JP4532688B2 - Device with surface optical element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a planar optical element capable of optically coupling an optical waveguide such as an optical fiber, an optical mounting body in which the planar optical element and the optical waveguide are optically coupled at low cost, a manufacturing method thereof, and The present invention relates to the optical wiring device used.
[0002]
[Prior art]
In recent years, optical modules for high-speed optical connection have been developed. However, there are many problems regarding the coupling between an optical element and an optical transmission body such as an optical fiber, particularly from the viewpoint of cost reduction and high performance.
[0003]
As a light receiving element, a surface type element is mainly used in terms of ease of manufacture and sensitivity. However, when an optical fiber is optically coupled to the main surface of the surface type element, the light receiving element receives light. Passive alignment that aligns elements without operating them is essential for cost reduction. As a technique for that purpose, a method of producing and assembling a fixing member is generally used. However, the mechanical accuracy of the fixing member is required, the elastic coefficient and the thermal expansion coefficient are limited, and the number of parts is increased, so that cost reduction is difficult. In particular, when a plastic mold or the like is used for cost reduction, there is a problem that the yield of optical coupling and long-term reliability are lacking.
[0004]
Also in light emitting devices, vertical cavity surface emitting lasers that emit light perpendicularly from the substrate surface can be improved in terms of reducing power consumption and cost of optical transmission modules. Yes. The surface emitting laser can be driven with a low threshold value of 1 mA or less, can perform wafer level inspection, and does not require cleavage accuracy, so that the cost can be reduced. The same problem as described above also occurs in the optical coupling between the surface emitting laser and the optical fiber.
[0005]
Therefore, a method has been proposed in which a guide hole for coupling with an optical fiber is produced with photolithography accuracy. For example, in Japanese Patent Application Laid-Open No. 8-111559, as shown in FIG. 11, a hole for fixing an optical fiber 1037 is formed by etching on a substrate 1021 side on which a surface light receiving element or a light emitting element is manufactured. Yes. In FIG. 11, 1022 is a light absorbing layer, 1023 and 1027 are DBR mirrors, 1024 and 1026 are cladding layers, 1025 is an active layer, 1028 is a contact layer, and 1032 is SiO.₂Layers 1033 and 1035 are electrodes, and 1036 is an antireflection film.
[0006]
Japanese Patent Laid-Open No. 6-2371616 also discloses a method of fixing an optical fiber 1210 by forming a guide hole 1209 by etching a substrate on the back side of a surface emitting laser 1203 as shown in FIG. Yes. In these cases, the number of parts can be reduced and the assembly is very simple, so that the cost can be reduced. In FIG. 12, 1201 is an electronic circuit board, 1202 is a light emitting chip, 1204 is a transistor, 1205, 1206 and 1207 are transistor electrodes, 1208 is an insulating layer, and 1211 is an adhesive.
[0007]
However, in the method of making a hole in the substrate, it is difficult to control the distance between the optical fiber and the light receiving part or the light emitting part, and there is a possibility that the element is deteriorated because the crystal is damaged when the fiber is hit against the crystal. there were. Therefore, in the invention of Japanese Patent Application Laid-Open No. 6-2371616, the guide hole 1209 is provided with a forward taper shape so that the diameter of the guide hole tip is reduced so that the fiber does not contact the crystal surface (see FIG. 12). A method has been used in which etching is stopped with the substrate remaining slightly without etching to the layer.
[0008]
On the other hand, a method of mounting an optical fiber by directly fixing a fiber fixing member on the surface side on which the surface optical element is formed has been proposed. For example, in Japanese Patent Application Laid-Open No. 11-307869, as shown in FIG. 13, projections 2022 and 2023 for fitting the fiber fixing member 2014 are provided on the surface of the surface emitting laser element 2018, and the surface emitting laser 2018 emits light. A guide hole is disclosed at a position corresponding to the portion. In FIG. 13, 2012 is a module substrate, 2016 is an optical fiber, 2024 is a fiber insertion hole, and 2026 and 2027 are guide holes.
[0009]
[Problems to be solved by the invention]
However, when the guide hole is formed by etching, the depth is usually 100 μm or more, so there is a problem in the controllability of the taper shape and the hole diameter, and it is difficult to improve the yield. Further, when the substrate is left, there is a problem of light absorption by the substrate, and the usable wavelength band is limited.
[0010]
On the other hand, in the case of using the optical fiber fixing block, the above-described manufacturing problems do not occur, but the number of parts and the processing steps increase, and thus the cost cannot always be reduced.
[0011]
In view of such a problem, an object of the present invention is to form a guide hole for fixing an optical waveguide such as an optical fiber, and without increasing the number of parts and improving process controllability, This improves the alignment accuracy of the surface optical element, which also facilitates the fixing work of the optical waveguide to improve the productivity and reduce the cost, and further, between the surface optical element and the optical waveguide. The object is to provide a structure in which the distance can be set freely and the ease of mounting and the degree of freedom are improved. It is another object of the present invention to provide a manufacturing method capable of mass-producing such a structure for mounting, an optical mounting body capable of reducing costs, and an optical wiring device using the same.
[0012]
[Means and Actions for Solving the Problems]
Surface optical device of the present inventionA device comprisingIn the above, the above-mentioned problem is solved by forming a structure serving as a guide hole for inserting an optical waveguide such as a fiber directly on the surface of the surface optical element by photolithography using a thick film material. That is, the planar optical element capable of emitting or receiving light according to the present invention.A device comprisingIsIn order to insert a substrate, the planar optical element provided on the substrate, a first hole provided in the upper part of the planar optical element, and an optical waveguide provided in the upper part of the first hole And a member disposed on a surface on the side where the planar optical element is provided with respect to the substrate, the contact between the optical waveguide and the planar optical element The diameter of the first hole is smaller than the diameter of the optical waveguide, and the member isIt is formed by curing a material (such as a thick film resist that can be polymerized) that has photosensitivity or electron beam curability and can be selectively cured by patterning with photolithography. .
[0013]
The thickness of the thick film material or thick film resist is preferably 10 μm (this is about the core of a quartz single mode fiber) to 1000 μm (this is about the core of a plastic fiber (POF) made of acrylic material), More desirably, a material having a thickness of about 50 μm to 500 μm is preferably used. As the size of the optical waveguide such as a fiber, any size from about 125 μm to about 1 mm is applicable. Since the thick film material or the thick film resist is processed in a normal photolithography process, it is easy to accurately align the surface optical element and the center position of the guide hole. Therefore, it is possible to omit the step of aligning and bonding the structure in which the guide hole is formed.
[0014]
The controllability and shape control of the hole diameter are also excellent from the characteristics of the thick film material or the thick film resist, and the process becomes simpler than the method of making a hole by substrate etching.
[0015]
For surface-type optical elements, surface-emitting lasers, surface-type light-receiving elements, etc. are used, and by mounting elements of the required chip size and number of arrays on the mounting substrate, removing the growth substrate to make it a thin film type, The mounting board can also be used as a handling board. As a result, the yield that can be obtained from the wafer of the surface optical element can be increased and the cost can be reduced.
[0016]
In addition, a plurality of the surface optical elements are arrayed and correspondingly formed with an array of guide holes, or the plurality of surface optical elements are only a surface light emitting element, only a surface light receiving element, or a surface. Type light emitting element and surface type light receiving element, the surface type optical element is a vertical cavity type surface emitting laser, or the surface emitting laser is only active layer, resonator layer, and Bragg reflection mirror layer The functional layer may be left, or the planar optical element may be a thin film type by removing or thinning the growth substrate, or the growth substrate may be left as it is.
[0017]
As for the distance between the end face of an optical waveguide such as a fiber and a planar optical element, if two layers of thick film material or thick film resist are used and the distance is controlled by the thickness of the first layer, controllability and flexibility Can be improved. That is, the thick film material or the thick film resist is formed on the first layer in which a hole smaller than the size of the optical waveguide and through which only light can pass is formed, and for fixing the optical waveguide. The thickness of the first layer defines the distance between the surface optical element and the end face of the optical waveguide.
[0018]
The shape of the optical waveguide guide hole can also be set freely depending on the design of the photomask, and it should be designed so that the fixing adhesive escapes or the optical waveguide and the guide hole are easily fitted ( For example, the guide hole may be tapered. That is, the guide hole formed of the thick film material or the thick film resist forms only a portion that matches the outer shape of the optical waveguide, or along with the portion that matches the outer shape of the optical waveguide. A groove pattern different from the outer shape is also formed, or in this case, the portion of the guide hole that matches the outer shape of the optical waveguide and the groove pattern are formed continuously.
[0019]
Furthermore, the surface optical device mounting body of the present invention is mounted on the mounting substrate with electrical connection so that the surface optical device can be driven, and the optical waveguide is fixed to the guide hole. It is characterized by comprising.
[0020]
The mounting substrate may be a mounting substrate that can integrate other optical elements or electronic elements in a hybrid manner and has a heat sink function.
[0021]
A plurality of the planar optical elements are arrayed, and the optical waveguides can be arrayed simultaneously. The optical waveguide may be composed of an optical fiber containing a polymer or an optical fiber containing quartz.
[0022]
Furthermore, in the method for producing the above-described surface-type optical element mounting body according to the present invention, a step of forming a wiring pattern on a wafer-shaped mounting substrate, and at least one surface-type optical element is sequentially mounted at a plurality of locations on the mounting substrate. A step of forming a guide hole with a thick film material on each surface type optical element, a step of sequentially flip-chip mounting a required electronic device, etc. at a required position, and then cutting out a plurality of mounting bodies of a required size, and finally And a step of inserting and fixing the optical waveguide into the guide hole.
[0023]
Furthermore, an optical wiring device according to the present invention is an optical wiring device that is mounted on a board in an electronic device via a connection lead, and transmits and receives signals between the boards by light, and the above-described planar optical element mounting body In addition, an electronic circuit for driving a planar optical element is also integrated, and the optical mounting body is surface-mounted on a pedestal for fixing a connection lead for obtaining electrical contact, thereby forming an optical connection module. Or mounting the above-mentioned surface-type optical element mounting body on the surface-type optical element driving electronic circuit and placing it in an electrical connector so that the electrical connection from the driving electronic circuit can be removed. It is characterized by the fact that signals are exchanged between electronic devices using light.
[0024]
As described above, an optical mounting body in which a planar optical element and an optical waveguide are combined using a thick film resist or a thick film material is integrated with an electronic circuit and used as an optical interconnection device equipped with transmission and reception. Can do. In that case, it can be used for optical wiring between electronic circuit boards, optical connection between electronic devices, and the like, and high-capacity high-speed transmission of multiple channels at 1 Gbps or more per channel can be realized at low cost while suppressing electromagnetic radiation noise.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0026]
(First embodiment)
A first embodiment according to the present invention is shown in FIG. Four surface emitting lasers 5 arrayed at a pitch of 750 μm are bonded to the mounting substrate 1 via the common electrode 2. An element isolation groove of each element 5 is indicated by 8, and a portion corresponding to the light emitting point is indicated by 6. As for the electric wiring for driving the surface emitting laser 5, a common electrode wiring 10 and an independent driving wiring 9 are formed on the mounting substrate 1. An independent electrode 25 for driving the surface emitting laser is connected to the wiring 9. Further, a driver IC 12 for driving the surface emitting laser is flip-chip mounted on the same mounting substrate 1. The driver IC 12 is connected to another electronic device or the like by the wiring 13.
[0027]
As an optical fiber to be inserted into the guide hole 4, a plastic optical fiber (POF) 16 having a diameter of 500 μm is used. The POF 16 is sandwiched between a fixing jig 14 having a V groove formed by a plastic mold and a flat jig 15 and fixed by an adhesive 17. By this V groove, the pitch and the center position of the POF 16 can be aligned. The tip of the POF 16 protrudes from the surface formed by the fixing jigs 14 and 15 as shown in FIG. 1, and in this embodiment, the protrusion amount is 500 μm. The four POFs 16 are bonded and fixed using the fixing jigs 14 and 15 and then collectively cut with a knife, and the end surfaces are flattened by polishing. Since the planarization is the POF 16, it may be performed by pressing against a heated flat surface. Further, an appropriate curved surface shape may be used to prevent reflection and to produce a lens effect.
[0028]
The POF 16 used in this example is a fiber (made by Asahi Glass, trade name Lucina) using a fully fluorinated polymer that can transmit up to 1.3 μm band. There are no limitations on materials such as those using resin. Of course, the core may be quartz or a fiber made entirely of quartz, and the diameter of the guide hole 4 and the shape of the V groove of the fixing jig 14 may be designed according to the fiber diameter.
[0029]
On the other hand, the guide hole 4 for the optical fiber, which is a feature of the present invention, is formed of the thick film resist 3 so that the center of each light emitting point 6 of the surface emitting laser 5 coincides with the core center of the optical fiber 16. . In FIG. 1, a perspective view is shown for easy understanding. The thick film resist 3 is applied directly on the mounting substrate 1 by a spin coater or the like, and is subjected to photolithography to form a pattern. For pattern matching, if a mark to be aligned with the electrode 25 formed on the surface of the surface emitting laser 5 is formed on the photomask, the center of the light emitting point 6 and the center of the guide hole 4 are made to coincide with each other with a positional accuracy of several μm or less. Can do.
[0030]
In this example, SU8-50 manufactured by MicroChem was used as the thick film resist 3. The film was applied by spin coating to a thickness of 200 μm, and prebaked at 90 ° C. on a hot plate. Exposure was performed with an aligner while performing the above pattern alignment using a photomask so as to have a circular pattern of 520 μm at a 750 μm pitch with an outer frame size of 3 mm × 1 mm. Next, post-exposure baking was performed again at 90 ° C. on a hot plate, and then the resist was developed with a developer. The development was rinsed with isopropyl alcohol, and baked at 90 ° C. in an oven to completely evaporate the solvent. As described above, since the process of the thick film resist 3 can be performed at a low temperature, the guide hole 4 can be formed without damaging the optical element 5 or the electrical contact. As the thick film resist 3, SU8 is used here. However, the present invention is not limited to this.
[0031]
After the adhesive is applied to the guide hole 4, the optical coupling can be easily achieved by inserting the POF 16 fixed to the fixing jig. As the adhesive, a thermosetting or ultraviolet curable optical adhesive which is a material having a refractive index close to that of POF 16 was used. When the lens effect is given to the fiber end face, materials having different refractive indexes may be used. In addition, the surface emitting laser exit surface is made of SiO to suppress reflection._xFor example, non-reflective coating (not shown) may be performed.
[0032]
Next, the joint between the surface emitting laser 5 and the POF 16 will be described with reference to FIG. 2 (A-A ′ section in FIG. 4) which is a sectional view of one element.
[0033]
Although details of the surface emitting laser 5 used in this embodiment will be described later, the growth substrate is removed so that the thick film resist 3 can be easily processed, and only the functional layer is transferred to form a thin film. The functional layer has a structure in which the one-wavelength resonator 23 including the active layer is sandwiched between the p-DBR mirror 22 and the n-DBR mirror 24 made of an AlGaAs multilayer film, and has a thickness of about 7 μm. On the p-DBR mirror 22 side, an air post 28 for current confinement is processed into a circular shape of 15 μmφ, and the periphery is embedded with polyimide 27 to be flattened. In the vicinity of the active layer, only an AlGaAs layer having an Al mole fraction of 0.95 or more is selectively steam-oxidized in the lateral direction to produce Al._xO_yThe layer 29 is formed, the aperture size of the current injection region is about 3 μmφ, and the oscillation threshold is 1 mA or less.
[0034]
A common electrode 20 is formed on the p-DBR mirror 22 side, and is bonded onto the electrode pad 2 on the surface of the substrate 1 with AuSn solder or the like. Bonding may be performed by Au bonding. The n-side electrode 25 is formed on the surface that appears after removing the GaAs substrate (not shown) on the surface of the n-DBR mirror 24 so that current can be injected independently into each element. An insulating film 26 is formed on this surface, a light extraction portion 31 and a contact hole 32 are formed, and contact is made with the wiring 9 formed on the surface of the substrate 1. Since the wiring 9 is stepped via the side wall of the surface emitting laser 5, the side wall of the laser 5 and the p-side common electrode pad 2 must be covered with the insulating film 26. For such an insulating film formation, for example, photosensitive polyimide such as PIMEL manufactured by Asahi Kasei is suitably used, and the thickness is set to 1 μm.
[0035]
The POF 16 is fixed at a position (in this example, the wiring 9 on the electrode 25) where the end face abuts against the element surface as shown in FIG. Therefore, it does not directly hit the crystal surface of the surface emitting laser and does not cause damage or the like.
[0036]
On the other hand, heat generated from the surface emitting laser is radiated to the mounting substrate 1 via the electrode pads 2. Therefore, the mounting substrate 1 is made of AlN or Al on the surface.₂0_ThreeSi having an insulating thin film formed thereon is preferably used.
[0037]
Next, a manufacturing process of the thin film type surface emitting laser used in this embodiment will be described with reference to FIG. Here, for the sake of simplification, an array of two elements will be described.
[0038]
In (a), on an n-GaAs substrate 30, an n-DBR mirror 24, an active layer made of three quantum wells of GaAs / AlGaAs, a one-wavelength resonator layer 23 made of AlGaAs, a p-DBR mirror 22, a p- A GaAs contact layer (not shown) is crystal-grown by metal organic chemical vapor deposition. Air post 28 is Cl₂The selective oxidation layer 29 described above is formed by oxidation with water vapor. Then SiN_xAn insulating film is formed with the film 21 and planarized with polyimide 27 to form the common electrode 20. For example, Ti / Au can be used as the common electrode 20.
[0039]
In (b), the element on the wafer manufactured in (a) is cut to an appropriate size after polishing the substrate 30 to about 100 μm, and Au—Au is formed on the electrode pad 2 formed on the mounting substrate 1. Adhesion is performed by pressure bonding (which may be assisted by ultrasonic waves) or by AuSn solder. At this time, the electrode pad 2 is made of Ti / Pt / Au, and the outermost surface is Au.
[0040]
In (c), the GaAs substrate 30 is replaced with H.₂O₂And NH_ThreeEtching is performed using the mixed solution of the above, and the etching is stopped by AlAs which is the first layer of the n-DBR mirror 24. Thereafter, the independent electrode 25 is formed on the n-GaAs layer that appears after removing A1As with HCl. For the independent electrode 25, for example, AuGe / Ni / Au can be used. Thereafter, annealing is performed at about 380 ° C. for contact.
[0041]
In (d), the whole is coated with polyimide 26 while forming holes 32 and light extraction windows 31 for electrode contact with photosensitive polyimide. When the wiring 9 is formed of Ti / Au or the like by a lift-off method or the like, the thin film surface emitting laser 5 is formed on the mounting substrate 1 as shown in the plan view of FIG.
[0042]
In the above description, the manufacturing process for one chip has been described. However, a wafer level process is actually required to improve productivity. FIG. 5 illustrates this state. A laser chip 51 (1 × 4 array in the above embodiment) of a necessary size is cut out from the GaAs wafer 50 on which the surface emitting laser is fabricated, and Al is formed on the surface.₂O_ThreeA plurality of films and electrode pads 2 are bonded to a Si wafer 52 formed in a necessary region 54. At this time, sequential bonding is performed while aligning at a required position 54 on the wafer 52 with a flip chip bonder device. In this state, the laser thinning process, wiring process, and formation of the fiber guide hole 4 by the thick film resist 3 are performed by photolithography and etching processes.
[0043]
Next, the Si-IC 53 for driving the laser is sequentially bonded with a flip chip bonder. Finally, by dicing into individual chips as shown by the broken line 55, a plurality of chips can be formed at once.
[0044]
In the examples so far, the example in which the number of arrays of the surface emitting lasers 5 and the optical fibers 16 is four has been shown, but of course there is no limitation to this number. There may be four or more, or only one surface emitting laser and one optical fiber. It can also be applied to a surface light receiving element.
[0045]
The optical mounting body may be either one in which only a surface emitting laser is integrated on the transmission side, one in which only a surface light receiving element is integrated on the reception side, or an optical mounting body having both transmission and reception. When the transmission device and the reception device are separated, the transmission is performed in one direction. On the other hand, when the transmission / reception device is housed in one module, bidirectional transmission is possible.
[0046]
(Second embodiment)
The second embodiment of the present invention relates to an example in which a normal surface emitting laser manufactured on a GaAs substrate is used instead of a thin film type surface emitting laser from which the GaAs substrate is removed. The cross-sectional structure of the surface emitting laser is almost the same as that shown in FIG. 3A for explaining the process. The place to separate is different.
[0047]
FIG. 8 shows a perspective view of the present embodiment. Except for the fact that the cut-out size of the surface emitting laser 84 is increased and that the wiring 84 of the laser 84 and the IC 12 is performed by wire bonding, the configuration is substantially the same as in FIG.
[0048]
On the surface of the surface emitting laser 84 fabricated on the GaAs substrate, Ti / Au 82 serving as a p-electrode and electric wiring and an electrode pad is formed on an insulating film. A light extraction window is formed at a position corresponding to the light emission point 83 of the p electrode. A wire bonding 81 is used between the electrode pad 80 and the p-electrode 82 on the mounting substrate 1 that is electrically bonded to the IC 12. A flexible wiring board or the like may be used for this wiring.
[0049]
The thick film resist 3 constituting the fiber guide hole 4 is formed on the surface in a lump after the surface emitting laser and the p-electrode are formed on the GaAs substrate and before being cut into chips. Therefore, there is no process such as photolithography after the surface emitting laser 84 chip is mounted on the mounting substrate 1, and there is only wiring by surface mounting by batch reflow (heating of solder) and wire bonding.
[0050]
In this embodiment, since the chip cut-out size from the GaAs wafer is larger than that in the first embodiment, the number of lasers obtained from the laser wafer, that is, the yield is reduced, and the cost of the mounting body is increased. Further, since it is driven as the cathode common, it is inferior in driving speed as compared with the anode common type as in the first embodiment.
[0051]
However, the structure in this embodiment is suitable for transmission with a small number of arrays and about 622 Mbps because the number of process steps is reduced, and the manufacturing cost can be reduced and the yield can be improved.
[0052]
(Third embodiment)
In the third embodiment of the present invention, the thick film resist is formed in two stages to define the distance between the emission surface of the surface emitting laser and the fiber end surface. This will be described with reference to FIG.
[0053]
The fiber guide hole 63 is formed by the second layer thick film resist 61, and the thick film resist 60 in which the hole 62 having a diameter of 300 μm smaller than the diameter of the fiber 16 is formed is the first layer. This can be configured by repeating the thick film resist patterning step similar to the first embodiment twice. In this case, any resist film thickness was 200 μm. As a result, when the fiber 16 is mounted in contact with the guide hole 63, it is possible to alleviate damage caused by colliding with the laser element or the like. Further, although it is desirable to collect light with a lens for optical coupling with the fiber 16, this can be achieved by inserting a ball lens or the like into the hole of the thick film resist 60 of the first layer. In particular, it is effective in coupling the light receiving element and the fiber 16.
[0054]
In this method, the distance between the fiber end face and the surface emitting laser end face can be set freely by controlling the thickness of the first layer thick film resist 60.
[0055]
(Fourth embodiment)
FIG. 7 shows a plan view of the pattern of the thick film resist 70 according to the fourth embodiment of the present invention. In addition to the guide hole 72 for mounting the fiber, a groove 71 is formed.
[0056]
By forming the groove 71, there are an effect of shortening the developing time of the thick film resist 70, an effect of relieving stress with the base, and an effect of escape of the fixing adhesive. Furthermore, there is also an advantage that when the fiber is inserted into the guide hole 72, it can be easily fitted.
[0057]
In the case of the method of forming the fiber guide hole using the thick film resist, the pattern shape can be freely designed by changing the pattern of the photomask in this way. For example, a guide groove that integrates different waveguide diameters (1 mmφ, 500 μmφ, 250 μmφ, etc.) or similarly fits a rectangular waveguide film other than the fiber is formed in the waveguide film. Can also be fixed.
[0058]
(Fifth embodiment)
The fifth embodiment according to the present invention relates to a high-speed optical wiring device obtained by modularizing the optical mounting body described above.
[0059]
FIG. 9 shows a connector module using a mounting body in which a surface emitting laser or a surface light receiving element and a fiber are fixed by a guide hole made of a thick film resist as in the first, second, and third embodiments. Yes. In FIG. 9A, 94 is a ribbon fiber in which four fibers are bundled, 95 is a POF, 96 is a POF fixing jig, and 93 is an entire cover that increases the fixing strength of the POF 95. Reference numeral 92 denotes the mounting substrate 1 shown in FIG. 1, in which peripheral circuits are formed at the same time to integrate chip resistors and capacitors. Further, reference numeral 90 denotes a pedestal for fixing the connection lead 91, which is bonded to the back surface of the mounting substrate 92 to connect the electrode pad of the mounting substrate 92 and the top of the lead 91 by wire bonding. The fixing between the fiber 95 and the mounting substrate 92 is finally performed after wire bonding. The connection lead 91 and the mounting substrate 92 may be connected by flip-chip mounting by forming a through hole in the mounting substrate 92.
[0060]
On the other hand, FIGS. 9B and 9C show how the connector module and the circuit board 97 are mounted. In (b), the socket 98 is fixed on the substrate 97 with the lead 102 and the solder 10, and contact can be obtained between the connector module connection lead 91 and the leaf spring 99 of the socket 98. Is possible. In (c), the connection lead 91 is soldered (103) directly to the circuit board 97.
[0061]
With such a configuration, it is possible to provide an optical wiring device when high-speed signal transmission is performed between boards. This is effective when exceeding 1Gbps per channel or when electromagnetic radiation noise becomes a problem.
[0062]
Although it is fixed to the circuit board 97 in FIG. 9C, the mounting board 92 and the fiber fixing jig 93 may not be bonded and may be detachable at the guide hole of the thick film resist 100. In that case, a removable mechanical mechanism may be formed by providing a claw or the like on the outer frame of the fiber fixing jig 93. Reference numeral 101 denotes a cover.
[0063]
(Sixth embodiment)
In the sixth embodiment according to the present invention, the optical transceiver module integrated with the optical mounting body is not directly mounted on the mother board as in the fifth embodiment, but is housed in the electrical connector 110 as shown in FIG. Thus, the interface portion of an electronic device such as a PC, a monitor, a printer, a digital camera, or a digital video camera can be attached / detached via the electrical connection lead 111. The electrical connector 110 can be manufactured according to the required equipment standard. For example, a 26-pin MDR connector can be used in accordance with a digital monitor interface standard for connecting a PC and a liquid crystal monitor, or a standard such as IEEE1394 or USB can be used. The present invention can also be applied to an internal connection between a scanner unit and a photosensitive unit of a digital copying machine. By using the optical wiring device of the present invention for connection between these electronic devices, signal transmission of 4 to 5 channels at 1 Gbps to 2.5 Gbps per channel becomes possible at 50 m or more. Thus, electrical cables can be used in place of the limited high-speed video transmission. In addition, since it is an optical connection, there is no electromagnetic radiation noise generated from the transmission line, which can reduce noise countermeasures particularly in high-speed digital transmission.
[0064]
【The invention's effect】
The following effects are expected by the present invention.
The alignment accuracy between the optical waveguide such as the optical fiber and the optical element can be improved, the fixing work of the optical waveguide such as the optical fiber can be facilitated, and the productivity can be improved. Further, by reducing the thickness of the planar optical element, it is possible to improve the ease of mounting and the degree of design freedom when performing optical coupling with an optical waveguide such as an optical fiber without a lens.
[0065]
Furthermore, by providing a manufacturing method capable of mass-producing such a structure for mounting, an optical mounting body capable of reducing the cost and an optical wiring device using the same can be realized. Therefore, in the signal connection between boards in electronic devices that handle high-speed digital signals, or in the signal connection between electronic devices, it is possible to transmit a signal with a limit of electrical connection, that is, about 2.5 Gbps over 50 m, and a large capacity video. Transmission can be easily performed without special countermeasures against electromagnetic noise.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a surface optical element mounting body according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a surface optical element mounting body in a first embodiment according to the present invention.
FIG. 3 is a cross-sectional view illustrating a method for manufacturing a surface optical element according to the present invention.
FIG. 4 is a plan view for explaining wiring of a surface optical element mounting body according to the present invention.
FIG. 5 is a perspective view for explaining a method for producing a surface optical element mounting body according to the present invention.
FIG. 6 is a sectional view of a surface-type optical element mounting body according to a third embodiment of the present invention.
FIG. 7 is a plan view of a guide hole shape according to a fourth embodiment of the present invention.
FIG. 8 is a perspective view illustrating a surface type optical element mounting body according to a second embodiment of the present invention.
FIG. 9 is a diagram illustrating an optical connection module according to the present invention.
FIG. 10 is a perspective view showing an optical wiring device according to the present invention.
FIG. 11 is a cross-sectional view illustrating the coupling between a conventional surface optical element and an optical fiber.
FIG. 12 is a cross-sectional view illustrating the coupling between a conventional surface optical element and an optical fiber.
FIG. 13 is a diagram illustrating the coupling between a conventional surface optical element and an optical fiber.
[Explanation of symbols]
1 ... Mounting board
2, 80 ... Electrode pads
3, 60, 61, 70, 100 ... thick film resist
4, 63, 72, 1209 ... Fiber guide hole
5, 84... Planar optical element
6, 31, 62, 83 ... light transmission window
8 ... Element isolation groove
9, 10, 13 ... Electric wiring
12, 53 ... Si-IC
14, 15, 2014 ... Fiber fixing jig
16, 95, 1210, 1037, 2016 ... optical fiber
17, 1211 ... Adhesive
20, 25, 1033, 1035 ... electrode
21, 26, 1208 ... insulating film
22, 24, 1023, 1027 ... DBR mirror
23 ... Active layer and resonator layer
27 ... buried layer
28 ... Air post
29 ... Selective oxidation Al_xO_ylayer
30, 1021 ... substrate
32 ... Contact hole
50 ... Laser wafer
51 ... Laser chip
52. Wafer for mounting
54 ... Mounting area
55 ... Cut line for dicing
71 ... Groove
81 ... Wire
90 ... Base for fixing connection leads
91, 111 ... connection lead
92 ... Optical mounting body
93, 96 ... Fiber fixing jig
94: Fiber array
97 ... Circuit board
98 ... Socket
99 ... leaf spring
101 ... Cover
102 ... Connection pin
103 ... Solder
110 ... electric connector
1022 ... Light absorption layer
1024, 1026 ... cladding layer
1025 ... Active layer
1028 ... Contact layer
1032 ... Si0₂
1036: Antireflection film
1201 ... Electronic circuit board
1202 ... Light emitting chip
1203, 2018 ... surface emitting laser
1204 ... Transistor
1205, 1206, 1207 ... transistor electrodes
2012 ... Module substrate
2022, 2023 ... projections
2024 ... Fiber insertion hole
2026, 2027 ... guide holes

Claims (4)

A device including a surface optical element capable of emitting or receiving light,
A substrate,
The surface optical element provided on the substrate;
A first hole provided in an upper portion of the planar optical element; and a second hole into which an optical waveguide provided in the upper portion of the first hole is inserted. A member disposed on the surface on which the surface optical element is provided,
In order to prevent contact between the optical waveguide and the planar optical element, the diameter of the first hole is smaller than the diameter of the optical waveguide;
The member is formed by curing a material that has photosensitivity or electron beam curability and can be selectively cured by patterning with photolithography.
An apparatus comprising a planar optical element, wherein the member is provided with a plurality of the second holes, and the second holes are connected by a groove. A device including a surface optical element capable of emitting or receiving light,
A substrate,
The surface optical element provided on the substrate;
A first hole provided in an upper portion of the planar optical element; and a second hole into which an optical waveguide provided in the upper portion of the first hole is inserted. A member disposed on the surface on which the surface optical element is provided,
In order to prevent contact between the optical waveguide and the planar optical element, the diameter of the first hole is smaller than the diameter of the optical waveguide;
The member is formed by curing a material that has photosensitivity or electron beam curability and can be selectively cured by patterning with photolithography.
An apparatus comprising a planar optical element, wherein the second hole of the member and the outside of the member are connected by a groove. The apparatus comprising a planar optical element according to claim 1 , wherein the second hole of the member and the outside of the member are connected by a groove. The member includes a first layer in which the first hole is formed, and a second layer formed on the first layer and in which the second hole is formed, and the thickness of the first layer is The apparatus provided with the surface type optical element of any one of Claim 1 to 3 which prescribes | regulates the distance between the said surface type optical element and the end surface of this optical waveguide body.

Images