JP2001323249A5 - - Google Patents
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- Publication number
- JP2001323249A5 JP2001323249A5 JP2000144270A JP2000144270A JP2001323249A5 JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5 JP 2000144270 A JP2000144270 A JP 2000144270A JP 2000144270 A JP2000144270 A JP 2000144270A JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit connection
- heat
- curing agent
- connection according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 3
- 238000000113 differential scanning calorimetry Methods 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144270A JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144270A JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005238698A Division JP2006028521A (ja) | 2005-08-19 | 2005-08-19 | 回路接続用接着剤 |
| JP2005331857A Division JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001323249A JP2001323249A (ja) | 2001-11-22 |
| JP2001323249A5 true JP2001323249A5 (cg-RX-API-DMAC7.html) | 2005-11-04 |
| JP4433564B2 JP4433564B2 (ja) | 2010-03-17 |
Family
ID=18650948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144270A Expired - Fee Related JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4433564B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7618713B2 (en) | 1997-03-31 | 2009-11-17 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
| JP2005194413A (ja) * | 2004-01-08 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
| JP4970767B2 (ja) * | 2005-10-26 | 2012-07-11 | リンテック株式会社 | 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法 |
| JP4626495B2 (ja) * | 2005-11-16 | 2011-02-09 | 日立化成工業株式会社 | 回路接続用接着剤 |
| JP4650456B2 (ja) | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
| EP2146404A1 (en) | 2007-05-09 | 2010-01-20 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| KR101157771B1 (ko) * | 2007-05-09 | 2012-06-25 | 히다치 가세고교 가부시끼가이샤 | 도전체 접속용 부재, 접속 구조 및 태양 전지 모듈 |
| KR101139749B1 (ko) * | 2007-08-10 | 2012-04-26 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 접착제 및 접합체 |
| CN102559077A (zh) | 2007-10-15 | 2012-07-11 | 日立化成工业株式会社 | 粘接膜作为电路连接材料的用途以及粘接膜用于电路连接材料的制造的用途 |
| JP5779895B2 (ja) * | 2011-02-08 | 2015-09-16 | 東レ株式会社 | 半導体用絶縁性接着剤 |
| JP5868823B2 (ja) * | 2012-10-01 | 2016-02-24 | 日立化成株式会社 | 異方導電フィルム |
| CN110461984A (zh) * | 2017-03-29 | 2019-11-15 | 日立化成株式会社 | 粘接剂组合物及结构体 |
| JP7234032B2 (ja) * | 2019-05-15 | 2023-03-07 | デクセリアルズ株式会社 | 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法 |
-
2000
- 2000-05-17 JP JP2000144270A patent/JP4433564B2/ja not_active Expired - Fee Related
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