TWI705541B - 複合式感測裝置封裝結構及封裝方法 - Google Patents

複合式感測裝置封裝結構及封裝方法 Download PDF

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TWI705541B
TWI705541B TW108125086A TW108125086A TWI705541B TW I705541 B TWI705541 B TW I705541B TW 108125086 A TW108125086 A TW 108125086A TW 108125086 A TW108125086 A TW 108125086A TW I705541 B TWI705541 B TW I705541B
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鄒文傑
張夷華
陳志維
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昇佳電子股份有限公司
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Abstract

一種複合式感測裝置封裝結構，包括一發光元件，密封於一第一透明模塑物質中；一感光元件，密封於一第二透明模塑物質中；一基板，其上設置有該發光元件、該感光元件、該第一透明模塑物質和該第二透明模塑物質；以及一不透明遮擋元件，設置於該基板上以及該第一透明模塑物質與該第二透明模塑物質之間，其中該不透明遮擋元件是由室溫為液態的不透明膠材經一固化處理所形成。

Description

複合式感測裝置封裝結構及封裝方法
本發明係指一種封裝結構及封裝方法，尤指一種複合式感測裝置封裝結構及封裝方法。
近距離感測器(proximity sensor)及環境光線感測器(ambient light sensor，ALS)廣泛應用於行動電話等攜帶式行動裝置或其它消費性電子裝置內。 近距離感測器和環境光線感測器都需使用感光元件，而且近距離感測器一般還需要使用發光元件(例如紅外線發射器)。
為了避免發光元件產生的光線干擾感光元件，傳統方式會讓感光元件與發光元件之間維持一段距離，以避免串音干擾(crosstalk)。然而，此方式會占據電子裝置較大的空間，也會損耗較多的能量(例如，訊號傳遞的距離越長，所消耗的能量越大)。在空間有限的情況下，避免串音干擾的方式是在發光元件和感光元件之間設置遮擋元件，一般是在晶片封裝製程中加入遮擋元件。
現有的一種封裝方式是使用金屬蓋體或塑料蓋體作為遮擋元件，然而，金屬蓋體與塑料蓋體需使用訂製模具來射出成型，但隨著電路面積以及感測器尺寸的縮減，遮擋元件的結構也會一併微型化。礙於模具成型能力的限制， 透過射出成型等方式製作微型化的遮擋元件結構的難度會大幅提升，而且微型化的金屬蓋體與塑料蓋體並不易固定於封裝結構，也容易發生掉落。
現有的另一種封裝方式是採用雙料射出成型(Double injection molding)技術，於發光元件和感光元件之間形成不透明模塑物質(例如，樹酯)來作為遮擋元件。第1圖為近距離感測器及環境光線感測器的封裝結構1示意圖。基板10上設置有發光元件11和感光元件13。在第一次射出成型時，將液態透明樹酯注入模具，待凝固後形成透明模塑物質16、17，其中透明模塑物質16、17之間形成有塑形空間。在第二次射出成型時，先將不透明樹酯膠錠加熱到液態狀態下，對液態膠錠施予壓力擠入透明模塑物質16、17之間，藉此填充塑形空間來塑型不透明模塑物質18。然而，不透明膠錠需在高溫環境下(例如攝氏140度)才能轉為液態狀，但在高溫下會造成透明模塑物質16、17超過玻璃轉化溫度(Glass transition temperature，一般稱為Tg點，例如攝氏120度)而軟化。在此情況下，當施予壓力將液態膠錠擠入塑形空間時，會造成透明模塑物質16、17變形，再加上軟化的透明模塑物質16、17無法給予足夠的支撐力，導致不透明模塑物質18和透明模塑物質16、17難以確實結合形成預定的結構。實務上更發現，在冷卻凝固後，不透明模塑物質18和透明模塑物質16、17因熱漲冷縮所致的形變，容易使不透明模塑物質18的側表面18R、18L和透明模塑物質16、17的側表面之間存有縫隙而無法結合。
基於上述缺失，實有必要提供一種近距離感測器和環境光線感測器的封裝結構與製程來達到阻斷串音干擾並使整體微型化的目的，以更符合實際應用的需求。
因此，本發明的主要目的即在於提供一種複合式感測裝置封裝結構及封裝方法，尤指一種將由室溫為液態的不透明膠材經固化處理而形成不透明遮擋元件的複合式感測裝置封裝結構及封裝方法。
本發明揭露一種複合式感測裝置封裝結構，包括一發光元件，密封於一第一透明模塑物質中；一感光元件，密封於一第二透明模塑物質中；一基板，其上設置有該發光元件、該感光元件、該第一透明模塑物質和該第二透明模塑物質；以及一不透明遮擋元件，設置於該基板上以及該第一透明模塑物質與該第二透明模塑物質之間；其中該不透明遮擋元件是由室溫為液態的不透明膠材經一固化處理所形成。
本發明另揭露一種複合式感測裝置封裝流程，包含於一基板上設置一發光元件和一感光元件；將該發光元件密封於一第一透明模塑物質中，並將感光元件密封於一第二透明模塑物質中；於該第一透明模塑物質和該第二透明模塑物質之間形成一塑形空間；以及將液態不透明膠材滴入塑形空間，對該液態不透明膠材進行一固化處理，以形成一遮擋元件。
1、2、3:複合式感測裝置封裝結構
10、20、30:基板
11、21、31:發光元件
22、24、32、34:導線
13、23、33:感光元件
25、35:模具
250、350:塑形空間
16、17、26、27、39、391、392:透明模塑物質
18:不透明模塑物質
38:液態不透明膠材
280、380:遮擋元件
28U:上表面
28R:右側表面
28L:左側表面
28D:下表面
X、Y、Z:方向
4:封裝流程
41、42、43、44:步驟
第1圖為近距離感測器及環境光線感測器的封裝結構示意圖。
第2A圖到第2D圖為本發明實施例一複合式感測裝置封裝結構的封裝流程示意圖。
第3A圖到第3D圖為本發明實施例一複合式感測裝置封裝結構的封裝流程示 意圖。
第4圖為本發明實施例一封裝流程的流程圖。
第2A圖到第2D圖為本發明實施例一複合式(Complex)感測裝置封裝結構2的封裝流程示意圖。複合式感測裝置封裝結構2包含一基板20、一發光元件21、導線22、24和一感光元件23。
如第2A圖所示，發光元件21和感光元件23設置於基板20上，其中發光元件21可以透過導線22連接到基板20，且感光元件23可以透過導線24連接到基板20。惟，除了傳統打線製程外，發光元件21或感光元件23也可以透過其它方式連接到基板20，本發明並不以此為限。於一實施例中，基板20為一銅箔基板、一陶瓷基板、一導線支架、一樹酯基板或一印刷電路板，而導線22、24則可以為金線，但不限於此。
於本實施例中，複合式感測裝置封裝結構2可以整合有一近距離感測器(proximity sensor)或一環境光線感測器(ambient light sensor，ALS)。發光元件21用來產生發射光(例如紅外光)，而感光元件23用來接收發射光的反射光，讓近距離感測器可根據發射光和反射光來進行距離估算。此外，感光元件23也可用來接收環境光源產生的環境光，以供環境光線感測器進行光度(light intensity)估算。於一實施例中，近距離感測器和環境光線感測器的運算電路和感光元件23設置在同一區域，而發光元件21與該區域相距一距離。於其它實施例中，近距離感測器和環境光線感測器各自使用獨立的感光元件。
在空間有限的情況下，為了降低感光元件23和發光元件21之間的串音干擾(crosstalk)，本發明於感光元件23和發光元件21之間形成不透明的遮擋元件，用來防止感光元件23直接接收到發光元件21發出的發射光。
具體而言，如第2B圖所示，在射出成型時，將一模具25覆蓋於複合式感測裝置封裝結構2，再將液態透明膠材(例如樹酯)注入模具25，待凝固後形成透明模塑物質26、27，並移除模具25。發光元件21和導線22密封於透明模塑物質26中，感光元件23和導線24密封於透明模塑物質27中，且一塑形空間250形成於透明模塑物質26、27之間，使得透明模塑物質26、27彼此分離。於本實施例中，塑形空間250的形狀為漏斗形，但不限於此，其可以是I形、T形或其它形狀。
如第2C圖所示，將液態不透明膠材28滴入(包含點膠、抹膠等方式)塑形空間250。請注意，本實施例選用的液態不透明膠材28在室溫下即呈現液態，因此可在不加溫、不特別施加壓力的情況下，將不透明膠材28滴入塑形空間250。 如此一來，即可避免第1圖的習知技術中高溫下造成透明模塑物質26、27超過玻璃轉化溫度而軟化的問題，也可避免施壓擠入造成透明模塑物質26、27變形的問題。
如第2D圖所示，對複合式感測裝置封裝結構2進行固化處理以固化液態不透明膠材28，以固化液態不透明膠材28而形成遮擋元件280。在此結構下，發光元件21發出的發射光可經由透明模塑物質26而傳遞，環境光源和反射光可穿透透明模塑物質27而被感光元件23所接收，且遮擋元件280可防止發光元件21發出的發射光直接被感光元件23所接收，以兼顧收發功能和降低串音干擾。其中，固化處理係將液態不透明膠材28轉化為固體材質的製程，舉例而言，當液態不 透明膠材28為環氧樹酯時，該固化處理可以為烘烤，即將複合式感測裝置封裝結構2加熱到低於攝氏100度的溫度使其固化。然而，視該不透明膠材28的材料不同，除了低於攝氏100度的低溫固化外，該固化處理也可以為常溫固化(透過讓不透明膠材28接觸氣體或液體使其固化)、高於攝氏100度但低於透明模塑物質26、27之玻璃轉化溫度的高溫固化、或是紫外光固化等其它固化處理方式。
請注意，本實施例選用的不透明膠材28例如是環氧樹酯、矽膠、樹酯跟矽膠混合膠、壓克力膠，且該不透明膠材28可以為黑色環氧樹酯等本身即不透光的材料，或者該不透明膠材28也可以透過摻雜染劑、碳黑、二氧化矽或二氧化鈦等填充物使其形成不透光，其固化溫度低於透明模塑物質26、27的玻璃轉化溫度，因此透明模塑物質26、27不會在烘烤過程中軟化，並可給予足夠的支撐力，讓遮擋元件280和透明模塑物質26、27可順利結合形成預定的結構。例如，遮擋元件280的右側表面28R與透明模塑物質26相連，遮擋元件280的左側表面28L與透明模塑物質27相連，且遮擋元件280的下表面28D與基板20相連。此外，藉由控制液態不透明膠材28滴入塑形空間250的量，可使遮擋元件280的上表面28U呈現平面或凸面，以控制發射光的角度及範圍，進而滿足不同應用需求。
簡言之，本發明在選用具有適當材料特性的不透明膠材的情況下(例如，環氧樹酯、矽膠、樹酯跟矽膠混合膠、壓克力膠，其室溫下為液態且固化溫度低於透明模塑物質的玻璃轉化溫度)，透過本發明實施例技術於感光元件23和發光元件21之間形成不透明的遮擋元件280，得以確保遮擋元件280和透明模塑物質26、27確實結合，更不會如同先前技的不透明模塑物質18和透明模塑物質16、17在冷卻凝固過程中因熱漲冷縮形變而產生縫隙。
第3A圖到第3D圖為本發明實施例一複合式感測裝置封裝結構3的封裝流程示意圖。複合式感測裝置封裝結構3包含一基板30、一發光元件31、導線32、34和一感光元件33。
如第3A圖所示，發光元件31和感光元件33設置於基板30上，其中發光元件31透過導線32連接到基板30，且感光元件33透過導線34連接到基板30。在射出成型時，將一模具35覆蓋於複合式感測裝置封裝結構3，再將液態透明膠材(例如樹酯)注入模具35，待凝固後形成透明模塑物質39，並移除模具35。發光元件31、感光元件33和導線32、34密封於透明模塑物質39中。
如第3B圖所示，使用一切割刀或研磨刀對透明模塑物質39進行塑形，以形成一塑形空間350及透明模塑物質391、392，其中發光元件31和導線32密封於透明模塑物質391中，感光元件23和導線24密封於透明模塑物質392中，且塑形空間350形成於透明模塑物質391、392之間，使得透明模塑物質391、392彼此分離。於本實施例中，由於近距離感測器和環境光線感測器的運算電路和感光元件33設置在同一區域，因此在電路布局設計時，可將感光元件33設置於遠離發光元件31的位置，並將近距離感測器和環境光線感測器的運算電路設置於靠近發光元件31的位置。在不影響感光元件33的感光能力的情況下，塑形空間350的範圍可延伸到感光元件33的上方，使塑形空間350的形狀呈現不對稱T形。但不限於此，塑形空間350的形狀可以是I形、漏斗形或其它形狀。
如第3C圖所示，將液態不透明膠材38滴入(包含點膠、抹膠等方式)塑形空間350。如第3D圖所示，對複合式感測裝置封裝結構3進行固化處理(例如前述烘烤)，以固化液態不透明膠材38而形成遮擋元件380。
請注意，複合式感測裝置封裝結構2、3的差異在於遮擋元件的塑形空間的塑形方式不同。複合式感測裝置封裝結構2的塑形空間250是藉由模具25的來塑形，此做法的優點是製程步驟較精簡，但缺點是製程彈性低(例如，模具25無法重複利用在不同規格的複合式感測裝置封裝結構)。複合式感測裝置封裝結構3的塑形空間350是藉由切割刀或研磨刀來塑形，此做法的優點是製程彈性高(例如，切割刀或研磨刀可塑形複雜多樣的形狀)，但缺點是製程步驟較多。 本領域具通常知識者可根據實際需求來選擇塑形空間的塑形方式。
複合式感測裝置封裝結構2、3的製造方式可歸納為一封裝流程4，如第4圖所示，封裝流程4包含以下步驟。
步驟41：於一基板上設置一發光元件和一感光元件。
步驟42：將發光元件密封於一第一透明模塑物質中，及將感光元件密封於一第二透明模塑物質中。
步驟43：於第一透明模塑物質和第二透明模塑物質之間形成一塑形空間。
步驟44：將液態不透明膠材滴入塑形空間，對液態不透明膠材進行一固化處理，以形成遮擋元件。
關於封裝流程4的詳細操作方式可參考第2A、2B、2C、2D圖和第3A、3B、3C、3D圖的相關說明，於此不贅述。
綜上所述，本發明在選用具有適當材料特性的不透明膠材的情況下(例如，環氧樹酯、矽膠、樹酯跟矽膠混合膠、壓克力膠，其室溫下為液態且 固化溫度低於透明模塑物質的玻璃轉化溫度)，透過雙料射出技術於感光元件和發光元件之間形成不透明的遮擋元件，以降低感光元件和發光元件之間的串音干擾。
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。
2:複合式感測裝置封裝結構
20:基板
21:發光元件
22、24:導線
23:感光元件
26、27:透明模塑物質
280:遮擋元件
28U:上表面
28R:右側表面
28L:左側表面
28D:下表面
X、Y、Z:方向

Claims (13)

  1. 一種複合式感測裝置封裝結構，包括：一發光元件，密封於一第一透明模塑物質中；一感光元件，密封於一第二透明模塑物質中；一基板，其上設置有該發光元件、該感光元件、該第一透明模塑物質和該第二透明模塑物質；以及一不透明遮擋元件，設置於該基板上以及該第一透明模塑物質與該第二透明模塑物質之間，其中該不透明遮擋元件是由室溫為液態的一不透明膠材經一固化處理所形成。
  2. 如請求項1所述之複合式感測裝置封裝結構，其中該不透明遮擋元件的固化溫度低於該第一透明模塑物質和該第二透明模塑物質的玻璃轉化溫度。
  3. 如請求項1所述之複合式感測裝置封裝結構，其中該不透明遮擋元件是環氧樹酯、矽膠、樹酯跟矽膠混合膠、壓克力膠。
  4. 如請求項1所述之複合式感測裝置封裝結構，其中該不透明遮擋元件的一第一側表面與該第一透明模塑物質相連，該不透明遮擋元件的一第二側表面與該第二明模塑物質相連，且該不透明遮擋元件的一下表面與該基板相連。
  5. 如請求項1所述之複合式感測裝置封裝結構，其中該不透明遮擋元件的一上表面為一平面或一凸面。
  6. 如請求項1所述之複合式感測裝置封裝結構，其中該發光元件用於一近距離感測器，且該感光元件用於該近距離感測器或一環境光線感測器。
  7. 如請求項1所述之複合式感測裝置封裝結構，其中該固化處理為常溫固化、低於攝氏100度的低溫固化、高於攝氏100度的高溫固化、或是紫外光固化。
  8. 一種複合式感測裝置封裝方法，包含：於一基板上設置一發光元件和一感光元件；將該發光元件密封於一第一透明模塑物質中，並將感光元件密封於一第二透明模塑物質中；於該第一透明模塑物質和該第二透明模塑物質之間形成一塑形空間；以及將一液態不透明膠材滴入該塑形空間，對該液態不透明膠材進行一固化處理，以形成一遮擋元件。
  9. 如請求項8所述之複合式感測裝置封裝方法，其中該液態不透明膠材的固化溫度低於該第一透明模塑物質和該第二透明模塑物質的一玻璃轉化溫度。
  10. 如請求項8所述之複合式感測裝置封裝方法，其中該液態不透明膠材是環氧樹酯、矽膠、樹酯跟矽膠混合膠、壓克力膠。
  11. 如請求項8所述之複合式感測裝置封裝方法，其中於該第一透明模塑 物質和該第二透明模塑物質之間形成該塑形空間的步驟包含：經由一模具塑形而形成該第一透明模塑物質、該第二透明模塑物質和該塑形空間於該基板上。
  12. 如請求項8所述之複合式感測裝置封裝方法，其中於該第一透明模塑物質和該第二透明模塑物質之間形成該塑形空間的步驟包含：經由一模具塑形而形成一透明模塑物質於該基板上；以及經由切割該透明模塑物質而形成該第一透明模塑物質、該第二透明模塑物質和該塑形空間於該基板上。
  13. 如請求項8所述之複合式感測裝置封裝方法，其中該固化處理為常溫固化、低於攝氏100度的低溫固化、高於攝氏100度的高溫固化、或是紫外光固化。
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