JP2002033344A - 半導体の樹脂封止及びその製造装置 - Google Patents

半導体の樹脂封止及びその製造装置

Info

Publication number
JP2002033344A
JP2002033344A JP2000218369A JP2000218369A JP2002033344A JP 2002033344 A JP2002033344 A JP 2002033344A JP 2000218369 A JP2000218369 A JP 2000218369A JP 2000218369 A JP2000218369 A JP 2000218369A JP 2002033344 A JP2002033344 A JP 2002033344A
Authority
JP
Japan
Prior art keywords
resin
curing
coated
semiconductor
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000218369A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002033344A5 (enExample
Inventor
Yasumasa Morita
康正 森田
Kimihiro Iritono
公浩 入戸野
Susumu Kiyokawa
清川　　晋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Misato Co Ltd
Original Assignee
Stanley Electric Co Ltd
Misato Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd, Misato Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2000218369A priority Critical patent/JP2002033344A/ja
Publication of JP2002033344A publication Critical patent/JP2002033344A/ja
Publication of JP2002033344A5 publication Critical patent/JP2002033344A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2000218369A 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置 Pending JP2002033344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000218369A JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000218369A JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Publications (2)

Publication Number Publication Date
JP2002033344A true JP2002033344A (ja) 2002-01-31
JP2002033344A5 JP2002033344A5 (enExample) 2007-09-06

Family

ID=18713331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000218369A Pending JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Country Status (1)

Country Link
JP (1) JP2002033344A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535001A (ja) * 2018-08-24 2021-12-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドPPG Industries Ohio, Inc. 成形されたポリマー物品を調製するための方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535001A (ja) * 2018-08-24 2021-12-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドPPG Industries Ohio, Inc. 成形されたポリマー物品を調製するための方法

Similar Documents

Publication Publication Date Title
US7815988B2 (en) Joining element and method for its attachment on a surface
US9093622B2 (en) Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module
JP2010153803A (ja) 電子部品実装モジュール及び電気機器
TWI528610B (zh) Oled封裝加熱裝置及工藝方法
TWI705541B (zh) 複合式感測裝置封裝結構及封裝方法
WO2011160521A1 (zh) 发光二极管封装结构及其制作方法
TW200910648A (en) Forming process of resin lens of an LED component
TWI672750B (zh) 翹曲減少裝置與方法
US10261420B2 (en) UV mask device and method for using the same
KR100491868B1 (ko) 실리콘 고무의 경화방법 및 경화장치
JP2002033344A (ja) 半導体の樹脂封止及びその製造装置
CN112467010B (zh) 二极管封装工艺及封装二极管
KR100509972B1 (ko) Ｍｉｌｌａｂｌｅ 실리콘 고무 발포체 방열시트 및 그제조방법
EP0106564A1 (en) A manufacturing method for a printed wiring substrate and a heater therefor
JP2012146834A (ja) 発光装置及び照明装置
JP2009246040A (ja) レーザ光源装置
KR20200076251A (ko) 레이저를 이용한 전자소자 접합장치
JP2001198926A (ja) 熱硬化性樹脂の硬化促進方法及びその装置
TWI668772B (zh) 於一埋置式固化區固化一熱可固化之材料的技術
JP2009119761A (ja) Ｌｅｄアッセンブリの光透過樹脂レンズの成型方法
CN222571650U (zh) 固化箱
KR102289362B1 (ko) 방열코팅용 조성물, 방열코팅용 도료 및 방열시트
JP2013239560A (ja) 半導体装置の製造方法
JP5128429B2 (ja) 赤外線照射部材及び赤外線透過ブロックを用いた圧縮成形装置及び圧縮成形方法
KR102092649B1 (ko) 방열 및 방사 기능이 구비된 전자 기기 패키징 장치 제조방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070718

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070718

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100112

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100608