ATE195400T1 - Abdeckstreifen für formbandverpackung und herstellungsverfahren - Google Patents

Abdeckstreifen für formbandverpackung und herstellungsverfahren

Info

Publication number
ATE195400T1
ATE195400T1 AT97941033T AT97941033T ATE195400T1 AT E195400 T1 ATE195400 T1 AT E195400T1 AT 97941033 T AT97941033 T AT 97941033T AT 97941033 T AT97941033 T AT 97941033T AT E195400 T1 ATE195400 T1 AT E195400T1
Authority
AT
Austria
Prior art keywords
base film
layer
production process
cover strips
antistatic
Prior art date
Application number
AT97941033T
Other languages
German (de)
English (en)
Inventor
Thomas J Auger
Original Assignee
Neptco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neptco Inc filed Critical Neptco Inc
Application granted granted Critical
Publication of ATE195400T1 publication Critical patent/ATE195400T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Package Frames And Binding Bands (AREA)
  • Adhesive Tapes (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)
AT97941033T 1996-09-13 1997-09-11 Abdeckstreifen für formbandverpackung und herstellungsverfahren ATE195400T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/713,504 US6030692A (en) 1996-09-13 1996-09-13 Cover tape for formed tape packing system and process for making same
PCT/US1997/016090 WO1998011768A1 (en) 1996-09-13 1997-09-11 Cover tape for formed tape packing system and process for making same

Publications (1)

Publication Number Publication Date
ATE195400T1 true ATE195400T1 (de) 2000-08-15

Family

ID=24866404

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97941033T ATE195400T1 (de) 1996-09-13 1997-09-11 Abdeckstreifen für formbandverpackung und herstellungsverfahren

Country Status (7)

Country Link
US (1) US6030692A (enExample)
EP (1) EP0925715B1 (enExample)
JP (1) JP2001500457A (enExample)
AT (1) ATE195400T1 (enExample)
CA (1) CA2266471C (enExample)
DE (1) DE69702770D1 (enExample)
WO (1) WO1998011768A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383935B2 (ja) * 1999-01-11 2003-03-10 北越製紙株式会社 電子デバイス用キャリアテープ紙
US6469372B2 (en) * 2000-05-16 2002-10-22 Texas Instruments Incorporated Matched thermal expansion carrier tape assemblage for semiconductor devices
DE10044435A1 (de) * 2000-09-08 2002-04-04 Siemens Ag Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt
US20030044056A1 (en) * 2001-06-13 2003-03-06 Robotic Vision Systems, Inc. Post-seal inspection system
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US7137985B2 (en) * 2003-09-24 2006-11-21 N Spine, Inc. Marking and guidance method and system for flexible fixation of a spine
US20050116387A1 (en) * 2003-12-01 2005-06-02 Davison Peter A. Component packaging apparatus, systems, and methods
US7575721B2 (en) * 2005-06-06 2009-08-18 Cepheid Method and apparatus for storing and dispensing reagent beads
US8247057B2 (en) 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
KR100777086B1 (ko) 2006-04-12 2007-11-19 안승배 전자 부품 이송용 커버 테이프 및 그 제조 방법
JP5055270B2 (ja) * 2006-04-25 2012-10-24 電気化学工業株式会社 カバーフィルム
US20080032099A1 (en) * 2006-07-20 2008-02-07 Elmer's Products, Inc. Heat activated art mounting sheet
JP5238699B2 (ja) 2006-08-09 2013-07-17 スリーエム イノベイティブ プロパティズ カンパニー 引裂開始型カバーテープを有するキャリアテープ、及びその製造方法
MY151527A (en) * 2007-04-11 2014-05-30 Sumitomo Bakelite Co Packaged article containing electronic device
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
CN102470964B (zh) * 2009-07-22 2013-08-28 住友电木株式会社 电子部件包装用上带和电子部件包装体
KR101735976B1 (ko) 2011-09-30 2017-05-15 인텔 코포레이션 트랜지스터 게이트용 캡핑 유전체 구조를 형성하는 방법
US9580776B2 (en) 2011-09-30 2017-02-28 Intel Corporation Tungsten gates for non-planar transistors
KR101780916B1 (ko) 2011-09-30 2017-09-21 인텔 코포레이션 집적회로 구조 및 집적회로 구조의 제조 방법
DE112011105702T5 (de) 2011-10-01 2014-07-17 Intel Corporation Source-/Drain-Kontakte für nicht planare Transistoren
WO2013095527A1 (en) * 2011-12-22 2013-06-27 Intel Corporation Electrostatic discharge compliant patterned adhesive tape
JP6000668B2 (ja) * 2012-06-07 2016-10-05 日東電工株式会社 半導体素子のマーキング方法、半導体装置の製造方法、及び半導体装置
JP7264007B2 (ja) * 2019-10-23 2023-04-25 株式会社村田製作所 電子部品連およびベーステープ
CN114015373A (zh) * 2021-12-10 2022-02-08 苏州佳值电子工业有限公司 一种局部遮蔽的集成式双面胶带

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158596A (ja) * 1983-02-28 1984-09-08 奥井　徳次郎 小型電子部品の収納方法
MY103125A (en) * 1987-07-24 1993-04-30 Lintec Corp Cover tape for sealing chip-holding parts of carrier tape
JPH0219271A (ja) * 1988-07-06 1990-01-23 Toshiba Corp 半導体装置用テーピング部品
US4966282A (en) * 1989-01-13 1990-10-30 Nitto Denko Corporation Electronic component carrier
US4944979A (en) * 1989-10-19 1990-07-31 At&T Bell Laboratories Tape conveyers for components
EP0466937B2 (en) * 1990-02-06 1998-03-18 Sumitomo Bakelite Company Limited Plastic carrier tape and cover tape for electronic component chip
MY107463A (en) * 1991-02-28 1995-12-30 Sumitomo Bakelite Co Cover tape for packaging chip type electronic parts.
US5637368A (en) * 1992-06-04 1997-06-10 Minnesota Mining And Manufacturing Company Adhesive tape having antistatic properties
US5343363A (en) * 1992-12-21 1994-08-30 Delco Electronics Corporation Split backed pressure sensitive die carrier tape
DE4305910A1 (de) * 1993-02-26 1994-09-01 Beiersdorf Ag Selbstklebender Verdeckelungsfilm für die Verpackung elektronischer Bauelemente
US5441809A (en) * 1993-10-28 1995-08-15 Brady U.S.A., Inc. Dissipative cover tape surface mount device packaging
TW310121U (en) * 1993-12-22 1997-07-01 Lintec Corp Cover tape
JPH07251860A (ja) * 1994-03-10 1995-10-03 Colcoat Eng Kk 電子部品包装用カバーテープ及びその製法
US5447784A (en) * 1994-06-01 1995-09-05 Rexham Industries Corp. Electrostatic dissipating cover tape
US5491013A (en) * 1994-08-31 1996-02-13 Rexam Industries Corp. Static-dissipating adhesive tape
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components

Also Published As

Publication number Publication date
US6030692A (en) 2000-02-29
CA2266471C (en) 2008-01-29
CA2266471A1 (en) 1998-03-19
EP0925715B1 (en) 2000-08-09
DE69702770D1 (de) 2000-09-14
EP0925715A1 (en) 1999-06-30
WO1998011768A1 (en) 1998-03-19
JP2001500457A (ja) 2001-01-16

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties