JP2002031747A - Planar optical element mounted body, its manufacturing method, and device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a planar optical element mounted body having improved productivity by enhancing alignment precision between an optical waveguide medium and an optical element and facilitating the fixing operation of the waveguide medium. SOLUTION: On a first substrate 1, guiding means 9, 13 are formed, which is for fixing the waveguide medium 3 in a prescribed state. On the same face of the first substrate 1 as that the guiding means 9, 13 are formed, the planar optical element 4 is mounted. A second substrate 2 is provided with an optical path-changing function part 5 which is for optically coupling the waveguide medium 3 with the planar optical element 4 emitting or receiving light nearly vertically to the element-mounted face, and is adhered to the first substrate 1 at a position enabling the optical coupling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-type optical element package capable of optically coupling a surface-type optical element and an optical waveguide medium such as an optical fiber at low cost, a method of manufacturing the same, and a method of using the same. To an optical wiring device.

[0002]

2. Description of the Related Art In recent years, an optical module for high-speed optical connection has been developed. In connection with the coupling of an optical element and an optical transmission medium such as an optical fiber, particularly from the viewpoint of cost reduction and high performance. There are many issues.

[0003] In the light receiving element, a planar element is mainly used as an optical element in terms of ease of production and sensitivity. However, when the optical fiber and the main surface of the surface-type element are coupled in a vertical incidence mode, the transmission path between the electronic circuit on which the amplifier circuit and the like are mounted becomes longer, which causes a hindrance to high-speed operation. . Therefore, a method is being developed in which an electronic circuit board and an optical fiber are mounted in parallel by providing a 45-degree mirror at the optical coupling portion.

For example, as shown in FIG. 9A, a 45-degree mirror 101A that changes the optical axis by 90 degrees is formed on the end face of the optical fiber 101, as disclosed in Japanese Patent Application Laid-Open No. Hei 6-151903. , A 45 degree mirror 143 as shown in FIG.
A structure has been developed in which the optical fiber 101 is inserted into a substrate 140-2 on which is formed, and a circuit substrate 120 on which a light receiving element 102 and an amplifier circuit 103 are mounted on a plane is stacked. In these examples, the flat lens layer 131 is provided to increase the efficiency of optical coupling. Further, a guide groove 141 for mounting optical fibers in an array is provided on the substrate 140 holding the fibers 101 as shown in FIG. 9B. Note that in FIGS. 9 and 10,
Reference numeral 118 denotes a connection lead, and 142 denotes an optical fiber guide groove.

On the other hand, a semiconductor laser as a light emitting element is
Generally, an edge emitting laser that emits light in parallel with the substrate is used, and the 45-degree mirror as described above is not required as long as the laser is used. However, a vertical cavity surface emitting laser having an emission direction different from the above may be improved from the viewpoint of reducing the power consumption and cost of the optical transmission module, and has been actively studied. The surface emitting laser can be driven at a low threshold value of 1 mA or less, can perform inspection at a wafer level, and can be reduced in cost because cleavage accuracy is not required. However, coupling the surface emitting laser and the optical fiber causes the same problem as the above-mentioned surface type light receiving element. To mount the element as close as possible to a high-speed drive circuit, it must be on the same plane as the electronic circuit board. However, there is a need for a 45-degree mirror. For example, as shown in FIG. 11, in the example disclosed in JP-A-10-223985, a surface emitting laser (980 nm
An optical fiber 202h and a holder 202i holding the optical fiber 202h and having a 45-degree mirror 202j are bonded to the back surface of the substrate 201 on which the band 201a is formed. In this case, the alignment of the optical axis with the holder 202i is realized by forming the alignment marker 201b on the back surface of the substrate 201. In FIG. 11, 203f is an electrode wiring,
201c is an outgoing light beam, 202c is a guided light beam, 2
02b is an alignment marker on the holder 202i side.

[0006]

However, in the above-described conventional method, a holder having a 45-degree mirror and a groove for holding an optical fiber and a mounting substrate for an optical element are separately formed, and alignment is performed later. Therefore, the work is not always easy and the number of assembling steps is large. In addition, since a substrate or the like inserted between the optical element and the optical fiber is required for mounting, the degree of freedom regarding the coupling distance between the optical element and the optical fiber is small, and the surface emitting laser and the optical fiber are lensless. There was a problem when combining with, for example. Also,
In the example of Japanese Patent Application Laid-Open No. H10-223985, there is a problem that it can be applied to a surface emitting laser in the 980 nm band, but cannot be applied to a 850 nm band.

In view of these problems, an object of the present invention is to
A planar optical element is mounted on the same surface as the surface of the substrate on which the guide means for fixing the optical waveguide medium such as an optical fiber is formed, thereby improving the alignment accuracy between the optical waveguide medium and the optical element, and fixing the optical waveguide medium. It is an object of the present invention to provide an optical element mounting body which facilitates work and improves productivity. It is still another object of the present invention to provide a manufacturing method capable of mass-producing such an optical element mounting body and an optical wiring device using such an optical element mounting body capable of reducing costs.

[0008]

In order to achieve the above object, the surface type optical element mounting body of the present invention has a guide means such as a guide groove for fixing an optical waveguide medium such as an optical fiber in a predetermined state. A surface-type optical element mounted on the same surface as the surface on which the guide means is formed on the formed first substrate, and emitting or receiving light substantially perpendicular to the surface; and the optical waveguide medium A second substrate provided with a function part for converting an optical path for optical coupling with the first substrate is fixed to the first substrate at a position where the optical coupling can be performed. In this configuration, for example, when forming a guide means such as a guide groove for fixing an optical waveguide medium such as an optical fiber, an electrode pad for mounting a surface-type optical element, an alignment marker, and the like are subjected to photolithographic accuracy. Can be manufactured on the same substrate.

The following forms are possible based on the above basic configuration. The guide means is a guide groove, and the guide groove is formed only in a partial area of the surface so that the optical waveguide medium can be mounted by abutment. It may have a step to keep the distance from the end of the optical waveguide medium housed in the groove constant. The guide means may be in the following forms. That is, there is a pair of parallel guide walls formed so as to protrude on the surface, and the pair of guide walls are inwardly attached to the ends so that the end surfaces of the optical waveguide medium can be mounted by abutment. It has a L-shaped wall portion bent so that the distance between the planar optical element on the surface and the end of the optical waveguide medium accommodated in the guide wall can be kept constant.

The second substrate may be fixed to the first substrate at a position where the optical coupling can be performed by forming a plurality of metal films serving also as alignment marks and solder bonding on surfaces to be bonded to each other. It is possible to adopt a form in which the metal films corresponding to each other are provided together and bonded by flip-chip mounting.

The second substrate may be provided with guide means such as a guide groove for fixing the optical waveguide medium.

On the first substrate on which the guide means for fixing the optical waveguide medium is formed, an IC for an amplification circuit for a surface light receiving element or a driving circuit for a surface light emitting element mounted on the first substrate is provided. An IC for mounting may be mounted, and electrical wiring between the IC and the planar optical element may be performed by a wiring pattern formed on the first substrate.

In the surface type optical device, only an active layer necessary for light reception or light emission, and a functional layer necessary for current injection or voltage application and light confinement are mounted on a first substrate. It may have a thin film structure in which the held third substrate is removed or thinned. By making the surface-type optical element thinner, the distance between the surface-type optical element and the optical waveguide medium can be shortened so that the optical coupling between the surface-type optical element and the optical waveguide medium can be performed without a lens. Can be improved. In addition, the bonding height with the second substrate on which a 45-degree mirror or the like is formed is reduced, and the degree of freedom of mounting is increased. Further, it is easy to manufacture electric wiring when a driving IC or the like is mounted on the first substrate. become.

The above-mentioned surface-type optical element having a thin film structure is a vertical cavity surface emitting laser composed of a compound semiconductor, wherein an active layer and a Bragg reflection mirror layer are flip-chip mounted on a first substrate. It may be a thin film structure from which is removed.

[0015] The functional part for converting the optical path for performing the optical coupling may be a 45-degree mirror formed on the second substrate. This makes it possible to effectively and easily perform optical coupling between a surface-type optical element that emits or receives light substantially perpendicular to the surface of the first substrate and an optical waveguide medium that typically extends substantially parallel to the surface. A second substrate on which a 45-degree mirror or the like is formed as an optical path conversion function unit for optical coupling between the surface optical device and an optical waveguide medium such as an optical fiber is prepared, and a second substrate on which the surface optical device is mounted is prepared. The first substrate may be flip-chip mounted using an alignment marker or the like.

The function section for converting the optical path for performing the optical coupling may be a curved surface formed on the second substrate and having a light condensing action.

With the above configuration, an optical package that is easy to assemble, has high alignment accuracy, and has high optical coupling efficiency can be realized.

Further, a method of manufacturing a surface-type optical element mounting body of the present invention that achieves the above object is provided by providing the first base with the guide means for fixing the optical waveguide medium and the surface-type optical element. A step of preparing a plurality of regions having the function of one substrate and then cutting out the first base to form a plurality of the first substrates; and a function of converting the optical path to a second base. Forming a plurality of regions having the function of the second substrate collectively, and then cutting out the second base to form a plurality of the second substrates; and A step of aligning and bonding the two substrates to each other, and a step of introducing and fixing the optical waveguide medium to at least an optical waveguide medium guide formed by the first substrate. Thus, processing of a substrate to be a surface-type optical element mounting body is performed collectively in a large-area wafer state, and dicing is performed at the end, so that productivity is improved.

Further, the method of manufacturing a surface-type optical element mounting body including a second substrate having a 45-degree mirror according to the present invention, which achieves the above object, is characterized in that the 45-degree mirror is formed with a blade having a tip having a 90-degree angle. It is characterized by cutting.

Further, according to the optical wiring apparatus of the present invention, which achieves the above object, the above-mentioned surface-type optical element mounting body is mounted on an electronic circuit for driving a surface-type optical element and housed in an electric connector, and an external electronic device is mounted. An electrical connection to the drive electronic circuit is made at a connection connecting portion detachable from the device, and transmission and reception of signals between the electronic devices are performed by light. The above optical package can be miniaturized at low cost.
By placing the connector in a sub or other electrical connector, a detachable optical wiring device can be realized in which the connection portion is electrically connected and the signal is optically connected. This is because the connected part is electric,
It is safe, easy to handle and the signal transmission is done by light,
High-speed, large-capacity transmission can be used for connection between electronic devices without special measures against electromagnetic noise.

[0021]

Embodiments of the present invention will be described below with reference to the embodiments shown in the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention. FIG. 1A is a cross-sectional view, and a planar optical element 4 is mounted at a predetermined position on a substrate 1 on which a guide groove 9 for fixing the optical fiber 3 is formed. When mounting the surface-type optical element 4, the positional relationship with the guide groove 9 is adjusted by a mounting apparatus. Optical coupling between the planar optical element 4 and the optical fiber 3 is performed by covering the substrate 2 on which a 45-degree mirror is formed as shown in FIG.

The alignment between the substrate 1 and the substrate 2 is shown in FIG.
As shown in the plan views (b) and (c), an alignment marker 8 made of a metal film is formed at a position facing the surface, and can be self-aligned by flip-chip mounting using a solder ball 7 or the like. It has become. The substrate 2 on which the 45-degree mirror is formed, as shown in FIG.
Flat counterbore 12 and 45 for receiving fiber 3
It has a 45-degree inclined portion 5 that becomes a degree mirror. A metal film such as Au is formed on the 45-degree inclined portion 5 so as to function as a reflecting mirror.

On the other hand, as shown in FIG. 1C, an IC for driving or amplifying a signal of the planar optical element 4 is provided on the substrate 1.
6 is also mounted by flip chip. The connection between the planar optical element 4 and the IC 6 is made by a wiring 11 formed on the substrate 1. Further, the wiring 10 is an electrode pad for connecting when mounting the optical package according to the present invention on another electronic circuit board. However, the wiring 10 may be provided with connection leads so that it can be directly soldered. Good. The light guide groove 9 is formed only in a partial area of the substrate 1, and as shown in FIG. 1A, the end face of the optical fiber 3 is brought into contact with the end face of the step portion 13 so that the optical fiber 3 is formed. It can be mounted by striking.

The materials of the substrates 1 and 2 include Si, glass,
Ceramics such as AlN and Al ₂ O ₃ , plastics, and the like can be considered. In the case of Si, it is necessary to form an oxide film or an insulating film such as Al ₂ O ₃ on the surface in order to use the surface type optical element 4 for mounting. From the viewpoint of cost, it is preferable that a plastic is formed by a mold. In this case, it is desirable to include a metal plate underlay layer in order to improve heat dissipation. Si is also good in terms of workability, cost reduction, and heat dissipation, but requires an insulating layer on the surface as described above.

The substrates 1 and 2 are processed by patterning by photolithography and anisotropic etching by wet if Si, processed by a mold as described above for plastic, and cut by other materials. Processing will be performed.

Next, the surface type optical element 4 will be described. In this embodiment, a general pin type photodiode or MSM photodiode is used as the light receiving element. In addition, a vertical cavity surface emitting laser was used as a light emitting element. In each case,
When the supporting substrate side of the element 4 is mounted on the substrate 1, the electrodes are taken out from the epi layer side which is the optical functional layer. Therefore, the wiring pattern 11 is denoted by reference numeral 2 in FIGS. 2 (a) and 2 (b).
As shown by 0, a step wiring covering the thickness of the element 4 (about 100 μm) is performed. This requires a process of covering the side wall of the element 4 with the tapered insulator 23. In FIG. 2, reference numeral 21 denotes an electrode pad for mounting a common electrode on the substrate 1 side of the surface-type optical element 4; Represents a separating portion of the array-shaped element 4.

On the other hand, when flip-chip mounting is performed on the epi side, such a step wiring is not required, and if a wiring pattern is formed on the substrate 1, no surface wiring is required. However, the problem with this method is that light must be coupled with the optical fiber 3 through the support substrate of the element.
When a GaAs substrate is used, light of about 900 nm or more, In
When a P substrate is used, the light must be about 1 μm or more. You may make holes in this support substrate,
In that case, the number of steps increases. Also, in a surface emitting laser, since an element is usually manufactured on an n-substrate, the epi side to be bonded is the anode side, and it is difficult to make the anode common, and the structure is not suitable for high-speed driving.

Next, the substrate 2 having the 45-degree mirror 5 will be described. It can be made by cutting, etching, or a combination thereof, as described above.
Since the guide V-groove for fixing the optical fiber is not formed on the substrate 2 and only the 45-degree mirror 5 is formed, the fabrication becomes easy. In order to manufacture a 45-degree mirror, it is preferable to use a diamond blade whose tip forms an angle of 90 degrees. FIG. 3 shows the processed state.

This shows a state in which a plurality of 45 ° mirror substrates are formed on a large wafer. First, a plurality of flat counterbore portions 30 and alignment markers 31 are collectively formed on a wafer by using photolithography or the like. Next, as depicted by three solid lines 33, a diamond blade having a 90-degree tip (typically, 90
Flat counterbore 30 with a rotating disk blade
By cutting the tip of V into a V-shape, 4
A five degree mirror can be made in a plurality of the tip regions. When the formation of the 45-degree mirror 5 is completed, the entire wafer is diced by a diamond blade at the positions indicated by the two broken lines 32 and cut into individual substrates 2.

Next, the substrate 1 will be described. As in the case of the substrate 2, a plurality of wafers are prepared in the same wafer in a wafer state as described with reference to FIG. First, an optical fiber fixing groove (not shown), electrode pads, wiring, and the like are formed in a plurality of regions 45 on a large wafer 40 such as a Si wafer. Next, the necessary array-shaped elements 42 are cut out from the separately manufactured surface-type optical element wafer 41, aligned, and mounted on each area 45. Similarly, Si-IC
43 is also mounted on each area 45, and finally, the wafer 40 is diced as shown by a broken line 44 to obtain a plurality of substrates 1.

The assembling method will be briefly described. The substrate 1 on which the optical fiber fixing groove 9 is formed is cut out in a fixed size in a state where the optical element 4 and the Si-IC 6 are mounted thereon, and similarly has the cut 45 degree mirror 5. The substrate 2 is cut out. Before cutting, the surface is protected with a resist or the like so that cutting dust does not adhere, and then removed. The two substrates 1 and 2 are superimposed on each other with the alignment marker 8 aligned, and bonded using a solder ball 7 or the like. Finally, the optical fiber 3 is inserted into the guide groove 9.
Is inserted and fixed with an adhesive, an optical package as shown in FIG. 1 can be manufactured. In this case, if the fiber 3 is inserted to the end 13 of the guide groove 9 and abutted, the alignment of the optical coupling between the optical element 4 and the optical fiber 3 is completed, so that the work becomes very easy.

Incidentally, as the optical fiber 3 used here, a plastic fiber (trade name Lucina: manufactured by Asahi Glass) using perfluorinated polyimide was used. This is advantageous for optical coupling because the core is as large as about 120 μm.
The depth at which the optical fiber 3 was embedded in the substrate 1 in the guide groove 9 was 100 μm. This is because the thickness of the surface type optical element 4 is 1
This is because the position of the core of the optical fiber 3 is higher than the upper surface of the planar optical element 4 by 50 μm because the radius of the lukin 3 is 250 μm at 00 μm. The distance between the end face of the optical fiber 3 and the planar optical element 4 was 750 μm.

According to the above-mentioned method, it is possible to provide an optical wiring module which is easy to manufacture, can perform optical mounting with high precision, and is low in cost and small in size.

(Second Embodiment) In a second embodiment of the present invention, the thickness of a planar optical device is reduced in order to solve the problem of the substrate thickness. Although the overall configuration is the same as that of FIG. 1, in the present embodiment, the surface-type optical element 4 is flip-chip mounted and is of an anode common type to achieve high-speed driving and easy wiring. Using the case of a surface emitting laser oscillating in the 830 nm band, the manufacturing method and structure are shown in FIG.
(A), (b) and (c). In the drawings showing the manufacturing method, only two elements are shown for convenience.

In FIG. 5A, on a GaAs substrate 50,
A reflecting mirror 51 composed of an AlAs / AlGaAs multilayer film, GaAs / Al
An AlGaAs one-wavelength resonator 52 having an active layer composed of a GaAs multiple quantum well, a reflector 53 also composed of an AlAs / AlGaAs multilayer film, and a crystal layer such as a GaAs contact layer (not shown) are formed by metal organic chemical vapor deposition ( Epitaxial growth by MOCVD). Here, the conductivity type is n-type up to the substrate 50, the reflector 51, and the active layer of the resonator 52, and the upper side of the active layer of the resonator 52, the reflector 53, and the contact layer are p-type. Only the layers are non-doped.

Next, in order to form a portion to be a light emitting region, a groove 56 is formed by etching, an insulating film 54 made of SiN _x is formed, and only a portion to be a light emitting region is opened. Also, a groove 57 for separating the elements is formed. The grooves 56 and 57 are buried with polyimide and flattened. On the top surface, Ti / Au55 which is a p-side electrode
Is formed, and a window 58 for light extraction is formed here.
The substrate 50 is polished to about 100 μm.

Referring to FIG. 5B, the wafer is attached to a Si substrate 59 with electron wax, and the GaAs substrate 50 is etched in a mixed solution of hydrogen peroxide and ammonia. Thus, the lowermost surface of the reflection mirror layer 51, AlAs
Stop the etching at the layer (not shown). After that, the AlAs layer was immediately removed by etching with an HCl solution, and the second
The GaAs layer (not shown) of the layer is exposed. On the surface thereof, an AuGe / Au electrode 60 as an n-electrode is formed so as to be independently driven for each element. Also, a through hole is formed up to the element surface side to take out the common p-electrode from below,
The Au plug 61 is formed by plating or the like. This through-hole may be formed at the time of the surface process of FIG. Here, Si was used as the bonding substrate 59, but a glass substrate or the like may be used as long as it has flatness.

In FIG. 5C, electrodes 60 and 60 are formed on a substrate 62 on which a cathode electrode pad 64 corresponding to each element and an anode electrode pad 63 serving as a common electrode are formed.
The wafer is flip-chip mounted while aligning 61 with pads 63 and 64. The substrate 62 is the same as the substrate 1 having the guide groove 9 shown in FIG. At this time, by applying an ultrasonic wave while applying a load by heating, the Au electrodes can be pressed together. Alternatively, AuSn solder may be vapor-deposited on the surfaces of the electrodes 63 and 64, and may be bonded by heating.
Finally, after peeling off the Si substrate 59, annealing is performed for electrode contact.

Prior to the flip-chip mounting of FIG. 5C, the following may be performed. In FIG. 5B, the Si substrate 5
9, the mounting wafer 40 shown in FIG.
A plurality of devices cut to a required size are pasted at necessary positions on the Si substrate (or wafer 40) so that the devices are bonded to portions corresponding to the mounting position 45 of the above. If the wafers are aligned and bonded as shown in FIG. 5C, the throughput is improved.

The thin-film type surface emitting laser as in this embodiment has a thickness of about 7 μm as an element, and has an advantage in mounting and high-speed driving because it is an anode common type. In this embodiment, since the height of the upper surface of the element from the mounting substrate 1 is reduced, the optical fibers 3 embedded in the substrate 1
Was 150 μm, and the height from the upper surface of the planar optical element 4 to the center of the core of the optical fiber 3 was 100 μm. This is the case where luquina is used as in the first embodiment.

By adopting the thin film type, it is possible to mount a thinner optical fiber, that is, a 125 μmφ silica-based fiber. In this case, the depth embedded in the substrate 1 was set to 40 μm. Although the surface emitting laser is shown here as an example, the same effect can be obtained by thinning the light receiver similarly.

(Third Embodiment) In a third embodiment of the present invention, a 45-degree mirror portion of the second substrate 2 is formed into a curved surface in order to improve optical coupling particularly on the light receiving side. It is. FIG. 6 shows a cross-sectional structure and a planar structure.

The structure is almost the same as that of the first embodiment. The cross-section of the light-reflecting portion 65 is, for example, elliptical, and the light-receiving or light-emitting portion of the surface-type optical element 4 comes to the two focal points, and the core of the end face of the optical fiber 3 comes to the other focal point. With such a setting, the optical coupling efficiency increases. Such an elliptical shape is formed by cutting or molding when the substrate 2 is made of glass or plastic, and is formed by combining anisotropic etching and isotropic etching when the substrate 2 is a Si substrate.

In this embodiment, as shown in FIG. 6B, a guide groove 67 for an optical fiber is also formed on the substrate 2 on which the mirror 65 is formed. Guide groove 67 and curved mirror 6
A step 66 is provided between the optical fiber 3 and the optical fiber 3 so that the optical fiber 3 can be adjusted by abutment. In this case, if the optical fiber 3 is first fixed in the guide groove 9 of the substrate 1 and the guide groove 67 of the substrate 2 is attached so as to receive the optical fiber 3 and bonded, alignment can be performed at the same time. it can. Therefore, there is no need for a device for observing and aligning the alignment markers between the bonding surfaces as used in flip chip mounting. The substrate 1 and the substrate 2 are bonded with an adhesive (not shown) for bonding between the optical fibers 3 and an adhesive 68 for directly bonding the substrates together. Such a structure can of course be applied to the first and second embodiments.

In the above examples, an example has been described in which the number of arrays of the planar optical element 4 and the optical fiber 3 is four, but the number is of course not limited. The number may be four or more, or may be only one surface type optical element and one optical fiber. In addition, as for the optical package, any of the optical package having only the surface light emitting element integrated as the transmitting side, the optical module having only the planar light receiving element integrated as the receiving side, or the optical package having both the transmitting and receiving sides is used. Good. Send,
If the reception is split, it is a one-way transmission,
If transmission and reception are contained in one module, bidirectional transmission is possible.

(Fourth Embodiment) In a fourth embodiment of the present invention, a high-speed optical wiring device is obtained by modularizing the optical package described above. FIG. 7 shows a state in which the optical package 74 is mounted on the electronic circuit board 70. In FIG. 7, reference numeral 75 denotes a ribbon formed by bundling a plurality of optical fibers optically coupled to a surface-type optical element by an optical package 74. The optical package 74 is mounted on the circuit board 70 by forming a metal pad (not shown) on the back surface of the lower substrate 77 in which the optical fiber guide groove of the optical package 74 is formed. Flip chip mounting. Driving for planar optical device
For electrical connection between the IC 78 and the circuit board 70, a through hole is formed in the lower substrate 77 bonded to the substrate 76 having an optical path conversion function, and an electrode pad for the contact is formed on the back surface of the substrate 77. It is performed at the same time as the flip chip mounting.

In order to make electrical connection more simply, a driving IC
Wire bonding may be performed between the electrode pad from 78 and the circuit board 70, or may be performed using a flexible wiring board. Also, as described in the first embodiment, a connection lead to the electronic circuit 70 may be formed on the substrate 77 and then connected by soldering.

The circuit board 70 is generally a multilayer wiring board which is small and has a surface mounting IC 72 on its surface.
And a surface mount capacitor 73 are mounted thereon, and an electrical connection lead 71 is formed for connection to a motherboard of an electronic device or the like.

Instead of directly mounting the optical transmitting / receiving module on which such an optical package 74 is integrated on the motherboard, the optical transmitting / receiving module is housed in an electric connector 80 as shown in FIG. It may be detachably connected to an interface unit of an electronic device such as a monitor, a printer, a digital camera, a digital video camera, or the like. The electrical connector 80 can be manufactured according to the required device standard. For example, a 26-pin MDR connector according to the digital monitor interface standard for connecting a PC and an LCD monitor,
It is also possible to conform to standards such as USB and USB. Also,
The present invention is also applicable to the internal connection between a scanner unit and a photosensitive unit of a digital copier. By using the optical wiring device of the present invention to connect these electronic devices, 1 Gbps per channel
5 to 4 to 5 signal transmission at 2.5Gbps
This is possible at 0 m or more, and can be used instead of high-speed video transmission, which is limited by electric cables. In addition, since the optical connection is used, there is no electromagnetic radiation noise generated from the transmission line, and it is possible to reduce noise measures particularly in high-speed digital transmission.

[0051]

As described above, the following effects are expected by the present invention. Since the surface type optical element is mounted on the same surface as the surface of the substrate on which the guide means for fixing the optical waveguide medium such as an optical fiber is formed, the alignment accuracy between the optical waveguide medium such as an optical fiber and the optical element is improved,
The work of fixing an optical waveguide medium such as an optical fiber can also be facilitated and productivity can be improved.

Further, by realizing a manufacturing method capable of mass-producing such a mounting structure, it is possible to provide an optical mounting body capable of reducing costs and an optical wiring device using the same. Therefore, in the signal connection between electronic devices handling high-speed digital signals, there is a limited area for electrical connection, that is, 50 m.
As described above, signal transmission of about 2.5 Gbps becomes possible, and large-capacity video transmission can be easily performed without any special measures against electromagnetic noise.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a surface-type optical element package according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating electric wiring in a first embodiment according to the present invention.

FIG. 3 is a diagram illustrating a method for manufacturing a substrate with an optical path conversion function unit according to the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing an optical package according to the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing a surface-type optical device according to a second embodiment of the present invention.

FIG. 6 is a diagram illustrating a substrate with an optical path conversion function unit according to a third embodiment of the present invention.

FIG. 7 is a diagram illustrating a mounting board according to a fourth embodiment of the present invention.

FIG. 8 is a diagram illustrating an optical wiring device according to a fourth embodiment of the present invention.

FIG. 9 is a diagram illustrating a conventional functional layer transfer type surface emitting laser array.

FIG. 10 is a diagram illustrating a conventional example of an optical package including a surface-type optical element and an optical fiber.

FIG. 11 is a diagram illustrating a conventional example of an optical package of a surface-type optical element and an optical fiber.

[Explanation of symbols]

 1,62,77,120… Mounting board 2,76,140-2… Substrate with optical path conversion function 3,75,101,202h… Optical fiber 4,42,102… Surface type optical element 5,101A, 143… 45 degree mirror 6,43,78,103… Driving or amplifying IC 7… Solder ball 8,31… Alignment electrode pad 9,67,141,141-2… Optical fiber guide groove 10,21,63,64… Electrode pad 11,20,203f… Electrode wiring 12,30… Flat counterbore part 22 ... Light emitting / receiving part of surface type optical element 23 ... Tapered insulating layer 24 ... Element separating part 32,44 ... Cut line for dicing 33 ... 45 degree mirror formed by blade 40 ... Wafer for mounting board 41 ... Surface type optical device wafer 45… Mounting area 50,201… Semiconductor substrate 51,53… Bragg reflection mirror 52… Active layer 54… Insulating film 55,60… Electrode 56,57… Polyimide buried layer 58… Light extraction window 59… Substrate 61… Through-hole electrode 65 ... Reflected surface 13,66 ... Step 68 ... Adhesive 70 ... Electronic circuit board 71,118 ... Connection lead 72 ... Drive IC 73 ... Surface mount components 74 Optical mounts 80 Connectors 131 Microlenses 140 Optical fiber holding substrates 202i Holders 202j Mirrors 201b and 202b Alignment markers 201c Emitted light beams 201a Surface emitting lasers 202c Guided light beam

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H037 AA01 BA02 BA11 CA38 DA03 DA04 DA06 DA11 DA12 DA13 5F073 AA62 AA74 AB17 AB28 AB29 BA01 CA04 DA22 DA31 FA06 FA13 5F088 AA01 BA16 BB01 JA03 JA14 KA02

Claims (13)

[Claims] 1. A surface type optical element is mounted on the same surface as a surface on which a guide means is formed on a first substrate on which a guide means for fixing an optical waveguide medium in a predetermined state is provided. A second substrate provided with a functional part for converting an optical path to perform optical coupling between the surface optical element that emits or receives light substantially perpendicular to the surface and the optical waveguide medium may perform the optical coupling. A surface-type optical element mounted body fixed to the first substrate at a position where it can be formed. 2. The optical waveguide medium is an optical fiber.
2. The surface-type optical element package according to 1. 3. The guide means is a guide groove, and the guide groove is formed only in a partial area of the surface so that the optical waveguide medium can be mounted by abutment, and is formed on a surface of the surface. 3. A step according to claim 1, further comprising a step for keeping a constant distance between the optical element and an end of the optical waveguide medium accommodated in the guide groove.
The surface-type optical element mounted body according to the above. 4. The method of fixing the second substrate to the first substrate at a position where the optical coupling can be performed is such that a metal film having both an alignment mark and a solder bond on surfaces to be bonded to each other. 4. The surface-type optical element mounted body according to claim 1, wherein a plurality of are provided, and the metal films corresponding to each other are combined and bonded by flip-chip mounting. 5. The surface-type optical element mounting body according to claim 1, wherein guide means for fixing said optical waveguide medium is also formed on said second substrate. 6. A first substrate on which said guide means for fixing an optical waveguide medium is formed, wherein an IC for an amplifying circuit for a surface-type light-receiving element or an IC for a surface-type light-emitting element mounted on the first substrate is provided. 6. The surface type according to claim 1, wherein a drive circuit IC is mounted, and electric wiring between the IC and the surface type optical element is performed by a wiring pattern formed on the first substrate. Optical element mounting body. 7. The surface type optical device comprises an active layer necessary for light reception or light emission, and a functional layer necessary for current injection or voltage application and light confinement mounted on a first substrate. 7. The surface-type optical element mounting body according to claim 1, having a thin film structure in which the third substrate holding the element is removed or thinned. 8. A vertical cavity surface emitting laser comprising a compound semiconductor, wherein the active layer and the Bragg reflection mirror layer are flip-chip mounted on a first substrate. 8. The surface-type optical element mounted body according to claim 7, which has a thin film structure from which the semiconductor substrate has been removed. 9. The surface-type optical element mounting according to claim 1, wherein the functional portion for converting an optical path for performing the optical coupling is a 45-degree mirror formed on the second substrate. body. 10. The surface mold according to claim 1, wherein the functional part for converting an optical path for performing the optical coupling is a curved surface having a light-condensing action formed on the second substrate. Optical element mounting body. 11. The method for manufacturing a surface-type optical element package according to claim 1, wherein the first base is provided with:
A plurality of regions having the function of the first substrate are collectively prepared by providing the guide means for fixing the optical waveguide medium and the surface type optical element, and then the first substrate is cut out and the first substrate is cut out. And forming a plurality of regions having the function of the second substrate on the second substrate by providing a functional portion for converting the optical path, and then cutting out the second substrate Forming a plurality of the second substrates by aligning and bonding the first substrate and the second substrate to each other;
Introducing the optical waveguide medium into the optical waveguide medium guide portion formed by the substrate and fixing the optical waveguide medium. 12. The method of manufacturing a surface-type optical element package according to claim 9, wherein the 45-degree mirror is cut with a blade having a 90-degree angle tip. Method. 13. A surface-type optical element mounting body according to claim 1, mounted on an electronic circuit for driving a surface-type optical element, housed in an electrical connector, and detachable from an external electronic device. An optical wiring device, wherein an electrical connection to the driving electronic circuit is performed at a connection portion for a proper connection, and transmission and reception of signals between the electronic devices are performed by light.