JP2012032733A - Optical module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a micro hole array including exact micro holes by a simple method, and to provide an optical module capable of performing optical connection with high reliability without performing an aligning work between the micro holes and optical devices and a method for manufacturing the optical module.SOLUTION: An optical module 1 performing optical transmission between an end portion of a multi-core optical fiber 2 constituted of N number of optical fibers 20 and a plurality of optical devices 11 such as VCSEL (Vertical Cavity Surface Emitting Laser) and PD (Photo Diode) includes an optical device module 12 with the plurality of optical devices 11 mounted thereon, a micro hole array 14 with a plurality of micro holes 13 punched therethrough and the optical fibers 20 having end portions inserted into the micro holes 13. Just insertion of the N optical fibers 20 into the micro holes 13 allows the optical fibers 20 to be positioned concentrically with the optical devices 11 of the optical device module 12 without adjustment of the optical fiber 20, thereby performing the efficient optical transmission.

Description

  The present invention relates to an optical module and a method for manufacturing the same, and in particular, alignment and optical coupling between a multi-core optical fiber and an optical device can be easily and reliably performed using a microhole array (MHA) having microholes. The present invention relates to a possible optical module and a method for manufacturing the same.

  In recent years, since digital devices need to process enormous amounts of data at high speed, transmission of data and the like has been performed by optical transmission using optical waveguides, optical fibers, or the like instead of metal transmission using metal wires. An example thereof is as shown in FIG. 13, and a plurality of cards (here, two cards 101 </ b> A and 101 </ b> B) are accommodated in a housing (not shown) of the electronic device 100, and multi-core light is used for data transmission. Fiber is used. The card 101A will be described. The card 101A is mounted on the printed circuit board 102 provided with a predetermined wiring pattern, a plurality of LSIs 103 mounted on the printed circuit board 102, and connected to the LSI 103. The plurality of multi-channel optical modules 104 and the plurality of optical connectors 106 attached to the frame 105 of the card 101A are configured. The card 10B is configured similarly.

  Each optical connector 106 of the card 101A and each multi-channel optical module 104 are connected by multi-fiber optical fibers 107A and 107B. Further, data transmission between the card 101A and the card 101B is performed by multi-fiber optical fibers 108A to 108D. Further, data transmission between the electronic device 100 and the other electronic device 200 is performed via the multi-core optical fibers 109A and 109B. The reason why the multi-fiber optical fibers 107A, 107B, 108A to 108D, 109A, and 109B are in one set is because they are divided into transmission (TX) and reception (RX).

  An SF (Sagged Fiber) optical connector 110 is attached to the side of the multi-fiber optical fibers 107A and 107B connected to the multi-channel optical module 104. Here, the SF optical connector is a connector that reliably connects the other optical fiber by making use of the buckling force of the optical fiber itself by bending a predetermined portion of the optical fiber. The use of the SF optical connector 110 is because the optical interface can be downsized, and the optical coupling efficiency with the optical fiber can be improved and the power consumption can be reduced.

  As shown in FIG. 14, the SF optical connector 110 generally includes a plug 111 formed by resin molding, and the end of the multi-fiber optical fiber 107 </ b> A (or 107 </ b> B) is held by the plug 111. . The multi-core optical fiber 107 </ b> A (107 </ b> B) is configured by integrating N multi-mode (MM) fibers 112, and the core 113 faces the end face of each MM fiber 112.

  On the other hand, the multi-channel optical module 104 that receives the plug 111 has a rectangular tube-shaped receptacle 114, and a VCSEL (Vertical Cavity Surface Emitting Laser) or PD (Photo Diode) is provided at the bottom thereof. An optical device module 116 on which a plurality of optical devices 115 such as diodes) are mounted is disposed. On top of the optical device module 116, a board 117 having two layers (a liquid crystal polymer substrate on the optical device module 116 side and a glass thin plate on the microhole array 119 side to be described later) held by the receptacle 114 is mounted on the board 117. A microhole array 119 having N microholes 118 having an inner diameter into which the N cores 113 of the MM fiber 112 can be inserted is disposed. Then, the cores 113 of the plurality of optical fibers 112 constituting the multi-core optical fiber 107A are arranged so as to face the optical devices 115 of the optical device module 116 by inserting into the micro holes 118 of the micro hole array 119. Is done.

  In order to attach the SF optical connector 110 to the multi-channel optical module 104, first, the multi-core optical fiber 107A attached to the plug 111 of the SF optical connector 110 is replaced with the plug 111 as shown in FIG. As shown in FIG. 14B, the N cores 113 of the multi-fiber optical fiber 107A are inserted into the N microholes 118 by being inserted into the Nth microhole 118, and the microhole 118 is further lowered. To the inserted state. In this state, if the optical device 115 is a VCSEL, the electrical signal transmitted from the LSI 103 to the multi-channel optical module 104 is converted into an optical signal by the VCSEL, and this optical signal is sent to the core 113 and sent through the optical fiber 112. Is transmitted through. If the optical device 115 is a PD, an optical signal transmitted via the optical fiber 112 is sent from the core 113 to the PD, and converted from an optical signal to an electrical signal by the PD. To the LSI 103.

  A specific example of the configuration of the SF optical connector described above is disclosed in Non-Patent Document 1, for example.

Nippon Telegraph and Telephone Corporation, NTT Photonics Laboratories "Optical Module Technology and Optical Connector Technology-3" 2009

  However, in the above-described conventional optical module, a microhole array provided with microholes for inserting a plurality of optical fibers constituting a multicore optical fiber is used as an array of optical devices such as a VCSEL or a PD or a multicore light. It is necessary to perforate so as to match the arrangement of a plurality of optical fibers constituting the fiber. In order to directly process this with a drill or the like, extremely precise processing work is required, and alignment work between the optical device and the optical fiber is also required.

  Therefore, the present invention has been made in view of such a problem, and a microhole array having an accurate microhole can be manufactured by a simple method, and alignment work between the microhole and the optical device is performed. It is an object of the present invention to provide an optical module and a method of manufacturing the same that enable optical connection with high reliability.

  In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that one end of each of a plurality of optical fibers constituting a multi-core optical fiber is held and optically connected to each of the plurality of optical fibers. In an optical module that performs optical transmission between a plurality of optical devices, the optical device mounted on the substrate is covered with a photocurable resin, and light is selectively emitted to the photocurable resin. A microhole array having a plurality of long hole-shaped microholes reaching the device is provided, and each of the plurality of optical fibers is inserted into the plurality of long hole-shaped microholes. It is characterized by enabling optical transmission to and from the device.

  In order to solve the above-mentioned problem, the present invention according to claim 2 is the optical module according to claim 1, wherein the plurality of long hole-shaped microholes are formed on the insertion-side openings into which the optical fibers are inserted. It is characterized by being formed in a tapered shape that becomes narrower as the size approaches the optical device side.

  In order to solve the above problems, the present invention according to claim 3 is provided with a plurality of long hole-shaped microholes, and one end of each of the plurality of optical fibers constituting a multi-core optical fiber in the long hole-shaped microholes. And one or more optical devices optically connected to the end face of the optical fiber held by the microhole array, and transmits light between the plurality of optical fibers and the optical device. In an optical module manufacturing method to be performed, a step of placing a mold so as to surround an optical device mounted on a substrate, a step of filling a photocurable resin in the mold, and a filling in the mold A photomask having a light-shielding pattern that matches the shape and arrangement of the ends of a plurality of optical fibers is placed on the photocurable resin, and light is irradiated to the photocurable resin. Therefore, the step of curing the portion irradiated with light and forming the microhole array as a plurality of long hole-shaped microholes into which the plurality of optical fibers can be inserted into the portion not irradiated with light is configured. It is characterized by that.

  In order to solve the above-mentioned problem, the present invention according to claim 4 is the method of manufacturing an optical module according to claim 3, wherein a plurality of long hole-shaped micros into which a plurality of optical fibers can be inserted without being irradiated with light. It is characterized by further comprising a step of inserting the end portions of the plurality of optical fibers without removing the photo-curing resin in the hole portion.

  In order to solve the above-mentioned problem, the present invention according to claim 5 is the module manufacturing method according to any one of claims 3 and 4, wherein the intensity of the irradiated light and / or the time of the irradiated light is determined. By adjusting, a long hole-shaped microhole is formed into a tapered shape that becomes narrower as the size of the opening on the insertion side into which each optical fiber is inserted becomes closer to the optical device side. To do.

  The optical module according to the present invention enables optical connection with high reliability without performing alignment work between a microhole and an optical device such as a VCSEL or a PD. There is an effect that an improvement in optical coupling efficiency and a reduction in power consumption can be easily achieved.

  According to the optical module manufacturing method of the present invention, it is possible to manufacture a precise microhole array without requiring alignment by a very simple method without performing precise drilling with a drill or the like, and with reliable performance. It is possible to provide an optical module that enables high optical connection.

1 is a front view showing a preferred embodiment of an optical module according to the present invention. It is process drawing which shows the 1st manufacturing method of the optical module which concerns on this invention. FIG. 3 is a process diagram showing a process that follows the process shown in FIG. 2. It is process drawing which shows the 2nd manufacturing method of the optical module which concerns on this invention. It is a figure which shows the manufacturing method by another light-shielding pattern. It is a figure which shows the manufacturing method by another light-shielding pattern. It is a top view which shows the photomask when not using a mold type | mold. It is a graph which shows the diffraction of light. It is a figure which shows the wraparound of light. It is a graph which shows the relationship between the intensity | strength of light, and the angle of a taper. It is a perspective view which shows the optical module provided in the side edge part of the board | substrate. It is a cross-sectional view of the optical module shown in FIG. It is a figure which shows the structural example of the electronic device using the optical interface of electrical-optical conversion and optical-electrical conversion for data transmission. It is sectional drawing which shows the structure of the multichannel optical module shown in FIG. 13, and SF optical connector connected to this.

[Configuration of optical module]
Hereinafter, an optical module according to the present invention will be described in detail based on a preferred embodiment. FIG. 1 is a cross-sectional view showing an embodiment of an optical module according to the present invention. The illustrated optical module 1 is disposed, for example, at a site that performs electrical-optical conversion and optical-electrical conversion accompanying data transmission between an LSI mounted on a board of an electronic device and another board or another device. The optical module 1 generally includes an insulating substrate 10 on which a predetermined wiring pattern is formed, a plurality of VCSELs (Vertical Cavity Surface Emitting Lasers), PDs (Photo Diodes), and the like. The optical device module 12 mounted at a predetermined position on the insulating substrate 10 and a plurality of long hole-shaped microholes 13 are formed, and a recess 15 provided in the lower portion is formed. A resin microhole array 14 is provided on the insulating substrate 10 so as to accommodate the optical device module 12. The “microhole” is a long hole having a small diameter into which the optical fiber is inserted, and the “microhole array” is a structure in which a plurality of microholes are arranged.

  In addition to the optical device 11 described above, various electronic components and boards for various electronic devices on which LSIs are mounted are mounted on the insulating substrate 10. The insulating substrate 10 includes a printed wiring pattern (not shown) for electrical connection with the optical device 11 and various electronic components and electronic equipment boards.

  The microhole array 14 disposed on the insulating substrate 10 so as to accommodate the optical device 11 is formed by using a photocurable resin, for example, an ultraviolet curable resin that is cured by ultraviolet rays. A plurality of microholes 13 are formed in the array 14 by a method described later. Each of the plurality of microholes 13 includes a plurality of MM fibers 20 of the multi-core optical fiber 2 whose ends are fixed to the plug 3. A predetermined length (for example, 1 mm) is inserted from each end face. The end face of the plug 3 (the bottom face of the plug 3 in FIG. 1) functions as a stopper by contacting the microhole array 14. In addition, the plurality of elongated microholes 13 are formed in a tapered shape that gradually becomes narrower as the size of the opening on the insertion side into which the plurality of MM fibers 20 are respectively inserted approaches the optical device 11 side. . Accordingly, each of the plurality of MM fibers 20 can be easily inserted into the microhole 13 and can be reliably optically connected to each of the optical devices 11.

  Each MM fiber 20 inserted into the microhole 13 of the microhole array 14 includes a core 21 and a cladding 22, whereby an optical signal generated by light emission of the VCSEL of the optical device module 12 is transmitted by the MM fiber 20. On the other hand, the optical signal sent from the MM fiber 20 enters the PD of the optical device module 12 and is converted into an electrical signal.

[Optical Module Manufacturing Method (1)]
Next, the first manufacturing method of the above-described optical module 1 will be described. 2A to 2E are process diagrams showing a first method for manufacturing an optical module according to the present invention, and FIG. 3 is a diagram showing a process following the process shown in FIG. First, as shown in FIG. 2A, an optical device module 12 mounted with a plurality of optical devices 11 mounted on an insulating substrate 10 is compared with a microhole array 14 as shown in FIG. A mold 30 for forming the outer shape is disposed on the insulating substrate 10 so as to surround the optical device module 12. Next, as shown in FIG. 2C, a photocurable resin 31 that is cured by irradiating light into the mold 30 is poured. Although it does not specifically limit about the photocurable resin 31 to be used, The ultraviolet curable resin hardened | cured by irradiating an ultraviolet-ray can be used simply. Next, as shown in FIG. 2D, the photomask 32 is disposed on the upper surface of the photocurable resin 31. The photomask 32 has a light-shielding pattern with a light-shielding area having a space and a size that match the arrangement of the plurality of optical devices 11, that is, the arrangement of the plurality of MM fibers 20 corresponding thereto. Specifically, a portion corresponding to a light shielding region that does not transmit light becomes the microhole 13, and a portion that is cured by being irradiated with light becomes the main body of the microhole array 14. Then, as shown in FIG. 2 (e), light for curing the photocurable resin 31, for example, ultraviolet light (UV) in the case of ultraviolet curable resin, is applied for a predetermined time from above to below the photomask 32. Irradiated. Note that it has already been demonstrated in the manufacturing process of conventional electronic devices such as LSIs that extremely high accuracy can be achieved in alignment with the optical device 11 using the photomask 32.

  When the photocurable resin 31 is irradiated with light for a predetermined time and cured, as shown in FIG. 3F, the photomask 32 disposed on the photocurable resin 31 is removed and the mold 30 is removed. Further, the non-irradiation portion 33 that is a portion that is not irradiated with light by the light-shielding portion of the photomask 32 is removed by cleaning or extracted using a dedicated jig or the like, thereby forming a plurality of microholes 13. Thereby, the microhole array 14 as shown in FIG. 3G is completed. Here, since the light shielding pattern of the photomask 32 is provided only at the position corresponding to the microhole 13, the outer periphery of the main body of the microhole array 14 is formed along the inner wall of the mold 30. FIG. As shown in FIG. 5, the outer periphery of the main body of the microhole array 14 can be formed into an arbitrary shape by further providing light shielding patterns 35 and 35 having an appropriate width inward from the position of the inner wall of the mold 30. Is possible. Further, as shown in FIG. 6, the microhole array 14 may be formed by arranging the photomask 32 and the light shielding patterns 35, 35 using the viscosity of the photocurable resin 31 without using the mold 30. Is possible. In the case of the method shown in FIG. 6, a photomask 32 as shown in FIG. 7 is used. That is, the illustrated photomask 32 is provided with a rectangular transparent portion 37 at the center of a flat plate such as transparent glass or acrylic resin, and the other portions are shielded from light. Circular light shielding portions 38 are provided in a row at intervals. In this case, since it is necessary to keep an appropriate distance between the insulating substrate 10 and the photomask 32 and the light shielding patterns 35 and 35, it is preferable to provide a spacer (not shown).

  Next, as shown in FIG. 3G, the multi-core optical fiber 2 mounted on the plug 3 is made to face the completed microhole array 14, and as shown in FIG. The optical module 1 shown in FIG. 1 is completed by attaching the tips (core 21 + cladding 22) of the plurality of MM fibers 20 so as to be inserted into the respective microholes 13 of the microhole array 14. At this time, the tip surface of the plug 3 works as a stopper and comes into contact with the microhole array 14.

Here, when the irradiation light intensity of the irradiation light is increased, the irradiation light from the bright part around the light-shielding pattern has a property of turning inward from the diameter of the circular opening of the photomask 32, and this is utilized. Accordingly, the tapered microhole 13 whose diameter is gradually narrowed toward the lower side (optical device module 12 side) can be formed. FIG. 8 shows the measurement result of the light intensity distribution when the photomask 32 is irradiated with ultraviolet light. The vertical axis represents the distance (mm) from the center of the circular light shielding portion 38 (see FIG. 7) of the photomask 32, and the horizontal axis represents the distance (μm) from the photomask 32. The parts A to D indicate the light intensity. The area A has a high light intensity, and the light intensity decreases in the order of B, C, and D below. Then, it can be seen that, at a location where the distance from the photomask 32 is about 200 μm or more, the ultraviolet light wraps around the light shielding portion 38 due to light diffraction. From this, the following can be understood.
(1) When the light irradiation intensity is increased or the irradiation time is lengthened, the light wraps around the light shielding portion 38 of the photomask 32 to cure the photocurable resin 31 below the photomask 32. Accordingly, a cured pattern that spreads toward the bottom is formed. That is, when this is seen in a portion where light is not irradiated (corresponding to the microhole 13), a tapered long hole with a tapered shape is formed (see FIG. 9).
(2) On the other hand, if the light irradiation intensity is weakened or the irradiation time is shortened, the influence of light wraparound in the photomask 32 is reduced, so that a linear or divergent taper-shaped cured portion is formed. It will be. If this is seen in a portion where light is not irradiated (corresponding to the microhole 13), a taper-shaped elongated hole that is widened forward is formed.

FIG. 10 shows a change in angle with respect to the angle θ in FIG. 9 when the light irradiation intensity is changed. FIG. 10 is a graph of the angle θ when the irradiation time is fixed at 5 seconds and the light irradiation intensity is changed to 0.18, 0.34, 0.54 W / cm ² . It was confirmed that as the irradiation intensity was increased, the angle θ was gradually increased to 0.4 °, 1.4 °, and 1.6 °, respectively. In this way, if the microhole 13 is formed in a tapered shape in which the diameter on the insertion side of the MM fiber 20 is large and the diameter gradually decreases toward the optical device 11, each MM fiber 20 has each microhole in the microhole array 14. The hole 13 can be inserted more smoothly, and therefore the alignment of the MM fiber 20 is facilitated.

[Optical Module Manufacturing Method (2)]
Next, the second manufacturing method of the optical module 1 described above will be described. 4A to 4C are process diagrams illustrating a second method for manufacturing an optical module according to the present invention. 2A to 2E are common in this manufacturing method, the illustration of the portion is omitted in FIG. 4 and the description thereof is omitted. First, after completing the steps shown in FIGS. 2A to 2E, the photomask 32 and the mold 30 are removed from the photocurable resin 31 as shown in FIG. In the second manufacturing method, the process of removing the uncured photocurable resin 31 in the non-irradiation part 33 is not performed. Therefore, in the microhole array 14, the photo-curing resin 31 of the non-irradiation part 33 remains without being cured. Then, as shown in FIG. 4B, the plug 3 provided with the multi-core optical fiber 2 is opposed to the microhole array 14. At this time, each MM fiber 20 faces each non-irradiated portion 33 where the uncured photocurable resin 31 is left. Then, the end portion of the multi-core optical fiber 2 is brought close to the microhole array 14 and the corresponding MM fiber 20 is inserted into the non-irradiated portion 33 where the uncured photocurable resin 31 remains. Since the photocurable resin 31 in the non-irradiation part 33 is uncured, the photocurable resin 31 in the non-irradiation part 33 is partially pushed out of the microhole array 14 by insertion of the MM fiber 20, but remains. By curing the photo-curing resin 31, the MM fiber 20 can be attached in a state where it is fixed so as not to be detachable as shown in FIG. Thereby, the optical module 1 shown in FIG. 1 is completed.

[Optical Module Manufacturing Method (3)]
Next, a third manufacturing method of the above-described optical module 1 will be described. FIG. 10 is a view showing a state in which the method for manufacturing an optical module according to the present invention is connected to an optical wiring disposed in an insulating substrate, and FIG. 11 is a cross-sectional view thereof. Using the first manufacturing method or the second manufacturing method of the optical module 1 described above, the optical module 1 can be used as a connector when connecting to the optical wirings 40, 40 disposed in the insulating substrate 10. That is, in recent years, data transmission has been performed by optical transmission using an optical wiring such as an optical waveguide or an optical fiber instead of metal transmission using a metal wire. In this case, an electro-optical mixing substrate in which an optical waveguide or an optical fiber is embedded inside the insulating substrate 10 is used, but the connection end of the optical wiring such as the optical waveguide or the optical fiber may be provided on the edge surface of the insulating substrate 10. Many. In FIG. 10, the connection end 41 of the optical wiring 40 is provided on the side edge end surface of the insulating substrate 10, and the first manufacturing method or the second manufacturing method of the optical module 1 described above is used for this connection end 41. Thus, the microhole array 14 is formed. Since the manufacturing process is as described above, a detailed description is omitted. As the mold 30, a mold provided with a frame body having a recess capable of accommodating the side edge of the insulating substrate 10 inside can be used.

[Effect of the embodiment]
As described above, according to the optical module of the present invention, since it can function as an SF optical connector, the optical fiber can be reduced by downsizing the optical module, improving the optical coupling efficiency with the optical fiber, and improving the optical coupling efficiency. Since positioning is possible, there is an effect that power consumption can be reduced.

  According to the manufacturing method of the optical module according to the present embodiment, the photocurable resin 31 is poured directly onto the optical device module 12 mounted on the insulating substrate 10 and only a predetermined portion is selectively cured using the photomask 32. By forming a microhole array 14 having a plurality of microholes 13, inserting the MM fiber 20 of the multi-core optical fiber 2 into the formed microholes 13, and performing optical coupling with the optical device module 12. There is an effect that alignment processing of the multi-fiber optical fiber 2 with respect to the optical device module 12 can be made unnecessary although it is a simple configuration.

  Furthermore, according to the manufacturing method of the optical module according to the present embodiment, the microhole array having the plurality of microholes 13 by selectively curing the ultraviolet curable resin 31 on the optical device module 12 mounted on the insulating substrate 10. 14 is formed, and the optical fiber can be positioned by the microhole 13, so that it is possible to provide a highly reliable and simple manufacturing method that eliminates the need for drilling or the like and eliminates the need for terminal processing and alignment processing. effective.

  In each of the above-described embodiments, instead of the optical device 11 and the optical device module 12, a multi-core optical fiber having the same configuration as that of the multi-core optical fiber 2 can be used. Further, instead of the optical device 11 and the optical device module 12, for example, a 45 ° reflection mirror, a prism, a lens, or the like can be provided.

  As described above, the preferred embodiment has been described. However, in the optical module and the manufacturing method thereof according to the present invention, other than the connection of the optical fiber to the optical device module, for example, the photoelectric conversion between the cards and between the devices, It can be used for optical interfaces such as optical conversion and connection between optical fibers.

DESCRIPTION OF SYMBOLS 1 Optical module 2 Multi-fiber optical fiber 3 Plug 10 Insulating substrate 11 Optical device 12 Optical device module 13 Micro hole 14 Micro hole array 15 Recess 20 MM fiber 21 Core 22 Clad 30 Mold type 31 UV curable resin 32 Photomask 33 Non-irradiation 40 Optical wiring 41 Connection end

Claims (5)

In an optical module that holds one end of each of a plurality of optical fibers constituting a multi-core optical fiber and performs optical transmission between one or more optical devices optically connected to each of the plurality of optical fibers. ,
A plurality of elongated microholes having a length reaching the optical device by covering the optical device mounted on the substrate with a photocurable resin and selectively irradiating the photocurable resin with light. The optical hole can be transmitted between the plurality of optical fibers and the optical device by inserting each of the plurality of optical fibers into the plurality of elongated microholes. An optical module characterized by that. The optical module according to claim 1,
The plurality of long-hole-shaped microholes are formed in a tapered shape in which the size of the opening on the insertion side into which each optical fiber is inserted becomes narrower as it approaches the optical device side. An optical module characterized by A microhole array having a plurality of long hole-shaped microholes, each holding one end of a plurality of optical fibers constituting a multi-core optical fiber in the long hole-shaped microholes, and held in the microhole array In an optical module manufacturing method comprising one or a plurality of optical devices optically connected to an end face of the optical fiber, and performing optical transmission between the plurality of optical fibers and the optical device,
Arranging a mold so as to surround the optical device mounted on a substrate;
Filling the mold with a photocurable resin;
A photomask having a light-shielding pattern that matches the shape and arrangement of the end portions of the plurality of optical fibers is disposed on the photocurable resin filled in the mold, and light is applied to the photocurable resin. The portion irradiated with the light is cured, and the portion not irradiated with the light is used as the plurality of elongated microholes into which the plurality of optical fibers can be inserted. Forming, and
A method for manufacturing an optical module, comprising: In the manufacturing method of the optical module of Claim 3,
The ends of the plurality of optical fibers are inserted without removing the photocurable resin in the plurality of elongated microholes into which the plurality of optical fibers can be inserted without being irradiated with the light. An optical module manufacturing method characterized by further comprising a step. In the manufacturing method of the module of any one of Claim 3 or 4,
By adjusting the intensity of the light to be irradiated and / or the time of the light to be irradiated, the size of the opening on the insertion side into which each of the optical fibers is inserted into the long hole-shaped microhole is closer to the optical device side. A method of manufacturing an optical module, wherein the taper is tapered so as to become narrower.

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