JP2002303978A5 - - Google Patents

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Publication number
JP2002303978A5
JP2002303978A5 JP2001107305A JP2001107305A JP2002303978A5 JP 2002303978 A5 JP2002303978 A5 JP 2002303978A5 JP 2001107305 A JP2001107305 A JP 2001107305A JP 2001107305 A JP2001107305 A JP 2001107305A JP 2002303978 A5 JP2002303978 A5 JP 2002303978A5
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JP
Japan
Prior art keywords
resist composition
hydrocarbon group
formula
positive resist
composition according
Prior art date
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JP2001107305A
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Japanese (ja)
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JP4124978B2 (en
JP2002303978A (en
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Publication date
Priority claimed from JP2001107305A external-priority patent/JP4124978B2/en
Priority to JP2001107305A priority Critical patent/JP4124978B2/en
Application filed filed Critical
Priority to KR1020020017975A priority patent/KR100907268B1/en
Priority to TW091106744A priority patent/TW583511B/en
Priority to US10/114,985 priority patent/US7179578B2/en
Publication of JP2002303978A publication Critical patent/JP2002303978A/en
Publication of JP2002303978A5 publication Critical patent/JP2002303978A5/ja
Publication of JP4124978B2 publication Critical patent/JP4124978B2/en
Application granted granted Critical
Priority to KR1020080101728A priority patent/KR100920164B1/en
Priority to KR1020090069621A priority patent/KR100950508B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【特許請求の範囲】
【請求項1】 (A)脂肪族環状炭化水素基を側鎖に有し、酸の作用によりアルカリ現像液に対する溶解速度が増加する樹脂として、下記一般式(Ia)で表される繰り返し単位を含有する樹脂と一般式(Ib)で表される繰り返し単位を含有する樹脂、及び(B)活性光線又は放射線の照射により酸を発生する化合物を含有することを特徴とするポジ型レジスト組成物。
【化1】

Figure 2002303978
式(Ia)及び(Ib)中、R1は独立に水素原子又はアルキル基を表し、Aは連結基を表す。
式(Ia)中、R11は炭素数1〜4のアルキル基を表し、Zは炭素原子とともに脂環式炭化水素基を形成するのに必要な原子団を表す。
式(Ib)中、R12〜R14は、各々独立に炭化水素基を表し、但し、R12〜R14のうち少なくとも1つは脂環式炭化水素基を表す。
【請求項2】 更に、(C)フッ素系及び/又はシリコン系界面活性剤を含有することを特徴とする請求項1に記載のポジ型レジスト組成物。
【請求項3】 更に、(D)有機塩基性化合物を含有することを特徴とする請求項1又は請求項2に記載のポジ型レジスト組成物。
【請求項4】 請求項1〜3のいずれかに記載のポジ型レジスト組成物によりレジスト膜を形成し、当該レジスト膜を露光、現像することを特徴とするパターン形成方法。

[Claims]
(A) A resin having an aliphatic cyclic hydrocarbon group in a side chain and having a dissolution rate in an alkali developing solution increased by the action of an acid, a repeating unit represented by the following general formula (Ia): A positive resist composition comprising: a resin containing the compound; a resin containing a repeating unit represented by formula (Ib); and (B) a compound that generates an acid upon irradiation with actinic rays or radiation.
Embedded image
Figure 2002303978
In the formulas (Ia) and (Ib), R 1 independently represents a hydrogen atom or an alkyl group, and A represents a linking group.
In the formula (Ia), R 11 represents an alkyl group having 1 to 4 carbon atoms, and Z represents an atomic group necessary for forming an alicyclic hydrocarbon group together with the carbon atoms.
In the formula (Ib), R 12 to R 14 each independently represent a hydrocarbon group, provided that at least one of R 12 to R 14 represents an alicyclic hydrocarbon group.
2. The positive resist composition according to claim 1, further comprising (C) a fluorine-based and / or silicon-based surfactant.
3. The positive resist composition according to claim 1, further comprising (D) an organic basic compound.
4. A pattern forming method, comprising: forming a resist film from the positive resist composition according to claim 1, exposing and developing the resist film.

JP2001107305A 2001-04-05 2001-04-05 Positive resist composition Expired - Lifetime JP4124978B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001107305A JP4124978B2 (en) 2001-04-05 2001-04-05 Positive resist composition
KR1020020017975A KR100907268B1 (en) 2001-04-05 2002-04-02 Positive resist composition and pattern forming method using the same
TW091106744A TW583511B (en) 2001-04-05 2002-04-03 Positive resist composition
US10/114,985 US7179578B2 (en) 2001-04-05 2002-04-04 Positive resist composition
KR1020080101728A KR100920164B1 (en) 2001-04-05 2008-10-16 Positive resist composition and pattern forming method using the same
KR1020090069621A KR100950508B1 (en) 2001-04-05 2009-07-29 Positive resist composition and pattern forming method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001107305A JP4124978B2 (en) 2001-04-05 2001-04-05 Positive resist composition

Publications (3)

Publication Number Publication Date
JP2002303978A JP2002303978A (en) 2002-10-18
JP2002303978A5 true JP2002303978A5 (en) 2006-01-19
JP4124978B2 JP4124978B2 (en) 2008-07-23

Family

ID=18959642

Family Applications (1)

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JP2001107305A Expired - Lifetime JP4124978B2 (en) 2001-04-05 2001-04-05 Positive resist composition

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JP (1) JP4124978B2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003280710A1 (en) 2002-11-05 2004-06-07 Jsr Corporation Acrylic copolymer and radiation-sensitive resin composition
JP4225817B2 (en) 2003-03-31 2009-02-18 富士フイルム株式会社 Positive resist composition
JP4360836B2 (en) 2003-06-04 2009-11-11 富士フイルム株式会社 Positive resist composition
JP4300420B2 (en) 2004-06-21 2009-07-22 信越化学工業株式会社 Polymer compound, resist material, and pattern forming method
JP4274057B2 (en) * 2004-06-21 2009-06-03 信越化学工業株式会社 Polymer compound, resist material, and pattern forming method
JP4485913B2 (en) * 2004-11-05 2010-06-23 東京応化工業株式会社 Method for producing resist composition and resist composition
JP4881686B2 (en) 2005-12-09 2012-02-22 富士フイルム株式会社 Positive resist composition and pattern forming method using the same
JP4881687B2 (en) 2005-12-09 2012-02-22 富士フイルム株式会社 Positive resist composition and pattern forming method using the same
JP5019055B2 (en) * 2006-01-25 2012-09-05 日産化学工業株式会社 Positive photosensitive resin composition and cured film obtained therefrom
JP4832237B2 (en) * 2006-09-27 2011-12-07 富士フイルム株式会社 Positive resist composition and pattern forming method using the same
JP4621754B2 (en) 2007-03-28 2011-01-26 富士フイルム株式会社 Positive resist composition and pattern forming method
EP1975716B1 (en) 2007-03-28 2013-05-15 Fujifilm Corporation Positive resist composition and pattern forming method
EP1975714A1 (en) 2007-03-28 2008-10-01 FUJIFILM Corporation Positive resist composition and pattern forming method
JP5434906B2 (en) * 2008-03-04 2014-03-05 Jsr株式会社 Radiation sensitive composition, polymer and monomer
JP2011075750A (en) * 2009-09-30 2011-04-14 Jsr Corp Radiation sensitive resin composition for chemically amplified resist and polymer
JP2013088763A (en) * 2011-10-21 2013-05-13 Jsr Corp Photoresist composition

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