JP2002111215A5 - - Google Patents
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- Publication number
- JP2002111215A5 JP2002111215A5 JP2000296946A JP2000296946A JP2002111215A5 JP 2002111215 A5 JP2002111215 A5 JP 2002111215A5 JP 2000296946 A JP2000296946 A JP 2000296946A JP 2000296946 A JP2000296946 A JP 2000296946A JP 2002111215 A5 JP2002111215 A5 JP 2002111215A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- liquid
- via hole
- woven fabric
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 51
- 229920005989 resin Polymers 0.000 description 47
- 239000007788 liquid Substances 0.000 description 31
- 239000003822 epoxy resin Substances 0.000 description 30
- 229920000647 polyepoxide Polymers 0.000 description 30
- 239000004020 conductor Substances 0.000 description 24
- 239000002759 woven fabric Substances 0.000 description 18
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 12
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000296946A JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000296946A JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002111215A JP2002111215A (ja) | 2002-04-12 |
| JP2002111215A5 true JP2002111215A5 (enrdf_load_stackoverflow) | 2009-09-24 |
Family
ID=18779139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000296946A Pending JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002111215A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115840A (ja) * | 2005-10-19 | 2007-05-10 | Kyocera Corp | 配線基板および配線基板の製造方法 |
| US8446734B2 (en) | 2006-03-30 | 2013-05-21 | Kyocera Corporation | Circuit board and mounting structure |
| JP4953875B2 (ja) * | 2006-03-30 | 2012-06-13 | 京セラ株式会社 | 配線基板および実装構造体 |
| JP4530089B2 (ja) | 2008-03-12 | 2010-08-25 | 株式会社デンソー | 配線基板の製造方法 |
| JP2011228676A (ja) * | 2010-03-29 | 2011-11-10 | Kyocera Corp | 配線基板およびその実装構造体 |
-
2000
- 2000-09-28 JP JP2000296946A patent/JP2002111215A/ja active Pending
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