JP2001313452A - Manufacturing method and apparatus of thick-film conductive circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a mass production manufacturing step of a thick-film con ductive circuit board which is suitable for a non contact ID card and the like. SOLUTION: While a resin film base 2 is carried continuously from an unwinding apparatus 3 to a winding apparatus 8, an electron beam curing conductive paste 5 is printed on the resin film 2 by a rotary screen printer 4, to from a thick-film conducting circuit pattern. The thick-film conductive circuit pattern is irradiated with an electron beam and cured by an electron beam irradiation apparatus 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a thick-film conductor circuit board used for a non-contact ID card, a non-contact tag, and the like.

[0002]

2. Description of the Related Art As is well known, a thick-film conductor circuit serving as an antenna of a non-contact ID card, a non-contact tag, etc. (hereinafter collectively referred to as non-contact ID cards) is made of polycarbonate or polyester. , Silver paste on a resin film substrate such as polyester alloy or vinyl chloride,
For example, printing to a thickness of 10 μm to 30 μm,
It is formed by drying or hardening it using a hot air circulation furnace or a combined furnace using both hot air and infrared rays.

As a typical example of such a silver paste,
Heat-curable, and non-solvent type epoxy resin-based silver paste and solvent-dried type vinyl resin-based silver paste, but when using these pastes,
It is necessary to heat at 120 ° C. to 150 ° C. for 10 minutes to 30 minutes.

[0004] Therefore, for example, a resin film substrate is 1 m
In order to convey at a speed of 120 ° C./min and to cure by heating with hot air at 120 ° C. for 30 minutes, a long hot air circulating furnace having a total length of 30 m or more must be installed.

In order to increase the productivity, the heat resistance must be 15
If a resin film substrate at 0 ° C. or higher is conveyed at a speed of 5 m / min and heated with hot air at 150 ° C. for 10 minutes to be cured, a longer hot air circulation furnace having a total length of 50 m or more must be installed. Therefore, a long installation space is required, and it is difficult to transfer the resin film substrate with a constant low tension in such a long high-temperature atmosphere.

In addition, printability, adhesiveness, laminability,
From the viewpoints of embossability and price, heat deformation temperature is generally low heat-resistant resin film substrate of 120 ° C. or less, and such a resin film substrate is often used.
If the resin film substrate is dried or cured by passing through a long heating atmosphere, the resin film substrate is dimensionally deformed by 0.1% to 0.5% in the vertical and horizontal directions after the drying or curing. Since the deformation is not uniform in the plane due to the deformation, in an extreme case, the resin film substrate may undulate, warp or wrinkle, and in particular, transfer the web-shaped resin film substrate in a roll-to-roll manner. This is remarkable in the case where it is performed, so that not only the appearance quality of the resin film substrate is degraded, but also the function is poor, such as the disconnection of the conductor circuit itself and the change in impedance of the thick film conductor circuit serving as an antenna. Had an effect.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks.
A method of manufacturing a thick-film conductor circuit board capable of forming and curing a thick-film conductor circuit pattern having excellent electrical and mechanical properties at high speed on a continuously fed resin film substrate and realizing mass production, and a method thereof. It is to provide a device.

A second object of the present invention is to form and cure a thick-film conductor circuit pattern having excellent electrical and mechanical characteristics at high speed without causing undulation or dimensional change in a continuously fed resin film substrate. It is an object of the present invention to provide a method and an apparatus for manufacturing a thick-film conductor circuit board that can be mass-produced.

[0009]

In order to achieve the first object, according to the present invention, an active energy ray-curable conductive paste is printed on a continuously fed resin film substrate using a rotary printing machine. Then, a thick-film conductor circuit pattern is formed, and the printed thick-film conductor circuit pattern is irradiated with active energy rays to be cured.

In order to achieve the second object, an electron beam-curable conductive paste, which is one of the active energy ray-curable conductive pastes, is used. The pattern is irradiated with an electron beam to be cured.

As described above, in the former, since the rotary printing press and the active energy ray-curable conductive paste are used, a thick film having excellent electrical and mechanical properties is formed on the continuously fed resin film substrate. The conductor circuit pattern can be formed and cured at high speed.

In the latter, since a rotary printing machine and an electron beam-curable conductive paste are used, the resin film substrate which is continuously fed can be electrically and mechanically operated without causing undulation or dimensional change. Thick-film conductor circuit pattern with excellent mechanical characteristics can be formed and cured at high speed.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a resin film substrate for forming a thick-film conductor circuit pattern is continuously fed from a substrate unwinding side to a substrate winding side, and then the resin film substrate which is continuously fed is formed. After printing the active energy ray-curable conductive paste using a rotary printing machine to form a thick-film conductor circuit pattern, the printed thick-film conductor circuit pattern is irradiated with active energy rays and cured. Such an active energy ray-curable conductive paste,
It is a paste containing a conductive substance and an active energy ray polymerizable compound.

As the conductive material, for example, gold, silver,
Copper, silver-plated copper powder, silver-copper composite powder, silver-copper alloy, nickel, chromium, palladium, aluminum, tungsten, molybdenum, platinum and other metal powders, inorganic powder coated with these metals, silver oxide, indium oxide And the like, powders coated with these metal oxides, carbon black, graphite and the like.

These conductive substances may be used in combination of two or more kinds, and among them, silver powder is preferable because of its high conductivity and little increase in resistance due to oxidation. In addition, the shape of the conductive material may be any shape such as a granular shape, a spherical shape, a flake shape, a flake shape, a plate shape, a dendritic shape, a cubic shape, and the like. From the viewpoint of properties, dendritic, scaly or spherical ones are preferred. Further, the average particle size is generally 0.1
The thickness is from 1 μm to 100 μm, but from 1 μm to 50 μm is preferable from the viewpoint of the conductivity and the fluidity of the conductive paste.

On the other hand, the active energy ray polymerizable compound is
A compound having an ethylenically unsaturated group such as a (meth) acrylic acid, a (meth) acrylate-based compound, a vinyl ether-based compound, and a polyallyl compound, which is polymerized by irradiation with an active energy ray, is generally used.

The compounding ratio of the above-mentioned conductive substance and the active energy ray-polymerizable compound is generally from 95% to 55% by weight of the conductive substance based on the total amount of the conductive substance and the active energy ray-polymerizable compound. By weight, the active energy ray polymerizable compound is from 5% to 45% by weight. If the compounding ratio of the conductive substance exceeds 95% by weight, the coating film formed using the conductive paste becomes brittle and the conductivity decreases,
If it is less than 55% by weight, sufficient conductivity cannot be obtained. Preferably, the conductive substance is 90% to 60% by weight, and the active energy ray polymerizable compound is 10% to 40% by weight.

The active energy ray-curable conductive paste may be added to a suitable solvent (for example, Kents, aromatics, alcohols, etc.) for adjusting the viscosity or film forming, if necessary. A binder polymer for adjusting the properties and the like are added, and in the case of an ultraviolet-curable conductive paste, a photopolymerization initiator and a photopolymerization initiation auxiliary agent are added.

The active energy ray is an energy ray used as a trigger for curing the conductive paste. Examples of the active energy ray include ultraviolet rays, electron rays, γ rays, infrared rays, and visible rays. An electron beam is preferred in terms of its curability and its influence on the substrate on which the conductive circuit is formed.

In general, it is preferable to irradiate the active energy ray under such conditions that the cured product of the composition obtained by removing the conductive substance from the conductive paste has a glass transition point of 0 ° C. to 200 ° C. If the glass transition point of the cured product exceeds 200 ° C., the initial conductivity and the adhesiveness of the base material are deteriorated, which is not suitable for practical use. If it is less than 0 ° C., the hardness and mechanical strength of the paste are insufficient. Easy to be.

The electron beam is preferably 100 KV to 100 KV.
It is obtained by an electron irradiation device having an acceleration voltage in the range of 0 KV, more preferably 150 KV to 250 KV. With an electron beam having an acceleration voltage of less than 100 KV, it is difficult to harden the inside of the conductor circuit, and with an electron beam exceeding 1000 KV, damage to the substrate is increased.

As the resin film substrate, a predetermined one can be appropriately selected. In the case of electron beam irradiation, a resin film having a softening point or a glass transition point at a low temperature, for example, a polyester alloy film, polyester Films and polyvinyl chloride films are preferred.

In the present invention, as described above, the active energy ray-curable conductive paste is printed by a rotary printer while continuously feeding the resin film substrate to form a thick-film conductor circuit pattern. Therefore, a thick-film conductor circuit pattern having excellent electrical and mechanical characteristics can be formed and cured at a high speed on a continuously fed resin film substrate.

The dry film thickness of such a thick conductor circuit pattern is generally 20 μm to 2 μm from the viewpoint of circuit resistance and curability.
When the film thickness is less than 20 μm, the probability of contact between the conductive substances in the film thickness direction is low, and the volume resistance tends to vary, resulting in unstable circuit resistance. On the other hand, if the film thickness is larger than 200 μm, the active energy ray cannot reach the inside of the conductor circuit, and is likely to be uncured.

A rotary printing machine is used as described above, which enables continuous printing of the active energy ray-curable conductive paste, and prints it at a high speed and with a uniform thickness. be able to. The rotary printing machine may be any of a lithographic printing type, an intaglio printing type, and a screen printing type. However, among them, the rotary screen printing machine is the most suitable because the conductive paste has excellent plate separation properties, can have a large film thickness, and can form a low-resistance conductor circuit. preferable.

Subsequently, the resin film substrate is continuously fed, so that the thick film conductor circuit pattern printed and formed by the rotary printing machine is transferred to the active energy ray irradiation zone, where the active energy ray irradiation is performed. Equipment is installed. This active energy ray irradiation device irradiates an active energy ray to a thick film conductor circuit pattern. During this time, the resin film substrate is continuously fed, and the thick-film conductor circuit pattern is cured and fixed by the irradiation of the active energy rays.

The above-mentioned active energy ray irradiation apparatus can be selected from predetermined ones, for example, an ultraviolet irradiation type, an electron beam irradiation type, an infrared irradiation type and the like. The line irradiation type is most preferable,
When an electron beam irradiation type is used, an electron beam curing type conductive paste is selected.

FIG. 1 shows a thick film conductor circuit board manufacturing apparatus 1 provided with an area beam type electron beam irradiation apparatus 6. The manufacturing apparatus 1 sends out a web-shaped resin film substrate 2 from an unwinder 3 and winds it up by a winder 8. At this time, the resin film substrate 2 is continuously transferred between the unwinding machine 3 and the winding machine 8, and the electron beam-curable conductive paste 5 is printed thereon by the rotary screen printing machine 4, thereby forming a thick film conductor circuit. The pattern is formed, and then the thick film conductor circuit pattern is irradiated with an electron beam by the electron beam irradiation device 6 to be cured and fixed.

The above-mentioned electron beam irradiation device 6 heats the filament 606 in a vacuum atmosphere to generate thermoelectrons, accelerates it by a potential difference, transmits through the irradiation window 602 made of Ti metal, and enters the electron beam into the chamber 604. Is irradiated. Further, the electron beam irradiator is provided with a nitrogen gas seal 605 for suppressing generation of ozone, and an X-ray shielding partition 603 for preventing X-rays from leaking out of the chamber 604. .

It should be noted that ultraviolet irradiation as active energy ray irradiation has a low light energy, requires the addition of a photopolymerization initiator or a photopolymerization initiation aid, and is light. It has drawbacks such as the tendency of uneven curing to easily occur in the shaded portions that are not irradiated.

On the other hand, the electron beam irradiation can be cured in a short time (instantly) and without applying heat to the resin film substrate. Therefore, this is more preferable, and various types of electron beam irradiation can be used. Among the apparatuses, the area beam type is most preferable because it is wide and excellent in uniform irradiation.

As described above, in the present invention, the active energy ray irradiation method is employed, unlike the conventional technique in which curing is performed by heating for a long time using a long hot air circulation furnace. Therefore, according to the present invention, an effect that cannot be obtained by such a conventional technique, that is, a thick film conductor circuit pattern having excellent electrical and mechanical properties is formed and cured at high speed on a continuously fed resin film substrate. Therefore, an effect that mass production can be achieved can be obtained. In addition, the adoption of the electron beam irradiation method enables high-speed formation and curing of a thick-film conductor circuit pattern having excellent electrical and mechanical properties without generating undulation, warpage, wrinkles, and dimensional changes. Thus, the effect that mass production can be achieved can be obtained.

In the manufacturing apparatus shown in FIG. 1, the resin film substrate 2 irradiated with the electron beam is transferred by a driving roller 601 and taken up by a film take-up machine 8. The unwinding machine 3, the rotary screen printing machine 4, the area beam type electron beam irradiating device 6, and the winding machine 8 absorb the difference in the substrate transfer speed between the devices so that a stable operation can be performed among the respective processes. A vacuum-type buffer device 301 for reducing the tension and maintaining the tension at an appropriate value is provided.

The rotary screen printing machine 4 is
The rotary screen printer 4 and the area beam type electron beam irradiation device 6 are provided with a rotatable screen 402 and a press roller 401, and are operated synchronously with each other. This is performed through the control devices 9 and 11, whereby the irradiation amount of the electron beam at the time of rising and falling of the transfer speed of the resin film substrate 2 or at the time of changing the printing condition is kept constant, and the length of the resin film substrate 2 is kept constant. Uniform curing level in the direction (full length direction) to stabilize quality.

Therefore, as shown in FIG. 2 which is a plan view, the web-shaped (wide) resin film substrate 2
In addition, for example, the thick film conductor circuit 10 (or 2
0) can be formed 4 × 4. In addition, cross-shaped alignment marks 30 are provided at the four corners. FIG. 3 shows an enlarged view of the thick-film conductor circuit 10 for four turns, and FIG. 4 shows an enlarged view of the thick-film conductor circuit 20 for six turns.

As described above, in the present invention, since the method for curing the conductive paste by irradiation with active energy for a short time is employed, the resin film substrate is not heated. It is also advantageous in that a resin film substrate having a heat resistant temperature of 150 ° C. or less can be applied, which is difficult to apply with a curable conductive paste.

For example, as a resin film substrate, a “polyester alloy film (softening temperature: 80 ° C. to 120 ° C.)
℃) ”,“ Polyester film (glass transition point 70 ° C)
-85 ° C), “Polyvinyl chloride-based film (softening point 70
C.-80.degree. C.), "polyphenylene sulfide film (glass transition point 90.degree. C.)", "polycarbonate film (glass transition point 150.degree. C.)", "polysulfone film (glass transition point 190.degree. C.)", "polyether sulfone film" (Glass transition point of 225 ° C.) ", among others. Among these, polyester alloy-based films, polyester films, polyvinyl chloride-based films, polyphenylene sulfide films, and polycarbonate films exhibiting a low-temperature softening point or glass transition. It is effective for.

More specifically, as a preferred embodiment, a resin film substrate having a heat deformation temperature of 150 ° C. or less as described above is used, and an electron beam of 75 KV to 300 KV is used.
Irradiation for 02 seconds to 1 second is mentioned. in this case,
If the irradiation time of the electron beam exceeds several seconds, the electron beam may deteriorate the resin film substrate. Therefore, in order to completely prevent the deterioration of the resin film substrate, the irradiation time should be 1
Seconds or less are preferred.

The rotary screen printing machine 4 may be mounted as shown in FIGS. In this case, the screen 402 and the press roller 40
1 is mounted on an XY stage. The XY stage includes a lower X stage 404 and an upper Y stage 403.
And a bracket 405 on which the screen 402 and the press roller 401 are supported is fixed on the Y stage 403.

For this reason, the positional deviation between the alignment mark (not shown) provided on the resin film substrate 2 and the printed thick-film conductor circuit pattern is read by a camera, and the screen 402 and the press roller 401 are moved to the X direction.
The position is corrected in the direction of the axis and the Y-axis so as to minimize the displacement. As a result, the thick-film conductor circuit pattern to be subsequently printed can be accurately positioned with respect to the preceding thick-film conductor circuit pattern printed on the resin film substrate 2, and therefore, a precise relative positional relationship can be obtained one after another. Can be printed while keeping

It should be noted that, unlike the above, a device for controlling the end face position of the resin film substrate 2 which is continuously fed may be provided so as to be able to adjust the printing position in the X-axis direction.
For the axial direction, the actual resin film substrate feed amount is
The printing position may be adjusted by controlling the rotation timing of the screen 402 in a predetermined manner so as to match the movement amount obtained by recognizing a plurality of alignment marks (not shown) provided on the substrate 2. .

In any case, printing can be easily and accurately performed by providing a position correcting device in the X-axis and Y-axis directions and a vacuum type buffer device 301 before and after it in combination. The installation of the above-described position correction device is not limited to being installed only in the rotary screen printing machine 4, but can also be installed in a planographic printing type or intaglio printing type rotary printing machine.

In addition, for example, if necessary, a hot air or infrared type preheating furnace is provided between the rotary screen printing machine 4 and the electron beam irradiating device 6, and the glass transition point of the resin film substrate 2 or The heating may be performed at a temperature equal to or lower than the softening temperature. By providing such a preheating furnace, the resistance value of the thick film conductor circuit can be reduced.

The mounting of the IC chip on the resin film substrate is performed using an appropriate bonding device. As shown by broken lines in FIGS. 3 and 4, the IC chip 15 includes the electrodes 10 a and 20 a of the thick film conductor circuits 10 and 20.
In this case, the IC chip may be bonded to a predetermined position by performing alignment using an alignment mark printed on the resin film substrate.

For example, if the width of the resin film substrate is 300 m
When the width of the resin film substrate is 500 mm or more, image processing is performed on all four alignment marks when the width of the resin film substrate is 500 mm or more. It is preferable to perform the alignment. When the width of the resin film substrate is 300 mm or less, a reference hole is provided on both sides of the resin film substrate when printing a thick film conductor circuit with a rotary screen printer, and alignment is performed using positioning guide pins. You may.

The resin film substrate in which the IC chip is mounted on all the thick-film conductor circuits is punched in a predetermined size, that is, in units of the thick-film conductor circuit board, thereby obtaining an inlet for non-contact ID cards. be able to. The thick film conductor circuit board according to the present invention is not limited to a single thick film conductor circuit formed on a resin film substrate,
A plurality of thick film conductor circuits may be formed. Hereinafter, examples and comparative examples according to the present invention will be described.

[0047]

EXAMPLES Example 1 A resin film substrate composed of a web-shaped polyester alloy-based film was fed from an unwinder, and was continuously wound by a winder. Then, an electron beam-curable silver paste (silver powder having a particle size of about 80 μm) using a binder containing an acrylate-based polymer compound and a silver powder having an average diameter of 2.5 μm as main components and an acrylic resin is used as a main component. % By weight) is printed using a rotary screen printer, and the thick film conductor circuit 10 having an average thickness of 30 μm for four turns shown in FIG.
Was formed and alignment marks 30 for alignment were printed at the four corners. Then, the thick-film conductor circuit was irradiated with an electron beam having an acceleration voltage of 200 KV and a dose of 40 KGY by the area beam type electron beam irradiation device 6.

The resistance of the obtained thick film conductor circuit 10 is 40Ω.
Met. In addition, the transfer speed of the resin film substrate in the electron beam irradiation part was 20 m / min, and the irradiation region length was 40 mm. Therefore, irradiation was performed for 0.12 seconds. In a hot air circulation furnace type comparative example described later, when the transfer speed of the resin film substrate is 1 m / min, a 30 m hot air circulation furnace is required, whereas the transfer speed of the resin film substrate is 20 m / min. And 20 of the former (comparative example of the hot air circulation furnace type)
Despite the doubling, the length of the electron beam irradiation device was 2 m. Therefore, the former is 1/15 of that of the former, and the device space can be saved significantly.

Since the electron beam irradiation time was as short as 0.12 seconds, no temperature rise was observed. As a result, no swell, warpage or wrinkles were observed on the resin film substrate taken out after the electron beam irradiation. The error between the alignment mark 30 (see FIG. 2) on the resin film substrate printed by the rotary screen printer and the electrode position of the thick film conductor circuit 10 serving as an antenna was measured. 05 mm or less.

Next, the resin film substrate is placed in a bonding apparatus, and two of the printed four alignment marks are image-processed to determine the electrode positions of the thick-film conductor circuit 10 serving as each antenna. The IC chip was bonded. As a result, it was found that any resin film substrate to which the IC chip was bonded was used as a non-contact ID card.

The time required for image processing and alignment of the alignment mark is only two alignment mark recognition times and a calculation time.
Compared to seconds, the total was significantly reduced to 4 seconds. Here, gold stud bumps were used for the bumps of the IC chip, and ACF (anisotropic conductive film) was used for the connection, which was cured by heating for 5 seconds.

Example 2 A resin film substrate composed of a web-shaped polyester film having a width of 300 mm was fed from an unwinder and was continuously wound by a winder. And, on the resin film substrate that is continuously transferred,
An electron beam curable silver paste (containing about 80% by weight of silver powder) containing an acrylate polymer compound and a silver powder having an average diameter of 2.5 μm as a main component and containing a binder containing an acrylic resin is supplied to a rotary screen printing machine. Print using
A thick film conductor circuit 20 having an average thickness of 20 μm for six turns shown in FIG. 4 is formed, and alignment marks 30 for alignment are printed at the four corners. An electron beam was irradiated by an electron beam irradiation device at an acceleration voltage of 150 KV and a dose of 20 KGY.

The resistance of the obtained thick film conductor circuit 20 is 60Ω.
Met. The transfer speed of the resin film substrate in the electron beam irradiation section was 10 m / min, and the length of the irradiation area was 40 mm. Therefore, the irradiation was performed for 0.24 seconds. In a hot air circulation furnace type comparative example described later, when the transfer speed of the resin film substrate is 1 m / min, a 30 m hot air circulation furnace is required, whereas the transfer speed of the resin film substrate is 10 m / min. And 10 of the former (comparative example of hot air circulation furnace type)
Despite the doubling, the length of the electron beam irradiation device was 2 m. Therefore, the former is 1/15 of that of the former, and the device space can be saved significantly.

The residence time of the resin film substrate in the electron beam irradiator was 0.2 times as long as 0.12 seconds in Example 1.
The time was 4 seconds, but no temperature increase was observed. As a result, no undulation, warpage, or wrinkles were observed on the resin film substrate after the electron beam irradiation. When an error in the distance between the alignment mark 30 on the resin film substrate printed by the rotary screen printing machine and the electrode position of the thick film conductor circuit 10 serving as an antenna was measured, the error was ± 0.05 mm or less.

Next, as in the first embodiment, the resin film substrate after the electron beam irradiation is placed in a bonding apparatus, and two of the printed four alignment marks 30 are image-processed, and each antenna is The electrode position of the thick film conductor circuit 20 was determined, and the IC chip was bonded.

As a result, it was found that any of the resin film substrates can be used as a non-contact ID card. The time required for image processing and alignment of the alignment mark 30 is only the recognition time for the two alignment marks 30 and the calculation time, and can be greatly reduced to a total of 4 seconds as compared with 28 seconds of a comparative example described later. Was. Here, gold stud bumps are used for the bumps of the IC chip, and an average of 4 μm is used for the connection.
And cured by heating for 10 seconds using an epoxy resin-based anisotropic conductive paste containing the conductive particles.

In the same manner as in the first and second embodiments, thick-film conductor circuits having a printed thickness of 50 μm were formed as the third embodiment. The electron beam irradiation conditions in Examples 1 to 3 are summarized as follows.

Printing Thickness Acceleration Voltage Linear Amount Irradiation Time Example 1 30 μm 200 KV 40 KGY 0.12 seconds Example 2 20 μm 150 KV 20 KGY 0.24 seconds Example 3 50 μm 300 KV 20-80 KGY 0.02 to 1 second

[Comparative Example] [Comparative Example 1] A thermosetting epoxy resin-based silver paste was printed on a resin film substrate composed of a web-shaped polyester alloy film having a width of 300 mm using a screen printer, and the pitch was adjusted. 70mm x 95
4 × 4 thick film conductor circuits were formed in mm, and alignment marks 30 were printed at the four corners.

Then, the resin film substrate on which the thick film conductor circuit and the alignment mark 30 were printed was heated in a hot air circulating furnace at 120 ° C. for 30 minutes, cooled, and taken out of the furnace.
The obtained resin film substrate undulated over the entire surface, and the end face was warped. The thick-film conductor circuit serving as an antenna had four turns, and the line width was 0.8 μm at a wide portion and 0.3 μm at a narrow portion.

On this circuit, the outer shape is 1.6 mm × 2.4.
mm, a bump diameter of 100 μm, and an IC chip in which two bumps were arranged diagonally at a pitch of 2.8 mm were mounted.
The precision required for bonding was ± 0.2 mm. However, the width of the resin film substrate shrinks by about 1 mm, and the pitch Pa, Pb (see FIG. 2) between the patterns of the thick-film conductor circuits serving as the antennas is -0.1 mm to -0.3 mm.
mm, the pitch Mp between the alignment marks 30 contracted by a maximum of -1.2 mm, and La shown in the figure contracted by about -0.6 mm.

For this reason, although the thick film conductor circuit was bonded simultaneously with the four alignment marks 30 printed at the four corners of the thick film conductor circuit using a heat-curable epoxy resin-based silver paste, bonding could be performed accurately at a predetermined position. could not. Although not shown, the same device was used again to avoid shrinkage, and reference holes were provided on both sides of the same resin film substrate, and the test was performed using positioning guide pins. However, bonding could not be performed at a predetermined position.

Therefore, in order to correct the displacement caused by the contraction, one or a plurality of electrode position alignment marks are provided in the vicinity of the electrodes of the thick conductor circuit serving as each antenna, and the image recognition alignment is performed for each resin film substrate. Had to do. As a result, each time bonding to each resin film substrate is performed, an extra alignment time of about 1.5 to 2 seconds (time for recognizing the electrode position as an image)
Cost. Bonding of 16 IC chips to the resin film substrate took 28 seconds to perform. Also, 16
Five of the defective products were considered to be due to deformation, such as disconnection of the thick film conductor circuit.

[0063]

As described above, according to the present invention, a thick film conductor circuit pattern having excellent electrical and mechanical properties can be formed and cured on a continuously fed resin film substrate at a high speed. At that time, the resin film substrate itself,
A thick-film conductor circuit pattern can be formed without generating undulations, dimensional changes, and the like. Therefore, mass production of a thick-film conductor circuit board suitable for use in non-contact ID cards and the like can be achieved.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a manufacturing apparatus for a thick film conductor circuit board.

FIG. 2 is a plan view of a resin film substrate on which a thick-film conductor circuit board is formed.

FIG. 3 is a plan view of a thick-film conductor circuit according to four turns.

FIG. 4 is a plan view of a thick-film conductor circuit according to 6 turns.

FIG. 5 is a front view showing a mounting mode of the rotary screen printing machine.

FIG. 6 is a plan view of FIG. 5;

[Explanation of symbols]

 1: Apparatus for manufacturing a thick film conductor circuit board 2: Resin film substrate 3: Unwinder 4: Rotary screen printer 5: Electron beam-curable conductive paste 6: Electron beam irradiator 7: Electron beam 8: Winding Machine 401: Press roller 402: Screen

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01B 13/00 503 H01B 13/00 503C

Claims (8)

[Claims] 1. A thick film conductor circuit pattern is formed by printing an active energy ray-curable conductive paste on a continuously fed resin film substrate using a rotary printing machine, and the printed thick film conductor circuit pattern is formed. A method for producing a thick-film conductor circuit board, comprising irradiating an active energy ray onto a substrate to cure the circuit. 2. The method according to claim 1, wherein the active energy ray-curable conductive paste is an electron beam-curable conductive paste, and is cured by irradiating the thick-film conductive circuit pattern with an electron beam. Method for manufacturing a thick film conductor circuit board. 3. The method according to claim 2, wherein the electron beam-curable conductive paste is an electron beam-curable silver paste. 4. The heat deformation temperature of the resin film substrate is 1
4. The method according to claim 3, wherein an electron beam at a temperature of 50 [deg.] C. or lower and 75 KV to 300 KV is irradiated for 0.02 to 1 second. 5. A winding machine for continuously winding a resin film substrate sent out from an unwinding machine, and forming an active energy ray-curable conductive paste on the resin film substrate to form a thick film conductor circuit pattern. A rotary printing machine for irradiating an active energy ray onto the printed thick-film conductor circuit pattern to cure the circuit. 6. The apparatus according to claim 5, wherein the rotary printing machine is a rotary screen printing machine. 7. The active energy beam-curable conductive paste is an electron beam-curable conductive paste, and the active energy beam irradiating device is an electron beam irradiating device. Thick film conductor circuit board manufacturing equipment. 8. The apparatus according to claim 7, wherein the electron beam irradiation device is an area beam type electron beam irradiation device.