JP2001523897A5 - - Google Patents
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- Publication number
- JP2001523897A5 JP2001523897A5 JP2000521685A JP2000521685A JP2001523897A5 JP 2001523897 A5 JP2001523897 A5 JP 2001523897A5 JP 2000521685 A JP2000521685 A JP 2000521685A JP 2000521685 A JP2000521685 A JP 2000521685A JP 2001523897 A5 JP2001523897 A5 JP 2001523897A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/970,503 US6031720A (en) | 1997-11-14 | 1997-11-14 | Cooling system for semiconductor die carrier |
US08/970,503 | 1997-11-14 | ||
PCT/US1998/024251 WO1999026460A1 (en) | 1997-11-14 | 1998-11-13 | Cooling system for semiconductor die carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001523897A JP2001523897A (ja) | 2001-11-27 |
JP2001523897A5 true JP2001523897A5 (ja) | 2006-01-12 |
Family
ID=25517044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000521685A Pending JP2001523897A (ja) | 1997-11-14 | 1998-11-13 | 半導体ダイキャリア用の冷却システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US6031720A (ja) |
EP (1) | EP1036491B1 (ja) |
JP (1) | JP2001523897A (ja) |
KR (1) | KR20010024613A (ja) |
AU (1) | AU1458399A (ja) |
DE (1) | DE69824758D1 (ja) |
WO (1) | WO1999026460A1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW484721U (en) * | 2000-11-06 | 2002-04-21 | Giga Byte Tech Co Ltd | Improved airflow guiding structure of server |
DE10063306A1 (de) * | 2000-12-19 | 2002-07-04 | Fujitsu Siemens Computers Gmbh | Kühlvorrichtung |
JP2004537869A (ja) * | 2001-08-09 | 2004-12-16 | セレスティカ インターナショナル インク. | 放熱システム |
US6912128B2 (en) * | 2001-08-09 | 2005-06-28 | Celestica International Inc. | Electronics cooling subassembly |
CA2462444A1 (en) * | 2001-10-04 | 2003-04-10 | Celestica International Inc. | Cooling system having independent fan location |
US6891385B2 (en) * | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US7064953B2 (en) * | 2001-12-27 | 2006-06-20 | Formfactor, Inc. | Electronic package with direct cooling of active electronic components |
JP2003258169A (ja) * | 2002-03-05 | 2003-09-12 | Fujikura Ltd | ヒートシンク |
US6661665B2 (en) * | 2002-03-11 | 2003-12-09 | Sun Microsystems, Inc. | Method and apparatus for removing heat from an electronic device |
US6975509B2 (en) * | 2002-05-16 | 2005-12-13 | Sun Microsystems, Inc. | Computing apparatus with cooling fan |
US6678157B1 (en) * | 2002-09-17 | 2004-01-13 | Sun Microsystems, Inc. | Electronics assembly with cooling arrangement |
KR20040038162A (ko) * | 2002-10-31 | 2004-05-08 | 삼성전자주식회사 | 컴퓨터 본체 |
KR100939992B1 (ko) * | 2002-11-21 | 2010-02-03 | 삼성전자주식회사 | 전기전자기기의 냉각장치 및 이를 장착한 전기전자기기 |
JP4411147B2 (ja) * | 2004-06-24 | 2010-02-10 | 株式会社日立製作所 | ファン付きヒートシンク |
CN2720626Y (zh) * | 2004-06-25 | 2005-08-24 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
US20060098414A1 (en) * | 2004-11-10 | 2006-05-11 | Meng-Cheng Huang | Heat sink |
TWI268995B (en) * | 2004-12-24 | 2006-12-21 | Foxconn Tech Co Ltd | Fan duct device |
CN100464279C (zh) * | 2005-11-17 | 2009-02-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
US7251136B2 (en) * | 2005-12-29 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a ventilating duct |
US7228889B1 (en) | 2006-01-09 | 2007-06-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
KR101110434B1 (ko) * | 2006-05-02 | 2012-02-24 | 엘지전자 주식회사 | 컴퓨터 냉각 장치 |
US20080112134A1 (en) * | 2006-11-09 | 2008-05-15 | Brandon Rubenstein | Dust accumulation resistant heat sink |
US7806167B2 (en) * | 2007-06-22 | 2010-10-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
WO2011155247A1 (ja) * | 2010-06-07 | 2011-12-15 | 三菱電機株式会社 | ヒートシンクおよびその製造方法 |
CN102654790A (zh) * | 2011-03-03 | 2012-09-05 | 鸿富锦精密工业(深圳)有限公司 | 散热系统 |
US9871358B2 (en) * | 2015-01-30 | 2018-01-16 | Abb Schweiz Ag | Electrical switchgear system |
BR112018003099A2 (pt) | 2015-08-25 | 2018-09-25 | Nokia Solutions And Networks Oy | configuração de quadro de rádio |
JP6855873B2 (ja) * | 2017-03-27 | 2021-04-07 | 富士電機株式会社 | 鉄道車両用電力変換装置 |
JP6988148B2 (ja) * | 2017-04-24 | 2022-01-05 | 富士電機株式会社 | 鉄道車両用電力変換装置 |
CN108932039B (zh) * | 2017-05-26 | 2021-08-13 | 鸿富锦精密工业(武汉)有限公司 | 导风罩及散热系统 |
JP6888468B2 (ja) * | 2017-08-01 | 2021-06-16 | 富士電機株式会社 | 鉄道車両用電力変換装置 |
JP2022178278A (ja) * | 2021-05-19 | 2022-12-02 | 日本電産株式会社 | 放熱部材 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
US4674004A (en) * | 1986-07-03 | 1987-06-16 | Burroughs Corporation | Parallel-flow air system for cooling electronic equipment |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
JPH0412559A (ja) * | 1990-05-01 | 1992-01-17 | Fujitsu Ltd | 電子装置の冷却構造 |
JPH0521665A (ja) * | 1991-07-11 | 1993-01-29 | Nec Corp | ヒートシンク付半導体パツケージ |
JP2596682B2 (ja) * | 1992-09-08 | 1997-04-02 | 株式会社日立製作所 | 電子機器冷却装置 |
US5428503A (en) * | 1992-03-24 | 1995-06-27 | Hitachi, Ltd. | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon |
JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
JPH08236664A (ja) * | 1995-02-23 | 1996-09-13 | Toshiba Corp | 半導体の冷却装置 |
US5597035A (en) * | 1995-08-18 | 1997-01-28 | Dell Usa, L.P. | For use with a heatsink a shroud having a varying cross-sectional area |
US5563768A (en) * | 1995-08-31 | 1996-10-08 | At&T Global Information Solutions Company | Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid |
US5828549A (en) * | 1996-10-08 | 1998-10-27 | Dell U.S.A., L.P. | Combination heat sink and air duct for cooling processors with a series air flow |
-
1997
- 1997-11-14 US US08/970,503 patent/US6031720A/en not_active Expired - Fee Related
-
1998
- 1998-11-13 DE DE69824758T patent/DE69824758D1/de not_active Expired - Lifetime
- 1998-11-13 JP JP2000521685A patent/JP2001523897A/ja active Pending
- 1998-11-13 KR KR1020007005249A patent/KR20010024613A/ko not_active Application Discontinuation
- 1998-11-13 EP EP98958566A patent/EP1036491B1/en not_active Expired - Lifetime
- 1998-11-13 WO PCT/US1998/024251 patent/WO1999026460A1/en active IP Right Grant
- 1998-11-13 AU AU14583/99A patent/AU1458399A/en not_active Abandoned