JP2001351870A - 基板処理装置 - Google Patents
基板処理装置Info
- Publication number
- JP2001351870A JP2001351870A JP2000174330A JP2000174330A JP2001351870A JP 2001351870 A JP2001351870 A JP 2001351870A JP 2000174330 A JP2000174330 A JP 2000174330A JP 2000174330 A JP2000174330 A JP 2000174330A JP 2001351870 A JP2001351870 A JP 2001351870A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- container
- processing apparatus
- substrate processing
- valve body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 164
- 238000012545 processing Methods 0.000 title claims abstract description 73
- 230000001939 inductive effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 48
- 239000007789 gas Substances 0.000 description 47
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 102100033040 Carbonic anhydrase 12 Human genes 0.000 description 1
- 101000867855 Homo sapiens Carbonic anhydrase 12 Proteins 0.000 description 1
- 101000783705 Myxoma virus (strain Uriarra) Envelope protein A28 homolog Proteins 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174330A JP2001351870A (ja) | 2000-06-09 | 2000-06-09 | 基板処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174330A JP2001351870A (ja) | 2000-06-09 | 2000-06-09 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001351870A true JP2001351870A (ja) | 2001-12-21 |
| JP2001351870A5 JP2001351870A5 (https=) | 2004-11-04 |
Family
ID=18676394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000174330A Pending JP2001351870A (ja) | 2000-06-09 | 2000-06-09 | 基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001351870A (https=) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071271A (ja) * | 2001-09-03 | 2003-03-11 | Foi:Kk | プラズマ処理装置 |
| JP2004063925A (ja) * | 2002-07-31 | 2004-02-26 | Mitsubishi Heavy Ind Ltd | プラズマ処理装置及びプラズマ処理方法 |
| JP2012104488A (ja) * | 2011-12-08 | 2012-05-31 | Lam Research Corporation | プラズマ処理装置 |
| WO2020012154A1 (en) * | 2018-07-09 | 2020-01-16 | Edwards Limited | Vacuum pump with through channel and vacuum chamber |
| WO2020190783A1 (en) * | 2019-03-15 | 2020-09-24 | Lam Research Corporation | Turbomolecular pump and cathode assembly for etching reactor |
| GB2584160A (en) * | 2019-05-24 | 2020-11-25 | Edwards Ltd | Vacuum assembly and vacuum pump with an axial through passage |
| WO2021181498A1 (ja) * | 2020-03-10 | 2021-09-16 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、排気流量制御装置及び半導体装置の製造方法 |
-
2000
- 2000-06-09 JP JP2000174330A patent/JP2001351870A/ja active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071271A (ja) * | 2001-09-03 | 2003-03-11 | Foi:Kk | プラズマ処理装置 |
| JP2004063925A (ja) * | 2002-07-31 | 2004-02-26 | Mitsubishi Heavy Ind Ltd | プラズマ処理装置及びプラズマ処理方法 |
| JP2012104488A (ja) * | 2011-12-08 | 2012-05-31 | Lam Research Corporation | プラズマ処理装置 |
| TWI801624B (zh) * | 2018-07-09 | 2023-05-11 | 英商愛德華有限公司 | 具有貫通通道的真空幫浦及真空腔室 |
| WO2020012154A1 (en) * | 2018-07-09 | 2020-01-16 | Edwards Limited | Vacuum pump with through channel and vacuum chamber |
| JP7394826B2 (ja) | 2018-07-09 | 2023-12-08 | エドワーズ リミテッド | スルーチャネル及び真空チャンバを備えた真空ポンプ |
| JP2021524556A (ja) * | 2018-07-09 | 2021-09-13 | エドワーズ リミテッド | スルーチャネル及び真空チャンバを備えた真空ポンプ |
| WO2020190783A1 (en) * | 2019-03-15 | 2020-09-24 | Lam Research Corporation | Turbomolecular pump and cathode assembly for etching reactor |
| KR20210129730A (ko) * | 2019-03-15 | 2021-10-28 | 램 리써치 코포레이션 | 에칭 반응기용 터보 분자 펌프 및 캐소드 어셈블리 |
| JP2022525753A (ja) * | 2019-03-15 | 2022-05-19 | ラム リサーチ コーポレーション | エッチングリアクタ用のターボ分子ポンプおよびカソードアセンブリ |
| JP7511570B2 (ja) | 2019-03-15 | 2024-07-05 | ラム リサーチ コーポレーション | エッチングリアクタ用のターボ分子ポンプおよびカソードアセンブリ |
| JP2024123194A (ja) * | 2019-03-15 | 2024-09-10 | ラム リサーチ コーポレーション | エッチングリアクタ用のターボ分子ポンプおよびカソードアセンブリ |
| US12106946B2 (en) | 2019-03-15 | 2024-10-01 | Lam Research Corporation | Turbomolecular pump and cathode assembly for etching reactor |
| KR102784967B1 (ko) * | 2019-03-15 | 2025-03-20 | 램 리써치 코포레이션 | 에칭 반응기용 터보 분자 펌프 및 캐소드 어셈블리 |
| JP7729951B2 (ja) | 2019-03-15 | 2025-08-26 | ラム リサーチ コーポレーション | エッチングリアクタ用のターボ分子ポンプおよびカソードアセンブリ |
| GB2584160A (en) * | 2019-05-24 | 2020-11-25 | Edwards Ltd | Vacuum assembly and vacuum pump with an axial through passage |
| WO2021182292A1 (ja) * | 2020-03-10 | 2021-09-16 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、排気流量制御装置及び半導体装置の製造方法 |
| WO2021181498A1 (ja) * | 2020-03-10 | 2021-09-16 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、排気流量制御装置及び半導体装置の製造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3667202B2 (ja) | 基板処理装置 | |
| KR100231255B1 (ko) | 처리장치의 진공배기 시스템 | |
| CN107868946B (zh) | 气体导入机构和处理装置 | |
| TW432466B (en) | Plasma processing apparatus | |
| JPH05291158A (ja) | 熱処理装置 | |
| TW200805491A (en) | Processing system | |
| US12469683B2 (en) | Water vapor plasma to enhance surface hydrophilicity | |
| KR101241570B1 (ko) | 기판 처리 방법 및 기판 처리 장치 | |
| WO2018140789A1 (en) | Systems and methods for rotating and translating a substrate in a process chamber | |
| US20210214845A1 (en) | Substrate processing apparatus and rotary drive method | |
| JP2011204944A (ja) | 基板処理装置および基板処理方法 | |
| JP2015056448A (ja) | 基板処理方法および基板処理装置 | |
| JP4867074B2 (ja) | 枚葉式の処理装置 | |
| JP2001351870A (ja) | 基板処理装置 | |
| CN112513322B (zh) | 成膜装置 | |
| JP2004235559A (ja) | 基板処理方法および基板処理装置 | |
| JP2008131019A (ja) | ガス導入機構及び被処理体の処理装置 | |
| KR100588041B1 (ko) | 진공 처리 장치 및 이것을 이용한 진공 처리 방법 | |
| US12385132B2 (en) | Substrate processing apparatus and substrate processing method | |
| JP2020170808A (ja) | 処理液生成装置、基板処理装置、処理液生成方法および基板処理方法 | |
| JP4361179B2 (ja) | オゾン処理装置及びオゾン処理方法 | |
| WO1997015073A1 (en) | Semiconductor treatment apparatus | |
| JP5852927B2 (ja) | 基板処理方法 | |
| JPH09115889A (ja) | 半導体エッチング装置及びその方法 | |
| US20250266269A1 (en) | Substrate processing apparatus and substrate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040513 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040525 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040715 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20051129 |