JP2002144211A - ワイヤソー加工装置 - Google Patents
ワイヤソー加工装置Info
- Publication number
- JP2002144211A JP2002144211A JP2000373530A JP2000373530A JP2002144211A JP 2002144211 A JP2002144211 A JP 2002144211A JP 2000373530 A JP2000373530 A JP 2000373530A JP 2000373530 A JP2000373530 A JP 2000373530A JP 2002144211 A JP2002144211 A JP 2002144211A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- slurry
- cutting
- wire guide
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 76
- 239000002002 slurry Substances 0.000 claims abstract description 49
- 239000006061 abrasive grain Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 29
- 244000126211 Hericium coralloides Species 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 26
- 238000005498 polishing Methods 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 12
- 239000013078 crystal Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 239000010453 quartz Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 6
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000004062 sedimentation Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- WDWZGJKZUMEZHW-UHFFFAOYSA-L [O-]OO[O-].[Li+].[Li+] Chemical compound [O-]OO[O-].[Li+].[Li+] WDWZGJKZUMEZHW-UHFFFAOYSA-L 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000373530A JP2002144211A (ja) | 2000-11-02 | 2000-11-02 | ワイヤソー加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000373530A JP2002144211A (ja) | 2000-11-02 | 2000-11-02 | ワイヤソー加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002144211A true JP2002144211A (ja) | 2002-05-21 |
| JP2002144211A5 JP2002144211A5 (enExample) | 2005-11-04 |
Family
ID=18842899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000373530A Pending JP2002144211A (ja) | 2000-11-02 | 2000-11-02 | ワイヤソー加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002144211A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102079113A (zh) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | 解决硅锭破方质量问题的设备和方法 |
| EP2347845A1 (de) * | 2010-01-26 | 2011-07-27 | Schott Solar AG | Drahtführungsrolle zur Verwendung in Drahtsägen |
| JP2012101310A (ja) * | 2010-11-09 | 2012-05-31 | Yasunaga Corp | ワイヤソー装置及びこれを用いたウエハの製造方法 |
| JP2023538494A (ja) * | 2020-07-21 | 2023-09-08 | ジルトロニック アクチエンゲゼルシャフト | ワークピースから複数のスライスを同時にスライスするための方法および装置 |
-
2000
- 2000-11-02 JP JP2000373530A patent/JP2002144211A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2347845A1 (de) * | 2010-01-26 | 2011-07-27 | Schott Solar AG | Drahtführungsrolle zur Verwendung in Drahtsägen |
| JP2012101310A (ja) * | 2010-11-09 | 2012-05-31 | Yasunaga Corp | ワイヤソー装置及びこれを用いたウエハの製造方法 |
| CN102079113A (zh) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | 解决硅锭破方质量问题的设备和方法 |
| JP2023538494A (ja) * | 2020-07-21 | 2023-09-08 | ジルトロニック アクチエンゲゼルシャフト | ワークピースから複数のスライスを同時にスライスするための方法および装置 |
| US12311577B2 (en) | 2020-07-21 | 2025-05-27 | Siltronic Ag | Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece |
| JP7753336B2 (ja) | 2020-07-21 | 2025-10-14 | ジルトロニック アクチエンゲゼルシャフト | ワークピースから複数のスライスを同時にスライスするための方法および装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8454852B2 (en) | Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer | |
| US5480344A (en) | Polishing process for optical connector assembly with optical fiber and polishing apparatus | |
| RU2368486C2 (ru) | Автоматический способ полировки для механических деталей из титана или титанового сплава | |
| KR20150034658A (ko) | 가공물로부터 복수 개의 웨이퍼를 동시에 절단하는 방법 | |
| KR20130082423A (ko) | 연마 브러시 및 연마 가공 방법 | |
| KR101624151B1 (ko) | 반도체 웨이퍼의 가공 프로세스 | |
| KR20170078593A (ko) | 복합 기판의 제조 방법 | |
| EP2236246B1 (en) | Method for producing large-size synthetic quartz glass substrate | |
| JP3924641B2 (ja) | 半導体ウェーハの製造方法 | |
| Xu et al. | Influence of ingot rocking on the surface quality of multi-wire sawing monocrystalline silicon wafers | |
| JP2010021394A (ja) | 半導体ウェーハの製造方法 | |
| JP3979578B2 (ja) | 単結晶サファイヤ基板の切断方法および切断装置 | |
| JP2002144211A (ja) | ワイヤソー加工装置 | |
| JP5117880B2 (ja) | ウエハの作製方法 | |
| JP2001351227A (ja) | 磁気記録媒体用ガラス基板の製造方法 | |
| JP2849908B2 (ja) | 半導体ウエハの製造方法 | |
| CN216576965U (zh) | 一种硅棒磨削用修整装置 | |
| JPS60242958A (ja) | 硬脆材料の加工法 | |
| JP2011140075A (ja) | 両面研削装置を用いたガラス基板の研削方法、及び該研削方法を用いたガラス基板の製造方法 | |
| JPH08352B2 (ja) | 切削工具研磨方法及びその装置 | |
| JPS6311273A (ja) | ラツピング加工方法 | |
| JP2003062828A (ja) | マルチワイヤソーによる切断方法 | |
| JP2002120140A (ja) | 圧電板の製造方法 | |
| JP7085672B2 (ja) | ウェーハの表裏判定装置及びそれを用いた面取り装置 | |
| JP7472546B2 (ja) | 圧電性酸化物単結晶基板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20050801 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050802 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20050802 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20051006 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051101 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051120 |
|
| A02 | Decision of refusal |
Effective date: 20060104 Free format text: JAPANESE INTERMEDIATE CODE: A02 |