JP2003262952A5 - - Google Patents

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JP2003262952A5
JP2003262952A5 JP2002065444A JP2002065444A JP2003262952A5 JP 2003262952 A5 JP2003262952 A5 JP 2003262952A5 JP 2002065444 A JP2002065444 A JP 2002065444A JP 2002065444 A JP2002065444 A JP 2002065444A JP 2003262952 A5 JP2003262952 A5 JP 2003262952A5
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Japan
Prior art keywords
integer
general formula
film
acid
photosensitive composition
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JP2002065444A
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Japanese (ja)
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JP3860053B2 (en
JP2003262952A (en
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Priority to JP2002065444A priority Critical patent/JP3860053B2/en
Priority claimed from JP2002065444A external-priority patent/JP3860053B2/en
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Publication of JP2003262952A5 publication Critical patent/JP2003262952A5/ja
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Claims (2)

（Ａ）活性光線又は放射線の照射により酸を発生する化合物、
（Ｂ）酸の作用により分解し、アルカリ現像液中での溶解度が増大する樹脂、及び
（Ｃ）下記一般式（１）で表されるモノマーに由来する繰り返し単位を含有するフルオロ脂肪族基含有重合体を含有することを特徴とするポジ型感光性組成物。
Figure 2003262952
一般式（１）においてＲ1は水素原子またはメチル基を表し、Ｘは酸素原子、イオウ原子または−Ｎ（Ｒ2）−を表し、ｍは１以上６以下の整数、ｎは２〜４の整数を表す。Ｒ2は水素原子または炭素数１〜４のアルキル基を表す。(A) a compound that generates an acid upon irradiation with an actinic ray or radiation,
(B) Resin that decomposes by the action of an acid and increases the solubility in an alkaline developer, and (C) A fluoroaliphatic group containing a repeating unit derived from a monomer represented by the following general formula (1) A positive photosensitive composition comprising a polymer.
Figure 2003262952
 In the general formula (1), R 1 represents a hydrogen atom or a methyl group, X represents an oxygen atom, a sulfur atom or —N (R 2 ) —, m is an integer of 1-6, and n is 2-4. Represents an integer. R 2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. 請求項１に記載のポジ型感光性組成物により膜を形成し、当該膜を露光、現像することを特徴とするパターン形成方法。A pattern forming method comprising: forming a film from the positive photosensitive composition according to claim 1; and exposing and developing the film.
JP2002065444A 2002-03-11 2002-03-11 Positive photosensitive composition Expired - Fee Related JP3860053B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002065444A JP3860053B2 (en) 2002-03-11 2002-03-11 Positive photosensitive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002065444A JP3860053B2 (en) 2002-03-11 2002-03-11 Positive photosensitive composition

Publications (3)

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JP2003262952A JP2003262952A (en) 2003-09-19
JP2003262952A5 true JP2003262952A5 (en) 2005-04-07
JP3860053B2 JP3860053B2 (en) 2006-12-20

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JP2002065444A Expired - Fee Related JP3860053B2 (en) 2002-03-11 2002-03-11 Positive photosensitive composition

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906268B2 (en) 2004-03-18 2011-03-15 Fujifilm Corporation Positive resist composition for immersion exposure and pattern-forming method using the same
JP4448782B2 (en) * 2004-03-18 2010-04-14 富士フイルム株式会社 Positive resist composition for immersion exposure and pattern forming method using the same
JP4740666B2 (en) * 2004-07-07 2011-08-03 富士フイルム株式会社 Positive resist composition for immersion exposure and pattern forming method using the same
EP1621927B1 (en) 2004-07-07 2018-05-23 FUJIFILM Corporation Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same
US20070059636A1 (en) * 2005-09-12 2007-03-15 Konica Minolta Medical & Graphic, Inc. Light sensitive planographic printing plate material
JP4691442B2 (en) * 2005-12-09 2011-06-01 富士フイルム株式会社 Positive resist composition and pattern forming method using the same
JP4912733B2 (en) 2006-02-17 2012-04-11 東京応化工業株式会社 Resist composition for immersion exposure and method for forming resist pattern
JP4961374B2 (en) * 2007-03-28 2012-06-27 富士フイルム株式会社 Positive resist composition and pattern forming method
JP5427436B2 (en) * 2009-02-26 2014-02-26 富士フイルム株式会社 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the composition
JP5277022B2 (en) * 2009-02-26 2013-08-28 富士フイルム株式会社 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the composition
JP5191567B2 (en) * 2011-01-12 2013-05-08 富士フイルム株式会社 Positive photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
TWI602015B (en) 2012-07-18 2017-10-11 住友化學股份有限公司 Photoresist composition and method for producing photoresist pattern
JP6327791B2 (en) * 2013-03-29 2018-05-23 株式会社ネオス Fluoropolymer and surface treatment agent containing the same
JP6252157B2 (en) * 2013-12-16 2017-12-27 住友化学株式会社 Resist composition and method for producing resist pattern

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