JP2002221795A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002221795A5 JP2002221795A5 JP2001017237A JP2001017237A JP2002221795A5 JP 2002221795 A5 JP2002221795 A5 JP 2002221795A5 JP 2001017237 A JP2001017237 A JP 2001017237A JP 2001017237 A JP2001017237 A JP 2001017237A JP 2002221795 A5 JP2002221795 A5 JP 2002221795A5
- Authority
- JP
- Japan
- Prior art keywords
- substituted
- resin
- branched
- linear
- cyclic alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
【特許請求の範囲】
【請求項1】 (A)活性光線又は放射線の照射により酸を発生する化合物、
(B)アルカリに対して不溶性又は難溶性であり、酸の作用により分解し、アルカリ現像液中での溶解度を増大させる樹脂
を含有するポジ型レジスト組成物において、
(B)の樹脂が少なくとも(B1)と(B2)の2種の樹脂の混合物からなり、そのそれぞれの分散度Mw/Mnを(B1M)及び(B2M)としたときに、9.9≧(B1M)/(B2M)≧1.3を満たすことを特徴とするポジ型フォトレジスト組成物。
【請求項2】 (B1)又は(B2)のうち少なくとも一方の樹脂が下記一般式(IV)及び(V)で表される繰り返し単位を含有することを特徴とする請求項1に記載のポジ型フォトレジスト組成物。
【化1】
上記一般式中、Lは、水素原子、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。Zは、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。またZとLが結合して5又は6員環を形成してもよい。
【請求項3】 (B1)及び(B2)の両方の樹脂が下記一般式(IV)及び(V)で表される繰り返し単位を含有することを特徴とする請求項1又は2に記載のポジ型フォトレジスト組成物。
【化2】
上記一般式中、Lは、水素原子、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。Zは、置換されてもよい、直鎖、分岐もしくは環状のアルキル基、又は置換されていてもよいアラルキル基を表す。またZとLが結合して5又は6員環を形成してもよい。
【請求項4】 請求項1〜3のいずれかに記載のポジ型フォトレジスト組成物によりレジスト膜を形成し、当該レジスト膜を露光、現像することを特徴とするパターン形成方法。
[Claims]
(A) a compound that generates an acid upon irradiation with actinic rays or radiation,
(B) a positive resist composition containing a resin which is insoluble or hardly soluble in alkali, decomposes under the action of an acid, and increases solubility in an alkali developer;
When the resin (B) is composed of a mixture of at least two resins (B1) and (B2), and their respective dispersities Mw / Mn are (B1M) and (B2M), 9.9 ≧ ( (B1M) / (B2M) ≧ 1.3. A positive photoresist composition.
2. The positive electrode according to claim 1, wherein at least one of the resins (B1) and (B2) contains a repeating unit represented by the following general formulas (IV) and (V). -Type photoresist composition.
Embedded image
In the above general formula, L represents a hydrogen atom, a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Z represents a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Further, Z and L may combine to form a 5- or 6-membered ring.
3. The positive resin according to claim 1, wherein both the resin (B1) and the resin (B2) contain repeating units represented by the following general formulas (IV) and (V). -Type photoresist composition.
Embedded image
In the above general formula, L represents a hydrogen atom, a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Z represents a linear, branched or cyclic alkyl group which may be substituted, or an aralkyl group which may be substituted. Further, Z and L may combine to form a 5- or 6-membered ring.
4. A pattern forming method, comprising: forming a resist film from the positive photoresist composition according to claim 1; and exposing and developing the resist film.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001017237A JP4177966B2 (en) | 2001-01-25 | 2001-01-25 | Positive photoresist composition |
TW90131827A TW575789B (en) | 2001-01-25 | 2001-12-21 | Positive photoresist composition |
KR1020020003821A KR100894260B1 (en) | 2001-01-25 | 2002-01-23 | Positive photoresist composition and patterning method with the use of the composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001017237A JP4177966B2 (en) | 2001-01-25 | 2001-01-25 | Positive photoresist composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002221795A JP2002221795A (en) | 2002-08-09 |
JP2002221795A5 true JP2002221795A5 (en) | 2006-01-19 |
JP4177966B2 JP4177966B2 (en) | 2008-11-05 |
Family
ID=18883473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001017237A Expired - Fee Related JP4177966B2 (en) | 2001-01-25 | 2001-01-25 | Positive photoresist composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4177966B2 (en) |
KR (1) | KR100894260B1 (en) |
TW (1) | TW575789B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100620437B1 (en) | 2005-01-17 | 2006-09-11 | 삼성전자주식회사 | Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition |
TWI499581B (en) * | 2010-07-28 | 2015-09-11 | Sumitomo Chemical Co | Photoresist composition |
JP5898521B2 (en) * | 2011-02-25 | 2016-04-06 | 住友化学株式会社 | Resist composition and method for producing resist pattern |
JP5852490B2 (en) * | 2011-04-07 | 2016-02-03 | 住友化学株式会社 | Resist composition and method for producing resist pattern |
JP6005964B2 (en) * | 2011-04-07 | 2016-10-12 | 住友化学株式会社 | Resist composition and method for producing resist pattern |
JP6022788B2 (en) * | 2011-04-07 | 2016-11-09 | 住友化学株式会社 | Resist composition and method for producing resist pattern |
JP5934536B2 (en) * | 2011-04-07 | 2016-06-15 | 住友化学株式会社 | Resist composition and method for producing resist pattern |
CN115803683A (en) * | 2020-07-29 | 2023-03-14 | 富士胶片株式会社 | Actinic-ray-or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0934112A (en) * | 1995-05-12 | 1997-02-07 | Sumitomo Chem Co Ltd | Photoresist composition |
EP0780732B1 (en) * | 1995-12-21 | 2003-07-09 | Wako Pure Chemical Industries Ltd | Polymer composition and resist material |
JP3890358B2 (en) * | 1996-03-11 | 2007-03-07 | 富士フイルム株式会社 | Positive photosensitive resin composition and pattern forming method |
DE69821049T2 (en) * | 1997-05-09 | 2004-10-21 | Fuji Photo Film Co Ltd | Positive-working photosensitive composition |
JP3741330B2 (en) * | 1997-07-15 | 2006-02-01 | 富士写真フイルム株式会社 | Positive photoresist composition and pattern forming method using the same |
JP3841375B2 (en) * | 1997-11-26 | 2006-11-01 | 富士写真フイルム株式会社 | Positive photoresist composition |
JP2000181066A (en) * | 1998-12-18 | 2000-06-30 | Jsr Corp | Radiation-sensitive resin composition |
JP4161358B2 (en) * | 1998-12-22 | 2008-10-08 | Jsr株式会社 | Radiation sensitive resin composition |
JP4178645B2 (en) * | 1999-02-09 | 2008-11-12 | Jsr株式会社 | Radiation sensitive resin composition |
JP3963625B2 (en) * | 1999-02-24 | 2007-08-22 | 富士フイルム株式会社 | Positive photoresist composition |
JP4281152B2 (en) * | 1999-05-14 | 2009-06-17 | Jsr株式会社 | Sulphonic acid onium salt compound and radiation-sensitive resin composition |
-
2001
- 2001-01-25 JP JP2001017237A patent/JP4177966B2/en not_active Expired - Fee Related
- 2001-12-21 TW TW90131827A patent/TW575789B/en not_active IP Right Cessation
-
2002
- 2002-01-23 KR KR1020020003821A patent/KR100894260B1/en not_active IP Right Cessation