KR101969502B1 - Slim Type Connector Plug, Active Optical Cable Assembly Using the Same and Method of Manufacturing the Same - Google Patents

Abstract

The present invention relates to a method and apparatus for packaging an optical element module without using a substrate in a FOWLP system using a semiconductor manufacturing process and forming a reflection mirror integrally on the optical element module so that alignment between the optical element and the mirror can be highly accurate A slim type connector plug, an active optical cable (AOC) assembly using the same, and a method of manufacturing the same.
The connector plug of the present invention includes: a supporting substrate having an optical fiber receiving groove on which an optical fiber is seated; An optical element module stacked on the support substrate and having a light engine for generating an optical signal or receiving an optical signal; And an optical component integrally installed in the optical element module and transmitting the optical signal between the optical fiber and the optical engine.

Description

Technical Field [0001] The present invention relates to a slim type connector plug, an active optical cable assembly using the same,

The present invention relates to a slim type connector plug, an active optical cable (AOC) assembly using the same, and a method of manufacturing the same. More specifically, the present invention relates to a method of packaging an optical element module without using a substrate by a FOWLP method using a semiconductor manufacturing process, (AOC) assembly using the same, and a method of manufacturing the same. 2. Description of the Related Art [0002] A slim-type connector plug having an optical element and a mirror can be accurately aligned by forming a mirror in a module.

An optical engine is typically used to transmit data at high speed. The light engine includes hardware for converting an electrical signal to an optical signal, transmitting the optical signal, receiving the optical signal, and converting the optical signal back into an electrical signal. An electrical signal is converted to an optical signal when the electrical signal is used to modulate a light source device such as a laser. Light from the source is coupled to a transmission medium such as an optical fiber. After passing through the optical network and reaching its destination through various optical transmission media, the light is coupled to a receiving device such as a detector. The detector generates an electrical signal based on the received optical signal for use by the digital processing circuitry.

Optical communication systems are often used to transmit data in various systems, such as telecommunication systems and data communication systems. Telecommunication systems often involve the transmission of data over a wide geographical distance ranging from a few miles to thousands of miles. Data communication often involves the transmission of data through a data center. Such systems include the transmission of data over distances ranging from a few meters to hundreds of meters. A coupling component that is used to transmit an electrical signal to an optical signal and that transfers the optical signal to an optical transmission medium such as an optical cable is relatively expensive. Because of this cost, optical transmission systems are typically used as the backbone of a network that transmits large amounts of data over long distances.

On the other hand, current computer platform architecture designs can encompass several different interfaces to connect one device to another. These interfaces provide I / O (input / output) to computing devices and peripherals, and can use a variety of protocols and standards to provide I / O. Different interfaces may use different hardware structures to provide interfaces. For example, current computer systems typically have multiple ports with corresponding connection interfaces, which are implemented by physical connectors and plugs at the ends of the cables connecting the devices.

A universal connector type is a universal serial bus (USB) subsystem, DisplayPort, High Definition Multimedia Interface (HDMI), Firewire (as defined in IEEE 1394), or Other connector shapes may be provided.

In addition, for transmission of very large data at a very high speed between two separate devices such as a UHD television (TV) using a set-top box, an electrical and optical input / output interface connector is required.

Furthermore, when a large amount of data needs to be transmitted and received between a board and a board in a UHD television, a miniaturized and slimmer optical interface connector with a thickness of 1 mm is required.

That is, in order to achieve high-speed transmission while satisfying a thin form factor in a TV or the like, the size of an active optical cable (AOC) connector or the size of an optical engine embedded in the AOC Should be as thin as 1mm or less. However, since the conventional AOC is packaged on a printed circuit board (PCB) in a bonding or COB (Chip On Board) form, it is difficult to realize a thin thickness.

AOC, which meets these requirements, is now being offered at a high price, which is the inaccurate alignment between PCBs, optical devices (PD / VCSEL), optical components (lenses or mirrors), optical fibers alignment is expensive, and it takes a lot of time to construct and assemble an accurate structure for passive alignment.

In addition, it is required to solve the performance degradation caused by wire-bonding of an optical device (PD / VCSEL) for high-speed interconnection of several tens Giga to 100 G or more.

[0004] In Korean Patent Laid-Open No. 10-2014-0059869 (Patent Document 1), an input / output (I / O) device includes both an electric and optical input / output interface, and the optical input / output interface includes an input / A first end terminated at the input / output connector and optically coupled to the at least one optical lens, and a transceiver module that converts optical signals to electrical signals and includes at least one lens, And a second end of the at least one optical fiber is terminated in the transceiver module, and the input / output connector and the transceiver module are not in contact with each other.

In the input / output device of Patent Document 1, since optical elements such as a light engine and driving chips are assembled by using a printed circuit board, automation for achieving high accuracy and productivity is difficult, and miniaturization and slimness are difficult.

2. Description of the Related Art Generally, an optical communication module includes a mechanical device capable of fixing an optical cable for transmitting an optical signal, an optical device for converting an optical signal transmitted from an optical cable into an electrical signal or an optical signal for transmission from an electrical signal, It should include an interface circuit for receiving and receiving the device and information.

Since the optical fiber fixing member, the optical device, and the interface circuit chips are disposed separately from each other on the circuit board in a separate process, the area occupied by the circuit board is widened, the manufacturing process is complicated, An electrical signal may be provided to the optoelectronic circuit through the conductive strip formed on the circuit board, which may result in deterioration of the electrical signal.

: Korean Patent Publication No. 10-2014-0059869

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an optical module module in which the optical element module is packaged without using a substrate in a FOWLP system using a semiconductor manufacturing process, And an active optical cable (AOC) assembly using the same, and a method of manufacturing the same.

It is another object of the present invention to provide a slim type connector plug capable of realizing a slim optical device module by packaging an optical device and a driving chip without using a substrate in a FOWLP (Fan Out Wafer Level Package) An active optical cable (AOC) assembly and a method of manufacturing the same.

Another object of the present invention is to provide a slim type connector plug which can be packaged into a single chip or a single element by combining a system-in-package (SIP) type optical device module and an optical sub-assembly (OSA) Cable (AOC) assembly and a method of manufacturing the same.

Still another object of the present invention is to provide a slim type connector plug capable of packaging without wire-bonding by mounting an optical element in a flip chip form in an optical element module, an active optical cable (AOC) assembly using the same, .

Another object of the present invention is to provide a slim type connector plug capable of automating the assembly of an optical fiber to an optical fiber assembly channel of a package in a pick-and-place type, an active optical cable (AOC) .

It is another object of the present invention to provide an active optical cable (AOC) assembly capable of transmitting and receiving a large amount of data at a very high speed and realizing a compact and slimmer structure with a thickness of 1 mm while being manufactured at low cost.

It is another object of the present invention to provide a slim type connector plug capable of being physically detachably coupled to an occlusion port of a terminal and capable of performing electrical I / O interfacing or optical interfacing through an interface provided at an occlusion port, and an active optical cable AOC) assembly.

Another object of the present invention is to provide a semiconductor device having an external connection terminal made of a solder ball and having an external connection terminal formed between a board and a PCB, between a chip and a chip, between a board and a chip, (AOC) assembly using the same and a slim type connector plug capable of performing ultra high-speed and high-capacity data transmission between a PCB and a peripheral device.

Another object of the present invention is to provide a transponder chip having an electro-optic conversion function and a photo-electric conversion function as a system-in-package (SiP), a system on chip (SoC) , And package on package (PoP), and an active optical cable (AOC) assembly using the connector plug.

According to an embodiment of the present invention, there is provided a connector plug comprising: a supporting substrate having an optical fiber receiving groove on which an optical fiber is seated; An optical element module stacked on the support substrate and having a light engine for generating an optical signal or receiving an optical signal; And an optical component integrally installed in the optical element module and transmitting the optical signal between the optical fiber and the optical engine.

The optical component is formed at a point where a first direction along the optical fiber mounting groove intersects the optical signal direction from the light engine, and the optical component transfers the optical signal between the optical fiber and the light engine.

The optical component may be a flat mirror or a cone-shaped mirror.

The optical element module comprising: a mold body having a first side and a second side; An external connection terminal formed on the first surface of the mold body and electrically connected to the outside; A light engine sealed by the mold body; Conductive vertical vias formed through the mold body and electrically connected to the external connection terminals; And a wiring layer formed on the second surface of the mold body for interconnecting the conductive vertical vias and the light engine.

Further, the connector plug according to an embodiment of the present invention further includes a reflecting surface formed between the light engine and the optical fiber, for transmitting the optical signal generated by the light engine or received by the light engine, .

The wiring layer including a wiring pattern for interconnecting the conductive vertical vias and the light engine; And an insulating layer covering the wiring pattern.

In the connector plug according to an embodiment of the present invention, the insulating layer may be transparent, and may further include a lens formed on a surface of the insulating layer facing the optical component to change a path of light generated from the light engine.

The connector plug according to an embodiment of the present invention may further include a guide protrusion pattern formed integrally with the wiring layer and for aligning and bonding the optical element module with the support substrate.

The reflection surface can convert the light path to a right angle by total reflection using the refractive index difference.

The connector plug according to an embodiment of the present invention may further include a ball grid array (BGA) for self-aligning the optical device module with the supporting substrate.

The connector plug can be applied to an on-board interconnection between a board and a board, between a chip and a chip, or between a board and a chip.

The external connection terminal may be formed of any one of a solder ball and a metal bump, and the connector plug may be fixedly coupled to the board.

The inner end of the optical fiber mounting groove may be set so that the tip of the assembled optical fiber coincides with the end of the optical module.

According to another aspect of the present invention, there is provided a connector plug comprising: an optical subassembly (OSA) having an optical fiber mounting groove on which an optical fiber is mounted; An optical device module having a light engine stacked on the optical subassembly and generating an optical signal or receiving an optical signal; And an optical component installed in the optical subassembly and transferring an optical signal between the optical fiber and the optical engine, the optical device module comprising: a mold body having a first side and a second side; An external connection terminal formed on the first surface of the mold body and electrically connected to the outside; A light engine that is sealed by the mold body and that generates optical signals or receives optical signals on the second surface; Conductive vertical vias formed through the mold body and electrically connected to the external connection terminals; And a wiring layer formed on the second surface of the mold body for interconnecting the conductive vertical vias and the light engine.

An active optical cable (AOC) assembly according to another embodiment of the present invention includes a connector plug having an optical fiber mounting groove; And at least one optical fiber coupled to the optical fiber receiving groove.

The connector plug may be connected to a board constituting any one of Field Programmable Gate Arrays (FPGA), Complex Programmable Logic Device (CPLD), Digital Signal Processor (DSP) (System on Chip), SoB (System on Board), and PoP (Package on Package).

A method of manufacturing a connector plug according to an embodiment of the present invention includes a light engine having an external connection terminal on a first surface and generating an optical signal or receiving an optical signal therein, Preparing an optical element module; Forming a reflective surface on a second surface of the optical element module to transmit a light signal generated in or received by the light engine; Preparing a supporting substrate on which an optical fiber receiving groove on which an optical fiber is to be placed is formed; Aligning the optical device module on the supporting substrate such that the optical signal generated from the optical engine of the optical device module is reflected or refracted on the reflecting surface and received by the core of the optical fiber; And bonding the aligned support substrate and the optical device module.

The step of preparing the optical device module includes attaching a photoreceptive element constituting at least one light engine to a molding tape having an adhesive layer formed on a molding frame, a via-PCB on which at least one conductive vertical via is formed, step; Forming a molding layer on the molding tape with an epoxy mold compound (EMC) and planarizing the surface after curing; Subjecting the upper surface of the cured mold to chemical mechanical polishing (CMP) so that the upper end of the conductive vertical via is exposed, and then separating the cured mold and the molding frame to obtain a mold body; And forming a wiring layer for inverting the obtained mold body and embedding a wiring pattern for electrically connecting the exposed optical element and the connection pad of the optical integrated circuit in the insulating layer.

The step of forming the reflective surface includes: forming a transparent insulating layer on the second surface of the optical device module; Etching the insulating layer to form a reflective surface; And forming a metal layer on the reflective surface.

The forming of the reflective surface may include: forming a transparent insulating layer on a second surface of the optical device module; Etching the insulating layer to form a reflective surface at a point where light generated from the light engine is incident; And forming a flat layer on the second surface of the optical element module and the lower part of the reflection surface using a material having a lower refractive index than that of the insulating layer so that light incident on the reflection surface causes total internal reflection on the reflection surface .

In general, an active optical cable (AOC) connector capable of high-speed transmission of several tens Giga to 100G or more is required to have a compact, 1 mm thick slim optical interface connector. In order to meet a reasonable manufacturing cost, Mis-alignment should not occur while Passive Alignment is used between optical components (VCSELs), optical components (lenses or mirrors), and optical fibers.

The location where misalignment occurs occurs mainly between PCB-optical devices, optical-device-mirror, optical-device-lens, and mirror-optical fiber.

In the present invention, alignment of an optical element and a mirror can be highly accurate by integrally forming a reflective mirror in an SIP (System In Package) type optical device module using a semiconductor manufacturing process.

In addition, in the present invention, an optical element and a driving chip are packaged in a FOWLP (Fan Out Wafer Level Package) system using a semiconductor manufacturing process, without using a substrate, so that an optical element module can be realized as 1/16 of the conventional one .

Also, in the present invention, a light engine including an optical fiber assembly channel can be one-chip packaged by combining an optical device module of a SIP (System In Package) type and an optical sub-assembly (OSA).

In the present invention, since the optical element is mounted on the optical element module in the form of a flip chip, packaging can be performed without wire-bonding, thereby reducing the signal resistance coefficient and the electrical resistance coefficient, do. As a result, performance degradation caused by wire bonding of optical devices (PD / VCSEL) with high-speed interconnection of several tens Giga to 100 G or more can be solved.

In the present invention, a pick-and-place type optical fiber assembly channel of the package may have a structure capable of automating optical fiber assembly.

In addition, the present invention can provide an active optical cable (AOC) assembly (optical interface connector) capable of transmitting and receiving a large amount of data at a very high speed and being slim with a thickness of 1 mm.

In the present invention, a physically detachable coupling is provided to an occlusion port of a terminal, and electrical I / O interfacing or optical interfacing can be performed through an interface provided at the occlusion port.

In the present invention, an external connection terminal made of a solder ball is provided and is provided between a PCB and a PCB, between a chip and a chip, between a PCB and a chip, ) And a peripheral device can perform high-speed and high-capacity data transfer.

The connector plug of the present invention is a transponder chip having both an electro-optical conversion function and a photo-electrical conversion function, and includes a system-in-package (SiP), a system on chip (SOC) , A package-on-package (PoP), or the like.

In addition, the present invention relates to an active optical cable (AOC), which may be a mini display port, a standard display port, a mini USB, a standard USB, PCI Express, IEEE 1394 Firewire, Thunderbolt, , Lightning, and high-definition multimedia interface (HDMI).

As a result, the HDMI type active optical cable (AOC) according to the present invention can simultaneously transmit control signals capable of applying video, audio, copy protection (recording prevention) technology to one cable, A digital signal can be applied for encrypted transmission between a video re-set device (set top box) and a video display device (TV) requiring data transmission.

1 is a schematic block diagram illustrating an optical communication system constructed using an active optical cable (AOC) assembly in accordance with the present invention.
2 is a longitudinal cross-sectional view of an active optical cable (AOC) assembly according to a first embodiment of the present invention.
FIGS. 3A and 3B are enlarged views of an optical interface portion and an optical fiber inlet portion of an active optical cable (AOC) assembly according to the first embodiment of the present invention shown in FIG. 2;
4A to 4C are enlarged views showing various structures of an optical fiber insertion channel in an active optical cable (AOC) assembly according to a first embodiment of the present invention shown in FIG.
4D is a cross-sectional enlarged view of the optical fiber.
5 is an exploded view of an active optical cable (AOC) assembly according to a first embodiment of the present invention shown in FIG.
6A to 6D are a plan view, a right side view, a perspective view and a perspective view of an application example in which an external connection terminal of an active optical cable (AOC) assembly according to a first embodiment of the present invention is implemented in a form of supporting a high-definition multimedia interface Sectional view showing a modified example.
FIG. 7 is a sample photograph of an active optical cable (AOC) assembly according to the first embodiment of the present invention implemented in a form supporting a high-definition multimedia interface (HDMI).
8A to 8G are cross-sectional views illustrating a method of fabricating an optical element module of an active optical cable (AOC) assembly according to a first embodiment of the present invention by a FOWLP (Fan Out Wafer Level Package) method.
9A to 9C are sectional views showing an exit structure of an optical element (light emitting element) arranged in an optical element module, respectively.
FIGS. 10A to 10D are longitudinal sectional views of an active optical cable (AOC) assembly according to a second embodiment of the present invention, an inverted state view of FIG. 10A, an enlarged view of a portion A of FIG. to be.
11A and 11B are longitudinal cross-sectional views of an active optical cable (AOC) assembly according to a third embodiment of the present invention, respectively, and a cross-sectional view showing a portion where an optical fiber is coupled in an optical sub-assembly (OSA).
Figs. 12A and 12B are enlarged views of an active optical cable (AOC) assembly according to a fourth embodiment of the present invention, respectively, in longitudinal section and B part of Fig. 12B.
13 is a cross-sectional view showing an active optical cable (AOC) assembly according to a fifth embodiment of the present invention.
FIGS. 14A and 14B show an active optical cable (AOC) assembly according to a sixth embodiment of the present invention, where each optical sub-assembly OSA is smaller than the optical device module, OSA) is aligned with the optical device module.
15A and 15B are a plan view and a cross-sectional view, respectively, showing a seventh embodiment in which the connector plug 100 of the present invention is made on-board interconnection to a board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience.

Due to the price of the element that converts electrical signals to optical signals and vice versa, optical communication systems are typically used as backbones in networks. However, optical communication systems can provide various advantages in computer communication. Computer communications refers to communications ranging from a few centimeters to hundreds of centimeters.

The present invention discloses a system applicable to computer communication as well as an optical communication system used for optical communication between a terminal located at a long distance and a terminal.

The optical system may use a semiconductor package that connects the optical fiber to an optical engine. The optoelectronic device is a light emitting device or a light receiving device. An example of a light emitting device is a vertically-cavity surface-emitting laser (VCSEL). An example of a light receiving device is a photodiode (PD).

A driving circuit (i.e., driving chip or optical IC) is used to operate according to the optical element. For example, a photodiode works with a trans-impedance amplifier to amplify an electrical signal due to a collision of photons on the photodiode. When the optoelectronic device is a light emitting device, the drive circuit is used to drive the light emitting device.

Disclosed is an optical device module package in which an optical device and a driving circuit are placed in a package of a SIP (System In Package) type without using a substrate, and an optical path between the optical device and the outside of the SIP is formed. The elimination of substrate usage enables smaller and cheaper optical transmission systems.

In the present invention, a driver circuit (driver chip) operating in accordance with an optoelectronic device is integrated without wire-bonding using a flip chip package technology together with an optoelectronic device, while devices are integrated without using a substrate, A slim optical device module can be implemented by packaging an optical device and a driving chip by using a fan-out technology (FOWLP) in which input / output terminals are extended by pulling out I / O terminals.

The optical device module is a kind of SIP technology, and it is compared with the conventional package by using the encapsulation material such as epoxy mold compound (EMC) for fixing the chip (die) without using the PCB etc. So that it can be downsized and slim to a level of about 1/16, and the cost can be reduced.

In addition, various alignment techniques are used to align the optoelectronic elements (optical elements) with the optical fibers inserted in the semiconductor package. In the optical device module, the manufacturing process is performed using a semiconductor process on a wafer-by-wafer basis, the optical sub-assembly (OSA) on which the optical fiber is mounted is also processed at a wafer level, Device module wafers and optical subassembly (OSA) wafers can be aligned by wafer level alignment (WLA) and bonded, and then the bonded wafers can be fixed by sawing and separate dicing processes A light engine package (Optical Engine Package) is obtained as a semiconductor package type.

Furthermore, as the optical device module wafer and optical subassembly (OSA) wafer are aligned and bonded in a wafer level alignment (WLA) manner, the alignment between the optical element and the mirror and the alignment between the mirror and the optical fiber, Even with the use of passive alignment technology, it can be done without misalignment.

1 is a schematic block diagram illustrating an optical communication system constructed using an active optical cable (AOC) assembly in accordance with the present invention.

The optical communication system 1 has optical communication between the first and second terminals 10 and 20 to provide optical communication and has first and second connector plugs 100 and 200 at respective ends thereof, An optical cable 300a with an optical fiber is connected between the second connector plugs 100 and 200

Here, the first and second terminals 10 and 20 may each be one of a number of computing devices not included in a desktop or laptop computer, a notebook, an Ultrabook, a tablet, a netbook, or the like.

In addition to computing devices, the first and second terminals 10,20 may include many other types of electronic devices. Other types of electronic devices include, for example, smartphones, media devices, PDAs (personal digital assistants), ultra mobile personal computers, multimedia devices, memory devices, cameras, voice recorders, I / O devices, , A scanner, a monitor, an entertainment control unit, a portable music player, a digital video recorder, a networking device, a game machine, and a gaming console.

The first and second terminals 10 and 20 are connected to each other through the optical communication system according to the present invention and the first and second connector plugs 100 and 200 are physically coupled to the housings 11 and 21, And at least one first and second occlusal ports 12 and 22 for interfacing are provided.

The first and second connector plugs 100 and 200 may support communication via an optical interface. Also, the first and second connector plugs 100 and 200 can support communication via an electrical interface.

In some exemplary embodiments, the first terminal 10 may include a first server having a plurality of processors, and the second terminal 20 may include a second server having a plurality of processors .

In these embodiments, the first server may be interconnected with the second server by means of the connector plug 100 and the occlusal port 12. In another embodiment, the first terminal 10 may comprise a set-top box, the second terminal 20 may comprise a television (TV), and vice versa. Also, the first and second connector plugs 100, 200 and the first and second occlusion ports 12, 22 described herein can be one of a number of embodiments.

Also, the second terminal 20 may be a peripheral I / O device.

The first and second connector plugs 100 and 200 may be configured to engage with the first and second occlusal ports 12 and 22 of the first and second terminals 10 and 20.

The first and second occlusal ports 12,22 may also have one or more optical interface components. In this case, the first occlusion port 12 may be coupled to an I / O device and may be coupled to the processing and / or terminal (not shown) for transferring optical signals (or optical and electrical signals) Parts can be provided. Signal propagation may include generation and conversion to or reception of optical signals and conversion to electrical signals.

The processors 13 and 23 provided in the first and second terminals 10 and 20 may process electric and / or optical signal I / O signals, and one or more of them may be used. The processor 13, 23 may be a microprocessor, a programmable logic device or array, a microcontroller, a signal processor, or a combination comprising some or all of these.

The first and second connector plugs 100 and 200 may include first and second light engines 110 and 210 in the connector plugs and the first and second connector plugs 100 and 200 may include an active optical connector Active optical receptacles and active optical plugs.

Generally, such an active optical connector can be configured to provide a physical connection interface to the mating connector and optical assembly. The optical assembly may also be referred to as a " subassembly ". An assembly may refer to a finished product or a completed system or subsystem of an article of manufacture, but the subassembly may generally be combined with other components or other subassemblies to complete the subassembly. However, subassemblies are not distinguished from " assemblies " herein, and references to assemblies can be referred to as subassemblies.

The first and second light engines 110, 210 may comprise any device configured to generate and / or process an optical signal according to various tasks.

In an embodiment, the first and second light engines 110 and 210 include a laser diode for generating an optical signal, a light integrated circuit (IC) for controlling the optical interfacing of the first and second connector plugs 100 and 200, And a photodiode for receiving the photodiode. In some embodiments, the optical IC may be configured to control the laser diode and the photodiode, drive the laser diode, and / or amplify the optical signal from the photodiode. In another embodiment, the laser diode comprises a vertically resonant surface emitting laser (VCSEL).

In one embodiment, the first and second light engines 110, 210 may be configured to process optical signals in accordance with or in accordance with one or more communication protocols. In embodiments where the first and second connector plugs 100, 200 are configured to transmit optical and electrical signals, optical and electrical interfaces may be required to operate in accordance with the same protocol.

 Depending on whether the first and second light engines 110 and 210 process the signal in accordance with the protocol of the electrical I / O interface, or process the signal in accordance with another protocol or standard, the first and second light engines 110 and 210, Or various optical engines may be configured for the various protocols.

In one embodiment, a photodiode, or a component having a photodiode circuit, can be considered as a photonic terminal component because the photodiode converts the optical signal into an electrical signal. The laser diode may be configured to convert an electrical signal to an optical signal. The optical IC may be configured to drive the laser diode based on a signal to be optically transmitted by driving the laser diode to an appropriate voltage to generate an output for generating the optical signal. The optical IC may be configured to amplify the signal from the photodiode. The optical IC may be configured to receive and interpret an electrical signal generated by the photodiode and process it.

In the embodiment of the present invention, an I / O complex (not shown) may be provided for transferring optical signals (or optical and electrical signals) between the processors 13, 23 and the occlusion ports 12, 22. The I / O complex allows the processor 13, 23 to communicate with the first and second terminals 10, 20 via the first and second light engines 110, 210 of the first and second connector plugs 100, Lt; RTI ID = 0.0 > I / O < / RTI > The I / O wiring may be configured to provide the ability to transmit one or more types of data packets of a communication protocol.

Various communication protocols or standards may be used in embodiments of the present invention. The communications protocol may be a mini display port, a standard display port, a universal serial bus (USB), a standard USB, a PCI Express, an IEEE 1394 Firewire, a Thunderbolt, a lightning, (High Definition Multimedia Interface) (HDMI), but the present invention is not limited to this.

Each different standard may have a different configuration or pinout for the electrical contact assembly. In addition, the size, shape and configuration of the connector may be subject to a standard that includes tolerances for occlusion of the mating connector. Thus, the layout of connectors for integrating optical I / O assemblies may differ in various standards.

The first and second connector plugs 100 and 200 and the first and second terminals 10 and 20 are provided with a physically detachable coupling between the mating ports 12 and 22, RTI ID = 0.0 > I / O < / RTI >

In another embodiment described later, the first and second connector plugs 100 and 200 are connected to the main board having the processors 13 and 23 instead of physically detachably coupled to the engagement ports 12 and 22, It is also possible that the external connection terminal made of balls is fixedly coupled. As shown in FIG. 1, the active optical cable (AOC) assembly of the present invention, in which the first and second connector plugs 100 and 200 are connected to both ends of the optical cable 300a, Between a chip and a board, between a board and a peripheral device, for example, between a terminal body and a peripheral I / O device The present invention can be applied to a case where a very high-speed large-capacity data transmission is required.

When the optical communication system 1 according to the present invention is connected such that optical communication is established between the first and second terminals 10 and 20, the first and second connector plugs 100 and 200 provided at the respective ends are configured identically . Accordingly, the first connector plug 100, that is, the active optical cable (AOC) assembly, to be coupled with the first terminal 100 will be described in detail below.

FIG. 2 is a longitudinal cross-sectional view of an active optical cable (AOC) assembly according to a first embodiment of the present invention, and FIGS. 3a and 3b are views showing an active optical cable (AOC) according to a first embodiment of the present invention shown in FIG. 4 is an enlarged view of an optical fiber inserted portion of the right side of an active optical cable (AOC) assembly according to the first embodiment of the present invention shown in Fig. 2, And FIG. 5 is an exploded view of an active optical cable (AOC) assembly according to a first embodiment of the present invention shown in FIG.

2 to 5, an active optical cable (AOC) assembly according to a first embodiment of the present invention includes a connector plug 100 and an optical cable 300a coupled thereto.

The connector plug 100 according to the first embodiment of the present invention mainly includes an optical element module 101 manufactured in the form of a SIP (System In Package) including the light engine 110, an optical subassembly OSA 190 and a plurality of optical fibers 300 connected to the optical fiber cable 300a in the optical fiber insertion channel 305 formed in the optical device module 101 and the optical subassembly (OSA) 300 are inserted.

8G, the connector plug 100 of the present invention includes an SIP (System In Package) wafer 102 and an optical sub-assembly (OSA) 190, which are manufactured in the form of a wafer, (OSA) wafers 190a manufactured in the form of wafers are manually aligned and integrated by a wafer level alignment (WLA) method, and then diced into individual connector plugs 100. FIG.

As described later, the optical device module 101 of the present invention can be manufactured in a slim form by packaging an optical device and a driving chip without using a substrate in a FOWLP (Fan Out Wafer Level Package) method using a semiconductor manufacturing process .

The optical element module 101 may include a light engine 110 (see FIG. 1) to provide an optical interface, and an external connection terminal 160, which satisfies one of various data transmission standard standards, And is formed in a strip shape.

7 shows a sample photograph showing an embodiment in which the external connection terminal 160 is implemented to satisfy, for example, a data transmission standard specification of a high definition multimedia interface (HDMI).

In this case, the external connection terminal 160 may be variously modified in the form of a conductive strip according to a data transmission standard, and may be formed in the form of a solder ball or a metal bump.

The optical element module 101 may comprise an active light engine 110 configured to actively generate and / or receive and process optical signals. The light engine 110 may include an optical element 130 for generating an optical signal or receiving an optical signal, and an optical IC 140 for controlling the optical interface by controlling the optical element. In addition to the optical IC 140, the optical element module 101 may include a processor (not shown), an encoder and / or a decoder, a passive element such as R, L, and C necessary for signal processing, As shown in FIG.

The optical element 130 may include, for example, a laser diode for generating an optical signal and / or a photodiode for receiving an optical signal. In another embodiment, the optical IC 140 may be configured to control the laser diode and the photodiode. In yet another embodiment, the optical IC 140 may be configured to drive a laser diode and amplify an optical signal from the photodiode. In another embodiment, the laser diode may comprise a VCSEL.

The optical element module 101 may be formed by stacking various components such as the optical element 130 and the optical IC 140 in the form of a flip chip without using a substrate, (EMC) epoxy mold compound to form the mold body 111. As a result, the mold body 111 serves to safely protect the light engine 110, which is packaged after being integrated, from impact.

The external connection terminal 160 disposed on the outer side and the conductive vertical vias 150 used for electrical interconnection are connected to the mold body 111 as shown in FIG. And are arranged in the vertical direction.

The optical element module 101 protects various components constituting the optical engine 110 such as the optical element 130 and the connection pads 131 and 141 of the optical IC 140 on the lower surface thereof, And a wiring layer 120 for electrical connection is formed.

In this case, the optical element 130 employs an element in which two connection pads 131 made of an anode and a cathode are disposed on the same plane as a portion where light enters and exits.

The wiring layer 120 is provided with a conductive wiring pattern 123a for connecting the optical element 130 and the connection pads 131 and 141 disposed on the lower surface of the optical IC 140, And a conductive wiring pattern 123b interconnecting the vias 150 is buried. As a result, packaging can be achieved without wire-bonding.

The wiring layer 120 is formed of a dielectric layer or a passivation layer material and may be formed of a material such as polyimide, poly (methylmethacrylate) (PMMA), benzocyclobutene (BCB) , may be made of silicon oxide (SiO _2), acrylic, or the insulating material of the other polymer-based.

Since the optical element 130 is composed of a laser diode for generating an optical signal and / or a photodiode for receiving an optical signal, the wiring layer 120 may be formed as shown in FIGS. 9A and 9B so as to receive an optical signal generated or received therefrom. And may be made of a transparent material.

When the wiring layer 120 is made of an opaque material, a window 125 through which optical signals generated from the optical device 130 can pass is formed as shown in FIG. 9B.

Furthermore, the wiring layer 120 may be formed of a transparent material, for example, by adjusting the distance between the optical element 130 and the optical component 171 disposed in the optical sub-assembly (OSA) 190, for example, An extension protrusion 126 may be provided.

2 and 3, the wiring layer 120 includes an optical lens 124 for changing (controlling) the path of the light L generated from the optical element 130 even when the optical element 130 is formed of a transparent material ).

The optical lens 124 may include, for example, a collimating lens that makes the path of the light L generated from the optical element 130 not parallel to the path of the collimating lens, or a function of a focusing lens For guiding the light L to be incident on the optical component 171, for example, a mirror or a lens disposed in the optical subassembly (OSA) 190.

The optical component 171 is disposed between the optical element 130 and the optical fiber assembled in the optical subassembly (OSA) 190 and functions as a light path changing member for reflecting or refracting the optical signal to change the path of the optical signal. do.

4, the optical device module 101 and the optical subassembly (OSA) 190 are combined to form an optical fiber insertion channel 301 that accommodates a plurality of optical fibers 300 The inner end 121 of the lid groove 122 described later serves as a stopper for limiting the insertion depth of the optical fiber 300 to a predetermined depth.

Hereinafter, a method of manufacturing the optical element module 101 according to the present invention will be described with reference to Figs. 8A to 8F.

8A, a molding tape 30 having an adhesive layer (or a release tape) 32 formed on one side of a molding frame 31 is used to manufacture a photodiode module 101 To be mounted on the molding tape 30 at predetermined positions.

In this case, the molding tape 30 may be formed in a wafer shape so that the manufacturing process can be performed at the wafer level, as shown in FIG. 8G.

Various components to be integrated in the optical element module 101 are the optical element 130 and the optical IC 140 and the via PCB 153 required to form the conductive vertical vias 150, It is implemented by pick & place method. In this case, a processor necessary for signal processing may be included as needed. The component to be mounted determines the mounting direction so that the connection pads of the chip are in contact with the molding tape 30.

The via PCB 153 may form a conductive vertical via 150 by laser penetrating the PCB or by using a pattern and etch process to form a through hole and filling the through hole with a conductive metal. The conductive metal may be formed of a metal such as gold, silver, or copper, but is not limited thereto and may be a conductive metal. In addition, the method of forming the conductive vertical vias 150 in the through holes may include a method of filling the through holes with a conductive metal by sputtering, evaporation, or plating in addition to the method of filling the conductive metal powder, And may be formed by planarizing the surface.

In this case, the optical element 130 uses a device in which two connection pads 131 made of an anode and a cathode are disposed on the same plane as the portion where the light enters and exits.

Next, as shown in FIG. 8B, a molding layer 33 is formed on the molding tape 30 with, for example, an epoxy mold compound (EMC) and the surface is planarized after curing. Then, after the upper end of the conductive vertical vias 150 is exposed by chemical mechanical polishing (CMP) the top surface of the cured mold, the cured mold and the molding frame 31 are separated, A slender molded body 111 is obtained.

Next, the obtained mold body 111 is reversed, and the wiring layer 120 for protecting and electrically connecting the exposed optical element 130 and the connection pads 131 and 141 of the optical IC 140 is shown in FIGS. 8D and 8D. Together.

First, an insulating layer for protecting the exposed optical element 130 and the connection pads 131 and 141 of the optical IC 140 is first formed, and then a contact window for the connection pads 131 and 141 is formed. A conductive wiring pattern 123a for connecting the connection pads 131 and 141 and a conductive wiring pattern 123 for interconnecting the optical IC 140 and the conductive vertical via 150 are formed by patterning the conductive metal layer, 123b.

The wiring patterns 123a and 123b are formed by forming a conductive metal layer by a method such as sputtering or evaporation using a conductive metal such as gold, silver, copper, or aluminum .

Thereafter, an insulating layer covering the conductive wiring patterns 123a and 123b is formed.

The insulating layer is, for example, polyimide (polyimide), PMMA (poly ( methylmethacrylate)), benzocyclobutene (BCB: benzocyclobutene) may be formed of a silicon oxide (SiO _2), acrylic, or the insulating material of the other polymer-based .

In this case, since the optical element 130 is made up of a laser diode for generating an optical signal and / or a photodiode for receiving an optical signal, the insulating layer is formed of a transparent material so as to receive the optical signal generated or received therefrom Lt; / RTI >

When the wiring layer 120 is formed of a transparent material, a collimating lens 124 is formed on the path through which the light generated from the optical device 130 passes, that is, on the surface of the wiring layer 120, as shown in FIG. 8E.

The lens 124 may be formed using an etch mask used to form the wiring layer 120. After the protrusion corresponding to the lens is formed of polyimide and then subjected to a reflow process, The collimating lens can be formed.

Another method of forming the lens 124 is to form an insulating layer of the wiring layer 120 with silicon oxide (SiO ₂ ) while forming a hemispherical etch mask of photoresist PR, Can be formed by etching.

A trapezoidal or trench type cover for fixing the optical fiber 300 mounted on the optical fiber mounting groove 172 when the optical fiber 300 is inserted into the optical fiber insertion channel 301 by etching one side of the wiring layer 120, The grooves 122 (see FIG. 4) are formed corresponding to the number of the optical fiber insertion channels 301.

In this case, the inner end 121 of the lid groove 122 is configured to stop to set a predetermined distance between the end face of the optical fiber 300 and the 45 ° reflecting face during assembly of the optical fiber 300, ).

Next, as shown in FIG. 8F, a conductive metal is deposited on the exposed conductive vertical vias 150 to form a metal layer, and then patterned to form a plurality of conductive strips satisfying one of standard data transmission standards, Terminals 160 are formed.

The external connection terminal 160 may be variously modified according to a data transmission standard, and may be formed in the form of a solder ball or a metal bump.

Although the method of integrating the via PCB 153 into the photonic device module 101 by a flip chip process to form the conductive vertical vias 150 has been proposed in the above embodiment, It is also possible to form the conductive vertical vias 150.

That is, a through hole is formed in the mold body 111 using a laser, a patterning, and an etching process, the through hole is filled with a conductive metal, or the conductive body is formed by sputtering, evaporation, A through hole is filled with a metal, and the mold surface is planarized.

The optical device module 101 of the present invention is packaged in a slim form by packaging the optical device 130 and the optical IC 140 without using a substrate in a fan out wafer level package (FOWLP) Can be achieved.

In the present invention, the optical device module 101 is coupled to the upper portion of the optical subassembly (OSA) 190 using a cover for fixing a plurality of optical fibers 300.

4A, an optical fiber insertion channel 305 is formed in combination with the optical fiber mounting groove 172 formed on the upper part of the optical subassembly (OSA) 190, in the wiring layer 120 of the optical device module 101, And a number of cover grooves 122 for fixing the optical fibers 301 to 304 seated in the optical fiber mounting grooves 172 of the optical subassembly OSA 190 are formed corresponding to the optical fibers 301 to 304 .

The lid groove 122 may have a structure in which the optical fiber 300 placed in the optical fiber receiving groove 172 is contacted and fixed at three points in the upper part. For this, the cover groove 122 may be formed in a trench-like groove shape having a shallow depth so that the upper end and the upper side of the optical fiber 300 are in contact with each other.

However, the lid groove 122 formed at one side of the wiring layer 120 of the optical element module 101 for fixing the optical fiber 300 placed in the optical fiber mounting groove 172 is not essential and may be omitted. That is, one side of the wiring layer 120 of the optical device module 101 corresponding to the optical fiber mounting groove 172 is made of a plate-like lid and may be in line contact with the optical fiber 300 mounted on the optical fiber mounting groove 172 have.

The optical element 130 disposed in the mold body 111 of the optical element module 101 is also arranged in the lateral direction corresponding to the plurality of optical fibers 301 to 304 inserted in the optical fiber insertion channel 305.

As shown in FIG. 4D, the optical fiber 300 includes a clad 311 made of a material having a refractive index lower than that of the core, a clad layer 311 serving as a protective layer, 312) are sequentially formed. The optical fiber 300 can be formed by repeating total reflection on the interface between the core 310 and the clad 311 by using the difference in refractive index between the core 310 and the clad 311, .

In this case, the optical fiber is largely divided into a glass optical fiber (GOF) and a plastic optical fiber (POF). Plastic optical fiber (POF) is relatively large in diameter compared with glass optical fiber (GOF), but the cross-sectional area of the core in which light propagates is also easy to handle.

The plastic optical fiber (POF) is made of an acrylic resin such as polymethyl methacrylate (PMMA), a polycarbonate resin, polystyrene or the like, for example, and the clad 311 is made of, for example, , F-PMMA (Fluorinated PMMA), fluorine resin, silicone resin, or the like, and the cover layer 312 may be made of, for example, PE. The plastic optical fiber can use, for example, an optical fiber made of F-PMMA (Fluorinated PMMA) clad in a polymethylmethacrylate (PMMA) core.

When a plurality of optical fibers 301 to 304 are combined to form one optical cable 300a as shown in FIGS. 4A, 4B and 6A in order to increase the overall bandwidth without using the optical fiber as a single wire, a plurality of optical fibers 301 304 may be formed in a mutually adhering manner to form a monolithic structure.

In the case of the plastic optical fiber (POF) described above, the diameter of each of the optical fibers 301 to 304 is 400 μm according to the development of the technology, and it is also applicable to the present invention.

In the glass optical fiber (GOF), the core 310 and the clad 311 are made of silica glass or multicomponent glass having different refractive indexes, and a cover layer 312 made of resin is formed on the outer periphery thereof.

A glass optical fiber (GOF) can be implemented in both a single mode and a multimode. The diameter of the core 310 and the clad 311 is 50/125 占 퐉 (multimode) or 10/125 占 퐉 ), Which is advantageous in that it can be made smaller in diameter than plastic optical fiber (POF).

In the case of a glass optical fiber (GOF), a portion of the connector plug 100 to be inserted into the optical fiber insertion channel 305 is peeled off from the cover layer 312 to form a plurality of optical fibers 301a made of only the core 310 and the clad 311 302a, 303a and 304a may be respectively accommodated in a plurality of optical fiber mounting grooves 172d formed in a V-groove shape on the supporting substrate 170 as shown in FIG. 4C.

Further, in the case of a glass optical fiber (GOF), the coating layers 312 of the plurality of optical fibers 301 to 304 are made to stick together to form a single optical cable 300a, The cover layer 312 may be inserted into the optical fiber insertion channel 305 of the connector plug 100 as shown in FIGS. 4A, 4B, and 6A.

In this case, in the present invention, the diameter of each of the plurality of optical fibers 301 to 304 may be 400 μm, and even if the optical fibers 301 to 304 having the diameter of 400 μm are used, the overall thickness of the connector plug 100 It can be implemented slimly to about 1 mm.

When the optical fibers 301 to 304 are inserted into the optical fiber insertion channel 305 of the connector plug 100 with the coating layer 312 formed on the outer periphery, as shown in FIGS. 4A and 4B, .

The optical fiber insertion channel 305 shown in FIG. 4A includes an optical fiber receiving groove 172 capable of receiving a plurality of optical fibers 301 to 304 attached to a supporting substrate 170 as a single receiving groove. .

In this case, a single optical fiber mounting groove 172 formed in the supporting substrate 170 of the optical subassembly (OSA) 190 has a width that accommodates the entire plurality of optical fibers 301 to 304 and a part Depth. The optical fiber mounting groove 172 is a trench-like groove structure in which both side walls 172c have inclined surfaces and both side walls 172c are in contact with the side surfaces of the optical fibers 301 and 304 disposed outside the plurality of optical fibers 301 to 304 It has an inclined surface.

The optical fiber inserting channel 305 shown in FIG. 4B includes an optical fiber receiving groove 172e having a plurality of trench-type grooves capable of accommodating a plurality of optical fibers 301 to 304 on the upper side of the supporting substrate 170, Lt; / RTI >

A plurality of optical fibers 301 to 304 coupled to the plurality of optical fiber seating grooves 172e are coated with a clad and a coating layer on the outer periphery of the core and the coating layers of adjacent optical fibers are separated from each other.

In this case, each of the plurality of optical fiber mounting grooves 172e formed in the supporting substrate 170 has an inclined surface in which both side walls 172c can contact the side surfaces of the plurality of optical fibers 301 to 304, And has a trench type groove structure in which the optical fibers 301 to 304 placed on the optical fiber 172e are contacted and fixed at three points of the lowermost portion and the both side portions.

The shape of the optical fiber receiving groove 172e is not limited to this and can be changed into another shape.

The optical sub-assembly (OSA) 190 includes a support substrate 170 formed of silicon (Si), glass, or plastic and having a plurality of optical fiber mounting grooves 172 on which the optical fibers 300 are mounted, And a strength reinforcing layer 180 stacked on the lower surface of the supporting substrate 170 to reinforce the strength.

In this case, the strength reinforcing layer 180 may be formed of, for example, a thin film of an epoxy resin or the like.

A reflecting surface is formed on a part of the supporting substrate 170 opposite to the optical element 130, that is, on a front surface of the plurality of optical fiber receiving grooves 172. Light L generated from the optical element 130 is reflected by the optical sub- An optical component 171 is formed to change the path so that the incident light L is incident on the core 310 of the optical fiber 300 disposed at right angles to the OSA 190.

As the optical component 171, for example, a concave mirror 174 having a 45-degree reflection mirror with a mirror formed on a 45-degree reflection surface or a concave 45-degree reflection surface may be used. The cone-shaped mirror 174 serves to collect the incident light L generated from the optical element 130 and to change the path to be incident on the core of the optical fiber 300. The mirror may be formed by depositing a metal layer of, for example, Au, Al, Cu, Pt or the like on the reflective surface to a thickness of 100 to 200 nm.

The supporting substrate 170 may simultaneously form a 45-degree reflection mirror and a V-groove.

The first method is a method of making a difference in etching rate between the (110) plane and the (111) plane of the Si substrate (wafer) and etching the (110) plane at 45 °. In this method, both the mirror surface and the wall surface of the V-groove are 45 degrees since the etching surfaces are all 45 degrees (110 surfaces). You can create a reflective surface and a V-groove in one mask pattern at a time. Thereafter, selective deposition of metal only on the reflective surface completes the 45-degree reflection mirror.

The first method will be described in detail. First, the mask is aligned on the Si wafer (substrate) in the direction of 110 to form a photoresist (PR) pattern to be used as an etch mask.

Thereafter, when an anisotropic etching is performed using a TMAH-Triton solution with an etching solution on an Si wafer (substrate) having an etching mask formed thereon, a 45 ° reflection surface and a V-groove can be formed together.

Subsequently, metal is selectively deposited only on the reflective surface, and the back surface of the Si wafer is grinded to make the supporting substrate 170 have a desired thickness.

Finally, an epoxy resin is deposited on the back surface of the supporting substrate 170 as a material for preventing cracking of the Si substrate to form the strength reinforcing layer 180.

In a second method of forming the supporting substrate 170, a Si wafer (substrate) is etched using a KOH solution as an etchant according to a conventional method to form a Si V-groove in a (111) direction.

Subsequently, the wall surface of the V-groove end portion is ground with a saw blade having a 45 ° blade to form a 45 ° reflection surface, and the reflection surface is etched to improve the roughness or to form a silicon oxide film, followed by peeling Improves roughness.

Thereafter, a metal is selectively deposited on the reflecting surface, and the back surface of the Si wafer is ground to make the supporting substrate 170 have a desired thickness.

The optical component 171 focuses the light received from the optical fiber 300 onto the optical element 130 (e.g., a photodiode) of the light engine 110, May be configured to focus the light L from an optical element (e.g., a laser diode) to the core 310 of the optical fiber 300.

The connector plug 100 may be configured to support one or more optical channels. In an embodiment having a plurality of optical channels, the connector plug 100 may include an optical component 171 for transmission and reception and a corresponding transmit and receive component of the light engine 110.

Hereinafter, an optical alignment method of the optical device module wafer 102 and the optical sub-assembly (OSA) wafer 190a will be described with reference to FIG. 8g.

In the present invention, as shown in FIG. 8G, an optical device module wafer 102 and an optical sub-assembly (OSA) wafer 190a are prepared.

Alignment markers are previously formed on the edge of each active area when the fabrication process is performed at the wafer level in the optical device module wafer 102 and the optical subassembly (OSA) wafer 190a. The alignment markers may also be disposed at four corners of the wafer.

A method of aligning an optical device module wafer with an OSA wafer using an alignment marker is disclosed in, for example, a first method using an optical microscope in the case of a transparent substrate, a method in which a through hole is formed in one of the wafers to be aligned, A third method of arranging the IR light on the opposite side of a transmission electron microscope (TEM) and aligning the alignment markers in the case of a Si wafer transparent to infrared (IR) A fourth method of arranging alignment markers on the front surface of two wafers to be aligned and arranging alignment markers on the back surface of another wafer by aligning the alignment markers with an optical microscope; A fifth method of arranging the pair of microscopes and aligning the alignment markers, a sixth method of aligning the alignment markers using two sets of microscopes and the deformed wafer table DAlign Method) can be selected and used.

The optical alignment method using the alignment markers described above allows the optical device module 101 and the optical subassembly (OSA) 190 to be transferred to the optical device module wafer 102 and the optical subassembly (OSA) wafer 190a at the wafer level The present invention is applicable to the case where manufacturing is performed.

However, if the optical element module 101 and the optical subassembly (OSA) 190 are not the same size, alignment at the wafer level can not be achieved.

When the sizes of the optical element module 101 and the optical subassembly (OSA) 190 are not the same, alignment can be performed using a guide pattern or the like instead of the optical alignment method using the alignment markers. Of course, even if the sizes of the optical element module 101 and the optical subassembly (OSA) 190 are the same, the alignment method using the guide pattern can be applied.

That is, alignment protrusions may be formed on one of the optical device module wafer 102 and the optical subassembly (OSA) wafer 190a, and alignment grooves may be formed in which the alignment protrusions are mated with each other.

First, when the optical device module 101 is smaller than the optical subassembly (OSA) 190 as in the fourth embodiment shown in FIG. 12A which will be described later, a stopper or alignment guide acts on one side of the supporting substrate 170b And the optical element module 101a can be mounted in a pick-and-place manner by protruding the extension 170c.

Further, including the first embodiment shown in Fig. 2, in the second and third embodiments shown in Figs. 10A and 11A to be described later, the optical sub-assembly OSA can be implemented smaller than the optical device module, An alignment method using a guide pattern can be applied.

When the optical sub-assembly OSA is implemented to be smaller than the optical device module, a method of aligning the optical sub-assembly OSA with the optical device module will be described with reference to Figs. 14A and 14B.

14A and 14B, when the optical sub-assembly (OSA) 190 is smaller than the optical element module 101, the guide protrusion 127 for alignment is formed on the joint surface of the optical element module 101, (OSA) 190 to the single optical device module 101 or the optical device module wafer 102 in a pick-and-place manner.

14B, the alignment guide protrusions 127 are arranged parallel to each other at a distance corresponding to the width of the optical subassembly (OSA) 190 to accommodate therein a rectangular optical subassembly (OSA) 190 A pair of first and second guide protrusions 127a and 127b and a third guide protrusion 127c arranged at right angles to intercept one end of the first and second guide protrusions 127a and 127b. It is preferable that the first to third guide protrusions 127a to 127c have a thickness of 20 to 50 탆.

In this case, it is preferable not to form the guide protrusion facing the third guide protrusion 127c, considering that a plurality of optical fibers are disposed at the other end of the first and second guide protrusions 127a and 127b. The first to third guide projections 127a to 127c have a structure protruding from the bonding surface so as to surround the optical subassembly (OSA)

The first and third guide protrusions 127a to 127c have first and second alignment protrusions 127a to 127c, which are aligned with alignment grooves (not shown) formed on the bonding surface of the optical subassembly (OSA) (127d, 127e). In this case, the first alignment protrusion 127d may be in the form of a small protrusion, for example, and the second alignment protrusion 127e may take the form of a linear protrusion having a constant length.

As described above, when the optical element module wafer 102 and the optical sub-assembly (OSA) wafer 190a are aligned in a wafer level alignment (WLA) manner, the optical element 130 and the mirror And the alignment between the mirror (optical component) and the optical fiber 300 can be accurately performed at a time, thereby achieving high efficiency.

Thereafter, an Eutectic Alloy layer or an adhesive layer is formed in advance on the optical subassembly (OSA) wafer 190a, and then heat is applied to the two wafer 102 and 190a in alignment with the optical device module wafer 102, .

The process alloy layer may be formed using, for example, an Au-Sn alloy, and hermetic sealing may be performed. As the adhesive layer, for example, a polymer adhesive of benzocyclobutene (BCB), epoxy or polyimide series may be used.

Then, the optical engine package (Optical Engine Package), that is, the connector plug 100, which can fix the optical fiber 300 by the dicing process in which the bonded wafers are sawed and separated, .

4, an optical fiber insertion channel 301 into which a plurality of optical fibers 301 to 304 are inserted is formed on one side of the optical engine package obtained as described above.

In this case, as shown in FIG. 3B, the insertion of the optical fibers 301 to 304 is performed at the entrance of the optical subassembly (OSA) wafer 190a forming the optical fiber insertion channel 301, that is, An inclined portion 173 for gradually widening the inlet can be formed.

A method of inserting the optical fibers 301 to 304 into the optical fiber insertion channel 301 of the optical engine package is as follows. First, an epoxy or polyimide type adhesive is preliminarily set at the entrance of the optical fiber insertion channel 301 A method of picking up the optical fibers 301 to 304 one by one using a pick and push device and pushing the optical fibers 301 to 304 into the optical fiber inserting channel 301 and then curing the adhesive by irradiating heat or UV light Lt; / RTI >

As described above, the connector plug 100 manufactured as a semiconductor package type has a structure in which the external connection terminal 160 is formed in the form of a conductive strip on the outer surface of the optical element module 101, so that the data transmission standard of high definition multimedia interface , It is implemented as shown in Figs. 6A to 6C. FIG. 7 shows a sample photograph of the connector plug 100 having a data transmission standard specification of a high-definition multimedia interface (HDMI).

The external connection terminal 160 may be formed on the outer surface of the optical device module 101 or the external connection terminal 160 may be formed on the same level as the outer surface of the optical device module 101 have.

In the illustrated embodiment, the external connection terminal 160 is formed only on the outer surface of the optical element module 101, and the optical vertical sub-assembly (OSA) a via 151 may be formed in the vertical direction and the solder ball 152 may be used between the wiring layer 120 of the optical device module 101 and the conductive vertical via 151.

In the active optical cable (AOC) assembly according to the modification, the connector plug 100b is a type for mounting the optical fiber 300 without the optical fiber cover as compared with the first embodiment, and includes an optical element module 101a, And an optical sub-assembly (OSA) 190 for supporting the device module 101a and the optical fiber 300. FIG.

The optical element module 101a has a functionally identical structure except that a cover portion covering an upper portion of the optical fiber is removed and its length is reduced as compared with the optical element module 101 of the first embodiment.

The connector plug 100b according to the modified example has no cover for covering the upper portion of the optical fiber 300 so that the optical device module 101a is first pick- the optical fiber 300 can be mounted on the optical fiber mounting groove 172 in a pick-and-place manner, so that the optical fiber 300 can be easily assembled.

In this case, the inner end of the optical fiber receiving groove 172 serves as a stopper when the optical device module 101a and the optical fiber 300 are assembled to the supporting substrate 170. [

When the optical fiber 300 is assembled to the optical fiber mounting groove 172 of the supporting substrate 170, an epoxy or polyimide adhesive is first filled into the optical mounting groove 172, The optical fiber mounting groove 172, and fixed by a method of curing the adhesive by irradiating heat or UV light.

The connector plug 100b can reduce the unnecessary area of the SIP package, that is, the optical element module 101a, thereby reducing the cost.

Since the connector plug 100b is composed of two structures, that is, the optical element module 101a and the optical subassembly (OSA) 190, the connector plug 100b can be formed as a thin film.

In this case, a conductive strip or an external connection terminal 161 in the form of a solder ball or a metal bump can be formed on the lower surface of the optical subassembly (OSA) 190, It is also possible to have a data transmission standard specification of a high-definition multimedia interface (HDMI), respectively.

In this case, since the optical element module 101 forms a SIP (System In Package) package by the FOWLP method using the semiconductor manufacturing process, the mold body 111 and the wiring layer 120 are formed as a thin film having a thickness of 200 mu m and 100 mu m, respectively And the optical subassembly (OSA) 190 is fabricated to 700 mu m while receiving the optical fiber 300 having a diameter of 400 mu m so that the connector plug 100 of the present invention achieves a thickness of 1 mm And the overall size is 8.20 × 9.30 × 1 mm.

As described above, in the present invention, when the optical device module 101 and the optical sub-assembly (OSA) wafer 190a are aligned in the wafer level alignment (WLA) It is possible to realize a slim structure.

Also, in the present invention, the optical element module wafer 102 and the optical sub-assembly (OSA) wafer 190a are aligned in a wafer level alignment (WLA) Parts) and the alignment between the mirror (optical part) and the optical fiber 300 can be accurately performed, and can be simply performed by one alignment.

An active optical cable (AOC) assembly according to a second embodiment of the present invention will be described with reference to Figs. 10A to 10D.

The connector plug 100a used in the active optical cable (AOC) assembly according to the second embodiment includes an optical subassembly (OSA) in which an optical fiber seating groove 172, which receives and supports a part of the optical fiber 300, Optical Sub Assembly 191; And an optical fiber receiving groove 177 for receiving and supporting the remaining portion of the optical fiber in correspondence with the optical fiber receiving groove 172. The optical fiber receiving groove 172 is coupled to an upper portion of the optical fiber receiving groove 172, An optical fiber cover 176 forming a channel; An optical element module 101 stacked on top of the optical subassembly 1910 and the optical fiber cover 176 and having a light engine 110 for generating an optical signal or receiving an optical signal therein; And an optical component 171 installed in the optical sub-assembly for transmitting the optical signal between the optical fiber and the optical engine.

In the description of the second embodiment, the same parts as those of the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted.

Compared to the first embodiment, the optical device module 101 according to the second embodiment has a bottom surface of the wiring layer 120 and a cover groove 122 for fixing the optical fiber 300 And the optical sub-assembly (OSA) 190 for holding the optical fiber 300 has been modified as follows.

In the second embodiment, the optical sub-assembly (OSA) 191 includes a support substrate 170a made of, for example, glass, a side of the supporting substrate 170a for fixing the optical fiber 300, And a spacer 175 that fills a space between the other side of the supporting substrate 170a and the optical device module 101. The optical fiber module 100 includes a plurality of optical fibers,

The optical fiber cover 176 and the spacer 175 are made of, for example, silicon.

First, the optical fiber cover 176 and the spacer 175 are required to have the same height so as to be uniformly bonded to the flat wiring layer 120 of the optical device module 101.

A plurality of optical fiber receiving grooves 172 and 177 similar to those of the first embodiment are formed on the supporting substrate 170a and the optical fiber lid 176 so as to support a plurality of optical fibers 301 to 304, respectively.

A 45 ° reflection surface is formed on a portion of the support substrate 170a opposed to the core 310 of the optical fiber 300 mounted on the optical fiber seating groove 172 and a metal layer is formed on the reflection surface, The optical path of the incident light L to the core 310 of the optical fiber 300 arranged in the right angle direction is determined so that the light L generated from the light source 130 enters the optical subassembly OSA 191 vertically. That is, the optical component 171 is formed.

In this case, it is preferable that the portions where the spacers 175 and the optical fiber cover 176 are opposed to each other form an inclined surface so that the light L generated from the optical element 130 does not interfere with the mirror when it reaches the mirror.

Also, as shown in FIG. 10D, the supporting substrate 170a according to the second embodiment can also remove portions covering the upper portions of the plurality of optical fibers 301 to 304. [ In this case, when a plurality of optical fibers 301 to 304 are assembled to the connector plug 100a, it can be pick-and-place mounted so that assembly can be easily performed.

In the second embodiment, two wafer level alignment (WLA) in which the optical fiber lid 176 is aligned and assembled on the supporting substrate 170a and then the optical module 101 is aligned and assembled is required, Which is different from the first embodiment in which the wafer level alignment (WLA) is performed.

An active optical cable (AOC) assembly according to a third embodiment of the present invention will be described with reference to Figs. 11A and 11B.

In the description of the third embodiment, the same parts as those of the second embodiment are denoted by the same reference numerals, and a description thereof will be omitted.

In the active optical cable (AOC) assembly according to the third embodiment, the connector plug 100a has the remaining portion excluding the portion where the optical fiber 300 is coupled in the subassembly (OSA) 191 as compared with the second embodiment Are the same.

The supporting substrate 170a and the optical fiber lid 176 are formed with a plurality of optical fiber receiving grooves 172 and 177 similar to those of the first embodiment so as to receive and support a plurality of optical fibers 301 to 304, respectively.

Accordingly, when the optical fiber cover 176 is assembled to the support substrate 170a, an optical fiber insertion channel into which the optical fiber is inserted is formed. In this case, it is preferable to increase the depth of the optical fiber seating groove 172 from the inside to the front end of the supporting substrate 170a to facilitate the insertion of the optical fiber 300 into the optical fiber inserting channel. That is, the width of the entrance 173a of the optical fiber insertion channel is set larger than that of the inside.

As a result, compared to the second embodiment, the active optical cable (AOC) assembly according to the third embodiment picks up the optical fibers 300 one by one using pick & push equipment, The process of pushing and assembling can be easily performed.

An active optical cable (AOC) assembly according to a fourth embodiment of the present invention will be described with reference to Figs. 12A and 12B.

In the description of the fourth embodiment, the same reference numerals are given to the same parts as those in the first embodiment, and a description thereof will be omitted.

In the active optical cable (AOC) assembly according to the fourth embodiment, the connector plug 100b is a type in which the optical fiber 300 is mounted without the optical fiber cover as compared with the first to third embodiments, And a supporting substrate 170b for supporting the optical element module 101a and the optical fiber 300. [

The optical element module 101a has a functionally identical structure except that a cover portion covering an upper portion of the optical fiber is removed and its length is reduced as compared with the optical element module 101 of the first embodiment.

That is, in the optical device module 101a, the optical engine 110 having the optical device 130 and the optical IC 140 is integrated in the form of a flip chip, and the outer periphery is formed of an epoxy mold compound (EMC) And a wiring layer 120 for protecting the optical element 130 and the optical IC 140 and electrically connecting the optical element 130 and the optical IC 140 is formed on the lower surface of the mold body 111.

In order to stably support the optical device module 101a and the optical fiber 300, one side of the supporting substrate 170b is in contact with the wiring layer 120a of the optical device module 101a, And an optical fiber receiving groove 172 is formed on the bottom of the other side to support the optical fiber 300. The optical fiber receiving groove 172 is formed in the bottom of the other side.

The support substrate 170b may be made of silicon (Si), glass, or plastic, and may be manufactured at a wafer level.

A 45 ° reflecting surface is formed on a portion of the supporting substrate 170b opposed to the core 310 of the optical fiber 300 mounted on the optical fiber receiving groove 172 and a metal layer is formed on the reflecting surface, When the light L generated from the light source 130 is vertically incident on the supporting substrate 170b constituting the optical sub-assembly OSA, the incident light L is incident on the core (not shown) of the optical fiber 300 That is, the optical component 171, to change the path so as to be incident on the optical element 171. [

A stepped portion 172a is formed between the 45 ° reflecting surface on which the metal layer is formed and the inner end 172b of the optical fiber receiving groove 172. The inner end portion 172b is formed at the time of assembly of the optical fiber 300 Provides a stop to establish a predetermined distance between the (300) end face of the optical fiber and the 45 ° reflective surface.

Since the connector plug 100b according to the fourth embodiment has no cover covering the upper portion of the optical fiber 300, the optical device module 101a can be picked up on one side of the supporting substrate 170b first. and the optical fiber 300 can be mounted on the optical fiber mounting groove 172 in a pick-and-place manner, thereby facilitating assembly.

In this case, the inner end 172b of the optical fiber mounting groove 172 on the supporting substrate 170b is set so that the tip end of the assembled optical fiber 300 coincides with the end of the optical device module 101a.

The extended portion 170c of the supporting substrate 170b and the inner end portion 172b of the optical fiber receiving groove 172 serve as stoppers when the optical device module 101a and the optical fiber 300 are assembled to the supporting substrate 170b do.

When the optical fiber 300 is assembled to the optical fiber mounting groove 172 of the supporting substrate 170b, an epoxy or polyimide adhesive is first filled into the optical mounting groove 172 and the optical fiber 300 The optical fiber mounting groove 172, and fixed by a method of curing the adhesive by irradiating heat or UV light.

The connector plug 100b according to the fourth embodiment can reduce the unnecessary area of the SIP package, that is, the optical element module 101a, thereby reducing the cost.

In addition, since the connector plug 100b according to the fourth embodiment is composed of two structures, that is, the optical element module 101a and the supporting substrate 170b, the overall thickness of the connector plug 100b can be realized as a thin film.

An active optical cable (AOC) assembly according to a fifth embodiment of the present invention will be described with reference to Fig.

In the description of the fifth embodiment, the same parts as those in the fourth embodiment are denoted by the same reference numerals, and a description thereof will be omitted.

In the active optical cable (AOC) assembly according to the fifth embodiment, the connector plug 100c is a type in which the optical fiber 300 is mounted without the optical fiber cover. In comparison with the fourth embodiment, the connector plug 100c has a metal layer There is a difference in the structure in which a mirror for changing the path is formed.

That is, in the fifth embodiment, a mirror for changing the light path is integrally formed under the wiring layer 120 of the optical device module 101a. When the optical element module 101a is manufactured in the SIP package form as in the fourth embodiment, the wiring layers 123a and 123b for interconnecting the light engine 110 and the external connection terminal 160 120, and the lower surface of the wiring layer 120 may be made of polyimide that is transparent to the insulating layer.

It is possible to form the mirror, that is, the optical component 171, which changes the light path by forming a 45-degree reflection surface by etching the polyimide insulation layer opposed to the optical element 130 and forming a metal layer on the reflection surface .

A flat layer 178 of polyimide is formed below the wiring layer 120 and the reflective surface to serve as a spacer for bonding with the supporting substrate 170b, for example.

In this case, if the refractive index of the flat layer 178 is lower than the refractive index of the polyimide insulating layer on which the optical component 171 is formed, even if a metal layer is not formed on the reflecting surface, The light incident on the reflective surface is totally reflected at the 45-degree reflection surface due to the difference in the refractive index, so that the light path can be refracted at a right angle.

Further, a BGA (Ball Grid Array) 152a may be formed under the polyimide flat layer 178 for alignment between the optical element module 101a and the supporting substrate 170b. In this case, alignment between the optical element module 101a and the supporting substrate 170b may be performed by a self alignment method using a BGA (Ball Grid Array) 152a.

As described above, in the fifth embodiment, the optical component 171, which changes the light path, is integrally formed in the optical device module 101a, so that the alignment between the optical device 130 and the optical component 171 can be realized more accurately .

In the present invention, optical device module wafers and optical sub-assemblies (OSA) wafers accommodating optical fibers are aligned in a wafer level alignment (WLA) manner using a passive alignment technique, whereby the alignment between the optical devices and the mirrors and the alignment between the mirrors and the optical fibers Can be achieved without misalignment, thereby reducing optical loss and realizing a connector plug with a slim structure.

As a result, according to the present invention, there is provided a packaging method that can solve the problem of the alignment cost, which is the biggest barrier to the spread of the active optical cable (AOC), and the increase in manufacturing cost thereof, and which ensures superior performance over existing packaging methods.

Although the first connector plug connected to one end of the optical cable has been described in the above embodiment, the second connector plug connected to the other end of the optical cable may have the same configuration. However, in the case where a laser diode which generates an optical signal by the optical element of the light engine included in the first connector plug is used, the optical element of the light engine included in the second connector plug is a point that a photodiode There is a difference.

The connector plug of the present invention comprises a plurality of conductive strips that satisfy one of data transmission standards to interconnect the terminal and the terminal while forming an active optical cable (AOC), an external connection terminal 160 in the form of solder balls or metal bumps .

In addition, the external connection terminal 160 of the connector plug can be variously modified according to the standard of data transmission.

6A and 6B, when the connector plug 100 of the present invention is physically attached to and detached from the occlusion port 12 of the terminal 10 as shown in FIG. 1, when the external connection terminal 160 is formed by a plurality of conductive strips It can be applied when possible coupling is possible.

In the case where the external connection terminal 160 is formed in the form of a solder ball or a metal bump, a board-to-board interconnection between a PCB and a board (PCB) in one terminal, On-chip interconnection, a board-to-chip interconnection, or an on-board interconnection between a terminal main board and peripheral I / O devices. board interconnection).

In this case, the connector plug 100 is soldered and fixed to a conductive electrode pad formed on a board using a solder ball or a metal bump like a chip instead of being physically detachable to the occlusion port 12 Lt; / RTI >

As described above, omitting the physical occlusion port-connector plug coupling results in on-board interconnections without electrical I / O interfacing or optical interfacing.

As a result, when on-board interconnections are made, the signal path can be minimized to reduce signal degradation and jitter, improve signal integrity, reduce data errors due to parasitic components on the signal path, It is possible to reduce the overall board development work, thereby reducing the engineering cost.

15A and 15B are a plan view and a cross-sectional view respectively showing a seventh embodiment in which the connector plug of the present invention is made on-board interconnection to a board.

15A and 15B, the on-board interconnect structure in which the connector plug according to the seventh embodiment is directly mounted on the board includes an external connection terminal 160 of the connector plug 100 formed of a solder ball or a metal bump For example, a conductive electrode pad formed on a board 41 constituting a field programmable gate array (FPGA), a DSP, a controller, or the like.

That is, the external connection terminal 160 formed of the solder ball or the metal bump is matched to the conductive electrode pad formed on the board 41, and then the connector plug 100 and the board 41 are interconnected. In this case, the electrode pad of the board 41 to be coupled to the solder ball of the external connection terminal 160 may have a structure such as BGA (Ball Grid Arrays) or QFN (Quad Flat Non-leaded Package) .

The board 41 may be, for example, a printed circuit board (PCB) used to construct an FPGA or a complex programmable logic device (CPLD), and a plurality of integrated A circuit (IC) chip and an electronic component 42 can be mounted.

FPGAs are generally applied to functional systems in various fields such as a digital signal processor (DSP), an ASIC early version, a software defined radio, a speech recognition, a machine learning system, etc., and a board 41 is provided with one or two The connector plug 100 can be directly coupled and can directly connect these systems to other functional boards (systems) or terminals via optical cables 300a.

Furthermore, the connector plug 100 or the active optical cable (AOC) assembly having the external connection terminal 160 made of the solder ball or the metal bump can be used as a transponder having an electro- Integrated chip (IC) chips having a plurality of different functions in a system in package (SiP) form may be integrated into a single package or a connector plug 100 may be mounted in a SOC (System on Chip) , Can be embedded in a single chip, or can be packaged in the form of a system on board (SoB) or a package on package (PoP).

An integrated circuit (IC) chip or a functional device that can be packaged together in the form of a SiP, SoC, SoB or PoP may be a processor having a signal processing function, for example, a CPU (Central Processing Unit), an MPU ), A microcontroller unit (MCU), a digital signal processor (DSP), an integrated circuit chip (IC Chip) of an ISP (Image Signal Processor), and a plurality of integrated circuits (IC) Control unit, an autonomous vehicle, and an integrated circuit chip such as artificial intelligence (AI).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limited to the embodiments set forth herein. Various changes and modifications may be made by those skilled in the art.

The present invention can be applied to an active optical cable (AOC) used for data transmission between a board and a board, a UHDTV-class TV, and a peripheral device, because a large amount of data can be transmitted and received at an extremely high speed of several tens Giga to 100G or more.

One; Optical communication system 10,20:
11, 21: housing 12, 22:
Processor 30: Molding tape
31: molding frame 32: adhesive layer
41: board 42: electronic parts
33: Molding layer 100 to 100c, 200: Connector plug
101, 101a: optical device module 102: optical device module wafer
110, 210: light engine 120: wiring layer
121, 172b: Inner end 122:
123a, 123b: wiring pattern 124: optical lens
125: Winding motion 126: Extension projection
127a-127c: Guide protrusions 127d and 127e:
130: optical element 131, 141: connection pad
140: optical IC 150,151: conductive vertical vias
152: Solder ball 153: Via PCB
160 and 161: external connection terminals 170 to 170b:
171: Optical component 171a: Reflecting surface
172, 172d, 172e, 177: optical fiber seating groove 172a:
172b: inner end portion 172c: wall
173: inclined portion 173a: entrance
174: Cone type mirror 175: Spacer
176: Optical fiber cover 178: Flat layer
180: Strengthening layer 190: Optical sub-assembly (OSA)
190a: optical subassembly (OSA) wafer 300 to 304: optical fiber
301: optical fiber insertion channel 310: core
311: clad 312: coating layer

Claims (21)

A supporting substrate on one side of which an optical fiber mounting groove on which an optical fiber is mounted;
A light engine having a first surface and a second surface, the second surface being laminated to the support substrate and generating an optical signal or receiving an optical signal therein, wherein the optical engine has a light engine A divergent optical device module; And
And an optical component formed on a second surface of the optical element module to transmit an optical signal generated in the light engine or received by the light engine,
Wherein the optical device module is arranged on the supporting substrate such that an optical signal generated from a light engine of the optical device module is reflected or refracted by the optical component and received by a core of the optical fiber. The method according to claim 1,
Wherein the optical component is formed at a position where a first direction along the optical fiber mounting groove intersects with an optical signal direction from the light engine,
Wherein the optical component transfers an optical signal between the optical fiber and the optical engine. 3. The method of claim 2,
Wherein the optical component is a flat mirror or a cone-shaped mirror. The method according to claim 1,
Wherein the optical element module comprises:
A mold body having a first side and a second side;
An external connection terminal formed on the first surface of the mold body and electrically connected to the outside;
A light engine sealed by the mold body;
Conductive vertical vias formed through the mold body and electrically connected to the external connection terminals; And
And a wiring layer formed on the second surface of the mold body for interconnecting the conductive vertical vias and the light engine. 5. The method of claim 4,
Further comprising a reflecting surface formed integrally with the wiring layer between the light engine and the optical fiber for transmitting an optical signal generated by the light engine or received by the light engine. 5. The method of claim 4,
The wiring layer
A wiring pattern for interconnecting the conductive vertical vias and the light engine; And
And an insulating layer covering the wiring pattern. The method according to claim 6,
The insulating layer is transparent,
Further comprising a lens formed on a surface of the insulating layer facing the optical component to change a path of light generated from the light engine. 5. The method of claim 4,
And a guide protrusion pattern formed integrally with the wiring layer for aligning and bonding the optical element module with the support substrate. 3. The method of claim 2,
Wherein the optical component switches the light path at a right angle by total internal reflection using a difference in refractive index. The method according to claim 1,
Further comprising a ball grid array (BGA) for self-aligning the optical element module with the support substrate. The method according to claim 1,
Wherein the connector plug is applied to an on-board interconnection between the board and the board, between the chip and the chip, or between the board and the chip. 5. The method of claim 4,
Wherein the external connection terminal is made of one of a solder ball and a metal bump, and the connector plug is fixedly coupled to the board. The method according to claim 1,
Wherein the inner end of the optical fiber mounting groove is set so that the tip of the assembled optical fiber coincides with the end of the optical module. 6. The method of claim 5,
Wherein the reflecting surface is a reflecting mirror, and wherein the reflecting surface switches the light path to a right angle by total reflection using a difference in refractive index. An optical subassembly (OSA) in which an optical fiber mounting groove on which an optical fiber is mounted is formed on one side;
An optical device module having a light engine stacked on the optical subassembly and generating an optical signal or receiving an optical signal; And
And an optical component installed in the optical subassembly and transferring an optical signal between the optical fiber and the optical engine,
The optical device module
A mold body having a first side and a second side;
An external connection terminal formed on the first surface of the mold body and electrically connected to the outside;
A light engine that is sealed by the mold body and that generates optical signals or receives optical signals on the second surface;
Conductive vertical vias formed through the mold body and electrically connected to the external connection terminals; And
And a wiring layer formed on the second surface of the mold body for interconnecting the conductive vertical vias and the light engine. A connector plug having an optical fiber mounting groove; And
And at least one optical fiber coupled to the optical fiber mounting groove,
Wherein the connector plug is a connector plug according to any one of the preceding claims. 17. The method of claim 16,
The connector plug may be coupled to a board constituting any one of a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a digital signal processor (DSP)
An active optical cable (AOC) assembly in which a package is formed in the form of a System in Package (SiP), a System on Chip (SoC), a System on Board (SoB), or a Package on Package (PoP). Preparing an optical device module having an external connection terminal on a first surface and having a light engine for generating an optical signal or receiving an optical signal therein and for emitting an optical signal in a second surface direction;
Forming a reflective surface on a second surface of the optical element module to transmit a light signal generated in or received by the light engine;
Preparing a supporting substrate on which an optical fiber receiving groove on which an optical fiber is to be placed is formed;
Aligning the optical device module on the supporting substrate such that the optical signal generated from the optical engine of the optical device module is reflected or refracted on the reflecting surface and received by the core of the optical fiber; And
And joining the aligned support substrate and the optical device module. 19. The method of claim 18,
The step of preparing the optical device module
Attaching an optical element constituting at least one light engine to a molding tape on which an adhesive layer is formed on a molding frame and a via-PCB on which an optical integrated circuit and at least one conductive vertical via are formed;
Forming a molding layer on the molding tape with an epoxy mold compound (EMC) and planarizing the surface after curing;
Subjecting the upper surface of the cured mold to chemical mechanical polishing (CMP) so that the upper end of the conductive vertical via is exposed, and then separating the cured mold and the molding frame to obtain a mold body; And
And forming a wiring layer for inverting the obtained mold body and embedding a wiring pattern for electrically connecting the exposed optical element and the connection pad of the optical integrated circuit into the insulating layer. 19. The method of claim 18,
Wherein the step of forming the reflective surface comprises:
Forming a transparent insulating layer on a second surface of the optical element module;
Etching the insulating layer to form a reflective surface; And
And forming a metal layer on the reflective surface. 19. The method of claim 18,
Wherein the step of forming the reflective surface comprises:
Forming a transparent insulating layer on a second surface of the optical element module;
Etching the insulating layer to form a reflective surface at a point where light generated from the light engine is incident; And
And forming a flat layer on the second surface of the optical device module and the lower part of the reflection surface with a material having a lower refractive index than that of the insulating layer so that light incident on the reflection surface is totally reflected on the reflection surface Gt;

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