JP2000332063A - Manufacture of film carrier tape for electronic component mounting and warpage reduction device of the tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce warpage of a film carrier tape by bringing a film carrier tape into contact with a heating roll shape capable of giving reverse wapage and, by quenching it thereafter. SOLUTION: A film carrier tape 1 provided with a solder resist layer as a wiring circuit pattern and a protection insulating layer is fed to a base film tape formed by sticking an adhesive layer to an insulation film, such as a polyimide film at a prescribed velocity from a reel fixed to a feed device 2. The fed film carrier tape 1 is brought into contact with a heating roll 3 shaped capable of giving reverse warpage. It is quenched from this state and is contracted again, and the film carrier tape 1 is made flat. Thereby, warpage of the film carrier tape 1 can be reduced rapidly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor IC and an LSI.
The present invention relates to a method for manufacturing a film carrier tape for mounting electronic components and a device for reducing the warpage of the tape used for mounting the device, and more particularly to manufacturing a film carrier tape capable of reducing the warpage of a film carrier tape coated with a solder resist as an insulating protective layer. The present invention relates to a method and an apparatus for reducing warpage of the tape.

[0002]

2. Description of the Related Art TAB (Tape Automated)
Bonding) tape, BGA (Ball Grid)
Array tape, CSP (Chip Size P)
Each of the wrapping tapes is a film carrier tape for mounting an IC, an LSI, or the like on a substrate, and is obtained by wiring a conductive material such as copper on the surface of an insulating film such as a polyimide film. Usually, on the surface on the wiring pattern side, a solder resist layer such as an epoxy resin is applied as an insulating protective layer to necessary portions except for terminal portions such as inner leads. The terminal portion is usually plated with tin or gold.

In the TAB method, the inner leads of the TAB tape and the corresponding electrodes on the IC chip are connected to each other on a method such as gang bonding via bumps such as gold.
Nner Lead Bonding). IC
The TAB tape to which the chip is connected is then sealed with an epoxy resin or the like by potting or transfer molding to protect the IC chip, and the resin is cured by heating.
On the other hand, the outer leads of the TAB tape are thermocompression-bonded or connected to a printed board by an anisotropic conductive film, soldering, or the like (Outer Lead Bonding).

The BGA tape is often the same as the TAB tape from the inner lead bonding to the resin sealing. However, instead of the outer lead bonding, a number of solder balls equal to the number of pins of the IC chip are arranged in a matrix. And the connection to the printed circuit board via these. For solder ball connection, the solder resist layer has a pitch of 0.5 to 2.0.
Micropores of 100 to 800 μmΦ arranged two-dimensionally in mm are required. The wiring pitch is coarser than that of the outer lead bonding, and can be used for an IC having a larger number of pins.

[0005] In the CSP tape, the connection of the IC is performed by inner lead bonding and S-shaped lead type connection (USP53).
98863) and the like, and the mounting material is literally reduced in size to the size of the IC chip, but is similar to the BGA in that solder ball connection is performed instead of outer lead bonding.

[0006] A BGA tape and a CSP tape can be manufactured by substantially the same steps and materials as a conventional TAB tape. TAB tape, BGA tape, CSP
In general, the tape width is 35 mm to 96 mm, and the thickness of the resin film is 20 to 75 mm.
μm and a copper layer thickness of 12 to 35 μm are often used.

[0007]

However, film carrier tapes such as TAB tapes and BGA tapes obtained by these conventional manufacturing methods include insulating films such as polyimide films, adhesive layers, copper foils and solder resists. Due to the difference in the coefficient of thermal expansion between the materials such as the above, and the curing shrinkage of the solder resist, a concave warpage occurs on the solder resist application side.

[0008] The warpage generated here cannot be removed not only in the subsequent process until the product is completed,
Warpage tends to further increase. Such products are TAB
In the case of the outer lead bonding, the tape greatly affects the positioning and workability. Also, BG
In the tape for A, troubles such as breakage of the inner lead and cracking of the sealing resin occur in the mounting stage from the inner lead bonding of the IC to the stiffener bonding for reinforcement and the like.

Conventionally, the following means have been disclosed as a method for preventing warpage of a film carrier tape. As the solder resist, a polyimide resin with little heat-curing shrinkage is used. The TAB film carrier is curved so as to inflate the pattern surface thereof, passes through a far-infrared furnace, and is heated by a heater in the furnace (Japanese Patent No. 2816841).

However, the polyimide resin of the above (1) is slightly inferior to the conventional epoxy resin in adhesion to the conductor surface such as copper. Therefore, the polyimide resin is not suitable for narrowing the solder resist coating pattern and forming micropores. It is difficult to respond. Patent No. 250
In No. 9509, a polyimide resin and an epoxy resin are selectively used depending on the portion of the film carrier tape, and the process is complicated. In the above (2), warpage in the width direction of the film carrier tape is reduced, but there is no effect on warpage in the long direction. In the above (2), since it is necessary to heat in a far-infrared furnace, it takes a certain amount of time for the temperature of the film carrier tape itself to reach a required temperature. Becomes In addition, it is necessary to modify an existing heating furnace or to install a new heating furnace at an appropriate part after the conventional heating step.

[0011] Accordingly, an object of the present invention is to provide a solder resist having good adhesiveness, narrowing of a solder resist layer, applicability of a fine pattern such as a fine hole, and the like.
A simple device that reduces the warpage of the film carrier tape, does not cause problems such as breakage of inner leads and cracks in the sealing resin during IC mounting and assembly, and does not cause misalignment when mounting on a printed circuit board. An object of the present invention is to provide a method of manufacturing a carrier tape and an apparatus for reducing warpage of the tape.

[0012]

Means for Solving the Problems As a result of research conducted to achieve the above object, the present inventors have found that a film carrier tape is brought into contact with a heating roll having a shape capable of imparting reverse warpage, and then rapidly cooled. As a result, a method for remarkably improving the warpage of the tape and a device for reducing the warpage of the tape have been found, and the present invention has been completed.

That is, in the method for manufacturing a film carrier tape of the present invention, a conductor wiring pattern is formed on the surface of an insulating film, and a solder resist is applied to a portion of the wiring pattern except for a terminal portion connected to a device or the like. The present invention is characterized in that the film carrier tape is brought into contact with a heating roll having a shape capable of imparting reverse warpage, and thereafter, the tape is rapidly cooled to reduce the warpage of the tape. Further, the device for reducing the warpage of the film carrier tape of the present invention is a delivery device for delivering a film carrier tape wound on a reel, a heating roll for applying heat while applying reverse warpage to the tape, a cooling device, And a winding device.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a film carrier tape and an apparatus for reducing the warpage of the tape according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an apparatus for reducing the warpage of a film carrier tape. In FIG. 1, reference numeral 1 denotes a film carrier tape. Reference numeral 2 denotes a delivery device in which the tape is wound on a reel. Reference numeral 3 denotes a heating roll having a shape capable of imparting reverse warpage to the tape. Reference numeral 4 denotes a winding device for winding the heat-treated tape on a reel. Reference numeral 5 denotes a control device that controls voltage or current to control the surface temperature of the heating roll, and 6 denotes a power supply that supplies power to the heating roll. 7
Is a cooling device for rapidly cooling the tape. Although not shown in the drawings, a guide roll may be attached between the sending device and the heating roll or between the heating roll and the winding device to stabilize the position of the film carrier tape. FIG. 2 shows a front view of a heating roll 3 having a shape capable of imparting reverse warpage to the film carrier tape. The film carrier tape is provided with a reverse warp in the width direction along the heating roll. Further, by setting the heating roll higher than the height of the film carrier tape and transferring the film carrier tape along the heating roll, reverse warpage can also be imparted in the longitudinal direction.

The warp reducing device having such a configuration is as follows.
For example, it can be provided after the solder resist is cured by heating, or after the terminal portion is plated with tin plating, gold plating, or the like. The warpage of the film carrier tape mainly occurs after the heat curing of the solder resist, but the warpage tends to increase in the subsequent steps. It is preferred to provide a reduction device.

Next, a method for producing the film carrier tape of the present invention will be described. In FIG. 1, a film carrier tape 1 provided with a wiring circuit pattern and a solder resist layer as a protective insulating layer is attached to a base film tape in which an adhesive layer is adhered to an insulating film such as a polyimide film, and the film carrier tape is attached to a sending device 2. At a predetermined speed from the reel. The fed film carrier tape 1 is brought into contact with a heating roll 3 having a shape capable of imparting reverse warpage. The film carrier tape 1 is heated in a state in which the reverse warpage is forcibly applied by contacting the heating roll 3, so that the solder resist layer is softened and plastically deforms to extend in the reverse warp state. Therefore, when the film carrier is rapidly cooled from this state, it contracts again, and the film carrier tape becomes flat. As shown in FIG. 2, in the example of the heating roll, the axial section is high at the center and low at both ends and curved. The axial cross section is designed so that the film carrier tape 1 is provided with a reverse warp of 4 to 80 degrees in the width direction.

The radius of curvature of the curvature of the heating roll is determined by conditions such as tape width and the like, and the degree of tape warpage varies depending on the thickness of the solder resist layer and the application area, and is determined in consideration of these conditions. Let R be 50 cm.
The diameter of the heating roll is 5 to 30 cm at the central portion, preferably 10 to 20 cm. By changing the diameter of the heating roll, the contact time between the film carrier tape and the heating roll can be controlled, and even when the conditions of the film carrier tape change, it is possible to select a condition with a large warp reduction effect. .

The temperature of the heating roll is usually 80 to 160 ° C.,
Particularly, the temperature is preferably set to 100 to 140 ° C. When the temperature of the heating roll is lower than 80 ° C., the temperature of the contacted film carrier tape 1 does not rise, and the above-described effect of reducing the warpage is not sufficient. Conversely, if the temperature is higher than 160 ° C., the constituent materials of the film carrier tape 1 may be adversely affected, for example, the adhesive properties of the adhesive layer of the film carrier tape 1 may be deteriorated. The heating roll is connected to the control device 5, and the temperature of the surface of the heating roll is controlled by controlling the voltage or current supplied from the power supply 6 by the control device 5. The speed at which the film carrier tape 1 contacts and passes through the heating roll depends on the thickness of the tape used and the type or layer thickness of the solder resist, but is usually 0.5 to 10 m / min, particularly 1.3 to 2. 2
A speed of m / min is preferred. The material of the heating roll can be, for example, stainless steel, titanium, or the like. The film carrier tape 1 that has passed while contacting the heating roll in this way is forcibly cooled by a cooling device 7 equipped with cooling means such as a fan or a cooling roll, and then wound around a reel of a winding device 4. By the above method, it is possible to reduce the warpage of the film carrier tape.

[0019]

EXAMPLES The present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

Embodiment 1 First, an example of a method for manufacturing a film carrier tape of the present invention will be described. Tape width 48mm, thickness 75μm
A base film tape obtained by laminating a sheet-like epoxy-based adhesive (trade name: X, manufactured by Hamakawa Paper Co., Ltd.) to a polyimide film (trade name: UPIREX S, manufactured by Ube Industries, Ltd.) by thermocompression bonding. Sprocket holes and other openings were formed by punching. Electrolytic copper foil (trade name: FQ-VLP, manufactured by Mitsui Mining & Smelting Co., Ltd.) having a thickness of 15 μm and a width of 43 mm was laminated on this base film tape, and heated in an oven at 160 ° C. for 10 hours. The laminated tape was subjected to application of a photosensitive photoresist, exposure to a circuit pattern, development, and copper etching according to a standard method, to form a copper circuit pattern.

After the copper circuit pattern is formed as described above, an alkali development type solder resist (trade name: FOC)
US COAT DPR-3FG (manufactured by Asahi Chemical Laboratory Co., Ltd.) was printed on a required portion to a dry thickness of 20 to 30 μm using a screen printer. After pre-curing in an oven after printing, the tape was irradiated with ultraviolet light using an exposure machine to form an exposed portion and a non-exposed portion.

Next, the exposed tape is developed with a 1% sodium carbonate solution, and the obtained tape is evacuated in an oven (trade name: Cleanspec Kusumoto Kasei Co., Ltd.) at 150 ° C. for 60 minutes while evacuating. , Post cure.

Next, the resulting tape was transferred to a plating layer, and 0.5 μm thick Sn plating was applied to the exposed copper foil surface portion where the solder resist was not applied.

The film carrier tape 1 thus obtained is wound around a reel of a delivery device 2 and processed using a device (including a heating roll) for reducing the warpage of the film carrier tape shown in FIG. Was done. The curvature R of the heating roll 3 is 25, and the diameter is 5 cm. The feeding speed of the film carrier tape 1 is 1.
The contact length with the heating roll was 6 cm, and the contact time was 2 seconds. Thereafter, the film carrier tape was rapidly cooled, and the film carrier tape 1 was wound up by the winding device 4 when the film carrier tape was advanced by 2 m from the heating roll.

The warpage of the thus treated tape was measured as follows. Microscope with dimension measurement function (trade name: Measuring Fi)
NeScope MF-100 (manufactured by Mitutoyo Corporation) was used, and the individual sample obtained in Example 1 (sample cut into one circuit unit) was used as a measurement sample.

First, the measurement sample was placed on a table of a measuring machine with the base film face up. Next, with the table surface as a reference position (0 mm), the curved height of the device hole was measured.

As shown in FIG. 3, the height of the warpage is measured in advance in the longitudinal direction of the tape as shown in FIG.
Measurement points were defined at three places, and the height was measured by focusing on the measurement points, and the obtained height was defined as the amount of warpage.

[0027]

Example 2 Tape width 48 as base film tape
Multilayer film tape (trade name: S'PERFLEX, Sumitomo) formed by forming an 18 μm thick copper layer on a polyimide film (trade name: Upilex S, manufactured by Ube Industries, Ltd.) having a thickness of 75 μm and a thickness of 75 μm without using an adhesive Metal Mining Co., Ltd.) was used. Sprocket holes were formed in this laminated film tape by punching, device holes were formed by excimer laser, and residues remaining in the holes were removed by desmear treatment.

After a copper circuit pattern was formed on the thus obtained tape in accordance with a conventional method, a film carrier tape for a semiconductor IC was prepared in exactly the same procedure as in Example 1. The warpage of the film carrier tape for semiconductor IC thus obtained was determined in the same manner as in Example 1. Table 1 shows the obtained results.

[0029]

Comparative Example 1 For comparison, the amount of warpage of a film carrier tape produced in exactly the same manner as in Example 1 was determined in the same manner as in Example 1 without performing the warp reduction treatment of the present invention. The results obtained are shown in Table 1.

[0030]

Comparative Example 2 For comparison, the amount of warpage was determined in exactly the same manner as in Example 2 except that a laminated film tape having a copper layer formed without an adhesive was used. The results obtained are shown in Table 1.

[0031]

[Table 1]

[0032]

According to the method for producing a film carrier tape of the present invention, the film carrier tape can be directly heated by a heating roll and can be imparted with reverse warpage. The warpage of the tape can be reduced. In addition, it is possible to reduce not only the tape in the width direction but also the warp in the long direction.
According to the present invention, it is possible to manufacture a film carrier tape which does not cause problems such as breakage of inner leads and cracking of a sealing resin at the time of IC mounting and assembly, and does not cause connection failure due to poor alignment with a printed circuit board. Further, according to the tape warpage reducing device, the warpage of the film carrier tape can be effectively reduced in a short time by an extremely compact device. According to the present invention, it is possible to manufacture a film carrier tape which does not cause problems such as breakage of inner leads and cracking of a sealing resin at the time of IC mounting and assembly, and does not cause connection failure due to poor alignment with a printed circuit board.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing a process for removing warpage of a film carrier tape according to the present invention.

FIG. 2 is a front view of a roll 3 of the present invention for heating a film carrier tape while imparting reverse warpage.

FIG. 3 shows measurement points of warpage of the film carrier tape.

[Explanation of symbols]

1: film carrier tape, 2: feeding device, 3: heating roll, 4: winding device, 5: control device, 6: power supply, 7:
Cooling system

Claims (3)

[Claims] 1. A film carrier tape in which a conductor wiring pattern is formed on the surface of an insulating film, and a solder resist is applied to a portion of the wiring pattern other than a terminal portion connected to a device or the like, and a reverse warpage is applied to the film carrier tape. The method for producing a film carrier tape according to claim 1, wherein the tape is reduced by contacting with a heating roll having a shape capable of forming the film, followed by rapid cooling. 2. A feeding device for feeding a film carrier tape wound on a reel, a heating roll for heating the tape while applying a reverse warp to the tape, a cooling device, and a winding device. The device for reducing warpage of a film carrier tape described above. 3. The film carrier tape according to claim 2, wherein the heating roll for heating the tape delivered from the delivery device while giving a reverse warp is barrel-shaped. apparatus.