JP2002158423A - Structure of printed wiring board and electrolytic plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the wiring accommodation property of a printed wiring board being subjected to electrolytic plating while reducing the manhour for the production. SOLUTION: Each wiring pattern 2 is arranged on a printed wiring board 1 such that each bonding pad 3 is directed in a specified direction. A lead 6 projects from the tip part 3a of each bonding pad 3. The lead 6 serves as a part for connecting a power supply at the time of applying electrolytic plating to the bonding pad 3. A rectangular electrode 7 is shaped such that it can touch all leads 6 simultaneously. The electrode 7 is made of pure copper and is connected to a power supply 8. At the time of applying electrolytic plating to each bonding pad 3, the bonding pad 3 is fed with a current from the power supply 8 through the electrode 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a printed wiring board on which electronic parts are mounted and subjected to surface treatment by electrolytic plating, and more particularly to a method of electrolytic plating on the printed wiring board.

[0002]

2. Description of the Related Art Conventionally, in a printed wiring board, the so-called sticking of the bonding pads is improved by applying electrolytic plating to the bonding pads of the mounted wiring pattern. A printed wiring board on which such electrolytic plating is performed is provided with a lead for supplying a current for plating. The plating lead is provided for each wiring pattern from the wiring pattern to the end of the printed wiring board. When plating is performed, a current is supplied from the power supply to the bonding pads of the wiring pattern from the power supply through the plating leads while the printed wiring board is placed in the plating bath.

[0003]

However, in the above-mentioned conventional printed wiring board on which electrolytic plating is performed, plating leads must be provided up to the end of the printed wiring board for each wiring pattern. The connection between the power supply and each plating lead was also difficult. When the printed wiring board is placed in a plating bath and plating is performed, wiring processing for connecting a power supply and each plating lead is also a complicated operation.

[0004]

In order to solve the above-mentioned problems, a printed wiring board according to the present invention is one in which a bonding pad of a wiring pattern is plated, wherein an electrode can contact a bonding pad of a plurality of wiring patterns. It is characterized in that each wiring pattern is arranged such that Leads protruding from the bonding pads of each wiring pattern are arranged so that the electrodes can contact the leads.

In a method of electrolytic plating a printed wiring board according to the present invention, a method for electroplating bonding pads of a plurality of wiring patterns mounted on a printed wiring board, wherein plating is performed on the bonding pads of the plurality of wiring patterns from electrodes. The plating is performed by supplying a current for use. A plating lead may be protruded from each of the bonding pads, and a plating current may be supplied to the plurality of bonding pads by bringing the electrode into contact with the plating lead.

According to the present invention having the above structure, it is not necessary to provide a plating lead between the wiring pattern and the end of the printed wiring board, and the connection between the plurality of bonding pads and the power supply can be collectively performed via the electrodes. Therefore, the connection between the bonding pad and the power supply becomes extremely simple.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view illustrating a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating the printed wiring board according to the embodiment. 1 and 2, a plurality of wiring patterns 2 are provided on a printed wiring board 1. The wiring pattern 2 has a bonding pad 3, a pattern 4, and a through hole 5. In the present invention, each wiring pattern 2 is arranged such that each bonding pad 3 faces a predetermined direction. In the present embodiment, as shown in FIG. 2, the plurality of bonding pads 3 are arranged so as to form a rectangle at the distal end portions 3a thereof. The arrangement of the wiring pattern 2 can be freely changed.

[0008] Leads 6 are provided so as to protrude from the tips 3 a of the bonding pads 3. Lead 6
Is a connection portion for connecting a power supply when performing electrolytic plating on the bonding pad 3. Since the tip portions 3a of the plurality of bonding pads 3 form a rectangle,
A rectangle is similarly formed by the plurality of leads 6.

FIG. 3 is a perspective view in which electrodes for flowing a current to the bonding pad 3 are arranged. In FIG. 3, the electrode 7 is formed in a rectangular shape, and has a shape capable of simultaneously contacting all the leads 6. The electrode 7 is formed of pure copper. The electrode 7 is connected to a power supply 8, and a current is supplied from the power supply 8 when performing electrolytic plating on each bonding pad 3.

Next, a process of applying electrolytic plating to the bonding pad will be described. FIGS. 4, 5, 6, and 7 are operation explanatory diagrams showing the plating process of the present embodiment. FIG.
, Two groups 9 of the wiring patterns 2 are arranged, and the electrodes 7 are arranged at the center of each group 9. As described with reference to FIG.
It is in pressure contact with a lead 6 projecting from each bonding pad 3 of the group 9. And when applying electrolytic plating,
As shown in FIG. 5, a power source 8 is connected to each electrode 7.

The electrode 7 is fixed to the printed wiring board 1 by a clamp 10 as shown in FIG. In this state, the printed wiring board 1 is placed in the plating bath 12 by the conveyor 11 as shown in FIG. When a current is supplied from the power supply 8, each bonding pad 3 is subjected to electrolytic plating. When the electrolytic plating process is completed, the printed wiring board 1 is removed from the plating bath 12, and furthermore, the clamp 10
And remove the electrode 7 from the printed wiring board 1.

As described above, according to the present embodiment, the wiring of the plating lead outside the through hole of each wiring pattern in the related art becomes unnecessary, and the wiring performed for each plating lead is unnecessary. The wiring capacity is improved,
Man-hours for manufacturing printed wiring boards can be reduced.

Electrolytic plating is applied only to the wiring pattern 2 having the bonding pads 3 and another wiring pattern having no bonding pads (indicated by reference numeral 13 in FIG. 3).
Since no plating is applied, no pattern short-circuit occurs due to plating in the ultrafine pattern gap. Further, current is supplied via the plating lead 6 close to the bonding pad 3, and a long plating lead is not used as in the related art. Therefore, it is possible to reduce poor plating adhesion due to disconnection of the plating lead. .

Although a rectangular electrode is used in the above embodiment, the shape of the electrode is not limited to this, and may be a circular or elliptical electrode. Even if it is not circular,
It may be linear. In short, multiple bonding pads 3
Any configuration may be used as long as it can simultaneously supply current by simultaneously contacting the plating leads protruding therefrom.

[0015]

As described in detail above, according to the present invention, plating is performed by supplying a plating current from the electrodes to the bonding pads of a plurality of wiring patterns. Wiring of plating leads outside the hole is not required, and wiring that has been performed for each plating lead is not required. Wiring accommodating property is improved, and man-hours for manufacturing a printed wiring board can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a printed wiring board according to an embodiment.

FIG. 2 is a plan view showing the printed wiring board of the embodiment.

FIG. 3 is a perspective view in which electrodes for flowing a current to a bonding pad are arranged.

FIG. 4 is an operation explanatory view showing a plating process according to the embodiment;

FIG. 5 is an operation explanatory view showing a plating process according to the embodiment;

FIG. 6 is an operation explanatory view showing a plating process of the embodiment.

FIG. 7 is an operation explanatory view showing a plating process of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Wiring pattern 3 Bonding pad 6 Lead 7 Electrode 8 Power supply 12 Plating bath

Claims (4)

[Claims] In a structure of a printed wiring board in which a bonding pad of a wiring pattern is plated, each wiring pattern is arranged so that an electrode can contact a bonding pad of a plurality of wiring patterns. Structure of printed wiring board. 2. The printed wiring board structure according to claim 1, wherein leads protruding from the bonding pads of the plurality of wiring patterns are arranged, and the electrodes can contact the respective leads. 3. A method for electrolytic plating a printed wiring board, wherein electrolytic bonding is performed on bonding pads of a plurality of wiring patterns mounted on the printed wiring board, wherein a current is supplied from an electrode to the bonding pads of the plurality of wiring patterns. An electroplating method for a printed wiring board, comprising plating. 4. The printed wiring according to claim 3, wherein a plating lead is projected from each of the bonding pads, and a plating current is supplied to the plurality of bonding pads by bringing the electrode into contact with each of the plating leads. Plate plating method.