JP2002217156A - ドライ洗浄装置 - Google Patents

ドライ洗浄装置

Info

Publication number
JP2002217156A
JP2002217156A JP2001007157A JP2001007157A JP2002217156A JP 2002217156 A JP2002217156 A JP 2002217156A JP 2001007157 A JP2001007157 A JP 2001007157A JP 2001007157 A JP2001007157 A JP 2001007157A JP 2002217156 A JP2002217156 A JP 2002217156A
Authority
JP
Japan
Prior art keywords
processed
dry cleaning
cleaning apparatus
gas
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001007157A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002217156A5 (https=
Inventor
Yoshinori Momoi
義典 桃井
Katanobu Yokogawa
賢悦 横川
Masaru Izawa
勝 伊澤
Shinichi Taji
新一 田地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2001007157A priority Critical patent/JP2002217156A/ja
Priority to KR10-2001-0012210A priority patent/KR100440380B1/ko
Priority to US09/809,202 priority patent/US6643893B2/en
Priority to TW090106334A priority patent/TW518258B/zh
Publication of JP2002217156A publication Critical patent/JP2002217156A/ja
Publication of JP2002217156A5 publication Critical patent/JP2002217156A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2001007157A 2001-01-16 2001-01-16 ドライ洗浄装置 Pending JP2002217156A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001007157A JP2002217156A (ja) 2001-01-16 2001-01-16 ドライ洗浄装置
KR10-2001-0012210A KR100440380B1 (ko) 2001-01-16 2001-03-09 드라이 세정장치
US09/809,202 US6643893B2 (en) 2001-01-16 2001-03-16 Apparatus for cleaning semiconductor wafers in a vacuum environment
TW090106334A TW518258B (en) 2001-01-16 2001-03-19 Dry cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001007157A JP2002217156A (ja) 2001-01-16 2001-01-16 ドライ洗浄装置

Publications (2)

Publication Number Publication Date
JP2002217156A true JP2002217156A (ja) 2002-08-02
JP2002217156A5 JP2002217156A5 (https=) 2005-07-07

Family

ID=18874941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001007157A Pending JP2002217156A (ja) 2001-01-16 2001-01-16 ドライ洗浄装置

Country Status (4)

Country Link
US (1) US6643893B2 (https=)
JP (1) JP2002217156A (https=)
KR (1) KR100440380B1 (https=)
TW (1) TW518258B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104014525A (zh) * 2014-05-24 2014-09-03 苏州昊枫环保科技有限公司 基于主机wifi无线智能控制的翻转电磁除尘系统

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925088B2 (ja) * 2001-01-16 2007-06-06 株式会社日立製作所 ドライ洗浄方法
DE50208448D1 (de) * 2002-05-31 2006-11-23 Trt Oil Off Gmbh Trockenreinigungsanlage für werkstücke
CH696188A5 (de) * 2002-07-29 2007-02-15 Brooks Pri Automation Switzerl Detektions- und Reinigungsvorrichtung in einer Handhabungsvorrichtung für Photomasken.
KR100542740B1 (ko) 2002-11-11 2006-01-11 삼성전자주식회사 가스 플라즈마 생성 방법 및 장치, 플라즈마 생성용 가스조성물 및 이를 이용한 반도체 장치의 제조 방법
US6843833B2 (en) * 2003-06-16 2005-01-18 Powerchip Semiconductor Corp. Front opening unified pod and associated method for preventing outgassing pollution
US7353560B2 (en) * 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
JP2007000824A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd 異物除去装置
US8695156B2 (en) * 2010-02-10 2014-04-15 Jeffrey S. Marshall Aeroacoustic duster
US9646859B2 (en) * 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
CN102343343B (zh) * 2011-10-02 2013-04-10 广州市嘉特斯机电制造有限公司 内孔干式清洗机及其清洗方法
WO2013112196A1 (en) * 2012-01-24 2013-08-01 Applied Materials, Inc. Cleaning module and process for particle reduction
US20130196572A1 (en) * 2012-01-27 2013-08-01 Sen-Hou Ko Conditioning a pad in a cleaning module
JP6700150B2 (ja) * 2016-10-03 2020-05-27 東京エレクトロン株式会社 パーティクル捕集装置、パーティクル捕集方法、およびパーティクル捕集システム
CN112845372B (zh) * 2020-12-31 2022-05-03 中国工程物理研究院激光聚变研究中心 光学元件疵病的抑制设备及方法
US20230215721A1 (en) * 2022-01-05 2023-07-06 STATS ChipPAC Pte. Ltd. Semiconductor Manufacturing Equipment and Method of Expelling Residue Through Suction Hood
CN115351012A (zh) * 2022-08-18 2022-11-18 东莞汇乐技术股份有限公司 一种结合超声波和气体除尘的干式除尘器
CN119593071B (zh) * 2025-02-05 2025-05-02 江苏中鲈科技发展股份有限公司 一种喷丝板用脉冲吹扫清洁装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
US5413954A (en) * 1992-11-10 1995-05-09 At&T Bell Laboratories Method of making a silicon-based device comprising surface plasma cleaning
JP3348804B2 (ja) 1994-09-20 2002-11-20 株式会社日立製作所 エッチング後処理方法
JP3563462B2 (ja) 1994-11-15 2004-09-08 松下エコシステムズ株式会社 活性空気による乾式洗浄方法とその装置、および除電方法
JPH0917776A (ja) 1995-06-27 1997-01-17 Sony Corp 半導体装置の製造方法及び半導体製造装置
JPH0964000A (ja) * 1995-08-18 1997-03-07 Matsushita Electric Ind Co Ltd ドライ洗浄装置
US5849135A (en) * 1996-03-12 1998-12-15 The Regents Of The University Of California Particulate contamination removal from wafers using plasmas and mechanical agitation
JPH09299889A (ja) * 1996-05-09 1997-11-25 Shimada Phys & Chem Ind Co Ltd 洗浄装置
KR19980026063A (ko) * 1996-10-07 1998-07-15 김광호 반도체 장치의 건식 세정 장치
JPH10294261A (ja) * 1997-04-18 1998-11-04 Sony Corp レジスト塗布装置
JPH1131672A (ja) * 1997-07-10 1999-02-02 Hitachi Ltd 基板処理方法および基板処理装置
US6308361B1 (en) * 1998-07-28 2001-10-30 Ebara Corporation Cleaning apparatus
KR100335485B1 (ko) * 1999-07-02 2002-05-04 윤종용 화학적-기계적 폴리싱 장치 및 방법
US6436303B1 (en) * 1999-07-21 2002-08-20 Applied Materials, Inc. Film removal employing a remote plasma source
US6148471A (en) * 1999-09-14 2000-11-21 Kern; Daniel Precision lens bond tester/particulate removal apparatus for optical subassemblies
KR100439253B1 (ko) * 2000-05-13 2004-07-05 주식회사 선익시스템 다 기능성 반응기
US6490746B1 (en) * 2000-07-24 2002-12-10 Eastman Kodak Company Apparatus and method for cleaning objects having generally irregular, undulating surface features
US6543078B1 (en) * 2000-07-24 2003-04-08 Eastman Kodak Company Apparatus and method for cleaning object having generally irregular surface features

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104014525A (zh) * 2014-05-24 2014-09-03 苏州昊枫环保科技有限公司 基于主机wifi无线智能控制的翻转电磁除尘系统

Also Published As

Publication number Publication date
KR100440380B1 (ko) 2004-07-14
TW518258B (en) 2003-01-21
US20020092121A1 (en) 2002-07-18
US6643893B2 (en) 2003-11-11
KR20020061451A (ko) 2002-07-24

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