JP2002110882A5 - - Google Patents

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Publication number
JP2002110882A5
JP2002110882A5 JP2000301987A JP2000301987A JP2002110882A5 JP 2002110882 A5 JP2002110882 A5 JP 2002110882A5 JP 2000301987 A JP2000301987 A JP 2000301987A JP 2000301987 A JP2000301987 A JP 2000301987A JP 2002110882 A5 JP2002110882 A5 JP 2002110882A5
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JP
Japan
Prior art keywords
headers
semiconductor
pellet
lead frame
semiconductor device
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Pending
Application number
JP2000301987A
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English (en)
Japanese (ja)
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JP2002110882A (ja
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Priority to JP2000301987A priority Critical patent/JP2002110882A/ja
Priority claimed from JP2000301987A external-priority patent/JP2002110882A/ja
Publication of JP2002110882A publication Critical patent/JP2002110882A/ja
Publication of JP2002110882A5 publication Critical patent/JP2002110882A5/ja
Pending legal-status Critical Current

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JP2000301987A 2000-10-02 2000-10-02 半導体装置およびその製造方法 Pending JP2002110882A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000301987A JP2002110882A (ja) 2000-10-02 2000-10-02 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000301987A JP2002110882A (ja) 2000-10-02 2000-10-02 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2002110882A JP2002110882A (ja) 2002-04-12
JP2002110882A5 true JP2002110882A5 (enrdf_load_stackoverflow) 2005-06-30

Family

ID=18783430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000301987A Pending JP2002110882A (ja) 2000-10-02 2000-10-02 半導体装置およびその製造方法

Country Status (1)

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JP (1) JP2002110882A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012857A (ja) 2005-06-30 2007-01-18 Renesas Technology Corp 半導体装置
JP5301497B2 (ja) * 2010-05-20 2013-09-25 三菱電機株式会社 半導体装置
WO2016006650A1 (ja) * 2014-07-10 2016-01-14 大日本印刷株式会社 リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、半導体装置の多面付け体、樹脂付きリードフレームの多面付け体の製造方法、それに使用される射出成形用金型、成形装置

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