JP2002033546A - Surface emitting optical element, surface emitting optical element mount, its manufacturing method and optical wiring device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface emitting optical element at a low cost by improving productivity by facilitating a fixing work of an optical waveguide without necessity of increasing the number of components and improving process controllability. SOLUTION: The surface emitting optical element 5 comprises a guide hole 4 formed on a surface of the element 5 to insert and fix the optical waveguide 16 capable of optically coupling to the element 5. In the element 5, the hole 4 is formed of a thick film material 3 selectively curable by patterning the hole by a photolithography having photosensitivity or electron beam curability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface optical device capable of optically coupling an optical waveguide such as an optical fiber, an optical package wherein the surface optical device and the optical waveguide are optically coupled at low cost, The present invention relates to a manufacturing method thereof and an optical wiring device using the same.

[0002]

2. Description of the Related Art In recent years, optical modules for high-speed optical connection have been developed. However, there are many problems regarding the coupling between an optical element and an optical transmission medium such as an optical fiber, particularly from the viewpoint of cost reduction and high performance.

[0003] As light receiving elements, planar elements are mainly used in light receiving elements in terms of easiness of production and sensitivity, but when optical coupling is performed between an optical fiber and the main surface of the planar element. In addition, passive alignment for performing alignment without operating the light receiving element is essential for cost reduction.
As a technique for that, a method of producing and assembling a fixing member is generally used. However, the mechanical accuracy of the fixing member is required, the elastic coefficient and the coefficient of thermal expansion are restricted, and the number of parts increases, so that it has been difficult to reduce the cost. In particular, when a plastic mold or the like is used for cost reduction, there is a problem that the yield of optical coupling and long-term reliability are lacking.

In a light emitting device, a vertical cavity surface emitting laser which emits light vertically from a substrate surface may be improved from the viewpoint of reducing the power consumption and the cost of an optical transmission module, and has been actively used. Has been studied. The surface emitting laser can be driven at a low threshold value of 1 mA or less, can perform inspection at a wafer level, and does not require cleavage accuracy, so that cost can be reduced. The same problem as described above occurs in the optical coupling between the surface emitting laser and the optical fiber.

Therefore, a method has been proposed in which a guide hole for coupling to an optical fiber is formed with photolithographic precision. For example, Japanese Patent Application Laid-Open No. H08-111559 discloses a technique in which a hole for fixing an optical fiber 1037 is formed by etching on the side of a substrate 1021 on which a surface-type light receiving element or a light emitting element is manufactured, as shown in FIG. I have.
In FIG. 11, reference numeral 1022 denotes a light absorbing layer, 1023 and 1027 denote DBR mirrors, 1024 and 1026 denote cladding layers, 1025 denotes an active layer, 1028 denotes a contact layer,
032 is a SiO ₂ layer, 1033 and 1035 are electrodes, 1036
Is an antireflection film.

[0006] Japanese Patent Application Laid-Open No. 6-237016 also discloses FIG.
As shown in FIG. 1, a method is disclosed in which a guide hole 1209 obtained by etching a substrate is formed on the back side of a surface emitting laser 1203 to fix an optical fiber 1210. In these cases, the number of parts can be reduced and assembly is very simple, so that cost reduction can be achieved. FIG.
, 1201 is an electronic circuit board, 1202 is a light emitting chip, 1204 is a transistor, 1205, 1206 and 1207 are transistor electrodes, 1208 is an insulating layer,
11 is an adhesive.

However, in the method of making a hole in the substrate, it is difficult to control the distance between the optical fiber and the light-receiving portion or the light-emitting portion, and when the fiber is hit against the crystal, the crystal is damaged. There was a fear that it would. Therefore, according to the invention of Japanese Patent Application Laid-Open No. 6-237016, the diameter of the tip of the guide hole is reduced so that the guide hole 1209 has a forward tapered shape so that the fiber does not contact the crystal plane (FIG. 1).
2), a method of stopping etching in a state where the substrate is slightly left without completely etching up to the epi layer.

On the other hand, there has been proposed a method of mounting an optical fiber by directly fixing a member for fixing a fiber to a surface on which a surface-type optical element is formed. For example, JP-A-11-307869
In the publication, as shown in FIG. 13, protrusions 2022 and 2023 for fitting the fiber fixing member 2014 are provided on the surface of the surface emitting laser element 2018, and a guide is provided at a position corresponding to the light emitting portion of the surface emitting laser 2018. An arrangement of holes is disclosed. Incidentally, in FIG.
12 is a module substrate, 2016 is an optical fiber, 202
4 is a fiber insertion hole, and 2026 and 2027 are guide holes.

[0009]

However, when a guide hole is formed by etching, the depth is usually 1 unit.
Since it is not less than 00 μm, there is a problem in controllability of the tapered shape and the hole diameter, and it has been difficult to improve the yield. Further, when the substrate is left, there is a problem of light absorption by the substrate, and there is a limit to a wavelength band that can be used.

[0010] On the other hand, when the optical fiber fixing block is used, the above-mentioned problem in the production does not occur, but the cost cannot be necessarily reduced because the number of parts and the processing steps are increased.

In view of such problems, an object of the present invention is to
By forming a guide hole for fixing an optical waveguide such as an optical fiber, the alignment accuracy between the optical waveguide and the planar optical element can be improved without increasing the number of parts and improving process control. Therefore, the work of fixing the optical waveguide is also facilitated, productivity is improved, cost is reduced, and the distance between the planar optical element and the optical waveguide can be set freely, so that mounting is easy and free. It is to provide a structure that improves the degree. It is still another object of the present invention to provide a manufacturing method capable of mass-producing such a structure for mounting, an optical package capable of reducing cost, and an optical wiring device using the same.

[0012]

According to the surface optical device of the present invention, a guide hole for inserting an optical waveguide such as a fiber into the surface of the surface optical device by photolithography using a thick film material directly on the surface of the surface optical device. The above-mentioned problem is solved by making a structure body. That is, the surface-type optical element capable of emitting or receiving light according to the present invention is provided with a guide hole for inserting and fixing an optical waveguide so as to enable optical coupling with the surface-type optical element. Is characterized by being formed of a thick film material (thick film resist that can be polymerized) that has photosensitivity or electron beam curability and can be selectively cured by patterning by photolithography. And

The thickness of the thick film material or the thick film resist is 10 μm (this is about the core of a quartz single mode fiber) to 1000 μm (this is about the core of a plastic fiber (POF) made of an acrylic material). More preferably, those having a thickness of about 50 μm to 500 μm are suitably used. As the size of an optical waveguide such as a fiber, any size from about 125 μm to about 1 mm can be applied. Since the thick film material or the thick film resist is processed by a usual photolithography process, it is easy to accurately match the center position of the guide hole with the surface type optical element. Therefore, it is possible to omit a step of aligning and bonding the structures having the guide holes formed therein.

The controllability and shape control of the hole diameter are also excellent due to the characteristics of the thick film material or the thick film resist, and the process becomes simpler than the method of forming a hole by etching a substrate.

For the surface-type optical element, a surface-emitting laser or a surface-type light-receiving element is used. After mounting elements of a required chip size and number of arrays on a mounting substrate, the growth substrate is removed to form a thin film type. Thus, the mounting substrate can be used as a handling substrate. Thereby, the yield that can be obtained from the wafer of the surface-type optical element is increased, and the cost can be reduced.

Also, the plurality of surface light elements are arrayed, and correspondingly, guide holes are formed in an array, and the plurality of surface light elements are only surface light emitting elements or only surface light receiving elements. Or a combination of a surface light emitting element and a surface light receiving element, the surface light element is a vertical cavity surface emitting laser, and the surface emitting laser is an active layer, a resonator layer, and a Bragg reflection. A functional layer only of a mirror layer is left, or the surface type optical element,
The growth substrate is removed or thinned to form a thin film type, or the growth substrate is left as it is.

The distance between the end face of the optical waveguide such as a fiber and the surface type optical element can be controlled by controlling the distance by controlling the distance with the thickness of the first layer by using two layers of thick film material or thick film resist. , The degree of freedom can be improved. That is, the thick film material or the thick film resist is formed on the first layer having a hole smaller than the size of the optical waveguide and allowing only light to pass therethrough, and for fixing the optical waveguide formed on the first layer. And the thickness of the first layer can define the distance between the planar optical element and the end face of the optical waveguide.

The shape of the guide hole of the optical waveguide can be freely set depending on the design of the photomask, and the escape hole of the fixing adhesive is formed, and the shape of the guide hole is designed to be easily fitted to the guide hole. (For example, the guide hole is tapered). That is, the guide hole formed of the thick film material or the thick film resist is formed by forming only a portion that matches the outer shape of the optical waveguide, or the portion that matches the outer shape of the optical waveguide, and A groove pattern different from the outer shape is also formed, and in this case, a portion of the guide hole corresponding to the outer shape of the optical waveguide and the groove pattern are formed continuously.

Further, in the surface-type optical element mounting body of the present invention, the above-mentioned surface-type optical element is mounted on a mounting board with electrical connection so as to be drivable, and the optical waveguide is inserted into the guide hole. It is characterized in that the body is fixed.

The mounting board may be a mounting board having a heat sink function on which other optical elements or electronic elements can be integrated in a hybrid manner.

A plurality of the planar optical elements are arrayed, and the optical waveguides can be arrayed simultaneously. The optical waveguide may be composed of an optical fiber containing a polymer or an optical fiber containing quartz.

Further, the method of manufacturing the above-mentioned surface-type optical element mounting body of the present invention comprises the steps of forming a wiring pattern on a wafer-like mounting substrate; The process of mounting, the process of forming a guide hole with a thick film material on each surface type optical element, the necessary electronic devices, etc. are sequentially flip-chip mounted at the required positions, and then cut into a plurality of mounting bodies of the required size And finally, a step of inserting the optical waveguide into the guide hole and fixing it.

Further, the optical wiring device of the present invention is an optical wiring device which is mounted on a board in an electronic device via a connection lead and transmits and receives signals between the boards by light. An electronic circuit for driving a surface-type optical element is also integrated on the element mounting body, and the optical mounting module is configured by surface mounting the optical mounting body on a pedestal for fixing connection leads for obtaining electrical contact. Or mounting the above-mentioned surface-type optical element mounting body on a surface-type optical element driving electronic circuit and storing it in an electric connector, and connecting the electric connection from the driving electronic circuit to a detachable connector. And the transmission and reception of signals between the electronic devices is performed by light.

As described above, the optical package in which the surface-type optical element and the optical waveguide are connected by using the thick-film resist or the thick-film material is integrated with the electronic circuit, and the optical interconnection device having the transmission and reception is provided. Can be used as In this case, it can be used for optical wiring between electronic circuit boards, optical connection between electronic devices, and the like, and high-speed, large-capacity multi-channel transmission at 1 Gbps or more per channel can be realized at low cost while suppressing electromagnetic radiation noise.

[0025]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a perspective view showing a first embodiment of the present invention. Surface emitting lasers 5 arrayed in four at a pitch of 750 μm are bonded to a mounting substrate 1 via a common electrode 2. An element isolation groove of each element 5 is indicated by 8, and a portion corresponding to a light emitting point is indicated by 6. As the electric wiring for driving the surface emitting laser 5, a wiring 10 for a common electrode and a wiring 9 for independent driving are formed on the mounting substrate 1. An independent electrode 25 for driving the surface emitting laser is connected to the wiring 9. A driver IC 12 for driving a surface emitting laser is flip-chip mounted on the same mounting substrate 1. The driver IC 12 is connected to the wiring 13
Is connected to other electronic devices.

As the optical fiber inserted into the guide hole 4, a plastic optical fiber (POF) 16 having a diameter of 500 μm is used. The POF 16 is sandwiched by a fixing jig 14 having a V-groove formed by a plastic mold and a flat jig 15 and fixed by an adhesive 17. The V groove allows the pitch and center position of the POF 16 to be aligned. PO
The tip of F16 has a shape protruding as shown in FIG. 1 from the surface formed by the fixing jigs 14 and 15, and the protruding amount is 500 μm in this embodiment. Four POF16
Is fixed by using fixing jigs 14 and 15 and then cut in a lump with a knife, and the end surface is flattened by polishing. Since the flattening is performed using the POF 16, the flattening may be performed by pressing the flattened surface against the heated flat surface. In addition, a suitable curved surface shape may be used to prevent reflection and to produce a lens effect.

The POF 16 used in this embodiment is a fiber using a perfluorinated polymer capable of transmitting up to the 1.3 μm band.
(Made by Asahi Glass, trade name Lucina), but there is no limitation on materials such as those using a deuterated polymer and those using a UV curable resin. The core may be made of quartz or a fiber made entirely of quartz. The diameter of the guide hole 4 and the shape of the V groove of the fixing jig 14 may be designed according to the fiber diameter.

On the other hand, the guide hole 4 for the optical fiber, which is a feature of the present invention, is formed of the thick film resist 3 so that the center of each light emitting point 6 of the surface emitting laser 5 coincides with the center of the core of the optical fiber 16. Have been. FIG. 1 is a transparent perspective view for easy understanding. The thick film resist 3 is applied directly onto the mounting substrate 1 by a spin coater or the like, and is patterned by photolithography. For pattern matching, if a mark for matching with the electrode 25 formed on the surface of the surface emitting laser 5 is formed on a photomask, the center of the light emitting point 6 and the center of the guide hole 4 are aligned with a positional accuracy of several μm or less. Can be.

In this embodiment, Micr is used as the thick film resist 3.
oChem SU8-50 was used. 200 by spin coating
μm thickness, 90 ℃ on hot plate
Prebaked. 3mm x 1mm outer frame size, 7
Exposure was performed with an aligner so as to have a circular pattern of 520 μm at a pitch of 50 μm using a photomask while performing pattern matching as described above. Next, after baking after exposure at 90 ° C. again on a hot plate, the resist was developed with a developing solution. Rinsing after development was performed with isopropyl alcohol, and baked at 90 ° C. in an oven to completely evaporate the solvent. As described above, since the step of forming the thick-film resist 3 can be performed at a low temperature, the guide hole 4 can be formed without damaging the optical element 5 and the electrical contact. As the thick-film resist 3, SU8 is used here. However, the present invention is not limited to this.

After the adhesive is applied to the guide holes 4, the optical coupling can be easily achieved by inserting the POF 16 fixed to the fixing jig. As the adhesive, a thermosetting or ultraviolet curable optical adhesive was used, which was a material whose refractive index was close to that of POF16. In the case where the fiber end face has a lens effect, materials having different refractive indices may be used. The surface emitting laser emitting surface may be provided with a non-reflective coating (not shown) of SiO _x or the like to suppress reflection.

Next, the surface-emitting laser 5 and the POF 16 will be described with reference to FIG.
The following describes the connecting part with.

The details of the surface emitting laser 5 used in this embodiment will be described later. However, the growth substrate is removed so that the process of the thick film resist 3 can be easily performed, and only the functional layer is transferred to reduce the thickness. And The functional layer includes a one-wavelength resonator 23 including an active layer and a p-DBR mirror 22 and an n-layer
-The structure is sandwiched between DBR mirrors 24 and the thickness is about 7
μm. An air post 28 for current confinement is formed on the p-DBR mirror 22 side into a circular shape having a diameter of 15 μmφ, and the periphery is buried with a polyimide 27 to be flattened. In the vicinity of the active layer, only the AlGaAs layer having an Al mole fraction of 0.95 or more is selectively subjected to steam oxidation in the lateral direction to form an Al _x O _y layer 29, and the aperture size of the current injection region is set to 3 μmφ. And the oscillation threshold is set to 1 mA or less.

A common electrode 20 is formed on the p-DBR mirror 22 side, and is bonded on the electrode pad 2 on the surface of the substrate 1 with AuSn solder or the like. The bonding may be performed by bonding between Au. The n-side electrode 25 has an n-DBR so that current can be independently injected into each element.
The GaAs substrate (not shown) on the surface of the mirror 24 is removed and formed on the exposed surface. An insulating film 26 is formed on this surface, a light extraction portion 31 and a contact hole 32 are formed, and a contact is made with the wiring 9 formed on the surface of the substrate 1. Since the wiring 9 is stepped via the side wall of the surface emitting laser 5, it is necessary that the side wall of the laser 5 and the p-side common electrode pad 2 are covered with the insulating film 26. For forming such an insulating film, for example, a photosensitive polyimide such as PIMEL manufactured by Asahi Kasei is preferably used, and the thickness is set to 1 μm.

As shown in FIG. 2, the POF 16 is fixed at a position where the end face abuts on the element surface (in this example, the wiring 9 on the electrode 25). Therefore, it does not directly hit the crystal surface of the surface emitting laser, and does not cause damage or the like.

On the other hand, heat generated from the surface emitting laser is radiated to the mounting substrate 1 via the electrode pads 2. The material of the mounting substrate 1 therefore, AlN or Si forming an insulating thin film such as Al ₂ 0 ₃ on the surface, it is preferably used.

Next, with reference to FIG. 3, a description will be given of a manufacturing process of the thin film type surface emitting laser used in this embodiment. Here, for the sake of simplicity, an explanation will be given using an array of two elements.

3A, an n-GaAs substrate 30 is provided with an n-GaAs substrate.
DBR mirror 24, one-wavelength resonator layer 23 made of AlGaAs including an active layer made of three quantum wells of GaAs / AlGaAs, p-DBR
The mirror 22 and a p-GaAs contact layer (not shown) are crystal-grown by a metal organic chemical vapor deposition method or the like. Cl air post 28
_The selective oxidation layer 29 is formed by reactive etching using water vapor and oxidized by steam.
After that, an insulating film is formed with the SiN _x film 21 and the polyimide 27 is formed.
And the common electrode 20 is formed. Common electrode 2
As 0, for example, Ti / Au can be used.

In (b), the device on the wafer prepared in (a) is cut into a suitable size after polishing the substrate 30 to about 100 μm by polishing, and is placed on the electrode pad 2 formed on the mounting substrate 1. Bonding is performed by Au-Au pressure bonding (may be assisted by ultrasonic waves) or by AuSn solder. At this time, the electrode pad 2 is made of Ti / Pt / Au, and the outermost surface is Au.

In (c), the GaAs substrate 30 is made of H ₂ O ₂ and NH
Is etched using the _third mixed solution, the etching is stopped at the AlAs a first layer of n-DBR mirror 24. Then, on the n-GaAs layer that appeared after removing A1As with HCl,
An independent electrode 25 is formed. For example, Au
Ge / Ni / Au can be used. Thereafter, annealing is performed at about 380 ° C. for contact.

In (d), a hole 32 for electrode contact and a light extraction window 31 are made of photosensitive polyimide.
Is formed, and the whole is coated with the polyimide 26. If the wiring 9 is formed by a lift-off method or the like using Ti / Au or the like, the thin-film type surface emitting laser 5 is formed on the mounting substrate 1 as shown in the plan view of FIG.

In the above, the manufacturing process for one chip has been described. However, a wafer-level process is actually required to improve productivity. FIG. 5 illustrates this state. A laser chip 51 (1 × 4 array in the above embodiment) having a required size is cut out from the GaAs wafer 50 on which the surface emitting laser is manufactured, and an Al ₂ O ₃ film and an electrode pad 2 are formed on the surface in a required area 54. To a plurality of Si wafers 52 formed thereon. At this time, the bonding is performed sequentially while aligning the required position 54 on the wafer 52 with the flip chip bonder device. The laser thinning process, the wiring process, and the formation of the fiber guide hole 4 by the thick film resist 3 are collectively performed in this state by photolithography and etching.

Next, the laser driving Si-ICs 53 are sequentially bonded by a flip chip honda. Finally, by dicing the chips one by one as shown by the broken line 55,
A plurality of chips can be formed collectively.

In the above examples, the surface emitting laser 5
Although an example has been described in which the number of arrays of the optical fibers 16 is four, the number is of course not limited. Four or more may be used, or only one surface emitting laser and one optical fiber may be used. Further, the present invention can be applied to a surface light receiving element.

As the optical package, any of a type in which only a surface emitting laser is integrated on a transmitting side, a type in which only a surface type light receiving element is integrated on a receiving side, and a type in which an optical package having both transmission and reception are provided. May be. When the transmitting device and the receiving device are separated, one-way transmission is performed. On the other hand, when the transmitting and receiving device is housed in one module, two-way transmission is possible.

(Second Embodiment) The second embodiment of the present invention is directed to an example in which a normal surface emitting laser manufactured on a GaAs substrate is used instead of a thin film type surface emitting laser from which a GaAs substrate has been removed. Get involved. The cross-sectional structure of the surface emitting laser is almost the same as that shown in FIG.
The structure of the electrode on the side is different in that a window for taking out light is provided, and the electrode is separated between the elements.

FIG. 8 is a perspective view of this embodiment. Except that the cutout size of the surface emitting laser 84 has been increased and that the wiring 84 of the laser 84 and the IC 12 has been performed by wire bonding, the configuration is almost the same as that of FIG.

Surface emitting laser 84 fabricated on GaAs substrate
A Ti / Au 82 serving as a p-electrode / electrical wiring and an electrode pad is formed on the insulating film. A light extraction window is formed at a position corresponding to the light emitting point 83 of the p-electrode. A wire bonding 81 is provided between the electrode pad 80 and the p-electrode 82 on the mounting board 1 electrically connected to the IC 12. This wiring may use a flexible wiring board or the like.

The thick film resist 3 constituting the fiber guide hole 4 is formed on the surface of the GaAs substrate after the surface emitting laser and the p-electrode are formed on the GaAs substrate before being cut into chips. Therefore, there is no process such as photolithography after the chip of the surface emitting laser 84 is mounted on the mounting substrate 1, but only surface mounting by batch reflow (heating of solder) and wiring by wire bonding.

In this embodiment, since the size of the chip cut out from the GaAs wafer is larger than that of the first embodiment, the number of lasers obtained from the laser wafer, that is, the yield, is reduced, and the cost of the package is increased. In addition, since it is driven as a cathode common, it is inferior in high-speed driving as compared with the anode common type as in the first embodiment.

However, in the structure according to the present embodiment, the number of arrays is small and 622 Mb because the number of process steps is reduced and the manufacturing cost and the yield can be reduced.
Suitable for transmission in the order of ps.

(Third Embodiment) In a third embodiment of the present invention, the distance between the emitting surface of the surface emitting laser and the end face of the fiber is defined by forming a thick resist in two steps. This will be described with reference to FIG.

The fiber guide hole 63 is formed by the second layer thick resist 61, and the fiber guide hole 63 is thinner than the diameter of the fiber 16.
The thick film resist 60 having the hole 62 of μmφ is the first layer. This can be configured by repeating the same thick film resist patterning step as in the first embodiment twice. In this case, the thickness of each resist is 200 μm.
m. As a result, the fiber 16 is inserted into the guide hole 63.
In the case of mounting by abutting on the laser device, it is possible to reduce the possibility of causing damage by colliding with a laser element or the like. It is desirable that the light is condensed by a lens for optical coupling with the fiber 16, but this can be achieved by inserting a ball lens or the like into the hole of the first thick film resist 60. In particular, it is effective in coupling the light receiving element to the fiber 16.

In this method, the distance between the end face of the fiber and the end face of the surface emitting laser can be freely set by controlling the thickness of the first thick film resist 60.

(Fourth Embodiment) FIG. 7 is a plan view showing a pattern of a thick film resist 70 according to a fourth embodiment of the present invention. A groove 71 is formed in addition to the guide hole 72 for mounting the fiber.

The formation of the groove 71 has the effect of shortening the development time of the thick film resist 70, the effect of alleviating the stress with the base, and the function of releasing the fixing adhesive. Further, there is an advantage that the fiber is easily fitted when inserted into the guide hole 72.

In the case of the method of forming the fiber guide holes using a thick resist, the pattern shape can be freely designed by changing the pattern of the photomask in this way. For example, those with different fiber diameters (1 mmφ, 500 μmφ,
250 μmφ), or a guide groove for fitting a rectangular waveguide film or the like other than a fiber in the same manner, and fixing the waveguide film or the like here.

(Fifth Embodiment) The fifth embodiment according to the present invention relates to a high-speed optical wiring device formed by modularizing the optical package described above.

FIG. 9 shows a connector module using a mounting body in which a surface-emitting laser or a surface-type light receiving element and a fiber are fixed by a guide hole made of a thick film resist as in the first, second, and third embodiments. Is shown. In FIG. 9A, reference numeral 94 denotes a ribbon fiber in which four fibers are bundled.
95 is a POF, 96 is a jig for fixing the POF, and 93 is a cover for enhancing the fixing strength of the POF 95 covering the whole. Also, 9
Reference numeral 2 denotes the mounting substrate 1 shown in FIG. 1, in which peripheral circuits are formed at the same time and chip resistors and capacitors are integrated.
Further, 90 is a pedestal for fixing the connection lead 91,
The electrode pads of the mounting board 92 are connected to the tops of the leads 91 by wire bonding by bonding to the back surface of the mounting board 92. The fixing between the fiber 95 and the mounting board 92 is performed last after performing the wire bonding. The connection between the connection lead 91 and the mounting board 92 may be performed by flip-chip mounting by forming a through hole in the mounting board 92.

On the other hand, FIGS. 9 (b) and 9 (c) show how the connector module and the circuit board 97 are mounted.
In (b), a socket 98 is fixed on a substrate 97 with a lead 102 and solder 10 so that contact can be obtained between a connection lead 91 of the connector module and a leaf spring 99 of the socket 98, and the socket 98 is detached. It is possible.
In (c), the connection leads 91 are directly soldered to the circuit board 97 (103).

With such a configuration, it is possible to provide an optical wiring device for transmitting a high-speed signal between boards. This is effective in the case of exceeding 1 Gbps per channel or in the case where electromagnetic radiation noise becomes a problem.

In FIG. 9C, the circuit board 97 is fixed, but the mounting board 92 and the fiber fixing jig 93 are not bonded to each other, but are detachable at the guide holes of the thick film resist 100. Is also good. In this case, a removable mechanical mechanism may be formed by providing a nail or the like on the outer frame of the fiber fixing jig 93. Incidentally, reference numeral 101 denotes a cover.

(Sixth Embodiment) A sixth embodiment according to the present invention is different from the fifth embodiment in that an optical transmitter / receiver module in which an optical package is integrated is not directly mounted on a motherboard. As shown in (1), it is housed in an electric connector 110 and can be connected to and detached from an interface section of an electronic device such as a PC, a monitor, a printer, a digital camera, a digital video camera, etc. via an electric connection lead 111. The electrical connector 110 can be manufactured according to the required device standard. For example, a 26-pin MDR connector according to the digital monitor interface standard for connecting a PC and an LCD monitor, or an IEEE1394 or U
It is also possible to conform to standards such as SB. Further, the present invention can be applied to an internal connection between a scanner unit and a photosensitive unit of a digital copier. By using the optical wiring device of the present invention for connection between these electronic devices, signal transmission of 4 to 5 channels at 1 Gbps to 2.5 Gbps per channel can be performed over 50 m.
This is possible. Thus, electric cables can be used in place of the limited high-speed video transmission. In addition, since the optical connection is used, there is no electromagnetic radiation noise generated from the transmission line, and it is possible to reduce noise measures particularly in high-speed digital transmission.

[0064]

According to the present invention, the following effects are expected. The alignment accuracy between the optical waveguide such as an optical fiber and the optical element can be improved, the work of fixing the optical waveguide such as the optical fiber can be facilitated, and the productivity can be improved.
Further, by reducing the thickness of the surface-type optical element, it is possible to improve the ease of mounting and the degree of freedom in designing when optical coupling with an optical waveguide such as an optical fiber is performed without a lens.

Further, by providing a manufacturing method capable of mass-producing such a structure for mounting, an optical package that can be reduced in cost and an optical wiring device using the same can be realized. Therefore, in a signal connection between boards in an electronic device handling high-speed digital signals, or in a signal connection between electronic devices, an electric connection has a limited area, that is, 2.
Signal transmission of about 5 Gbps becomes possible, and large-capacity video transmission can be easily performed without any special measures against electromagnetic noise.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a surface-type optical element package according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the surface-type optical element package according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing a surface optical device according to the present invention.

FIG. 4 is a plan view illustrating wiring of a surface-type optical element mounted body according to the present invention.

FIG. 5 is a perspective view illustrating a method for manufacturing a surface-type optical element mounted body according to the present invention.

FIG. 6 is a sectional view of a surface-type optical element mounted body according to a third embodiment of the present invention.

FIG. 7 is a plan view of a guide hole shape according to a fourth embodiment of the present invention.

FIG. 8 is a perspective view illustrating a surface-type optical element package according to a second embodiment of the present invention.

FIG. 9 is a diagram illustrating an optical connection module according to the present invention.

FIG. 10 is a perspective view showing an optical wiring device according to the present invention.

FIG. 11 is a cross-sectional view illustrating a conventional coupling between a planar optical element and an optical fiber.

FIG. 12 is a cross-sectional view illustrating a conventional coupling between a planar optical element and an optical fiber.

FIG. 13 is a diagram illustrating a conventional coupling between a planar optical element and an optical fiber.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Mounting board 2, 80 ... Electrode pad 3, 60, 61, 70, 100 ... Thick film resist 4, 63, 72, 1209 ... Fiber guide hole 5, 84 ... Surface optical element 6, 31, 62, 83 ... Light transmission window 8 ... Element isolation groove 9, 10, 13 ... Electrical wiring 12, 53 ... Si-IC 14, 15, 2014 ... Fiber fixing jig 16, 95, 1210, 1037, 2016 ... Optical fiber
Bars 17, 1211 ... Adhesives 20, 25, 1033, 1035 ... Electrodes 21, 26, 1208 ... Insulating films 22, 24, 1023, 1027 ... DBR mirrors 23 ... Active layers and resonator layers 27 ... Buried layers 28 ... Air posts 29 ... selective oxidation Al_xO_yLayers 30 and 1021 Substrate 32 Contact hole 50 Laser wafer 51 Laser chip 52 Mounting wafer 54 Mounting area 55 Cutting line for dicing 71 Groove 81 Wire 90 Base for fixing lead 91, 111 Connection Lead 92: Optical mounting body 93, 96: Fiber fixing jig 94: Fiber array 97: Circuit board 98: Socket 99: Leaf spring 101: Cover 102: Connection pin 103: Solder 110: Electrical connector 1022: Light absorbing layer 1024, 1026: clad layer 1025: active layer 1028: contact layer 1032: Si0_Two  1036 antireflection film 1201 electronic circuit board 1202 light emitting chip 1203, 2018 surface emitting laser 1204 transistor 1205, 1206, 1207 transistor electrode 2012 module board 2022, 2023 protrusion 2024 fiber insertion hole 2026, 2027 Guide hole

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H037 AA01 BA02 BA05 BA11 BA14 DA04 DA06 DA11 DA17 5F073 AA65 AA74 AB17 BA09 CA04 CB22 CB23 DA23 EA29 FA07 FA13 5F088 BA18 BB10 EA02 EA09 JA14 JA20

Claims (21)

[Claims] 1. A planar optical element capable of emitting or receiving light, wherein a guide hole for inserting and fixing an optical waveguide so as to enable optical coupling with the planar optical element is provided in the planar optical element. A surface-type optical element, wherein the surface of the optical element is formed of a thick film material having photosensitivity or electron beam curability and which can be selectively cured by patterning by photolithography. 2. The surface optical device according to claim 1, wherein the thick film material is a polymerizable thick film resist. 3. The surface type optical device according to claim 1, wherein the thickness of the thick film material or the thick film resist is 10 μm to 1000 μm. 4. The thick film material or the thick film resist comprises: a first layer having a hole smaller than the size of the optical waveguide and allowing only light to pass therethrough; and an optical waveguide formed on the first layer. 4. The optical device according to claim 1, comprising a second layer formed with a guide hole for fixing, wherein a thickness of the first layer defines a distance between the planar optical element and an end face of the optical waveguide. Surface type optical element. 5. The surface mold according to claim 1, wherein the guide hole formed of the thick film material or the thick film resist forms only a portion corresponding to the outer shape of the optical waveguide. Optical element. 6. The guide hole formed of the thick film material or the thick film resist forms a groove pattern different from the outer shape together with a portion corresponding to the outer shape of the optical waveguide. 5. The surface-type optical element according to any one of 4. 7. The surface type optical element according to claim 6, wherein a portion of the guide hole corresponding to the outer shape of the optical waveguide and the groove pattern are formed continuously. 8. The surface optical device according to claim 1, wherein a plurality of said surface optical devices are arrayed, and corresponding guide holes are also arrayed. 9. The surface type optical device according to claim 8, wherein the plurality of surface type optical devices are only a surface type light emitting device, only a surface type light receiving device, or a combination of a surface type light emitting device and a surface type light receiving device. 10. The surface optical device according to claim 1, wherein said surface optical device is a vertical cavity surface emitting laser. 11. The surface-type optical device according to claim 10, wherein the surface-emitting laser has a functional layer including only an active layer, a resonator layer, and a Bragg reflection mirror layer. 12. The surface-type optical device according to claim 1, wherein the surface-type optical device has a thin film type by removing or thinning a growth substrate. 13. The surface optical device according to claim 1, wherein the growth substrate is left as it is. 14. A surface optical device according to claim 1, wherein:
A surface-type optical element mounting body, which is mounted on a mounting board with electrical connection so as to be drivable, and wherein an optical waveguide is fixed to the guide hole. 15. The surface-type optical element mounting body according to claim 14, wherein the mounting substrate is a mounting substrate on which other optical elements or electronic elements can be integrated in a hybrid manner and has a heat sink function. 16. The optical device according to claim 14, wherein a plurality of said planar optical elements are arrayed, and optical waveguides are also arrayed simultaneously.
The surface-type optical element mounted body according to the above. 17. The surface-type optical element mounting body according to claim 14, wherein the optical waveguide is composed of an optical fiber containing a polymer. 18. The surface-type optical element package according to claim 14, wherein the optical waveguide is composed of an optical fiber containing quartz. 19. A method for manufacturing a surface-type optical element mounted body according to claim 14, wherein a step of forming a wiring pattern on a wafer-like mounting substrate includes the step of sequentially performing at least one surface-type optical element. , The process of mounting on multiple locations on the mounting board, the process of forming guide holes with a thick film material on each surface type optical element, the required size after the necessary electronic devices etc. are sequentially flip-chip mounted at the required positions 2. A method for manufacturing a surface-type optical element mounting body, comprising: a step of cutting out a plurality of mounting bodies, and finally, a step of inserting and fixing an optical waveguide in a guide hole. 20. A planar optical device according to claim 14, wherein the optical interconnection device is mounted on a board in an electronic device via a connection lead and transmits and receives signals between the boards by light. An electronic circuit for driving a surface-type optical element is also integrated on the mounting body, and the optical mounting module is configured by mounting the optical mounting body on a pedestal for fixing connection leads for obtaining electrical contact. Optical wiring device. 21. The surface-type optical element mounting body according to claim 14, mounted on an electronic circuit for driving a surface-type optical element, housed in an electrical connector, and mounted on the electronic circuit for driving. An optical wiring device, wherein an electrical connection is made by a connection pin for a detachable connector, and a signal between electronic devices is transmitted and received by light.