JP2001500457A5 - - Google Patents
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- Publication number
- JP2001500457A5 JP2001500457A5 JP1998513858A JP51385898A JP2001500457A5 JP 2001500457 A5 JP2001500457 A5 JP 2001500457A5 JP 1998513858 A JP1998513858 A JP 1998513858A JP 51385898 A JP51385898 A JP 51385898A JP 2001500457 A5 JP2001500457 A5 JP 2001500457A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/713,504 US6030692A (en) | 1996-09-13 | 1996-09-13 | Cover tape for formed tape packing system and process for making same |
| US08/713,504 | 1996-09-13 | ||
| PCT/US1997/016090 WO1998011768A1 (en) | 1996-09-13 | 1997-09-11 | Cover tape for formed tape packing system and process for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001500457A JP2001500457A (ja) | 2001-01-16 |
| JP2001500457A5 true JP2001500457A5 (enExample) | 2005-05-12 |
Family
ID=24866404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10513858A Pending JP2001500457A (ja) | 1996-09-13 | 1997-09-11 | 形成されたテープパッキングシステムのためのカバーテープおよびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6030692A (enExample) |
| EP (1) | EP0925715B1 (enExample) |
| JP (1) | JP2001500457A (enExample) |
| AT (1) | ATE195400T1 (enExample) |
| CA (1) | CA2266471C (enExample) |
| DE (1) | DE69702770D1 (enExample) |
| WO (1) | WO1998011768A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3383935B2 (ja) * | 1999-01-11 | 2003-03-10 | 北越製紙株式会社 | 電子デバイス用キャリアテープ紙 |
| US6469372B2 (en) * | 2000-05-16 | 2002-10-22 | Texas Instruments Incorporated | Matched thermal expansion carrier tape assemblage for semiconductor devices |
| DE10044435A1 (de) * | 2000-09-08 | 2002-04-04 | Siemens Ag | Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
| US20030044056A1 (en) * | 2001-06-13 | 2003-03-06 | Robotic Vision Systems, Inc. | Post-seal inspection system |
| SG115510A1 (en) * | 2001-12-20 | 2005-10-28 | Nitto Denko Corp | Cover tape for the electronic part conveyance, process for its production and electronic part conveying member |
| US7137985B2 (en) * | 2003-09-24 | 2006-11-21 | N Spine, Inc. | Marking and guidance method and system for flexible fixation of a spine |
| US20050116387A1 (en) * | 2003-12-01 | 2005-06-02 | Davison Peter A. | Component packaging apparatus, systems, and methods |
| US7575721B2 (en) * | 2005-06-06 | 2009-08-18 | Cepheid | Method and apparatus for storing and dispensing reagent beads |
| US8247057B2 (en) | 2005-09-16 | 2012-08-21 | 3M Innovative Properties Company | Cover tape and method for manufacture |
| KR100777086B1 (ko) | 2006-04-12 | 2007-11-19 | 안승배 | 전자 부품 이송용 커버 테이프 및 그 제조 방법 |
| JP5055270B2 (ja) * | 2006-04-25 | 2012-10-24 | 電気化学工業株式会社 | カバーフィルム |
| US20080032099A1 (en) * | 2006-07-20 | 2008-02-07 | Elmer's Products, Inc. | Heat activated art mounting sheet |
| JP5238699B2 (ja) | 2006-08-09 | 2013-07-17 | スリーエム イノベイティブ プロパティズ カンパニー | 引裂開始型カバーテープを有するキャリアテープ、及びその製造方法 |
| MY151527A (en) * | 2007-04-11 | 2014-05-30 | Sumitomo Bakelite Co | Packaged article containing electronic device |
| US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
| CN102470964B (zh) * | 2009-07-22 | 2013-08-28 | 住友电木株式会社 | 电子部件包装用上带和电子部件包装体 |
| KR101735976B1 (ko) | 2011-09-30 | 2017-05-15 | 인텔 코포레이션 | 트랜지스터 게이트용 캡핑 유전체 구조를 형성하는 방법 |
| US9580776B2 (en) | 2011-09-30 | 2017-02-28 | Intel Corporation | Tungsten gates for non-planar transistors |
| KR101780916B1 (ko) | 2011-09-30 | 2017-09-21 | 인텔 코포레이션 | 집적회로 구조 및 집적회로 구조의 제조 방법 |
| DE112011105702T5 (de) | 2011-10-01 | 2014-07-17 | Intel Corporation | Source-/Drain-Kontakte für nicht planare Transistoren |
| WO2013095527A1 (en) * | 2011-12-22 | 2013-06-27 | Intel Corporation | Electrostatic discharge compliant patterned adhesive tape |
| JP6000668B2 (ja) * | 2012-06-07 | 2016-10-05 | 日東電工株式会社 | 半導体素子のマーキング方法、半導体装置の製造方法、及び半導体装置 |
| JP7264007B2 (ja) * | 2019-10-23 | 2023-04-25 | 株式会社村田製作所 | 電子部品連およびベーステープ |
| CN114015373A (zh) * | 2021-12-10 | 2022-02-08 | 苏州佳值电子工业有限公司 | 一种局部遮蔽的集成式双面胶带 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59158596A (ja) * | 1983-02-28 | 1984-09-08 | 奥井 徳次郎 | 小型電子部品の収納方法 |
| MY103125A (en) * | 1987-07-24 | 1993-04-30 | Lintec Corp | Cover tape for sealing chip-holding parts of carrier tape |
| JPH0219271A (ja) * | 1988-07-06 | 1990-01-23 | Toshiba Corp | 半導体装置用テーピング部品 |
| US4966282A (en) * | 1989-01-13 | 1990-10-30 | Nitto Denko Corporation | Electronic component carrier |
| US4944979A (en) * | 1989-10-19 | 1990-07-31 | At&T Bell Laboratories | Tape conveyers for components |
| EP0466937B2 (en) * | 1990-02-06 | 1998-03-18 | Sumitomo Bakelite Company Limited | Plastic carrier tape and cover tape for electronic component chip |
| MY107463A (en) * | 1991-02-28 | 1995-12-30 | Sumitomo Bakelite Co | Cover tape for packaging chip type electronic parts. |
| US5637368A (en) * | 1992-06-04 | 1997-06-10 | Minnesota Mining And Manufacturing Company | Adhesive tape having antistatic properties |
| US5343363A (en) * | 1992-12-21 | 1994-08-30 | Delco Electronics Corporation | Split backed pressure sensitive die carrier tape |
| DE4305910A1 (de) * | 1993-02-26 | 1994-09-01 | Beiersdorf Ag | Selbstklebender Verdeckelungsfilm für die Verpackung elektronischer Bauelemente |
| US5441809A (en) * | 1993-10-28 | 1995-08-15 | Brady U.S.A., Inc. | Dissipative cover tape surface mount device packaging |
| TW310121U (en) * | 1993-12-22 | 1997-07-01 | Lintec Corp | Cover tape |
| JPH07251860A (ja) * | 1994-03-10 | 1995-10-03 | Colcoat Eng Kk | 電子部品包装用カバーテープ及びその製法 |
| US5447784A (en) * | 1994-06-01 | 1995-09-05 | Rexham Industries Corp. | Electrostatic dissipating cover tape |
| US5491013A (en) * | 1994-08-31 | 1996-02-13 | Rexam Industries Corp. | Static-dissipating adhesive tape |
| US5524765A (en) * | 1994-11-15 | 1996-06-11 | Tempo G | Carrier tape packaging system utilizing a layer of gel for retaining small components |
-
1996
- 1996-09-13 US US08/713,504 patent/US6030692A/en not_active Expired - Lifetime
-
1997
- 1997-09-11 JP JP10513858A patent/JP2001500457A/ja active Pending
- 1997-09-11 CA CA002266471A patent/CA2266471C/en not_active Expired - Lifetime
- 1997-09-11 AT AT97941033T patent/ATE195400T1/de not_active IP Right Cessation
- 1997-09-11 EP EP97941033A patent/EP0925715B1/en not_active Expired - Lifetime
- 1997-09-11 WO PCT/US1997/016090 patent/WO1998011768A1/en not_active Ceased
- 1997-09-11 DE DE69702770T patent/DE69702770D1/de not_active Expired - Lifetime