JP2002094222A5 - - Google Patents

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Publication number
JP2002094222A5
JP2002094222A5 JP2000283624A JP2000283624A JP2002094222A5 JP 2002094222 A5 JP2002094222 A5 JP 2002094222A5 JP 2000283624 A JP2000283624 A JP 2000283624A JP 2000283624 A JP2000283624 A JP 2000283624A JP 2002094222 A5 JP2002094222 A5 JP 2002094222A5
Authority
JP
Japan
Prior art keywords
electronic component
circuit
forming body
bonding sheet
recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000283624A
Other languages
English (en)
Japanese (ja)
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JP2002094222A (ja
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Publication date
Application filed filed Critical
Priority to JP2000283624A priority Critical patent/JP2002094222A/ja
Priority claimed from JP2000283624A external-priority patent/JP2002094222A/ja
Publication of JP2002094222A publication Critical patent/JP2002094222A/ja
Publication of JP2002094222A5 publication Critical patent/JP2002094222A5/ja
Withdrawn legal-status Critical Current

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JP2000283624A 2000-09-19 2000-09-19 電子部品接合用シート、電子部品実装方法、及び電子部品実装装置 Withdrawn JP2002094222A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000283624A JP2002094222A (ja) 2000-09-19 2000-09-19 電子部品接合用シート、電子部品実装方法、及び電子部品実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000283624A JP2002094222A (ja) 2000-09-19 2000-09-19 電子部品接合用シート、電子部品実装方法、及び電子部品実装装置

Publications (2)

Publication Number Publication Date
JP2002094222A JP2002094222A (ja) 2002-03-29
JP2002094222A5 true JP2002094222A5 (enExample) 2005-06-02

Family

ID=18767962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000283624A Withdrawn JP2002094222A (ja) 2000-09-19 2000-09-19 電子部品接合用シート、電子部品実装方法、及び電子部品実装装置

Country Status (1)

Country Link
JP (1) JP2002094222A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199546A (ja) * 2009-11-25 2010-09-09 Sony Chemical & Information Device Corp 電子部品実装構造体及びその製造方法
JP2011187554A (ja) * 2010-03-05 2011-09-22 Murata Mfg Co Ltd 複合モジュールおよび複合モジュールの製造方法
JP2014075317A (ja) * 2012-10-05 2014-04-24 Sumitomo Bakelite Co Ltd 導電接続シート、半導体装置および電子機器
JP6759578B2 (ja) * 2014-12-22 2020-09-23 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
KR102134135B1 (ko) * 2016-05-27 2020-07-15 후지필름 가부시키가이샤 전자 소자, 및 반도체 소자를 포함하는 구조체

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