 2002261156 A JP2002261156 A JP 2002261156A JP 2001057711 A JP2001057711 A JP 2001057711A JP 2001057711 A JP2001057711 A JP 2001057711A JP 2002261156 A JP2002261156 A JP 2002261156A
Authority
JP
Japan
Prior art keywords
susceptor
wafer
substrate
ashing
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001057711A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002261156A5 (enExample
Inventor
Yuji Yoshida
祐治 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2001057711A priority Critical patent/JP2002261156A/ja
Publication of JP2002261156A publication Critical patent/JP2002261156A/ja
Publication of JP2002261156A5 publication Critical patent/JP2002261156A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2001057711A 2001-03-02 2001-03-02 基板処理装置 Pending JP2002261156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001057711A JP2002261156A (ja) 2001-03-02 2001-03-02 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001057711A JP2002261156A (ja) 2001-03-02 2001-03-02 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007163389A Division JP2007294990A (ja) 2007-06-21 2007-06-21 基板処理装置

Publications (2)

Publication Number Publication Date
JP2002261156A true JP2002261156A (ja) 2002-09-13
JP2002261156A5 JP2002261156A5 (enExample) 2007-08-23

Family

ID=18917549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001057711A Pending JP2002261156A (ja) 2001-03-02 2001-03-02 基板処理装置

Country Status (1)

Country Link
JP (1) JP2002261156A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018170428A (ja) * 2017-03-30 2018-11-01 トヨタ自動車株式会社 ウェハ支持装置
JP2020533806A (ja) * 2017-09-13 2020-11-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板裏側の損傷の低減のための基板支持体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018170428A (ja) * 2017-03-30 2018-11-01 トヨタ自動車株式会社 ウェハ支持装置
JP2020533806A (ja) * 2017-09-13 2020-11-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板裏側の損傷の低減のための基板支持体
JP7438104B2 (ja) 2017-09-13 2024-02-26 アプライド マテリアルズ インコーポレイテッド 基板裏側の損傷の低減のための基板支持体
US11955362B2 (en) 2017-09-13 2024-04-09 Applied Materials, Inc. Substrate support for reduced damage substrate backside

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