JP2002246423A - Tape carrier and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the warp of a TAB tape carrier, due to the thermal expansion coefficients different between a copper foil and a tape base of the carrier and the influence of the viscoelasticity of adhesives. SOLUTION: A tape base 5 with adhesives 3 is provided on one side of a polyimide resin film and punched through, as specified, and a copper foil 2 is overlaid on the tape base by a roll laminator and etched to form a wiring pattern, or in addition, a solder resist is applied to manufacture a tape carrier for TABs. In this method, prior to bonding of the foil 2, the tape base 5 is left to absorb moisture in a high-humidity atmosphere at a relative humidity of 85% or higher and then the foil 2 is bonded using the roll laminator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display and a CSP.
(Chip Scale Package) TAB (Tape Automated Bon)
ding) tape or COF (Chip o) without device hole
The present invention relates to a structure of a tape carrier such as a TAB tape for n-film and a manufacturing method thereof.

[0002]

2. Description of the Related Art In general, a TAB tape carrier is formed, as in FIG. 1 (a) according to an embodiment of the present invention, on one side of a tape base material 4 made of a polyimide resin film via an adhesive 3 with a copper foil. 2 has a three-layer basic structure (single-sided copper-clad single-layer CCL using an adhesive).

Conventionally, this TAB tape carrier is prepared by punching a tape base with an adhesive provided with an adhesive on one side of a polyimide resin film into a perforated hole or a device hole by a press, and then adding a copper to the tape base. After bonding the foils with a roll laminator and curing the adhesive, the copper foil surface is exposed and etched to form a wiring pattern, and the wiring pattern is formed by applying a liquid solder resist.

More specifically, as shown in FIG. 9, a tape base material with an adhesive (a polyimide tape with an adhesive) 5 is unwound from an unwinding reel 11 while the protective film is wound around a reel 10. The unwound tape base material 5 with adhesive is passed through the preheat chamber 12 and then passed through a pair of a rubber roll 7 having no built-in heating device and an iron roll 8 having no built-in heating device. The sheet was superposed on a copper foil (thickness: 9 to 35 μm) unwound from 14 and roll-laminated.

[0005] The copper foil is coated with a photoresist, pre-cured, exposed, developed, and post-cured. The copper foil is etched to form a circuit wiring pattern, and then a liquid photo solder resist is applied. Or an epoxy-based solder resist is printed, exposed and developed, or post-baked to form an insulating protective film layer on the wiring of the circuit wiring pattern.

Based on the recognition that such a TAB tape carrier is warped due to the solder resist on one side, several techniques for eliminating the warp have been proposed. For example, Japanese Patent Application Laid-Open No. 4-28244 discloses that a correction resist layer made of the same material as a protective resist layer is formed on the opposite surface of a base tape to prevent the base tape from being warped when subjected to heat history. Techniques are disclosed. Japanese Patent Application Laid-Open No. 7-169793 discloses that an epoxy resin solder resist is applied on a circuit pattern on the surface of a polyimide film substrate, and an epoxy resin is applied on the back surface. By covering both sides of the substrate with epoxy resin, the adhesive strength with the highly reliable resin on the back side of the film base is increased to the same level as the adhesive strength on the front side, increasing the strength against surface pressing and warping. There is disclosed a technique for eliminating the problem.

[0007]

SUMMARY OF THE INVENTION However, TAB
In the tape carrier for use, warping that cannot be ignored is caused even due to a difference in thermal expansion coefficient between the tape base material of the insulating resin film and the copper foil bonded thereto.

That is, in general, a TAB tape carrier is prepared by laminating and curing a tape base made of a polyimide resin film with a copper foil having a thickness of 9 to 35 μm, and then applying a liquid photoresist to the tape base. Is exposed and developed to form a wiring circuit pattern of copper foil. However, in the copper foil laminating step, the tape substrate with the adhesive is exposed to an environment under the laminating and curing conditions shown in FIG. 10, and is heated to a considerably high laminating temperature and then returned to room temperature. At this time, the thermal expansion coefficient of the polyimide tape during lamination of the copper foil is smaller than that of the copper foil, and the curing shrinkage of the adhesive is large. The shape is not flat, and it warps like a rain doi with the copper foil inside. For this reason, even when a copper foil having a thickness of 18 μm is used, a fine pattern (50 μm pitch or less) cannot be uniformly etched, and the Cu wiring is short-circuited or disconnected, resulting in a product defect. .

Further, in the case of a TAB tape carrier for CSP / BGA, tape warpage is large and mounting productivity is poor.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and to reduce the warpage caused by the difference in the coefficient of thermal expansion between the copper foil of the TAB tape carrier and the tape substrate and the viscoelasticity of the adhesive. An object of the present invention is to provide a structure of a carrier and a manufacturing method thereof.

[0011]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

(1) A tape carrier according to the present invention comprises a tape base with an adhesive provided on one side of a resin film, a copper foil bonded to a tape base with a roll laminator, and a line pattern formed on the copper foil. Alternatively, in a TAB tape carrier in which the wiring pattern is protected by a solder resist film, the adhesive-backed tape base material absorbs moisture in a high humidity atmosphere having a relative humidity of 85% or more prior to bonding of the copper foil. It is characterized by comprising a tape base material provided with an adhesive (claim 1). The resin film is made of, for example, a polyimide resin film (claim 2).

(2) The method of manufacturing a tape carrier according to the present invention comprises the steps of: punching a tape substrate with an adhesive in which an adhesive is provided on one side of a polyimide resin film; After the adhesive is cured, the copper foil surface is exposed and etched to form a wiring pattern, or a method of manufacturing a TAB tape carrier in which a solder resist is further applied to the wiring pattern. Prior to bonding, the adhesive-backed tape base material is absorbed in a high-humidity atmosphere having a relative humidity of 85% or more, and then the copper foil is bonded by a roll laminator (claim 3). Here, the resin film is, for example, a polyimide resin film (claim 4).

In the method of manufacturing a tape carrier according to the present invention, the wiring pattern is plated directly with Sn, Ni, Au or the like (claim 5), or a liquid solder resist is applied to the wiring pattern and cured. After the processing, the wiring pattern portion exposed from the solder resist film may be plated with Sn, Ni, Au or the like (claim 6). Alternatively, electroless plating or electroplating may be performed on the wiring pattern, or a solder resist may be further applied to perform a hardening process (claim 7).

<Summary of the Invention> As described above, in the prior art, the shape of a TAB tape is affected by the low coefficient of thermal expansion of a polyimide tape when laminating a copper foil, and particularly by the effect of the viscoelasticity of a heat-resistant adhesive. Is not flat, and warps like a rain doi with the copper foil inside, resulting in poor flatness. Therefore, a fine pattern (pitch of 50 μm or less) cannot be made uniform, resulting in a product failure due to disconnection, short-circuit, and deviation of dimensional tolerance, and the like. Accordingly, the present invention is to improve these by making it possible to obtain a TAB tape with small warpage.

That is, the main point of the present invention is to solve the above-mentioned conventional problems by allowing the polyimide tape to absorb and expand before laminating the copper foil and then laminating the copper foil to return from the laminating temperature to room temperature. The thermal expansion difference between the adhesive and the copper foil is reduced, thereby improving the flatness of the shape of the TAB tape carrier.

In the case of using a polyimide resin film having a thickness of 50 μm as a tape base material and using a tape base material with an adhesive obtained by applying an adhesive to one surface of the tape base material (polyimide base material with an adhesive) Is as follows.

(1) Polyimide substrate with adhesive (50 μm)
When the copper foil is bonded and cured to the polyimide substrate with the adhesive after absorbing the moisture (m thickness), the warpage of the subsequent tape is reduced and flattened for the following reason.

That is, the polyimide resin film (50 μm thick) has a thermal expansion coefficient of 16 ppm / ° C. from 50 ° C. to 200 ° C. and a moisture expansion coefficient of 13 p.
pm /% RH (relative humidity). Curve A in FIG. 2 shows the case of a polyimide substrate with an adhesive obtained by applying an adhesive to one side of a product name “UPILEX S” manufactured by Ube Industries, Ltd. as a polyimide resin having a thickness of 50 μm. It shows the dimensional change rate, and its coefficient of hygroscopic expansion is 18.9 ppm /% RH (relative humidity).

On the other hand, the coefficient of thermal expansion of the copper foil is 50 ° C. to 20 ° C.
The temperature up to 0 ° C. is 16 ppm / ° C., and the thermal expansion coefficient of the adhesive is 110 ppm / ° C.

Therefore, 50% of the polyimide substrate with the adhesive is used.
μm thickness to expand by absorbing moisture, lamination temperature about 13
By reducing the amount of heat shrinkage to room temperature after bonding at 0 ° C., the warpage of the tape after bonding and curing the copper foil and the polyimide base material with the adhesive can be reduced and the tape can be flattened.

(2) The copper foil to be laminated and cured is, for example, an electrolytic or rolled foil having a thickness of 3 to 35 μm.
m. This copper foil may be an electrolytic or rolled foil which is available and whose roughness is controlled.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows the structure of a TAB tape carrier of the present invention and a method of manufacturing the same.

As shown in FIG. 1 (a), this TAB tape carrier 1 is bonded to a tape base material 5 having an adhesive by providing an adhesive 3 on one side of a tape base material 4 made of a polyimide resin film. Basic structure of three layers where copper foil 2 is bonded via agent 3 (single-sided copper bonded single layer CCL using adhesive)
have. The structure differs from the conventional one in that the tape base material 5 with the adhesive is placed at a relative humidity of 8 before bonding the copper foil 2.
It consists of a tape base material with an adhesive absorbed in an atmosphere of 5% or more.

FIGS. 1 (b1) to 1 (b5) show a method of manufacturing this TAB tape carrier.

As shown in FIG. 1 (b1), first, a tape base material 5 with an adhesive in which an adhesive 3 is provided on one surface of a tape base material 4 made of a polyimide resin film is prepared. Then, a perforated hole is formed in the tape base material 5 with the adhesive by pressing,
Necessary punching processing of via holes, device holes, and the like is performed (FIG. 1B2).

Next, prior to bonding the copper foil 2, the tape substrate 5 with the adhesive is expanded by absorbing moisture in a high temperature and high humidity atmosphere such as an 85% humidity atmosphere or a 95% humidity atmosphere (FIG. 1 (b3)). )).

Thereafter, the copper foil 2 is bonded to this with a roll laminator (FIG. 1 (b4)). That is, as shown in FIG. 5, instead of a pair of a rubber roll 9 in a roll laminator which does not incorporate a conventional heating device and an iron roll 8 which does not incorporate a heating device, an iron roll in which a heating device 15 is incorporated. A pair of a rubber roll 9 having a built-in 6 and a heating device 15 is provided, and the copper foil 2 is laminated and cured while heating the tape base 4 made of a polyimide resin film. During this process, the adhesive is also cured.

In this embodiment, both the iron roll and the rubber roll are heated. However, it is also possible to heat only the rubber roll in contact with the polyimide tape among the iron roll and the rubber roll. That is, the pair of the iron roll 6 and the rubber roll 9 need not include the heating device 15 in both, and for example, as shown in FIG.
A pair of iron rolls 8 without a built-in 5 can be used.

Next, a copper foil surface of the copper foil 2 is exposed and etched to form a wiring pattern, or a liquid solder resist is further applied to the wiring pattern to form a product TA.
Complete the tape carrier for B.

FIG. 3 shows a T for BGA (Ball Grid Array).
1 shows a wiring pattern (copper foil signal layer pattern) 20 of an AB tape carrier 21. FIG. 4 is a cross-sectional view of a part of the via hole 17 for a solder ball provided in the tape base 4.
And a solder ball pad 20a provided directly above the solder ball pad so as to close it. And this TAB
In the case of a tape carrier, the wiring pattern 20 is plated with Ni / Au 18 as shown in FIG. However, after applying the liquid solder resist 16 to the wiring pattern 20 and performing a hardening treatment, the wiring pattern portion exposed from the solder resist film (eg, the solder ball pad 20a).
Can be plated with Sn, Ni, Au, or the like.

[0033]

<Embodiment 1> FIG. 7 shows a TAB tape carrier according to a first embodiment of the present invention and a semiconductor device using the same.

The tape substrate 4 has a thickness of 50 μm and a width of 7
Using a 0 mm polyimide resin film, here "UPILEX S" (trade name, manufactured by Ube Industries, Ltd.), and coating the tape base 4 with an adhesive (trade name, "Hawakawa SP", manufactured by Hamakawa Paper Mills) as an epoxy adhesive 3 Thereby, a tape base material with an adhesive was obtained.

The polyimide tape (tape substrate with adhesive) to which the epoxy adhesive is adhered is punched to form a perforation and a CSP / BGA.
Via holes for forming solder balls (via holes 17 for solder balls) (300 μm diameter)
Was punched out with 144 holes. After that, 85 ° C x 95% humidity
After moisture absorption and expansion of the polyimide tape in RH, FQ-VLP foil copper foil (thickness foil 18 μm) manufactured by Mitsui Kinzoku Mining
The tape was laminated and cured, and then the copper foil surface was exposed and etched using a photo application to form a wiring pattern 20 (50 μm pitch) of the copper foil signal layer.

Next, after applying a liquid solder resist 16 to the wiring pattern 20 and subjecting the solder resist to a hardening treatment, the wiring pattern portion (the copper wiring is exposed) from the solder resist coating layer (solder resist film) is applied. (Exposed area) is electroplated with Ni and Au (Ni / Au plating 18) to a thickness of 1.0 μm and 0.4 μm, and TA
This was a completed tape carrier for B. However, a configuration in which the solder resist 16 is not applied may be adopted.

For comparison, as a conventional product, a tape base 4 made of a polyimide resin film having a thickness of 50 μm and a width of 70 mm in the above-described combination was applied to the epoxy adhesive 3
To form a tape substrate with an adhesive, without laminating and curing a copper foil 2 made of Mitsui Kinzoku Mining Co., Ltd. FQ-VLP foil copper foil thick foil 18 μm tape and then photo application Wiring pattern 2
A pattern having 0 (50 μm pitch) was prepared.

As a result, the tape carrier prepared by absorbing and expanding the polyimide tape according to the present invention by moisture absorption and expansion has a tape warpage of less than 1/2, less disconnection and short-circuit, and a resist surface caused by contact during the transfer of the photoresist. Rub was also reduced, and the yield was improved.

Next, using the TAB tape carrier, a semiconductor device package was assembled as shown in FIG. First, the semiconductor element (semiconductor chip) 24 is fixed to the plating pattern of the TAB tape carrier with the die attach agent 26, and then the element electrode of the semiconductor element 24 and the wiring pattern 2 are fixed.
0 is wire-bonded to the pad region (Ni / Au plating 18) where the copper wiring of No. 0 is exposed by the gold wire 22;
It was connected to the wiring pattern 20 of the TAB tape.

Next, one surface on the side of the semiconductor element 24 was transfer-molded with a transfer molding resin 28, and after curing, a solder ball 31 was mounted in the via hole 17 for a solder ball to obtain a finished product.

At this time, the tape carrier of the structure and the manufacturing method of the present invention has no trouble in transport due to warpage and no cracking of the semiconductor element due to the warpage of the tape, and has a resin leakage (transfer of the tape due to transfer molding on one side). ), Resulting in good assembly.

<Embodiment 2> FIG. 8 shows a TAB tape carrier according to a second embodiment of the present invention and a semiconductor device using the same.

As the tape substrate 4, a thickness of 50 μm and a width of 3
Using a 5 mm polyimide resin film "UPILEX S" (trade name, manufactured by Ube Industries, Ltd.), this tape base material 4 is coated with an epoxy-based adhesive 3 (trade name, "Hawakawa SP", an adhesive manufactured by Tomagawa Paper Mill). Thereby, a tape base material with an adhesive was obtained.

The polyimide tape (tape substrate with adhesive) to which the epoxy adhesive is bonded is punched to form a perforation, a device hole 32, and a CSP / BGA solder ball. 144 holes of the polyimide via hole (solder ball via hole 17) (300 μm diameter) were punched out.
After that, the polyimide tape is subjected to moisture absorption expansion in 85 ° C. × 85% RH, and then FQ-VL manufactured by Mitsui Kinzoku Mining.
Laminate and cure P foil copper foil (thickness foil 18μm) tape, then expose the copper foil surface by photo application.
After etching, the wiring pattern 20 (50
μm pitch).

Next, electroless Sn plating 19 was applied to the entire surface of the wiring pattern 20 to a thickness of 0.4 μm, and then a liquid solder resist 16 was applied to obtain a completed TAB tape carrier 1.

For comparison, as a conventional product, a tape base 4 made of a polyimide resin film having a thickness of 50 μm and a width of 35 mm in the above-mentioned combination was attached to the epoxy adhesive 3
To form a tape substrate with an adhesive, without laminating and curing a copper foil 2 made of Mitsui Kinzoku Mining Co., Ltd. FQ-VLP foil copper foil thick foil 18 μm tape and then photo application In inner lead 2
A wiring pattern 20 (pitch: 50 μm) including No. 5 was formed.

As a result, the tape carrier prepared by absorbing and expanding the polyimide tape according to the present invention by moisture absorption and expansion has a smaller tape warpage of less than ２, less disconnection and short-circuit, and a resist surface caused by contact during the transfer of the photoresist. Rub was also reduced, and the yield was improved.

Next, using the TAB tape carrier, a semiconductor device package was assembled as shown in FIG.

First, a semiconductor element 24 is provided at the position of the device hole 6 on the TAB tape carrier 1, and the protruding electrode (Au bump electrode 23) is connected to the inner lead 25.
And a flip chip / inner lead bonding (flip chip bonding) to connect to the wiring pattern 20 of the TAB tape.

Next, after this connection portion was sealed with a sealing resin 27, a stiffener 29 was provided via an adhesive 30, and a solder ball 31 was mounted thereon to obtain a completed semiconductor device package.

At this time, the tape carrier of the structure and the manufacturing method of the present invention has no trouble of transport due to warpage and no cracking of the semiconductor element due to the warpage of the tape, and has a resin leakage (transfer of the tape due to transfer molding on one side). ), Resulting in good assembly.

<Modification> T in the above embodiment (FIGS. 7 to 8)
In the AB tape carrier, the case where the product name “UPILEX S” manufactured by Ube Industries, Ltd. was used for the polyimide resin tape was used as an example, but the present invention is not limited to this. For example, a curve B shown in FIG. The present invention can be applied to a case where a TAB tape having a moisture absorption coefficient of “Kapton EN” manufactured by Toray Dupont Co., Ltd. is used.

Here, the functions and effects of the above embodiment (FIGS. 7 and 8) can be summarized as follows.

(1) Since the TAB tape carrier of this embodiment is made to absorb and expand the tape base material and bond it to the copper foil as described above, the amount of shrinkage when the copper foil is bonded and returned to room temperature is reduced. , Approach the shrinkage of copper foil and adhesive. For this reason,
The warpage of the tape can be controlled to be small, and as a result,
The etching yield of fine wiring is also improved, and T
An AB tape carrier can be supplied.

(2) Using the TAB tape carrier of this embodiment, the semiconductor element is fixed to the plating pattern with a die attach agent, and then wire-bonded to connect to the wiring of the TAB tape carrier. When a semiconductor device is assembled by transfer molding one side and mounting a solder ball after curing, compared with the case of using a conventional tape carrier that does not absorb and expand the tape base material, the manufacturing method of the present invention and its structure are There is no transfer trouble due to warpage, no cracking of semiconductor elements (chips) due to tape warpage, little resin leakage due to transfer molding on one side, and little distortion due to tape warpage, and good assembly can be performed.

(3) The tape carrier for TAB of this embodiment has a small tape warpage, so that the etching shape of fine wiring (50 μm pitch or less) is good, and the etching factor is improved to 3.5 or more. High migration resistance and excellent migration resistance.

(4) The TAB tape carrier of the present embodiment can control the thickness of the copper foil by the amount removed by etching, and can efficiently produce fine wirings having a pitch of 60 μm or less, and have a 40 μm pitch. Is easy to form, the slim design is possible, and the size reduction is easy.
A TAB tape carrier having a GA / CSP structure can be supplied.

<How to Use, Applied System, etc.> The tape carrier for TAB of the present invention has a small warpage of the tape so that the tape has an excellent warp shape, excellent migration resistance, and fine wiring (pitch: 60 μm or less) device hole. Beam lead type LC for flip chip connection, for BGA / CSP and with device holes
It can be applied to D (liquid crystal display).

[0059]

As described above, according to the present invention, the following excellent effects can be obtained.

(1) The tape carrier of the present invention (claim 1)
According to 2), since the tape base material is absorbed and expanded by moisture absorption and bonded to the copper foil, the shrinkage amount when the copper foil is bonded and returned to room temperature approaches the shrinkage amount of the copper foil and the adhesive. For this reason,
The warpage of the tape can be controlled to be small, and as a result,
The etching yield of fine wiring is also improved, and T
An AB tape carrier can be supplied.

The tape carrier of the present invention has a small tape warpage, so that the etching shape of fine wiring (50 μm pitch or less) is good, and the etching factor is improved to 3.5 or more, so that the insulation resistance is high and the tape resistance is high. Excellent migration characteristics.

In the TAB tape carrier of the present invention, the thickness of the copper foil can be controlled by the etching removal amount.
Since fine wiring with a pitch of μm or less can be efficiently produced, and the formation of wiring with a pitch of 40 μm is easy,
BGA ・ C which enables slim design and easy miniaturization
A TAB tape carrier having an SP structure can be supplied.

(2) According to the tape carrier manufacturing method of the present invention (claims 3 to 7), the tape substrate with the adhesive is subjected to a relative humidity of 85% or a relative humidity of 95 prior to the bonding of the copper foil.
% In a high-humidity atmosphere, and then bond the copper foil with a roll laminator, so that from the initial stage to the final stage of TAB tape carrier production, it is possible to handle tape carriers without warpage. This can contribute to improvement in efficiency of the entire process.

When manufacturing a semiconductor device package using this TAB tape carrier, there is no trouble in transport due to warpage, no breakage of semiconductor elements (chips) due to warpage of the tape, and one side is formed by transfer molding. There is little distortion due to resin leakage or tape warpage, and good assembly can be performed.

[Brief description of the drawings]

FIG. 1 is a view showing a basic structure of a TAB tape carrier of the present invention and a method of manufacturing the same.

FIG. 2 is a graph showing a dimensional expansion change rate due to moisture absorption of a polyimide resin film used as a tape base in an example of the present invention.

FIG. 3 is a plan view showing a wiring pattern surface of the TAB tape carrier for BGA according to the embodiment of the present invention.

4 is a TAB for BGA of FIG. 3 according to an embodiment of the present invention.
It is a fragmentary sectional view of a tape carrier.

FIG. 5 is a view showing a structure of a roll laminator for bonding a copper foil to a tape substrate with an adhesive in the present invention.

FIG. 6 is a view showing a modification of the roll laminator of FIG. 5;

FIG. 7 is a sectional view showing a TAB tape carrier according to the first embodiment of the present invention and a semiconductor device package using the same.

FIG. 8 is a sectional view showing a TAB tape carrier and a semiconductor device package using the same according to a second embodiment of the present invention.

FIG. 9 is a view showing a structure of a conventional roll laminator.

FIG. 10 is a view showing a conventional laminate curing condition.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 TAB tape carrier 2 Copper foil 3 Adhesive 4 Tape base 5 Tape base with adhesive 6 Iron roll 9 Rubber roll 15 Heating device 16 Solder resist 17 Solder ball via hole 18 Ni / Au plating 19 Sn plating 20 Wiring pattern 24 Semiconductor device 25 Inner lead 28 Transfer mold resin 29 Stiffener 31 Solder ball

Claims (7)

[Claims] 1. A copper foil is adhered to a tape substrate with an adhesive provided with an adhesive on one side of a resin film by a roll laminator, and a wiring pattern is formed on the copper foil. In a TAB tape carrier protected by a membrane, the adhesive-backed tape base material may be a tape-backed adhesive base material that has been absorbed in a high-humidity atmosphere having a relative humidity of 85% or more prior to the bonding of the copper foil. A tape carrier, comprising: 2. The tape carrier according to claim 1, wherein
A tape carrier, wherein the resin film comprises a polyimide resin film. 3. A required punching process is performed on a tape substrate with an adhesive in which an adhesive is provided on one side of a polyimide resin film, and then a copper foil is bonded thereto with a roll laminator, and the adhesive is cured. In a method for manufacturing a TAB tape carrier, wherein a wiring pattern is formed by exposing and etching a foil surface, or a solder resist is further applied to the wiring pattern, the tape base with the adhesive before the bonding of the copper foil In a high-humidity atmosphere having a relative humidity of 85% or more, and thereafter bonding the copper foil with a roll laminator. 4. A method according to claim 3, wherein said resin film comprises a polyimide resin film. 5. The method according to claim 3, wherein
A method of manufacturing a tape carrier, wherein plating of Sn, Ni, Au or the like is directly applied to the wiring pattern. 6. The method according to claim 3, wherein
After applying a liquid solder resist to the wiring pattern and subjecting the wiring pattern to a hardening treatment, the wiring pattern exposed from the solder resist film is plated with Sn, Ni, Au, or the like. Production method. 7. The method according to claim 3, wherein
A method for producing a tape carrier, wherein electroless plating or electroplating is performed on the wiring pattern, or a solder resist is further applied and cured.