JP2001316895A - 電解メッキ装置及び電解メッキ方法 - Google Patents

電解メッキ装置及び電解メッキ方法

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Publication number
JP2001316895A
JP2001316895A JP2000135246A JP2000135246A JP2001316895A JP 2001316895 A JP2001316895 A JP 2001316895A JP 2000135246 A JP2000135246 A JP 2000135246A JP 2000135246 A JP2000135246 A JP 2000135246A JP 2001316895 A JP2001316895 A JP 2001316895A
Authority
JP
Japan
Prior art keywords
anode
plating
region
electrolytic plating
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000135246A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001316895A5 (https=
Inventor
Yasushi Yagi
靖司 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000135246A priority Critical patent/JP2001316895A/ja
Publication of JP2001316895A publication Critical patent/JP2001316895A/ja
Publication of JP2001316895A5 publication Critical patent/JP2001316895A5/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2000135246A 2000-05-08 2000-05-08 電解メッキ装置及び電解メッキ方法 Pending JP2001316895A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000135246A JP2001316895A (ja) 2000-05-08 2000-05-08 電解メッキ装置及び電解メッキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000135246A JP2001316895A (ja) 2000-05-08 2000-05-08 電解メッキ装置及び電解メッキ方法

Publications (2)

Publication Number Publication Date
JP2001316895A true JP2001316895A (ja) 2001-11-16
JP2001316895A5 JP2001316895A5 (https=) 2007-04-26

Family

ID=18643360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000135246A Pending JP2001316895A (ja) 2000-05-08 2000-05-08 電解メッキ装置及び電解メッキ方法

Country Status (1)

Country Link
JP (1) JP2001316895A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100827481B1 (ko) * 2006-08-24 2008-05-06 동부일렉트로닉스 주식회사 웨이퍼의 도금장치
KR101191543B1 (ko) 2010-08-09 2012-10-15 주식회사 케이씨텍 기판 도금 장치
KR101217460B1 (ko) * 2010-11-11 2013-01-02 주식회사 케이씨텍 기판 도금 장치
JP2016117918A (ja) * 2014-12-18 2016-06-30 三菱マテリアル株式会社 電解めっき方法及び電解めっき装置
CN117721511A (zh) * 2024-02-07 2024-03-19 苏州智程半导体科技股份有限公司 一种快速补充金属离子的半导体晶圆电化学沉积设备

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100827481B1 (ko) * 2006-08-24 2008-05-06 동부일렉트로닉스 주식회사 웨이퍼의 도금장치
KR101191543B1 (ko) 2010-08-09 2012-10-15 주식회사 케이씨텍 기판 도금 장치
KR101217460B1 (ko) * 2010-11-11 2013-01-02 주식회사 케이씨텍 기판 도금 장치
JP2016117918A (ja) * 2014-12-18 2016-06-30 三菱マテリアル株式会社 電解めっき方法及び電解めっき装置
CN117721511A (zh) * 2024-02-07 2024-03-19 苏州智程半导体科技股份有限公司 一种快速补充金属离子的半导体晶圆电化学沉积设备

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