JP2001316871A - 液処理方法、及び液処理装置 - Google Patents

液処理方法、及び液処理装置

Info

Publication number
JP2001316871A
JP2001316871A JP2000174447A JP2000174447A JP2001316871A JP 2001316871 A JP2001316871 A JP 2001316871A JP 2000174447 A JP2000174447 A JP 2000174447A JP 2000174447 A JP2000174447 A JP 2000174447A JP 2001316871 A JP2001316871 A JP 2001316871A
Authority
JP
Japan
Prior art keywords
liquid
processing
processed
plating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000174447A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001316871A5 (https=
Inventor
Wataru Okase
亘 大加瀬
Takenobu Matsuo
剛伸 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000174447A priority Critical patent/JP2001316871A/ja
Publication of JP2001316871A publication Critical patent/JP2001316871A/ja
Publication of JP2001316871A5 publication Critical patent/JP2001316871A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000174447A 2000-05-08 2000-05-08 液処理方法、及び液処理装置 Pending JP2001316871A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000174447A JP2001316871A (ja) 2000-05-08 2000-05-08 液処理方法、及び液処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000174447A JP2001316871A (ja) 2000-05-08 2000-05-08 液処理方法、及び液処理装置

Publications (2)

Publication Number Publication Date
JP2001316871A true JP2001316871A (ja) 2001-11-16
JP2001316871A5 JP2001316871A5 (https=) 2007-06-14

Family

ID=18676484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000174447A Pending JP2001316871A (ja) 2000-05-08 2000-05-08 液処理方法、及び液処理装置

Country Status (1)

Country Link
JP (1) JP2001316871A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3490993B2 (ja) 2001-10-29 2004-01-26 アプライド マテリアルズ インコーポレイテッド めっき方法
JP2004513222A (ja) * 2000-07-07 2004-04-30 アプライド　マテリアルズ　インコーポレイテッド 金属堆積のため挿入する際に基板を傾斜させる方法及び関連する装置
WO2002029137A3 (en) * 2000-10-03 2004-08-05 Applied Materials Inc Method and associated apparatus for tilting a substrate upon entry for metal deposition
WO2004075266A3 (en) * 2003-02-18 2004-11-11 Applied Materials Inc Method for immersing a substrate
CN118007221A (zh) * 2024-04-10 2024-05-10 苏州智程半导体科技股份有限公司 一种晶圆水平电镀腔室

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280292A (ja) * 1985-10-02 1987-04-13 Hitachi Ltd めつき方法及びその装置
JPH02190476A (ja) * 1989-01-17 1990-07-26 Nec Corp 噴流めっき装置
JPH0299970U (https=) * 1989-01-20 1990-08-09
JPH0522557U (ja) * 1991-07-29 1993-03-23 山形日本電気株式会社 噴流式めつき装置
JPH0637355U (ja) * 1992-10-14 1994-05-17 カシオ計算機株式会社 ウエハ用メッキ装置
JPH06140407A (ja) * 1992-04-27 1994-05-20 Nec Corp めっき処理装置
JPH07211719A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd めっき方法
JPH07335650A (ja) * 1994-06-08 1995-12-22 Keiichiro Suganuma 半導体の製造方法
JPH10204679A (ja) * 1997-01-20 1998-08-04 Electroplating Eng Of Japan Co カップ式めっき装置
JPH11209890A (ja) * 1998-01-28 1999-08-03 Electroplating Eng Of Japan Co カップ式めっき方法及びそれに用いるカップ式めっき装置
JPH11279797A (ja) * 1998-03-27 1999-10-12 Dainippon Screen Mfg Co Ltd 基板メッキ装置
JP2001049495A (ja) * 1999-08-12 2001-02-20 Ebara Corp めっき装置及びめっき方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280292A (ja) * 1985-10-02 1987-04-13 Hitachi Ltd めつき方法及びその装置
JPH02190476A (ja) * 1989-01-17 1990-07-26 Nec Corp 噴流めっき装置
JPH0299970U (https=) * 1989-01-20 1990-08-09
JPH0522557U (ja) * 1991-07-29 1993-03-23 山形日本電気株式会社 噴流式めつき装置
JPH06140407A (ja) * 1992-04-27 1994-05-20 Nec Corp めっき処理装置
JPH0637355U (ja) * 1992-10-14 1994-05-17 カシオ計算機株式会社 ウエハ用メッキ装置
JPH07211719A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd めっき方法
JPH07335650A (ja) * 1994-06-08 1995-12-22 Keiichiro Suganuma 半導体の製造方法
JPH10204679A (ja) * 1997-01-20 1998-08-04 Electroplating Eng Of Japan Co カップ式めっき装置
JPH11209890A (ja) * 1998-01-28 1999-08-03 Electroplating Eng Of Japan Co カップ式めっき方法及びそれに用いるカップ式めっき装置
JPH11279797A (ja) * 1998-03-27 1999-10-12 Dainippon Screen Mfg Co Ltd 基板メッキ装置
JP2001049495A (ja) * 1999-08-12 2001-02-20 Ebara Corp めっき装置及びめっき方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004513222A (ja) * 2000-07-07 2004-04-30 アプライド　マテリアルズ　インコーポレイテッド 金属堆積のため挿入する際に基板を傾斜させる方法及び関連する装置
WO2002004711A3 (en) * 2000-07-07 2004-05-06 Applied Materials Inc Method and associated apparatus for tilting a substrate upon entry for metal deposition
WO2002029137A3 (en) * 2000-10-03 2004-08-05 Applied Materials Inc Method and associated apparatus for tilting a substrate upon entry for metal deposition
JP3490993B2 (ja) 2001-10-29 2004-01-26 アプライド マテリアルズ インコーポレイテッド めっき方法
WO2004075266A3 (en) * 2003-02-18 2004-11-11 Applied Materials Inc Method for immersing a substrate
CN118007221A (zh) * 2024-04-10 2024-05-10 苏州智程半导体科技股份有限公司 一种晶圆水平电镀腔室

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