JP2002096261A5 - - Google Patents
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- Publication number
- JP2002096261A5 JP2002096261A5 JP2000280216A JP2000280216A JP2002096261A5 JP 2002096261 A5 JP2002096261 A5 JP 2002096261A5 JP 2000280216 A JP2000280216 A JP 2000280216A JP 2000280216 A JP2000280216 A JP 2000280216A JP 2002096261 A5 JP2002096261 A5 JP 2002096261A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- top ring
- holding
- elastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000280216A JP3856634B2 (ja) | 2000-09-14 | 2000-09-14 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
EP01117745A EP1177859B1 (de) | 2000-07-31 | 2001-07-30 | Substrathalter und Poliervorrichtung |
DE60138343T DE60138343D1 (de) | 2000-07-31 | 2001-07-30 | Substrathalter und Poliervorrichtung |
EP09005308A EP2085181A1 (de) | 2000-07-31 | 2001-07-30 | Substrathaltevorrichtung und Substratpoliervorrichtung |
TW090118572A TW516991B (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200501205A SG125152A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
KR1020010046378A KR100876381B1 (ko) | 2000-07-31 | 2001-07-31 | 기판 고정 장치 및 기판 폴리싱 장치 |
SG200804145-1A SG157258A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200104611-9A SG129989A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
US09/917,732 US6890402B2 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
US10/972,579 US20050072527A1 (en) | 2000-07-31 | 2004-10-26 | Substrate holding apparatus and substrate polishing apparatus |
US11/907,590 US20080047667A1 (en) | 2000-07-31 | 2007-10-15 | Substrate holding apparatus and substrate polishing apparatus |
US11/979,019 US20080066862A1 (en) | 2000-07-31 | 2007-10-30 | Substrate holding apparatus and substrate polishing apparatus |
US12/136,424 US7897007B2 (en) | 2000-07-31 | 2008-06-10 | Substrate holding apparatus and substrate polishing apparatus |
SG10201706765QA SG10201706765QA (en) | 2000-07-31 | 2014-07-31 | Substrate holding apparatus and substrate polishing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000280216A JP3856634B2 (ja) | 2000-09-14 | 2000-09-14 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002096261A JP2002096261A (ja) | 2002-04-02 |
JP2002096261A5 true JP2002096261A5 (de) | 2004-12-24 |
JP3856634B2 JP3856634B2 (ja) | 2006-12-13 |
Family
ID=18765099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000280216A Expired - Lifetime JP3856634B2 (ja) | 2000-07-31 | 2000-09-14 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3856634B2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7357699B2 (en) | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
JP5464820B2 (ja) | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
JP5976522B2 (ja) | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
KR102160111B1 (ko) * | 2013-12-11 | 2020-09-25 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드 |
JP7372107B2 (ja) * | 2019-10-15 | 2023-10-31 | 株式会社岡本工作機械製作所 | ウェーハ研磨用ヘッド |
KR20210061273A (ko) * | 2019-11-19 | 2021-05-27 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치 |
-
2000
- 2000-09-14 JP JP2000280216A patent/JP3856634B2/ja not_active Expired - Lifetime
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