JP2002093986A - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JP2002093986A
JP2002093986A JP2000283088A JP2000283088A JP2002093986A JP 2002093986 A JP2002093986 A JP 2002093986A JP 2000283088 A JP2000283088 A JP 2000283088A JP 2000283088 A JP2000283088 A JP 2000283088A JP 2002093986 A JP2002093986 A JP 2002093986A
Authority
JP
Japan
Prior art keywords
external connection
lead frame
frame
die pad
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000283088A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002093986A5 (https=
Inventor
Tomoo Takahashi
智男 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP2000283088A priority Critical patent/JP2002093986A/ja
Publication of JP2002093986A publication Critical patent/JP2002093986A/ja
Publication of JP2002093986A5 publication Critical patent/JP2002093986A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2000283088A 2000-09-19 2000-09-19 リードフレーム Pending JP2002093986A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000283088A JP2002093986A (ja) 2000-09-19 2000-09-19 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000283088A JP2002093986A (ja) 2000-09-19 2000-09-19 リードフレーム

Publications (2)

Publication Number Publication Date
JP2002093986A true JP2002093986A (ja) 2002-03-29
JP2002093986A5 JP2002093986A5 (https=) 2007-09-13

Family

ID=18767501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000283088A Pending JP2002093986A (ja) 2000-09-19 2000-09-19 リードフレーム

Country Status (1)

Country Link
JP (1) JP2002093986A (https=)

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