JP2002046067A - ワイヤソーの加工液 - Google Patents
ワイヤソーの加工液Info
- Publication number
- JP2002046067A JP2002046067A JP2000237965A JP2000237965A JP2002046067A JP 2002046067 A JP2002046067 A JP 2002046067A JP 2000237965 A JP2000237965 A JP 2000237965A JP 2000237965 A JP2000237965 A JP 2000237965A JP 2002046067 A JP2002046067 A JP 2002046067A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- wire
- workpiece
- wire saw
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 17
- 238000003754 machining Methods 0.000 title abstract description 5
- 239000006061 abrasive grain Substances 0.000 claims abstract description 37
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 20
- 239000010432 diamond Substances 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 239000012530 fluid Substances 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- -1 ferrite Chemical compound 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000237965A JP2002046067A (ja) | 2000-08-07 | 2000-08-07 | ワイヤソーの加工液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000237965A JP2002046067A (ja) | 2000-08-07 | 2000-08-07 | ワイヤソーの加工液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002046067A true JP2002046067A (ja) | 2002-02-12 |
| JP2002046067A5 JP2002046067A5 (https=) | 2004-11-11 |
Family
ID=18729740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000237965A Pending JP2002046067A (ja) | 2000-08-07 | 2000-08-07 | ワイヤソーの加工液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002046067A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002060777A (ja) * | 2000-08-22 | 2002-02-26 | Ishii Hyoki Corp | ワイヤーソー用水性スラリー |
| WO2006073094A1 (ja) * | 2005-01-07 | 2006-07-13 | Sumitomo Electric Industries, Ltd. | Iii族窒化物基板の製造方法 |
| JP2009152622A (ja) * | 2009-02-04 | 2009-07-09 | Sumitomo Electric Ind Ltd | Ｉｉｉ族窒化物基板及びその製造方法 |
| CN111976043A (zh) * | 2020-08-26 | 2020-11-24 | 西安奕斯伟硅片技术有限公司 | 一种晶棒切割装置及晶棒切割方法 |
-
2000
- 2000-08-07 JP JP2000237965A patent/JP2002046067A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002060777A (ja) * | 2000-08-22 | 2002-02-26 | Ishii Hyoki Corp | ワイヤーソー用水性スラリー |
| WO2006073094A1 (ja) * | 2005-01-07 | 2006-07-13 | Sumitomo Electric Industries, Ltd. | Iii族窒化物基板の製造方法 |
| JP2006190909A (ja) * | 2005-01-07 | 2006-07-20 | Sumitomo Electric Ind Ltd | Ｉｉｉ族窒化物基板の製造方法 |
| US7223155B2 (en) | 2005-01-07 | 2007-05-29 | Sumitomo Electric Industries, Ltd. | Method of producing III-nitride substrate |
| CN100419967C (zh) * | 2005-01-07 | 2008-09-17 | 住友电气工业株式会社 | Ⅲ族氮化物基板的制造方法 |
| US7464702B2 (en) | 2005-01-07 | 2008-12-16 | Sumitomo Electric Industries, Ltd. | Method of producing III-nitride substrate |
| EP1739731A4 (en) * | 2005-01-07 | 2009-11-11 | Sumitomo Electric Industries | PROCESS FOR PREPARING GROUP III NITRIDE SUBSTRATES |
| JP2009152622A (ja) * | 2009-02-04 | 2009-07-09 | Sumitomo Electric Ind Ltd | Ｉｉｉ族窒化物基板及びその製造方法 |
| CN111976043A (zh) * | 2020-08-26 | 2020-11-24 | 西安奕斯伟硅片技术有限公司 | 一种晶棒切割装置及晶棒切割方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20051028 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20060712 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061122 |