JP2001500457A5 - - Google Patents

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Publication number: JP2001500457A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1998513858A

Other languages

English (en)

Other versions

JP2001500457A (ja

Filing date

1997-09-11

Publication date

2005-05-12

1996-09-13 Priority claimed from US08/713,504 external-priority patent/US6030692A/en

1997-09-11 Application filed filed Critical

2001-01-16 Publication of JP2001500457A publication Critical patent/JP2001500457A/ja

2005-05-12 Publication of JP2001500457A5 publication Critical patent/JP2001500457A5/ja

Status Pending legal-status Critical Current

Description

JP10513858A 1996-09-13 1997-09-11 形成されたテープパッキングシステムのためのカバーテープおよびその製造方法 Pending JP2001500457A (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US08/713,504		1996-09-13
US08/713,504 US6030692A (en)	1996-09-13	1996-09-13	Cover tape for formed tape packing system and process for making same
PCT/US1997/016090 WO1998011768A1 (en)	1996-09-13	1997-09-11	Cover tape for formed tape packing system and process for making same

Publications (2)

Publication Number	Publication Date
JP2001500457A JP2001500457A (ja)	2001-01-16
JP2001500457A5 true JP2001500457A5 (ja)	2005-05-12

Family

ID=24866404

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10513858A Pending JP2001500457A (ja)	1996-09-13	1997-09-11	形成されたテープパッキングシステムのためのカバーテープおよびその製造方法

Country Status (7)

Country	Link
US (1)	US6030692A (ja)
EP (1)	EP0925715B1 (ja)
JP (1)	JP2001500457A (ja)
AT (1)	ATE195400T1 (ja)
CA (1)	CA2266471C (ja)
DE (1)	DE69702770D1 (ja)
WO (1)	WO1998011768A1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3383935B2 (ja) *	1999-01-11	2003-03-10	北越製紙株式会社	電子デバイス用キャリアテープ紙
US6469372B2 (en) *	2000-05-16	2002-10-22	Texas Instruments Incorporated	Matched thermal expansion carrier tape assemblage for semiconductor devices
DE10044435A1 (de) *	2000-09-08	2002-04-04	Siemens Ag	Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt
WO2002102051A2 (en) *	2001-06-13	2002-12-19	International Product Technology,Inc.	Post-seal inspection system
SG115510A1 (en) *	2001-12-20	2005-10-28	Nitto Denko Corp	Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US7137985B2 (en) *	2003-09-24	2006-11-21	N Spine, Inc.	Marking and guidance method and system for flexible fixation of a spine
US7365414B2 (en) *	2003-12-01	2008-04-29	Intel Corporation	Component packaging apparatus, systems, and methods
US7575721B2 (en) *	2005-06-06	2009-08-18	Cepheid	Method and apparatus for storing and dispensing reagent beads
US8247057B2 (en)	2005-09-16	2012-08-21	3M Innovative Properties Company	Cover tape and method for manufacture
KR100777086B1 (ko)	2006-04-12	2007-11-19	안승배	전자 부품 이송용 커버 테이프 및 그 제조 방법
US20090246518A1 (en) *	2006-04-25	2009-10-01	Denki Kagaku Kogyo Kabushiki Kaisha	Cover film
US20080032099A1 (en) *	2006-07-20	2008-02-07	Elmer's Products, Inc.	Heat activated art mounting sheet
EP2049609A4 (en)	2006-08-09	2014-07-09	3M Innovative Properties Co	SUPPORTING STRIPS HAVING RECOVERY BANDS INITIATED TO THE DETECTION AND METHODS OF MAKING SAME
JP5554561B2 (ja) *	2007-04-11	2014-07-23	住友ベークライト株式会社	電子部品包装体
US8205766B2 (en) *	2009-05-20	2012-06-26	The Bergquist Company	Method for packaging thermal interface materials
US8430264B2 (en) *	2009-05-20	2013-04-30	The Bergquist Company	Method for packaging thermal interface materials
WO2011010453A1 (ja) *	2009-07-22	2011-01-27	住友ベークライト株式会社	電子部品包装用カバーテープおよび電子部品包装体
CN107039527A (zh)	2011-09-30	2017-08-11	英特尔公司	用于晶体管栅极的帽盖介电结构
US9177867B2 (en)	2011-09-30	2015-11-03	Intel Corporation	Tungsten gates for non-planar transistors
US9580776B2 (en)	2011-09-30	2017-02-28	Intel Corporation	Tungsten gates for non-planar transistors
US8981435B2 (en)	2011-10-01	2015-03-17	Intel Corporation	Source/drain contacts for non-planar transistors
US20130334713A1 (en) *	2011-12-22	2013-12-19	Dingying D. Xu	Electrostatic discharge compliant patterned adhesive tape
JP6000668B2 (ja) *	2012-06-07	2016-10-05	日東電工株式会社	半導体素子のマーキング方法、半導体装置の製造方法、及び半導体装置
JP7264007B2 (ja) *	2019-10-23	2023-04-25	株式会社村田製作所	電子部品連およびベーステープ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59158596A (ja) *	1983-02-28	1984-09-08	奥井　徳次郎	小型電子部品の収納方法
MY103125A (en) *	1987-07-24	1993-04-30	Lintec Corp	Cover tape for sealing chip-holding parts of carrier tape
JPH0219271A (ja) *	1988-07-06	1990-01-23	Toshiba Corp	半導体装置用テーピング部品
US4966282A (en) *	1989-01-13	1990-10-30	Nitto Denko Corporation	Electronic component carrier
US4944979A (en) *	1989-10-19	1990-07-31	At&T Bell Laboratories	Tape conveyers for components
DE69109756T3 (de) *	1990-02-06	1998-10-15	Sumitomo Bakelite Co	Trägerband aus plastik und abdeckband für elektronische chips.
TW203624B (ja) *	1991-02-28	1993-04-11	Sumitomo Bakelite Co
US5637368A (en) *	1992-06-04	1997-06-10	Minnesota Mining And Manufacturing Company	Adhesive tape having antistatic properties
US5343363A (en) *	1992-12-21	1994-08-30	Delco Electronics Corporation	Split backed pressure sensitive die carrier tape
DE4305910A1 (de) *	1993-02-26	1994-09-01	Beiersdorf Ag	Selbstklebender Verdeckelungsfilm für die Verpackung elektronischer Bauelemente
US5441809A (en) *	1993-10-28	1995-08-15	Brady U.S.A., Inc.	Dissipative cover tape surface mount device packaging
TW339840U (en) *	1993-12-22	1998-09-01	Lintec Corp	Coating applicator
JPH07251860A (ja) *	1994-03-10	1995-10-03	Colcoat Eng Kk	電子部品包装用カバーテープ及びその製法
US5447784A (en) *	1994-06-01	1995-09-05	Rexham Industries Corp.	Electrostatic dissipating cover tape
US5491013A (en) *	1994-08-31	1996-02-13	Rexam Industries Corp.	Static-dissipating adhesive tape
US5524765A (en) *	1994-11-15	1996-06-11	Tempo G	Carrier tape packaging system utilizing a layer of gel for retaining small components

1996
- 1996-09-13 US US08/713,504 patent/US6030692A/en not_active Expired - Lifetime
1997
- 1997-09-11 JP JP10513858A patent/JP2001500457A/ja active Pending
- 1997-09-11 CA CA002266471A patent/CA2266471C/en not_active Expired - Lifetime
- 1997-09-11 WO PCT/US1997/016090 patent/WO1998011768A1/en active IP Right Grant
- 1997-09-11 DE DE69702770T patent/DE69702770D1/de not_active Expired - Lifetime
- 1997-09-11 AT AT97941033T patent/ATE195400T1/de not_active IP Right Cessation
- 1997-09-11 EP EP97941033A patent/EP0925715B1/en not_active Expired - Lifetime

Publication	Publication Date	Title
JP2000506165A5 (ja)	2005-02-10
JP2001505104A5 (ja)	2005-07-14
JP2000501771A5 (ja)	2004-08-19
JP2000501599A5 (ja)	2005-05-12
JP2000501018A5 (ja)	2005-05-12
JP2000500076A5 (ja)	2005-07-14
JP2000501324A5 (ja)	2005-05-12
JP2000500055A5 (ja)	2005-04-07
JP2000501338A5 (ja)	2005-05-12
JP2000500874A5 (ja)	2005-04-07
JP2000502485A5 (ja)	2005-04-07
JP2000502570A5 (ja)	2004-11-18
JP2000500912A5 (ja)	2005-02-10
JP2000502568A5 (ja)	2004-11-11
JP2000503407A5 (ja)	2005-07-14
JP2001516520A5 (ja)	2005-07-14
JP2000501744A5 (ja)	2004-11-11
JP2000500857A5 (ja)	2005-03-10
JP2000501229A5 (ja)	2005-04-07
JP2001501602A5 (ja)	2005-05-12
JP2000502714A5 (ja)	2004-11-11
JP2000505469A5 (ja)	2004-11-25
JP2000500318A5 (ja)	2005-04-07
JP2000501569A5 (ja)	2005-05-12
JP2001500457A5 (ja)	2005-05-12