JP2001506196A - 弾力性バンプの製法 - Google Patents
弾力性バンプの製法Info
- Publication number
- JP2001506196A JP2001506196A JP52762898A JP52762898A JP2001506196A JP 2001506196 A JP2001506196 A JP 2001506196A JP 52762898 A JP52762898 A JP 52762898A JP 52762898 A JP52762898 A JP 52762898A JP 2001506196 A JP2001506196 A JP 2001506196A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- release agent
- bumps
- elastomer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
- B29C33/64—Silicone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Micromachines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 l. ウェーハ型上に離型剤を付着する工程を有する、溝を有するウエーハ型か らバンプを形成する方法において、前記型(100)の表面を、塵及び他の粒子 を除いて清浄にし、離型剤の層(118)を、該離型剤の自己集合単分子層を形 成することにより付着し、硬化可能なエラストマーを施して前記型上にエラスト マー構造体(208)を形成し、前記型及び前記構造体を硬化し、次いで前記構 造体を型から分離する、諸工程からなる、上記方法。 2. 清浄化を二つの工程、第一にH2O2及びNH3の溶液を用い、第二にH2O2 及びHC1溶液を用いて行う、請求項1記載の方法。 3. 離型剤層(118)を付着させるのに、型(100)を無水ジメチル−ジ クロロシラン溶液中へ入れ、次にエタノール中で洗浄する工程を行う、請求項2 記載の方法。 4. 離型剤層(118)を付着させるのに、型(100)をパラ−キシリレン の単量体蒸気であるガスに曝し、前記ガスに曝された全ての表面で重合させ、約 400℃の溶融温度で硬化し、等角的ポリ−パラ−キシリレン被覆を形成する諸 工程を行う、請求項1記載の方法。 5. 硬化可能なエラストマーを施す方法が、回転、擦り、又は噴霧である、請 求項1記載の方法。 6. 硬化可能エラストマーがシリコーンエラストマーである、請求項1記載の 方法。 7. 硬化前に、構造体(208)上に基体(206)を重ねる工程を有する、 請求項1〜6のいずれか1項に記載の方法。 8. 基体(206)が可撓性材料からなる、請求項7記載の方法。 9. 硬化前に、エラストマー構造体(208)の上に類似の型をかぶせる工程 を有する、請求項1〜6のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604675A SE508968C2 (sv) | 1996-12-19 | 1996-12-19 | Förfarande för att göra elastiska kulor |
SE9604675-0 | 1996-12-19 | ||
PCT/SE1997/002176 WO1998026913A1 (en) | 1996-12-19 | 1997-12-19 | Method for making elastic bumps |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001506196A true JP2001506196A (ja) | 2001-05-15 |
JP3992747B2 JP3992747B2 (ja) | 2007-10-17 |
Family
ID=20405041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52762898A Expired - Fee Related JP3992747B2 (ja) | 1996-12-19 | 1997-12-19 | 弾力性バンプの製法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US6068801A (ja) |
EP (1) | EP0954420B1 (ja) |
JP (1) | JP3992747B2 (ja) |
KR (1) | KR20000069541A (ja) |
CN (1) | CN1073005C (ja) |
AU (1) | AU5505398A (ja) |
CA (1) | CA2275650A1 (ja) |
DE (1) | DE69719805T2 (ja) |
HK (1) | HK1024662A1 (ja) |
SE (1) | SE508968C2 (ja) |
TW (1) | TW508699B (ja) |
WO (1) | WO1998026913A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006148055A (ja) * | 2004-11-19 | 2006-06-08 | Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi | 熱間エンボシングリソグラフィーを行う方法 |
JP2010052419A (ja) * | 2008-08-29 | 2010-03-11 | Samsung Electro-Mechanics Co Ltd | セラミックグリーンシートの製造方法及びこれを用いた多層セラミック回路基板の製造方法 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758794B2 (en) | 2001-10-29 | 2010-07-20 | Princeton University | Method of making an article comprising nanoscale patterns with reduced edge roughness |
US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
US6309580B1 (en) * | 1995-11-15 | 2001-10-30 | Regents Of The University Of Minnesota | Release surfaces, particularly for use in nanoimprint lithography |
WO1999012207A1 (fr) * | 1997-09-01 | 1999-03-11 | Fanuc Ltd | Procede d'assemblage de petites pieces et ensemble de petites pieces |
DE19909477C2 (de) * | 1999-03-04 | 2002-01-17 | Freudenberg Carl Fa | Verfahren und Vorrichtung zur Aufbringung von oberflächenmodifizierenden Hilfssubstanzen auf die Arbeitsrauminnenflächen von Werkzeugformen |
US6411754B1 (en) | 2000-08-25 | 2002-06-25 | Corning Incorporated | Micromechanical optical switch and method of manufacture |
US6673287B2 (en) * | 2001-05-16 | 2004-01-06 | International Business Machines Corporation | Vapor phase surface modification of composite substrates to form a molecularly thin release layer |
DE10134011B4 (de) * | 2001-07-12 | 2007-08-16 | Infineon Technologies Ag | Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist |
US7813634B2 (en) | 2005-02-28 | 2010-10-12 | Tessera MEMS Technologies, Inc. | Autofocus camera |
JP4184140B2 (ja) * | 2002-05-10 | 2008-11-19 | キヤノン化成株式会社 | 遠心成形金型およびその製造方法ならびにこれを用いて製造される遠心成形体およびブレードならびにその製造方法 |
TWI286272B (en) * | 2004-01-16 | 2007-09-01 | Hon Hai Prec Ind Co Ltd | Manufacturing method of a cavity |
US20060204699A1 (en) * | 2004-12-08 | 2006-09-14 | George Maltezos | Parylene coated microfluidic components and methods for fabrication thereof |
US7646969B2 (en) * | 2005-02-28 | 2010-01-12 | Siimpel Corporation | Camera snubber assembly |
US8137626B2 (en) * | 2006-05-19 | 2012-03-20 | California Institute Of Technology | Fluorescence detector, filter device and related methods |
US8187541B2 (en) * | 2006-09-18 | 2012-05-29 | California Institute Of Technology | Apparatus for detecting target molecules and related methods |
US8768157B2 (en) | 2011-09-28 | 2014-07-01 | DigitalOptics Corporation MEMS | Multiple degree of freedom actuator |
US8619378B2 (en) | 2010-11-15 | 2013-12-31 | DigitalOptics Corporation MEMS | Rotational comb drive Z-stage |
US20090159200A1 (en) * | 2007-12-19 | 2009-06-25 | Heptagon Oy | Spacer element and method for manufacturing a spacer element |
JP2010266667A (ja) * | 2009-05-14 | 2010-11-25 | Fujifilm Corp | ウェハレベルレンズアレイ及びその製造方法 |
JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
US9352962B2 (en) | 2010-11-15 | 2016-05-31 | DigitalOptics Corporation MEMS | MEMS isolation structures |
US9019390B2 (en) | 2011-09-28 | 2015-04-28 | DigitalOptics Corporation MEMS | Optical image stabilization using tangentially actuated MEMS devices |
US8608393B2 (en) | 2010-11-15 | 2013-12-17 | DigitalOptics Corporation MEMS | Capillary actuator deployment |
US8337103B2 (en) | 2010-11-15 | 2012-12-25 | DigitalOptics Corporation MEMS | Long hinge actuator snubbing |
US8604663B2 (en) | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Motion controlled actuator |
US8941192B2 (en) | 2010-11-15 | 2015-01-27 | DigitalOptics Corporation MEMS | MEMS actuator device deployment |
US9061883B2 (en) | 2010-11-15 | 2015-06-23 | DigitalOptics Corporation MEMS | Actuator motion control features |
US9052567B2 (en) | 2010-11-15 | 2015-06-09 | DigitalOptics Corporation MEMS | Actuator inside of motion control |
US8637961B2 (en) | 2010-11-15 | 2014-01-28 | DigitalOptics Corporation MEMS | MEMS actuator device |
US9515579B2 (en) | 2010-11-15 | 2016-12-06 | Digitaloptics Corporation | MEMS electrical contact systems and methods |
US8605375B2 (en) | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Mounting flexure contacts |
US8521017B2 (en) | 2010-11-15 | 2013-08-27 | DigitalOptics Corporation MEMS | MEMS actuator alignment |
US8884381B2 (en) | 2010-11-15 | 2014-11-11 | DigitalOptics Corporation MEMS | Guard trench |
US8430580B2 (en) | 2010-11-15 | 2013-04-30 | DigitalOptics Corporation MEMS | Rotationally deployed actuators |
US8358925B2 (en) | 2010-11-15 | 2013-01-22 | DigitalOptics Corporation MEMS | Lens barrel with MEMS actuators |
US8547627B2 (en) | 2010-11-15 | 2013-10-01 | DigitalOptics Corporation MEMS | Electrical routing |
US8947797B2 (en) | 2010-11-15 | 2015-02-03 | DigitalOptics Corporation MEMS | Miniature MEMS actuator assemblies |
US8803256B2 (en) | 2010-11-15 | 2014-08-12 | DigitalOptics Corporation MEMS | Linearly deployed actuators |
US20130235334A1 (en) * | 2011-08-31 | 2013-09-12 | Michael F. Widman | Ophthalmic lens forming optic |
US9350271B2 (en) | 2011-09-28 | 2016-05-24 | DigitalOptics Corporation MEMS | Cascaded electrostatic actuator |
US8616791B2 (en) | 2011-09-28 | 2013-12-31 | DigitalOptics Corporation MEMS | Rotationally deployed actuator devices |
US8855476B2 (en) | 2011-09-28 | 2014-10-07 | DigitalOptics Corporation MEMS | MEMS-based optical image stabilization |
US9281763B2 (en) | 2011-09-28 | 2016-03-08 | DigitalOptics Corporation MEMS | Row and column actuator control |
US8853975B2 (en) | 2011-09-28 | 2014-10-07 | DigitalOptics Corporation MEMS | Electrostatic actuator control |
US8571405B2 (en) | 2011-09-28 | 2013-10-29 | DigitalOptics Corporation MEMS | Surface mount actuator |
US8869625B2 (en) | 2011-09-28 | 2014-10-28 | DigitalOptics Corporation MEMS | MEMS actuator/sensor |
JP5814958B2 (ja) * | 2013-02-21 | 2015-11-17 | 株式会社東芝 | テンプレート作製方法、テンプレート検査方法、及びテンプレート材料 |
TW201501175A (zh) * | 2013-06-19 | 2015-01-01 | Nanocrystal Asia Inc | 半導體製造工具的強化方法 |
CN114633414A (zh) * | 2022-03-04 | 2022-06-17 | 微智医疗器械有限公司 | 用于制备硅胶制品的方法及模具 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4263350A (en) * | 1979-12-31 | 1981-04-21 | Ppg Industries, Inc. | Silane release surfaces on glass |
JPS59182218A (ja) * | 1983-03-30 | 1984-10-17 | Hoxan Corp | 多結晶シリコンウエハの製造方法 |
JPS59182217A (ja) * | 1983-03-30 | 1984-10-17 | Hoxan Corp | 多結晶シリコンウエハの製造方法 |
JPS6123313A (ja) * | 1984-07-11 | 1986-01-31 | Hoxan Corp | 多結晶シリコンウエハの製造皿用離型剤層形成方法 |
NL8600809A (nl) * | 1986-03-28 | 1987-10-16 | Philips Nv | Methode om een matrijs te voorzien van een loslaag. |
US4775544A (en) * | 1986-12-22 | 1988-10-04 | Carrier Vibrating Equipment, Inc. | Method for plasticizing nuts and the like |
US4937653A (en) * | 1988-07-21 | 1990-06-26 | American Telephone And Telegraph Company | Semiconductor integrated circuit chip-to-chip interconnection scheme |
US4946369A (en) * | 1989-06-19 | 1990-08-07 | Dow Corning Corporation | Silicone mold and elastomer tool life |
US5064583A (en) * | 1989-08-01 | 1991-11-12 | Zycon Corporation | Method for applying mold release coating to separator plates for molding printed circuit boards |
JPH03234605A (ja) * | 1990-02-13 | 1991-10-18 | Toshiba Corp | レジン成形装置 |
US5243756A (en) * | 1991-06-28 | 1993-09-14 | Digital Equipment Corporation | Integrated circuit protection by liquid encapsulation |
US5217568A (en) * | 1992-02-03 | 1993-06-08 | Motorola, Inc. | Silicon etching process using polymeric mask, for example, to form V-groove for an optical fiber coupling |
US5439569A (en) * | 1993-02-12 | 1995-08-08 | Sematech, Inc. | Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath |
US5343544A (en) * | 1993-07-02 | 1994-08-30 | Minnesota Mining And Manufacturing Company | Integrated optical fiber coupler and method of making same |
US5620634A (en) * | 1995-08-17 | 1997-04-15 | Lucent Technologies Inc. | Method of making fiber waveguide connectors |
-
1996
- 1996-12-19 SE SE9604675A patent/SE508968C2/sv not_active IP Right Cessation
-
1997
- 1997-01-29 TW TW086100964A patent/TW508699B/zh not_active IP Right Cessation
- 1997-12-19 DE DE69719805T patent/DE69719805T2/de not_active Expired - Fee Related
- 1997-12-19 CA CA002275650A patent/CA2275650A1/en not_active Abandoned
- 1997-12-19 CN CN97180834A patent/CN1073005C/zh not_active Expired - Fee Related
- 1997-12-19 WO PCT/SE1997/002176 patent/WO1998026913A1/en active IP Right Grant
- 1997-12-19 US US08/995,194 patent/US6068801A/en not_active Expired - Fee Related
- 1997-12-19 AU AU55053/98A patent/AU5505398A/en not_active Abandoned
- 1997-12-19 JP JP52762898A patent/JP3992747B2/ja not_active Expired - Fee Related
- 1997-12-19 KR KR1019997005475A patent/KR20000069541A/ko active IP Right Grant
- 1997-12-19 EP EP97951402A patent/EP0954420B1/en not_active Expired - Lifetime
-
2000
- 2000-06-30 HK HK00103992A patent/HK1024662A1/xx not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006148055A (ja) * | 2004-11-19 | 2006-06-08 | Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi | 熱間エンボシングリソグラフィーを行う方法 |
JP2010052419A (ja) * | 2008-08-29 | 2010-03-11 | Samsung Electro-Mechanics Co Ltd | セラミックグリーンシートの製造方法及びこれを用いた多層セラミック回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1073005C (zh) | 2001-10-17 |
CA2275650A1 (en) | 1998-06-25 |
EP0954420A1 (en) | 1999-11-10 |
SE9604675D0 (sv) | 1996-12-19 |
EP0954420B1 (en) | 2003-03-12 |
JP3992747B2 (ja) | 2007-10-17 |
CN1241155A (zh) | 2000-01-12 |
SE9604675L (sv) | 1998-06-20 |
TW508699B (en) | 2002-11-01 |
SE508968C2 (sv) | 1998-11-23 |
HK1024662A1 (en) | 2000-10-20 |
US6068801A (en) | 2000-05-30 |
KR20000069541A (ko) | 2000-11-25 |
AU5505398A (en) | 1998-07-15 |
DE69719805T2 (de) | 2003-11-06 |
WO1998026913A1 (en) | 1998-06-25 |
DE69719805D1 (de) | 2003-04-17 |
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