JP2002221795A5 - - Google Patents

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JP2002221795A5
JP2002221795A5 JP2001017237A JP2001017237A JP2002221795A5 JP 2002221795 A5 JP2002221795 A5 JP 2002221795A5 JP 2001017237 A JP2001017237 A JP 2001017237A JP 2001017237 A JP2001017237 A JP 2001017237A JP 2002221795 A5 JP2002221795 A5 JP 2002221795A5
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Japan
Prior art keywords
substituted
resin
branched
linear
cyclic alkyl
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JP2001017237A
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Japanese (ja)
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JP2002221795A (en
JP4177966B2 (en
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Publication date
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Priority to JP2001017237A priority Critical patent/JP4177966B2/en
Priority claimed from JP2001017237A external-priority patent/JP4177966B2/en
Priority to TW90131827A priority patent/TW575789B/en
Priority to KR1020020003821A priority patent/KR100894260B1/en
Publication of JP2002221795A publication Critical patent/JP2002221795A/en
Publication of JP2002221795A5 publication Critical patent/JP2002221795A5/ja
Application granted granted Critical
Publication of JP4177966B2 publication Critical patent/JP4177966B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【特許請求の範囲】
【請求項1】 (A)活性光線又は放射線の照射により酸を発生する化合物、
(B)アルカリに対して不溶性又は難溶性であり、酸の作用により分解し、アルカリ現像液中での溶解度を増大させる樹脂
を含有するポジ型レジスト組成物において、
(B)の樹脂が少なくとも(B1)と(B2)の2種の樹脂の混合物からなり、そのそれぞれの分散度Mw/Mnを(B1M)及び(B2M)としたときに、9.9≧(B1M)/(B2M)≧1.3を満たすことを特徴とするポジ型フォトレジスト組成物。
【請求項2】 (B1)又は(B2)のうち少なくとも一方の樹脂が下記一般式(IV)及び(V)で表される繰り返し単位を含有することを特徴とする請求項1に記載のポジ型フォトレジスト組成物。
【化1】

Figure 2002221795
上記一般式中、Lは、水素原子、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。Zは、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。またZとLが結合して5又は6員環を形成してもよい。
【請求項3】 (B1)及び(B2)の両方の樹脂が下記一般式(IV)及び(V)で表される繰り返し単位を含有することを特徴とする請求項1又は2に記載のポジ型フォトレジスト組成物。
【化2】
Figure 2002221795
上記一般式中、Lは、水素原子、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。Zは、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。またZとLが結合して5又は6員環を形成してもよい。
【請求項4】 請求項1〜3のいずれかに記載のポジ型フォトレジスト組成物によりレジスト膜を形成し、当該レジスト膜を露光、現像することを特徴とするパターン形成方法。 [Claims]
(A) a compound that generates an acid upon irradiation with actinic rays or radiation,
(B) a positive resist composition containing a resin which is insoluble or hardly soluble in alkali, decomposes under the action of an acid, and increases solubility in an alkali developer;
When the resin (B) is composed of a mixture of at least two resins (B1) and (B2), and their respective dispersities Mw / Mn are (B1M) and (B2M), 9.9 ≧ ( (B1M) / (B2M) ≧ 1.3. A positive photoresist composition.
2. The positive electrode according to claim 1, wherein at least one of the resins (B1) and (B2) contains a repeating unit represented by the following general formulas (IV) and (V). -Type photoresist composition.
Embedded image
Figure 2002221795
In the above general formula, L represents a hydrogen atom, a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Z represents a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Further, Z and L may combine to form a 5- or 6-membered ring.
3. The positive resin according to claim 1, wherein both the resin (B1) and the resin (B2) contain repeating units represented by the following general formulas (IV) and (V). -Type photoresist composition.
Embedded image
Figure 2002221795
In the above general formula, L represents a hydrogen atom, a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Z represents a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Further, Z and L may combine to form a 5- or 6-membered ring.
4. A pattern forming method, comprising: forming a resist film from the positive photoresist composition according to claim 1; and exposing and developing the resist film.

JP2001017237A 2001-01-25 2001-01-25 Positive photoresist composition Expired - Fee Related JP4177966B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001017237A JP4177966B2 (en) 2001-01-25 2001-01-25 Positive photoresist composition
TW90131827A TW575789B (en) 2001-01-25 2001-12-21 Positive photoresist composition
KR1020020003821A KR100894260B1 (en) 2001-01-25 2002-01-23 Positive photoresist composition and patterning method with the use of the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001017237A JP4177966B2 (en) 2001-01-25 2001-01-25 Positive photoresist composition

Publications (3)

Publication Number Publication Date
JP2002221795A JP2002221795A (en) 2002-08-09
JP2002221795A5 true JP2002221795A5 (en) 2006-01-19
JP4177966B2 JP4177966B2 (en) 2008-11-05

Family

ID=18883473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001017237A Expired - Fee Related JP4177966B2 (en) 2001-01-25 2001-01-25 Positive photoresist composition

Country Status (3)

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JP (1) JP4177966B2 (en)
KR (1) KR100894260B1 (en)
TW (1) TW575789B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100620437B1 (en) 2005-01-17 2006-09-11 삼성전자주식회사 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition
TWI499581B (en) * 2010-07-28 2015-09-11 Sumitomo Chemical Co Photoresist composition
JP5898521B2 (en) * 2011-02-25 2016-04-06 住友化学株式会社 Resist composition and method for producing resist pattern
JP5852490B2 (en) * 2011-04-07 2016-02-03 住友化学株式会社 Resist composition and method for producing resist pattern
JP6005964B2 (en) * 2011-04-07 2016-10-12 住友化学株式会社 Resist composition and method for producing resist pattern
JP6022788B2 (en) * 2011-04-07 2016-11-09 住友化学株式会社 Resist composition and method for producing resist pattern
JP5934536B2 (en) * 2011-04-07 2016-06-15 住友化学株式会社 Resist composition and method for producing resist pattern
CN115803683A (en) * 2020-07-29 2023-03-14 富士胶片株式会社 Actinic-ray-or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0934112A (en) * 1995-05-12 1997-02-07 Sumitomo Chem Co Ltd Photoresist composition
EP0780732B1 (en) * 1995-12-21 2003-07-09 Wako Pure Chemical Industries Ltd Polymer composition and resist material
JP3890358B2 (en) * 1996-03-11 2007-03-07 富士フイルム株式会社 Positive photosensitive resin composition and pattern forming method
DE69821049T2 (en) * 1997-05-09 2004-10-21 Fuji Photo Film Co Ltd Positive-working photosensitive composition
JP3741330B2 (en) * 1997-07-15 2006-02-01 富士写真フイルム株式会社 Positive photoresist composition and pattern forming method using the same
JP3841375B2 (en) * 1997-11-26 2006-11-01 富士写真フイルム株式会社 Positive photoresist composition
JP2000181066A (en) * 1998-12-18 2000-06-30 Jsr Corp Radiation-sensitive resin composition
JP4161358B2 (en) * 1998-12-22 2008-10-08 Jsr株式会社 Radiation sensitive resin composition
JP4178645B2 (en) * 1999-02-09 2008-11-12 Jsr株式会社 Radiation sensitive resin composition
JP3963625B2 (en) * 1999-02-24 2007-08-22 富士フイルム株式会社 Positive photoresist composition
JP4281152B2 (en) * 1999-05-14 2009-06-17 Jsr株式会社 Sulphonic acid onium salt compound and radiation-sensitive resin composition

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