TW518928B - Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external - Google Patents

Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external Download PDF

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Publication number
TW518928B
TW518928B TW090129969A TW90129969A TW518928B TW 518928 B TW518928 B TW 518928B TW 090129969 A TW090129969 A TW 090129969A TW 90129969 A TW90129969 A TW 90129969A TW 518928 B TW518928 B TW 518928B
Authority
TW
Taiwan
Prior art keywords
circuit board
board
heat
fixed
scope
Prior art date
Application number
TW090129969A
Other languages
English (en)
Chinese (zh)
Inventor
Michal P Warzecha
Herbert J Tanzer
Timothy M Sheridon
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of TW518928B publication Critical patent/TW518928B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067Devices for protecting against damage from electrostatic discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
TW090129969A 2000-12-22 2001-12-04 Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external TW518928B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/746,887 US6496386B2 (en) 2000-12-22 2000-12-22 Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment

Publications (1)

Publication Number Publication Date
TW518928B true TW518928B (en) 2003-01-21

Family

ID=25002781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129969A TW518928B (en) 2000-12-22 2001-12-04 Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external

Country Status (4)

Country Link
US (1) US6496386B2 (enExample)
JP (1) JP2002217579A (enExample)
SG (1) SG93293A1 (enExample)
TW (1) TW518928B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004030837A (ja) * 2002-06-27 2004-01-29 Toshiba Corp 記憶装置および電子機器
US7280358B2 (en) * 2004-04-19 2007-10-09 Hewlett-Packard Development Company, L.P. Liquid loop with multiple heat exchangers for efficient space utilization
US7002799B2 (en) * 2004-04-19 2006-02-21 Hewlett-Packard Development Company, L.P. External liquid loop heat exchanger for an electronic system
US6997247B2 (en) * 2004-04-29 2006-02-14 Hewlett-Packard Development Company, L.P. Multiple-pass heat exchanger with gaps between fins of adjacent tube segments
KR100594454B1 (ko) 2004-10-07 2006-06-30 엘지전자 주식회사 이동단말기용 인쇄회로기판 장치
CN101005740A (zh) * 2006-01-17 2007-07-25 华硕电脑股份有限公司 电子装置
US7135644B1 (en) * 2006-02-01 2006-11-14 International Business Machines Corporation Permeable conductive shield having a laminated structure
JP5142573B2 (ja) * 2007-04-04 2013-02-13 キヤノン株式会社 電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710514C2 (de) * 1997-03-13 2001-06-28 Itt Mfg Enterprises Inc Steckkarte für elektronische Geräte

Also Published As

Publication number Publication date
JP2002217579A (ja) 2002-08-02
US20020080591A1 (en) 2002-06-27
SG93293A1 (en) 2002-12-17
US6496386B2 (en) 2002-12-17

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees