JP2001508828A5 - - Google Patents
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- Publication number
- JP2001508828A5 JP2001508828A5 JP1998534644A JP53464498A JP2001508828A5 JP 2001508828 A5 JP2001508828 A5 JP 2001508828A5 JP 1998534644 A JP1998534644 A JP 1998534644A JP 53464498 A JP53464498 A JP 53464498A JP 2001508828 A5 JP2001508828 A5 JP 2001508828A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3594897P | 1997-01-21 | 1997-01-21 | |
| GB60/035,948 | 1997-01-22 | ||
| GBGB9701294.2A GB9701294D0 (en) | 1997-01-22 | 1997-01-22 | Latent catalysts for epoxy curing systems |
| GB9701294.2 | 1997-01-22 | ||
| PCT/US1998/001041 WO1998031750A1 (en) | 1997-01-21 | 1998-01-20 | Latent catalysts for epoxy curing systems |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001508828A JP2001508828A (ja) | 2001-07-03 |
| JP2001508828A5 true JP2001508828A5 (OSRAM) | 2005-09-08 |
| JP4080546B2 JP4080546B2 (ja) | 2008-04-23 |
Family
ID=26310844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53464498A Expired - Lifetime JP4080546B2 (ja) | 1997-01-21 | 1998-01-20 | エポキシ硬化系のための潜触媒 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0954553B2 (OSRAM) |
| JP (1) | JP4080546B2 (OSRAM) |
| KR (1) | KR100569617B1 (OSRAM) |
| CN (1) | CN1129648C (OSRAM) |
| AT (1) | ATE273348T1 (OSRAM) |
| DE (1) | DE69825561T3 (OSRAM) |
| MY (1) | MY128727A (OSRAM) |
| TW (1) | TW503246B (OSRAM) |
| WO (1) | WO1998031750A1 (OSRAM) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI261059B (en) * | 1999-12-13 | 2006-09-01 | Dow Global Technologies Inc | Flame retardant phosphorus element-containing epoxy resin compositions |
| US6641923B2 (en) | 2001-07-31 | 2003-11-04 | Ppg Industries Ohio, Inc. | Weldable coating compositions having improved intercoat adhesion |
| US6617400B2 (en) | 2001-08-23 | 2003-09-09 | General Electric Company | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| ATE279474T1 (de) * | 2002-10-19 | 2004-10-15 | Leuna Harze Gmbh | Härtbare epoxidharzzusammensetzung |
| US20040101689A1 (en) | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
| JP4895487B2 (ja) * | 2003-08-05 | 2012-03-14 | 一般財団法人川村理化学研究所 | 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法 |
| CN102653598B (zh) | 2004-05-28 | 2015-05-13 | 陶氏环球技术有限责任公司 | 可用于制造无卤素抗引燃聚合物的含磷化合物 |
| US20090234080A1 (en) * | 2005-09-27 | 2009-09-17 | Sumitomo Dakelite Co., Ltd. | Process for producing latent catalyst and epoxy resin composition |
| JP5502326B2 (ja) * | 2005-12-22 | 2014-05-28 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性エポキシ樹脂組成物およびそれから作られた積層体 |
| JP5460583B2 (ja) * | 2007-06-11 | 2014-04-02 | ビーエーエスエフ ソシエタス・ヨーロピア | エポキシ硬化のための触媒 |
| KR101547874B1 (ko) | 2007-07-26 | 2015-08-27 | 아지노모토 가부시키가이샤 | 수지 조성물 |
| JP5144572B2 (ja) * | 2009-03-26 | 2013-02-13 | 太陽ホールディングス株式会社 | 熱硬化性樹脂組成物 |
| SG176923A1 (en) * | 2009-06-22 | 2012-01-30 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
| CN102695744A (zh) * | 2009-11-06 | 2012-09-26 | 陶氏环球技术有限责任公司 | 用于电层合体的存储稳定的环氧树脂组合物 |
| CN102031082B (zh) * | 2010-12-10 | 2013-04-03 | 东华大学 | 苯并咪唑二胺固化型环氧胶粘剂及其制备方法 |
| EP2705090A1 (en) * | 2011-05-02 | 2014-03-12 | Dow Global Technologies LLC | Trimethyl borate in epoxy resins |
| JP6273213B2 (ja) * | 2012-02-17 | 2018-01-31 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | ベンズオキサジン、エポキシ及び無水物の混合物 |
| DK2695903T3 (en) | 2012-08-08 | 2019-01-14 | Siemens Ag | Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process |
| EP2695727B1 (en) | 2012-08-08 | 2017-12-06 | Siemens Aktiengesellschaft | Method of accelerating the curing process in resin overflow systems for the use in casting processes and resin overflow container |
| US10662304B2 (en) | 2013-12-31 | 2020-05-26 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
| US11550220B2 (en) | 2019-10-31 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Negative tone photoresist for EUV lithography |
| CN113278251A (zh) * | 2021-04-26 | 2021-08-20 | 厦门理工学院 | 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备 |
| DE102024103231A1 (de) | 2024-02-06 | 2025-08-07 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung und dafür geeignete Härtersysteme |
| CN119285906B (zh) * | 2024-10-25 | 2025-10-14 | 厦门艾贝森电子有限公司 | 一种生物质阻燃环氧电子封装材料及其制备方法 |
| CN119661811B (zh) * | 2024-12-02 | 2026-03-27 | 江南大学 | 基于酸酐-叔胺动态离子对潜伏型促进剂及其制法和用途 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3732332A (en) † | 1970-10-16 | 1973-05-08 | Allied Chem | Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom |
| US3997499A (en) * | 1974-08-29 | 1976-12-14 | Gulf Oil Corporation | Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof |
| US4594291A (en) * | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
| JPS62207320A (ja) * | 1986-03-07 | 1987-09-11 | Hitachi Ltd | 熱硬化性樹脂組成物で封止してなる半導体装置 |
| US4873273A (en) * | 1986-03-20 | 1989-10-10 | James River-Norwalk, Inc. | Epoxide coating composition |
| JPH072829B2 (ja) † | 1987-11-04 | 1995-01-18 | 株式会社日立製作所 | 積層板 |
| EP0328020B1 (en) * | 1988-02-12 | 1996-10-09 | The Dow Chemical Company | Use of a catalyst in epoxy compositions |
| GB8824391D0 (en) * | 1988-10-18 | 1988-11-23 | Ciba Geigy Ag | Compositions |
| SG43193A1 (en) † | 1990-05-21 | 1997-10-17 | Dow Chemical Co | Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom |
| ZA913801B (en) * | 1990-05-21 | 1993-01-27 | Dow Chemical Co | Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| DE69423234T2 (de) † | 1993-11-02 | 2000-08-10 | The Dow Chemical Co., Midland | Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate |
| DE69505410T2 (de) † | 1994-09-08 | 1999-05-20 | Akzo Nobel N.V., Arnheim/Arnhem | Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung |
| GB9421405D0 (en) † | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
-
1998
- 1998-01-20 DE DE69825561T patent/DE69825561T3/de not_active Expired - Lifetime
- 1998-01-20 CN CN98802989A patent/CN1129648C/zh not_active Expired - Lifetime
- 1998-01-20 AT AT98903586T patent/ATE273348T1/de active
- 1998-01-20 KR KR1019997006593A patent/KR100569617B1/ko not_active Expired - Fee Related
- 1998-01-20 WO PCT/US1998/001041 patent/WO1998031750A1/en not_active Ceased
- 1998-01-20 JP JP53464498A patent/JP4080546B2/ja not_active Expired - Lifetime
- 1998-01-20 EP EP98903586A patent/EP0954553B2/en not_active Expired - Lifetime
- 1998-01-21 TW TW087100801A patent/TW503246B/zh not_active IP Right Cessation
- 1998-01-21 MY MYPI98000244A patent/MY128727A/en unknown