JP2002217579A - 回路基板を静電気放電及び機械的損傷から保護するための方法及びシステム - Google Patents

回路基板を静電気放電及び機械的損傷から保護するための方法及びシステム

Info

Publication number
JP2002217579A
JP2002217579A JP2001385632A JP2001385632A JP2002217579A JP 2002217579 A JP2002217579 A JP 2002217579A JP 2001385632 A JP2001385632 A JP 2001385632A JP 2001385632 A JP2001385632 A JP 2001385632A JP 2002217579 A JP2002217579 A JP 2002217579A
Authority
JP
Japan
Prior art keywords
circuit board
shield
electrostatic discharge
mechanical damage
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001385632A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002217579A5 (enExample
Inventor
Michal P Warzecha
マイケル・ピー・ワルツェーシャ
Herbert J Tanzer
ハーバート・ジェイ・タンザー
Timothy M Sheridon
ティモシー・エム・シェリドン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2002217579A publication Critical patent/JP2002217579A/ja
Publication of JP2002217579A5 publication Critical patent/JP2002217579A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2001385632A 2000-12-22 2001-12-19 回路基板を静電気放電及び機械的損傷から保護するための方法及びシステム Pending JP2002217579A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/746887 2000-12-22
US09/746,887 US6496386B2 (en) 2000-12-22 2000-12-22 Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment

Publications (2)

Publication Number Publication Date
JP2002217579A true JP2002217579A (ja) 2002-08-02
JP2002217579A5 JP2002217579A5 (enExample) 2005-07-28

Family

ID=25002781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001385632A Pending JP2002217579A (ja) 2000-12-22 2001-12-19 回路基板を静電気放電及び機械的損傷から保護するための方法及びシステム

Country Status (4)

Country Link
US (1) US6496386B2 (enExample)
JP (1) JP2002217579A (enExample)
SG (1) SG93293A1 (enExample)
TW (1) TW518928B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100594454B1 (ko) 2004-10-07 2006-06-30 엘지전자 주식회사 이동단말기용 인쇄회로기판 장치
JP2008258371A (ja) * 2007-04-04 2008-10-23 Canon Inc 電子機器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004030837A (ja) * 2002-06-27 2004-01-29 Toshiba Corp 記憶装置および電子機器
US7280358B2 (en) * 2004-04-19 2007-10-09 Hewlett-Packard Development Company, L.P. Liquid loop with multiple heat exchangers for efficient space utilization
US7002799B2 (en) * 2004-04-19 2006-02-21 Hewlett-Packard Development Company, L.P. External liquid loop heat exchanger for an electronic system
US6997247B2 (en) * 2004-04-29 2006-02-14 Hewlett-Packard Development Company, L.P. Multiple-pass heat exchanger with gaps between fins of adjacent tube segments
CN101005740A (zh) * 2006-01-17 2007-07-25 华硕电脑股份有限公司 电子装置
US7135644B1 (en) * 2006-02-01 2006-11-14 International Business Machines Corporation Permeable conductive shield having a laminated structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710514C2 (de) * 1997-03-13 2001-06-28 Itt Mfg Enterprises Inc Steckkarte für elektronische Geräte

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100594454B1 (ko) 2004-10-07 2006-06-30 엘지전자 주식회사 이동단말기용 인쇄회로기판 장치
JP2008258371A (ja) * 2007-04-04 2008-10-23 Canon Inc 電子機器

Also Published As

Publication number Publication date
TW518928B (en) 2003-01-21
US20020080591A1 (en) 2002-06-27
SG93293A1 (en) 2002-12-17
US6496386B2 (en) 2002-12-17

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