JP2002033422A - 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 - Google Patents

熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Info

Publication number
JP2002033422A
JP2002033422A JP2000214512A JP2000214512A JP2002033422A JP 2002033422 A JP2002033422 A JP 2002033422A JP 2000214512 A JP2000214512 A JP 2000214512A JP 2000214512 A JP2000214512 A JP 2000214512A JP 2002033422 A JP2002033422 A JP 2002033422A
Authority
JP
Japan
Prior art keywords
heat
conductive sheet
heat conductive
reinforcing
cooling means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000214512A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002033422A5 (enExample
Inventor
Nobuto Fujiwara
伸人 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000214512A priority Critical patent/JP2002033422A/ja
Publication of JP2002033422A publication Critical patent/JP2002033422A/ja
Publication of JP2002033422A5 publication Critical patent/JP2002033422A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2000214512A 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 Pending JP2002033422A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000214512A JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000214512A JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Publications (2)

Publication Number Publication Date
JP2002033422A true JP2002033422A (ja) 2002-01-31
JP2002033422A5 JP2002033422A5 (enExample) 2007-08-16

Family

ID=18710079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000214512A Pending JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Country Status (1)

Country Link
JP (1) JP2002033422A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740251B2 (en) 2015-03-26 2017-08-22 Nec Corporation Cooling device and device
US9870973B2 (en) 2015-03-26 2018-01-16 Nec Corporation Cooling device and device
US10607917B2 (en) 2018-05-24 2020-03-31 Fujitsu Limited Substrate
JPWO2022054929A1 (enExample) * 2020-09-14 2022-03-17
WO2025047375A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置および半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740251B2 (en) 2015-03-26 2017-08-22 Nec Corporation Cooling device and device
US9870973B2 (en) 2015-03-26 2018-01-16 Nec Corporation Cooling device and device
US10607917B2 (en) 2018-05-24 2020-03-31 Fujitsu Limited Substrate
JPWO2022054929A1 (enExample) * 2020-09-14 2022-03-17
WO2025047375A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置および半導体装置の製造方法

Similar Documents

Publication Publication Date Title
US5581443A (en) Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5784256A (en) Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US20110128706A1 (en) Electronic apparatus
JP5096010B2 (ja) 熱拡散シート及び熱拡散シートの位置決め方法
TW510986B (en) Cooling unit for cooling circuit component generating heat and electronic apparatus comprising the cooling unit
KR100669754B1 (ko) 디스플레이 패널의 방열 구조 및 이를 구비한 디스플레이모듈
JPH0955459A (ja) 半導体装置
JPH10242354A (ja) 熱伝導部材およびそれを用いた電子装置
CN116056409B (zh) 一种主板的屏蔽散热结构及电子设备
JPH09102688A (ja) 電子パッケージの実装構造およびそれを用いたノートブック型コンピュータ
JPH10303582A (ja) 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
CN111171746A (zh) 防静电散热胶带及其制备方法和显示装置及其制备方法
JP2001326492A (ja) 熱および電磁ノイズ兼用対策部品、および電子機器
JPH10150283A (ja) 印刷配線基板の放熱構造
JP2002033422A (ja) 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器
JP2014123645A (ja) 電子機器
KR101838738B1 (ko) 금속 박막층을 포함하는 방열 시트
JPH04368155A (ja) 半導体装置および電子装置
TW200400493A (en) Storage device comprising circuit board on which heat-generating circuit component is mounted, and electronic apparatus
JP2004200586A (ja) 冷却装置および冷却装置を有する電子機器
JP3119569B2 (ja) 発熱素子の放熱構造
JP2001102501A (ja) 回路モジュールおよびこの回路モジュールを搭載した電子機器
JPH0887348A (ja) 携帯形電子機器
CN117479771A (zh) 显示模组和显示装置
JP4730180B2 (ja) 冷却装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070628

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070628

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090731

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090804

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091201