JP3724474B2 - Manufacturing method of film carrier tape for mounting electronic components - Google Patents

Description

【０１３３】
上記表１に示すように、実施例１〜４の電子部品実装用フィルキャリアテープは、比較例１〜３と比較すると、幅方向及び長手方向の反り量が大幅に低減しているのは明らかである。
【０１３４】
また、比較例１〜３の電子部品実装用フィルムキャリアテープは、幅方向の反りは比較的低減しているが、長手方向の反りは低減していないのが分かる。特に、比較例３は、反り取りを行ったにもかかわらず長手方向の反り量は非常に大きくなっている。このことから、電子部品実装用フィルムキャリアテープの幅方向の反り取りの後に長手方向の反り取りの実効を図るためには、絶縁フィルムの長手方向の熱膨張係数を導体層の長手方向の熱膨張係数と略同等若しくはそれよりも大きくするのが好ましい。
【０１３５】
以上のことから、実施例１〜４の電子部品実装用フィルムキャリアテープは、ポリイミドフィルム（絶縁フィルム）の長手方向の熱膨張係数を銅箔（導体層）と略同等若しくはそれより大きくすると共に、ポリイミドフィルムの幅方向の熱膨張係数を銅箔と略同等若しくはそれより大きくして最適化し、さらに、上述した幅方向及び長手方向の反り取り工程を行うことにより、電子部品実装用フィルムキャリアテープの幅方向及び長手方向に発生する反りを大幅に低減できることが分かった。
【０１３６】
【発明の効果】
以上説明したように、本発明の電子部品実装用フィルムキャリアテープの製造方法では、絶縁フィルムの長手方向の熱膨張係数を導体層の長手方向の熱膨張係数に基づいて最適化し、且つ第１の反り取り工程に起因した電子部品実装用フィルムキャリアテープの長手方向の反り取りを第２の反り取り工程で行うことにより、電子部品実装用フィルムキャリアテープの幅方向及び長手方向に発生する反りを大幅に低減することができる。したがって、平坦な電子部品実装用フィルムキャリアテープを実現できる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る積層フィルムを示す概略図であって、（ａ）は一部斜視図であり、（ｂ）は断面図である。
【図２】本発明の一実施形態に係る積層フィルムの製造方法の一例を示す概略側面図である。
【図３】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの一例を示す概略図であって、（ａ）は平面図であり、（ｂ）は一部断面図である。
【図４】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの製造方法の一例を示す一部断面図である。
【図５】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの他の例を示す概略図であって、（ａ）は平面図であり、（ｂ）は断面図である。
【図６】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの他の例を示す概略平面図である。
【図７】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの他の例を示す概略断面図である。
【図８】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの製造に用いられる巻き取りリールの概略斜視図である。
【図９】本発明の一実施形態に係る短冊状に切断した電子部品実装用フィルムキャリアテープの概略斜視図である。
【図１０】本発明の一実施形態に係る電子部品実装用フィルムキャリアテープの製造に用いられる治具の概略斜視図である。
【符号の説明】
１０ 積層フィルム
１１ 導体層（導体）
１２ 絶縁層（絶縁体）
１３ 接着剤層
１４ 絶縁フィルム
１５ 巻き出しローラ
１６、１７ 熱圧着ローラ
１８ 巻き取りローラ
２０ 電子部品実装用フィルムキャリアテープ
２１ 配線パターン[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a film carrier tape for mounting electronic components such as IC or LSI, and in particular, TAB (Tape Automated Bonding), COF (Chip On Film), CSP (Chip Size Package). ), BGA (Ball Grid Array), μ-BGA (μ-Ball Grid Array), FC (Flip Chip), QFP (Quad Flat Package), etc. Film carrier tape (hereinafter simply referred to as “electronic component mounting film”) It is related with the manufacturing method of a carrier tape.
[0002]
[Prior art]
With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) has been increasing rapidly. High functionality is demanded, and recently, a mounting method using a TAB tape, a T-BGA tape, an ASIC tape, or the like has been adopted as a method for mounting these electronic components. In particular, as electronic devices become lighter, thinner and smaller, electronic components are mounted at a higher density, and in order to improve the reliability of the electronic components, a board having a size substantially corresponding to the size of the electronic components to be mounted is used. For example, film carrier tapes for mounting electronic components such as CSP, BGA, and μ-BGA, in which external connection terminals are arranged on almost the entire surface, are increasing in frequency.
[0003]
Here, such a film carrier tape for mounting electronic components forms punch holes such as a sprocket hole for conveyance, a round hole for mounting a solder ball, and a device hole for bonding on an insulating film made of polyimide. After forming the wiring pattern by patterning the copper foil provided on the one side of the insulating film via the adhesive layer while transporting the insulating film using the sprocket holes, and then wiring as necessary It is manufactured through a process of forming a solder resist layer on the pattern.
[0004]
In addition, the electronic component mounting film carrier tape manufactured in this way is mounted with electronic components such as IC chips directly on the wiring pattern or via wire bonding, metal bumps, solder balls, etc. Molded with sealing resin.
[0005]
Thus, when mounting an electronic component on the film carrier tape for electronic component mounting, for example, with respect to a mounting apparatus, the film carrier tape for electronic component mounting cut | disconnected to 5-10 IC chips and a strip shape, Is generally supplied.
[0006]
By the way, in recent miniaturization and weight reduction of electronic devices, it is required to make the electronic component mounting film carrier tape thinner and lighter. In addition, with the recent spread of printers, color liquid crystal displays, and the like, film pitches for mounting electronic components are rapidly becoming finer. And the above-described film carrier tape for mounting electronic parts cannot cope with the reduction in size and weight of such electronic parts and the fine pitch.
[0007]
Therefore, in recent years, in addition to the above-described film carrier tape for mounting electronic components having a three-layer structure formed of an insulating film, an adhesive layer and a copper foil, it has a two-layer structure composed of a resin film and a conductive metal foil. Further, COF (chip on film) tape in which a bare IC chip without a device hole is directly mounted is widespread, and in such a film carrier tape for mounting an electronic component having a two-layer structure, the total thickness thereof Is also manufactured.
[0008]
In addition, there is an increasing demand for higher density electronic devices and improved productivity. For example, the width of the insulating film is changed from 35 mm to 48 mm. In addition, the tape width of the insulating film is defined as 35, 48, and 70 mm, respectively, by the EIAJ (Japan Electronic Machinery Manufacturers Association) standard (for example, Non-Patent Document 1).
[0009]
Here, when manufacturing the above-described film carrier tape for mounting electronic components, a laminated film in which a copper foil and an insulating film are laminated is used. As such a laminated film, there is a thermocompression-type laminated film in which an insulating film is thermocompression bonded to a copper foil via, for example, a thermoplastic resin or a thermosetting resin. Such a thermocompression-bonding type laminated film is used for manufacturing a film carrier tape for mounting electronic components. For example, a wiring pattern or the like is formed by patterning a conductor layer.
[0010]
However, when a wiring pattern or the like is formed on the conductor layer in this way, the surface of the film carrier tape for mounting electronic components, which is the final product, is warped in the width direction so that the surface on which the wiring pattern is formed becomes a concave surface. There is a problem.
[0011]
Therefore, in general, with respect to the warp generated in the width direction, improvement is achieved by providing a reverse warp opposite to the warp in the width direction of the film carrier tape for mounting electronic components. .
[0012]
Recently, in order to solve the problem of warping in the width direction of the laminated film and the film carrier tape for mounting electronic components described above, the warping in the width direction is optimized by optimizing the properties of the insulating film and the physical properties of the adhesive component. There has been proposed a tape with an adhesive for semiconductor devices that improves the above (for example, Patent Document 1).
[0013]
In such a tape with an adhesive for a semiconductor device, (1) the film thickness is 10 to 65 μm (2) the linear expansion coefficient in the film width direction (TD) at 50 to 200 ° C. is 17 to 30 ppm / ° C. (3) tensile elasticity An insulating film layer (insulating film) having a physical property of 6 to 12 GPa is used. Moreover, this insulating film layer has a physical property that the difference in linear expansion coefficient between the film width direction (TD) and the longitudinal direction (MD) is 3 to 10 ppm / ° C.
[0014]
[Patent Document 1]
JP 2002-076062 A
[Non-Patent Document 1]
Semiconductor Package Special Committee "Integrated Circuit Outline Rules Quad Tape Carrier Package (QTP)" EIAJ ED-7431A, Japan Electronic Machinery Manufacturers Association (EIAJ) Standard, Japan Electronic Machinery Manufacturers Association, October 1994
[0015]
[Problems to be solved by the invention]
However, like the above-mentioned adhesive tape for semiconductor devices, for example, even if the physical properties such as the linear expansion coefficient in the width direction (TD) of the insulating film are optimized, the width of the insulating film is changed from 35 mm to 48 mm or more. When increasing the density and improving the productivity, there is a problem that it is difficult to reduce the warp in the width direction of the insulating film to a level where it can actually be used.
[0016]
On the other hand, in the film carrier tape for mounting electronic components cut into strips before mounting the electronic components, if the warp generated in the width direction is corrected by applying the reverse warp as described above, the longitudinal stress is caused by the stress at that time. There is a problem that the surface on the wiring pattern side is warped over the direction so as to be a concave surface. Further, such a phenomenon is not limited to the electronic component mounting film carrier tape cut into strips, and similarly occurs in a tape state. Further, the above-described adhesive tape for a semiconductor device also has a problem that the problem of warping in the longitudinal direction similarly occurs.
[0017]
If the film carrier tape for mounting electronic components is warped in the longitudinal direction as described above, a conveyance failure or the like in the IC mounting process occurs, which adversely affects workability. It becomes a serious problem because it cannot be done.
[0018]
The warp generated in the width direction and the longitudinal direction of the electronic component mounting film carrier tape described above appears remarkably in, for example, a relatively thin type electronic component mounting film carrier tape having a total thickness of 75 μm or less.
[0019]
In view of such circumstances, it is an object of the present invention to provide a method for producing a flat film carrier tape for mounting electronic components in which warpage occurring in the longitudinal direction and the width direction is relatively easy and greatly reduced.
[0020]
[Means for Solving the Problems]
  According to a first aspect of the present invention for solving the above-mentioned problem, in the method for manufacturing a film carrier tape for mounting electronic components in which a wiring pattern is formed on the conductor layer of the laminated film having a conductor layer on one surface of the insulating film, After forming the wiring pattern using a laminated film in which the insulating film has a longitudinal thermal expansion coefficient substantially equal to or greater than the thermal expansion coefficient of the conductor layerIn addition, a step of applying and curing a solder resist while leaving the terminal portion of the wiring pattern is performed,Before mounting an electronic component, the electronic component mounting film which gives stress for correcting a warp in which the surface on the side of the wiring pattern generated in the width direction of the film carrier tape for mounting an electronic component becomes a concave surface A first warp removing step in the width direction of the carrier tape and a stress for correcting a warp in which the surface on the side of the wiring pattern generated along the longitudinal direction of the film carrier tape for mounting an electronic component becomes a concave surface is applied. A method of manufacturing a film carrier tape for mounting electronic components, comprising performing a second warp removing step in the longitudinal direction of the film carrier tape for mounting electronic components.
[0021]
  In the first aspect, the insulating filmLongitudinalThe coefficient of thermal expansion of the conductor layerLongitudinalBy optimizing based on the thermal expansion coefficient and performing warpage removal in the longitudinal direction of the film carrier tape for mounting electronic components resulting from the first warpage removal process in the second warpage removal process, in the width direction and the longitudinal direction. A flat film carrier tape for mounting electronic components with greatly reduced warpage is realized.Moreover, the warp generated in the width direction and the longitudinal direction of the film carrier tape for mounting electronic components due to the shrinkage stress when the solder resist is cured is greatly reduced by the subsequent first and second warp removing steps. .
[0022]
  The second aspect of the present invention is:In the method for manufacturing a film carrier tape for mounting an electronic component in which a wiring pattern is formed on a conductive layer of a laminated film having a conductive layer on one side of the insulating film, the insulating film has a thermal expansion coefficient in the longitudinal direction of the conductive layer. Using a laminated film having a thermal expansion coefficient in the longitudinal direction that is substantially equal to or greater than that and formed over the width direction of the electronic component mounting film carrier tape after the wiring pattern was formed and before the electronic component was mounted. A first warp removing step in the width direction of the electronic component mounting film carrier tape for applying a stress for correcting a warp in which the surface on the wiring pattern side is a concave surface, and a longitudinal direction of the electronic component mounting film carrier tape The electronic component that applies stress for correcting warpage that occurs on the surface of the wiring pattern that is formed across the direction becomes a concave surface. And a second warp removing step in the longitudinal direction of the film carrier tape for the electronic component mounting, and in the second warp removing step, the surface on the conductor layer side of the film carrier tape for mounting electronic components is directed outward. It winds around a take-up reel and holds the electronic component mounting film carrier tape at a temperature in the range of 80 to 150 ° C. for 10 hours or more.The present invention resides in a method for manufacturing a film carrier tape for mounting electronic components.
[0023]
  TakeSecond aspectIn the insulation filmLongitudinalOptimize the coefficient of thermal expansion based on the coefficient of thermal expansion in the longitudinal direction of the conductor layerIn addition, the warpage occurring in the width direction and the longitudinal direction is greatly reduced by performing the warpage removal in the longitudinal direction of the film carrier tape for mounting electronic components resulting from the first warpage removal process in the second warpage removal process. Thus, a flat film carrier tape for mounting electronic components is realized. Moreover, the warp which generate | occur | produces in the width direction and longitudinal direction of the film carrier tape for electronic component mounting is reduced significantly by hold | maintaining the state which provided the reverse curvature to the film carrier tape for electronic component mounting on predetermined conditions.
[0024]
  Of the present inventionThe third aspect is the second aspect.In the second warping removing step, the electronic component mounting film carrier tape is heated by winding the electronic component mounting film carrier tape together with a spacer on the take-up reel.
[0025]
  TakeThird aspectThen, the stable operation | work is ensured by protecting the conductor layer side of the film carrier tape for electronic component mounting, ie, the surface at the side of a wiring pattern, with a spacer. In addition, by applying a reverse warp while being wound on a take-up reel and heating the film carrier tape for mounting electronic components, the warp generated in the width direction and longitudinal direction of the film carrier tape for mounting electronic components is greatly reduced. Is done.
[0026]
  Of the present inventionThe fourth aspect is the third aspect.In the manufacturing method of the film carrier tape for electronic component mounting, wherein the spacer is a flat spacer.
[0027]
  TakeFourth aspectThen, it is easy to wind with the film carrier tape for electronic component mounting on a take-up reel, and workability | operativity can be improved.
[0028]
  According to a fifth aspect of the present invention,In the method for manufacturing a film carrier tape for mounting an electronic component in which a wiring pattern is formed on a conductive layer of a laminated film having a conductive layer on one side of the insulating film, the insulating film has a thermal expansion coefficient in the longitudinal direction of the conductive layer. Using a laminated film having a thermal expansion coefficient in the longitudinal direction that is substantially equal to or greater than that and formed over the width direction of the electronic component mounting film carrier tape after the wiring pattern was formed and before the electronic component was mounted. A first warp removing step in the width direction of the electronic component mounting film carrier tape for applying a stress for correcting a warp in which the surface on the wiring pattern side is a concave surface, and a longitudinal direction of the electronic component mounting film carrier tape The electronic component that applies stress for correcting warpage that occurs on the surface of the wiring pattern that is formed across the direction becomes a concave surface. A second warp removing step in the longitudinal direction of the film carrier tape for use, and in the second warp removing step, the film carrier tape for mounting electronic components is cut into a strip shape and then given a predetermined curvature. Heat while sandwiched between jigsThe present invention resides in a method for manufacturing a film carrier tape for mounting electronic components.
[0029]
  TakeFifth aspectIn the insulation filmLongitudinalThe coefficient of thermal expansion of the conductor layerLongitudinalOptimize based on thermal expansion coefficientIn addition, the warpage occurring in the width direction and the longitudinal direction is greatly reduced by performing the warpage removal in the longitudinal direction of the film carrier tape for mounting electronic components resulting from the first warpage removal process in the second warpage removal process. Thus, a flat film carrier tape for mounting electronic components is realized. Moreover, the flat strip-shaped electronic component mounting film carrier tape which reduced the curvature of the width direction and the longitudinal direction is realizable. Thereby, an electronic component such as an IC chip can be reliably mounted at a predetermined position.
[0030]
  First of the present invention6The aspect of the firstAny of ~ 5The method of manufacturing a film carrier tape for mounting electronic components, wherein a thermal expansion coefficient in the width direction of the insulating film is substantially equal to or greater than a thermal expansion coefficient in the width direction of the conductor layer. .
[0031]
  Take this second6In this aspect, by optimizing the thermal expansion coefficient in the width direction of the insulating film based on the thermal expansion coefficient in the width direction of the conductor layer, the warp generated in the width direction of the film carrier tape for mounting electronic components is greatly reduced. Is done.
[0032]
  First of the present invention7The aspect of the firstAny of ~ 6The method of manufacturing a film carrier tape for mounting electronic parts is characterized in that the thermal expansion coefficient in the longitudinal direction of the insulating film is smaller than the thermal expansion coefficient in the width direction of the insulating film.
[0033]
  Take this second7In this aspect, since the film carrier tape for mounting electronic components is conveyed while applying a predetermined tension, the thermal expansion coefficient in the longitudinal direction of the insulating film may be smaller than the thermal expansion coefficient in the width direction.
[0034]
  First of the present invention8The aspect of the7In the embodiment, the insulating film has a thermal expansion coefficient in the longitudinal direction of 14 to 28 ppm / ° C., and the thermal expansion coefficient in the width direction of the insulating film is 14 to 30 ppm / ° C. It exists in the manufacturing method of a film carrier tape.
[0035]
  Take this second8In this aspect, by optimizing the thermal expansion coefficients in the width direction and the longitudinal direction of the insulating film based on the thermal expansion coefficients in the width direction and the longitudinal direction of the conductor layer, the width direction and the longitudinal direction of the film carrier tape for mounting electronic components are optimized. Warpage occurring in the direction is greatly reduced.
[0036]
  First of the present invention9The aspect of 1st-18In any of the embodiments, the conductor layer is a copper foil, and there is a manufacturing method of a film carrier tape for mounting electronic components.
[0037]
  Take this second9In this aspect, a film carrier tape for mounting electronic components having a wiring pattern made of copper foil having excellent conductivity is obtained.
[0038]
  First of the present invention10The aspect of 1st-19In any of the above aspects, there is provided a method for producing a film carrier tape for mounting electronic components, wherein a laminated film obtained by thermocompression bonding the insulating film and the conductor layer is used.
[0039]
  Take this second10In this aspect, the conductor layer and the insulating film can be bonded relatively easily and reliably.
[0040]
  First of the present invention11The aspect of the10The method of manufacturing a film carrier tape for mounting electronic parts is characterized in that a laminated film obtained by thermocompression bonding the conductor layer via a thermoplastic resin layer on the insulating film is used.
[0041]
  Take this second11In this aspect, the insulating film is pressure-bonded to the conductor layer via the thermoplastic resin layer.
[0042]
  First of the present invention12The aspect of the10The method of manufacturing a film carrier tape for mounting electronic parts is characterized in that a laminated film obtained by thermocompression bonding the conductor layer via a thermosetting resin layer on the insulating film is used.
[0043]
  Take this second12In this aspect, the insulating film is pressure-bonded to the conductor layer via the thermosetting resin layer.
[0044]
  First of the present invention13The aspect of 1st-112In any of the above aspects, in the first warp removing step, heating is performed while warping the electronic component mounting film carrier tape in a direction opposite to a warp in which the surface on the conductor layer side becomes a concave surface. There is a method for manufacturing a film carrier tape for mounting electronic components.
[0045]
  Take this second13In this aspect, the warp generated in the width direction of the electronic component mounting film carrier tape is greatly reduced by applying the reverse warp to the electronic component mounting film carrier tape that has been softened entirely by heating.
[0048]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic view of a laminated film used for manufacturing a film carrier tape for mounting electronic components according to an embodiment of the present invention, in which (a) is a partial perspective view and (b) is a cross-sectional view. It is.
[0049]
As shown in FIG. 1, the laminated film 10 includes a conductor layer 11 and an insulating layer 12 that is thermocompression bonded to the conductor layer 11.
[0050]
The conductor layer 11 may be made of gold, silver, aluminum, or the like, in addition to copper, and among these, a copper foil is common. Moreover, although it does not specifically limit as this copper foil, When an etching characteristic, operativity, etc. are considered, electrolytic copper foil, rolled copper foil, etc. are preferable. The thickness of the conductor layer 11 is generally 1 to 70 μm, preferably 5 to 35 μm, and more preferably 9 to 25 μm. When copper foil is used as the conductor layer 11, the coefficient of thermal expansion (CTE) in the width direction and the longitudinal direction is 14 to 17 ppm / ° C. In this embodiment, a copper foil (isotropic) having a thickness of 25 μm and a thermal expansion coefficient of 16.5 ppm / ° C. is used as the conductor layer 11.
[0051]
The width direction here refers to a direction in which the laminated film 10 is conveyed, a direction orthogonal to a so-called mechanical direction (MD), a so-called transverse direction (TD).
[0052]
The insulating layer 12 includes an adhesive layer 13 for bonding with the conductor layer 11 and an insulating film 14 to which the adhesive layer 13 is attached. The insulating film 14 can be made of a material having flexibility and chemical resistance and heat resistance. The chemical resistance is set to be in contact with chemicals such as an acid during etching, and the heat resistance is set to prevent deterioration due to heating during bonding.
[0053]
As a material for such an insulating film 14, for example, polyester, polyamide, polyethersulfone, liquid crystal polymer, and the like can be used in addition to polyimide. In particular, pyromellitic dianhydride and aromatic diamine are used. Synthesized wholly aromatic polyimide (for example, trade name: Kapton; manufactured by Toray DuPont Co., Ltd.), wholly aromatic polyimide having a biphenyl skeleton (for example, trade name: Upilex; manufactured by Ube Industries, Ltd.) Is preferred. The thickness of the insulating film 14 is generally 12.5 to 75 μm, and preferably 25 to 75 μm. Further, as described above, the standard value of the width of the insulating film 14 is defined as 35, 48, and 70 mm according to the EIAJ (Japan Electronic Machinery Association) standard. In the present embodiment, a polyimide (PI) film having a width of 48 mm and a thickness of 50 μm is used for high density and productivity improvement and for thinning. In addition, about the width | variety of the insulating film 14, it is not limited to each standard value mentioned above, For example, you may be larger than 70 mm.
[0054]
On the other hand, as a material for forming the adhesive layer 13 for bonding the conductor layer 11 and the insulating film 14, for example, a thermosetting resin, a thermoplastic resin, etc. having flexibility and chemical resistance and heat resistance are provided. Is mentioned. Examples of the thermosetting resin include epoxy resin materials and polyamide resin materials, and examples of the thermoplastic resin materials include thermoplastic polyimide resin materials. Of course, the material of the adhesive layer 13 is not particularly limited as long as the conductor layer 11 and the insulating film 14 are securely bonded to each other. Such an adhesive layer 13 may be formed by directly applying to one surface of the insulating film 14, or may be formed using an adhesive tape.
[0055]
Such insulating film 14 and adhesive layer 13 include sprocket holes used for transport and positioning of film carrier tape for mounting electronic components, through holes for solder balls, device holes for mounting electronic components, or A through hole such as a through hole for wire bonding may be provided in advance. Further, for example, when a sprocket hole is provided, the conductor layer 11 may be thermocompression bonded to a region other than both ends where the sprocket hole is provided, and the insulating film including the region where the sprocket hole is provided is included. The conductor layer 11 may be thermocompression bonded to the entire surface of 14 via the adhesive layer 13.
[0056]
Here, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 described above is substantially equal to or greater than the thermal expansion coefficient in the longitudinal direction of the conductor layer 11, for example, 14 to 28 ppm / ° C., preferably 16 to 23 ppm. / ° C, more preferably 16 to 22 ppm / ° C.
[0057]
As described above, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is optimized based on the thermal expansion coefficient of the conductor layer 11 when the conductor layer 11 and the insulating film 14 are thermocompression bonded. The conductor layer 11 surface of the laminated film 10 becomes a concave surface due to the difference between the amount of change in the longitudinal direction due to thermal expansion and the amount of change in the insulating film 14 in the longitudinal direction due to thermal expansion. This is to reduce warping over the longitudinal direction. And the curvature of the film carrier tape for electronic component mounting which is a final product can be reduced significantly by taking the countermeasure against the curvature of the laminated film 10 in the longitudinal direction in this way.
[0058]
In the present invention, the insulating film 14 is preferably in the longitudinal direction in consideration of, for example, the thermal expansion coefficient in the longitudinal direction of the conductor layer 11, the longitudinal expansion due to moisture absorption of the insulating film 14, or the thickness, material, and the like. What has a thermal expansion coefficient of (5) may be selected as appropriate, and is not limited to those described above.
[0059]
That is, when the thermal expansion coefficient in the longitudinal direction of the conductor layer 11 and the thermal expansion coefficient in the longitudinal direction of the insulating film 14 are substantially equal, for example, the insulating film 14 hardly expands due to moisture absorption, 11 and the insulating film 14 preferably have the same expansion due to moisture absorption. This is for preventing the conductor layer 11 surface of the laminated film 10 from being warped in the longitudinal direction due to expansion due to moisture absorption of the insulating film 14 after thermocompression bonding.
[0060]
In addition, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is preferably set to be somewhat larger than the thermal expansion coefficient in the longitudinal direction of the conductor layer 11 in consideration of the expansion in the longitudinal direction due to moisture absorption of the insulating film 14. This is because the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is large, and when the insulating film 14 is cooled after thermocompression bonding, the insulating film 12 surface of the laminated film 10 is temporarily concave in the longitudinal direction. However, due to the subsequent expansion in the longitudinal direction due to moisture absorption of the insulating film 14, a predetermined stress in the reverse direction that warps in the longitudinal direction is generated so that the conductor layer 11 surface of the laminated film 10 becomes a concave surface. This is because a flat laminated film 10 can be obtained.
[0061]
Note that the adhesive layer 13 that press-bonds the insulating film 14 and the conductor layer 11 generally has a large thermal expansion coefficient, but is very thin compared to the insulating film 14 and has almost no effect on the warp due to thermal expansion. Don't give. However, it is preferable to use the adhesive layer 13 having a thermal expansion coefficient close to that of the insulating film 14 as much as possible.
[0062]
Thus, in this embodiment, the surface of the conductor layer 11 of the laminated film 10 is set by setting the thermal expansion coefficient in the longitudinal direction of the insulating film 14 to be approximately equal to or greater than the thermal expansion coefficient in the longitudinal direction of the conductor layer 11. Can be greatly prevented from warping in the longitudinal direction so as to be concave.
[0063]
In the present embodiment, the thermal expansion coefficient in the width direction of the insulating film 14 is determined as the conductor layer for the problem of warping in the width direction of the insulating film 14 due to the difference in thermal expansion between the conductor layer 11 and the insulating layer 12 described above. Improvements were made by optimizing based on a thermal expansion coefficient of 11. That is, in this embodiment, the thermal expansion coefficient in the width direction of the insulating film 14 is substantially equal to or greater than the thermal expansion coefficient in the width direction of the conductor layer 11, for example, 14 to 30 ppm / ° C., preferably 16 -25 ppm / ° C, more preferably 16-23 ppm / ° C.
[0064]
As for the thermal expansion coefficient in the width direction of the insulating film 14, for example, the thermal expansion coefficient in the width direction of the conductor layer 11 and the width direction due to moisture absorption of the insulating film 14 are the same as the thermal expansion coefficient in the longitudinal direction described above. A material having a suitable thermal expansion coefficient in the width direction may be appropriately selected in consideration of expansion, thickness, material, etc., and is not limited to the above.
[0065]
Thus, in this embodiment, not only the thermal expansion coefficient in the longitudinal direction of the insulating film 14 described above but also the thermal expansion coefficient in the width direction are optimized based on the thermal expansion coefficient in the width direction of the conductor layer 11. Since it did in this way, it can prevent significantly that the laminated | multilayer film 10 curves not only in the longitudinal direction but the width direction, and also the flat laminated | multilayer film 10 can be implement | achieved. Therefore, the warp in the width direction and the longitudinal direction generated in the film carrier tape for mounting electronic components described later can be suppressed to be relatively small.
[0066]
Here, an example of the manufacturing method of the laminated film 10 mentioned above is shown.
[0067]
As shown in FIG. 2, the laminated film 10 includes an insulator (insulating layer) 12 composed of an insulating film 14 and an adhesive layer 13 that are conveyed, and a conductor (conductor layer) 11 that is unwound from an unwinding roller 15. The thermoplastic resin or thermosetting resin is applied onto the conductor 11 by applying a predetermined tension to the conductor 11 and the insulator 12 and heating the conductor 11 and the insulator 12 at a certain temperature while being sandwiched between the two thermocompression rollers 16 and 17. It is manufactured by adhering an insulating film 14 via an adhesive layer 13 made of The laminated film 10 thus manufactured is then wound up with a predetermined tension applied by the winding roller 18.
[0068]
Here, only one of the thermocompression-bonding rollers 16 and 17 may be heated, or both may be heated. Generally, the thermocompression roller 16 on the conductor 11 side is heated, but in order to prevent warping, it is better to heat both thermocompression rollers 16 and 17. Moreover, when heating both, the heating temperature with respect to the conductor 11 of the thermocompression-bonding rollers 16 and 17 or the insulator 12 may be the same heating temperature respectively, but the warp in the width direction of the laminated film 10 may be applied. In order to reduce significantly, it is preferable to set the heating temperature of the thermocompression roller 17 on the insulator 12 side high. In addition, the manufacturing method of such a laminated film 10 is not limited to this.
[0069]
As described above, in this embodiment, the conductor 11 and the insulator 12 are transported in a state in which a predetermined tension is applied in the longitudinal direction of the conductor 11 and the insulator 12, that is, the winding direction, in the step of thermocompression bonding. As a result, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 described above has the effect of being smaller than the thermal expansion coefficient in the width direction.
[0070]
In consideration of the tension applied to the conductor 11 and the insulator 12 during the production of such a laminated film 10, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is made smaller than the thermal expansion coefficient in the width direction. May be slightly smaller than the thermal expansion coefficient of the conductor layer 11 in the longitudinal direction. For example, when the thermal expansion coefficient of the copper foil is 16.5 ppm / ° C., the thermal expansion coefficient in the width direction of the insulating film 14 is 20.5 ppm, and the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is 15.8 ppm / ° C. It is good.
[0071]
Note that, as described above, in the present embodiment, the method of manufacturing the laminated film 10 by thermocompression bonding of the conductor 11 and the insulator 12 is exemplified, but the present invention is not particularly limited. For example, on the insulator You may employ | adopt the method of forming while heating a conductor, the method of forming an insulator on a conductor conversely, etc.
[0072]
Hereinafter, the film carrier tape for electronic component mounting manufactured using the laminated film 10 mentioned above is demonstrated. FIG. 3 is a schematic configuration diagram showing an example of a film carrier tape for mounting electronic components according to an embodiment of the present invention, where (a) is a plan view and (b) is a partial cross-sectional view. is there.
[0073]
A film carrier tape 20 for mounting an electronic component as shown in FIGS. 3A and 3B is a CSP (Chip Size Package) film having a size substantially the same as an electronic component manufactured using the laminated film 10 described above. The tape-shaped electronic component mounting film carrier tape 20 is a carrier tape, and a plurality of regions where electronic components and the like are mounted are continuously provided.
[0074]
The electronic component mounting film carrier tape 20 has a wiring pattern 21 formed by patterning the conductor layer 11, sprocket holes 22 provided on both sides of the wiring pattern 21 in the width direction, and a wiring pattern 21. And a plurality of through-holes 23 provided in the region. The sprocket hole 22 is used for positioning when patterning the conductor layer 11 or conveying when mounting an electronic component.
[0075]
Further, a solder resist layer 24 formed by applying a solder resist material coating solution by, for example, a screen printing method is provided on the wiring pattern 21. The wiring pattern 21 not covered with the solder resist layer 24 becomes the device side connection terminal 25. Further, the wiring pattern 21 corresponding to the position where the through hole 23 is provided becomes an external connection terminal 26 for connecting an electronic component and an external wiring (not shown). In the present embodiment, the solder resist layer 24 is a thermosetting solder resist layer.
[0076]
Such a solder resist layer 24 cures the solder resist by forming a wiring pattern and then applying and heating the solder resist leaving the device side connection terminals 25 electrically connected to the electronic components. When such a solder resist is cured, a shrinkage stress is applied to the wiring pattern 21, the insulating film 14, and the like, and eventually causes warping of the electronic component mounting film carrier tape 20. The warping process in the width direction and the longitudinal direction of the electronic component mounting film carrier tape 20 is corrected by performing the warping process in the width direction and the longitudinal direction.
[0077]
Furthermore, a plating layer 27 is formed on the device side connection terminals 25 and the external connection terminals 26 by, for example, electroplating. Such a plated layer 27 is appropriately selected from materials such as tin, solder, gold, and nickel depending on the mounting method of the electronic component. For example, in this embodiment, a gold plating is formed on the nickel plating. Yes. The thickness of the plating layer 27 is 0.02 to 12.0 μm, preferably 0.02 to 3.0 μm.
[0078]
Such a film carrier tape 20 for mounting electronic components is used, for example, in a mounting process of electronic components such as an IC chip and a printed circuit board while being transported. Note that the electronic components and the like are mounted on the solder resist layer 24 of the electronic component mounting film carrier tape 20.
[0079]
Here, an example of a manufacturing method of the above-described electronic component mounting film carrier tape 20 will be described with reference to FIG. FIG. 4 is a partial cross-sectional view showing an example of a method for manufacturing a film carrier tape for mounting electronic components according to the present embodiment.
[0080]
First, as shown in FIG. 4A, the above-described laminated film 10 is prepared. In this embodiment, the laminated film 10 has a sprocket hole 22 and a through hole 23 formed at the same time through the insulating film 14 and the adhesive layer 13 in advance by punching or the like, and this is formed into a conductor layer made of copper foil. 11 was formed by thermocompression bonding. The conductor layer 11 is pressure-bonded only to portions other than both sides in the width direction where the through holes 23 are provided.
[0081]
Next, as shown in FIG. 4B, for example, a negative photoresist material coating solution is applied to the region where the wiring pattern 21 is formed on the conductor layer 11 by using a general photolithography method. Then, a photoresist material coating layer 28 is formed. Of course, a positive photoresist material coating solution may be used.
[0082]
Further, after positioning pins (not shown) are inserted into the sprocket holes 22 to position the conductor layer 11 and the insulating layer 12, exposure and development are performed via a photomask 29 as shown in FIG. As a result, the photoresist material coating layer 28 is patterned to form a wiring pattern resist pattern 30 as shown in FIG.
[0083]
Next, the wiring pattern 21 as shown in FIG. 4E is formed by dissolving and removing the conductor layer 11 with an etching solution using the wiring pattern resist pattern 30 as a mask pattern. Subsequently, as shown in FIG. 4F, the solder resist layer 24 is formed by applying a thermosetting solder resist material coating liquid and curing it by using, for example, a screen printing method. The solder resist layer 24 may be formed using a general photolithography method instead of the screen printing method.
[0084]
Thereafter, a plating layer 27 is formed on the device side connection terminals 25 and the external connection terminals 26 by electroplating. Of course, the material used for the plated layer 27 can be the same material as described above, and needless to say, it may be selected as appropriate depending on the mounting method of the electronic component.
[0085]
The electronic component mounting film carrier tape 20 manufactured using the above-described laminated film 10 is not limited to the above-described CSP film carrier tape. For example, COF, BGA, and μ-BGA type electronic component mounting film carriers are used. Needless to say, it may be a tape.
[0086]
Hereinafter, other examples of the film carrier tape for mounting electronic components manufactured using the laminated film 10 described above will be described. 5A and 5B are schematic configuration diagrams showing a film carrier tape for mounting an electronic component according to the present invention, where FIG. 5A is a plan view and FIG. 5B is a cross-sectional view.
[0087]
A film carrier tape 20 for mounting an electronic component as shown in FIGS. 5A and 5B is a COF (Directly Mounted Bare IC Chips in a Small Space and High Density Manufactured Using the Laminated Film 10 described above. Chip-on-film) is a film carrier tape, and includes a wiring pattern 21 patterned on the conductor layer 11 and sprocket holes 22 provided on both sides of the wiring pattern 21 in the width direction. In addition, each wiring pattern 21 has a size substantially corresponding to the size of the electronic component to be mounted, and is continuously provided on the surface of the insulating layer 12. Furthermore, a solder resist layer 24 formed by applying a solder resist material coating solution by, for example, a screen printing method is provided on the wiring pattern 21. Of course, the solder resist layer 24 may be formed by using a photolithography method instead of the screen printing method.
[0088]
The electronic component mounting film carrier tape 20 is used for mounting an electronic component such as an IC chip or a printed circuit board while being conveyed, for example.
[0089]
Moreover, the other example of the film carrier tape for electronic component mounting manufactured using the laminated | multilayer film 10 which concerns on this embodiment is demonstrated using FIG.6 and FIG.7. 6 is a schematic plan view showing another example of a film carrier tape for mounting electronic components according to an embodiment of the present invention, and FIG. 7 is a cross-sectional view of FIG.
[0090]
The film carrier tape 20 for mounting an electronic component as shown in FIGS. 6 and 7 is a TAB tape provided with a slit 31 for wire bonding, and an area where the electronic component or the like is mounted on the tape-like insulating film 14. Are continuously provided. The insulating film 14 is formed with sprocket holes 22 for transportation on both sides in the width direction at regular intervals. Generally, electronic components are mounted while being transferred through the sprocket holes 22.
[0091]
Such an electronic component mounting film carrier tape 20 has a wiring pattern 21, device-side connection terminals 25, and external connection terminals 26 on almost the entire surface of the insulating film 14 having a size substantially corresponding to the size of the electronic component to be mounted. The slit 31 for connecting with the electronic component mounted in the back surface side of the device side connection terminal 25 is provided.
[0092]
The wiring pattern 21 excluding the device side connection terminals 25 and the external connection terminals 26 is covered with a solder resist layer 24, and terminal holes 32 are formed in the solder resist layer 24 corresponding to the external connection terminals 26. The external connection terminal 26 serves as a solder ball pad and is connected to the outside via a solder ball (not shown). A plating layer 27 is applied to the wiring pattern 21, the device-side connection terminal 25, and the external connection terminal 26 that are not covered with the solder resist layer 24. As the plating layer 27, it is preferable to form gold plating on nickel plating in order to perform mounting by wire bonding. However, the plating layer 27 is not particularly limited to this. For example, tin plating, solder plating, gold plating, etc. What is necessary is just to select according to the mounting method etc.
[0093]
Here, since the film carrier tape 20 for mounting electronic components described above is manufactured using the flat laminated film 10 in which the thermal expansion coefficients of the conductor layer 11 and the insulating film 14 are optimized, the width direction and the longitudinal direction thereof are the same. The warping of the direction can be sufficiently suppressed. However, due to factors such as reducing the thickness of the electronic component mounting film carrier tape 20 and increasing the width to 48 mm or more in order to increase density and improve productivity, the final product electronic component mounting film carrier tape The warpage in the width direction and the longitudinal direction of 20 becomes substantially large, and there is a product that cannot be dealt with by the warp countermeasures by simply manufacturing the laminated film 10 flat.
[0094]
Therefore, in the present embodiment, the final process of manufacturing the electronic component mounting film carrier tape 20, that is, the width direction of the electronic component mounting film carrier tape 20 after forming the wiring pattern 21 and the like and before mounting the electronic component. After the first warping process, a second warping process in the longitudinal direction is performed. Hereinafter, the film carrier tape 20 for mounting electronic components shown in FIG. 3 will be described.
[0095]
In the production of the electronic component mounting film carrier tape 20, the wiring pattern 21 layout and the shrinkage stress generated when the solder resist is hardened cause the electronic component mounting film carrier tape 20 to be a conductor layer across its width direction. 11 side, that is, the surface of the wiring pattern 21 and the solder resist layer 24 side is warped so as to be a concave surface.
[0096]
And in this embodiment, in order to correct the curvature of the width direction of the film carrier tape 20 for electronic component mounting as a post process which forms the wiring pattern 21 grade | etc., A reverse curvature is provided with respect to the curvature generate | occur | produced in the width direction. A first warp removing step for removing the warp in the width direction is provided.
[0097]
Specifically, for the warp generated in the width direction of the electronic component mounting film carrier tape 20, the wiring pattern 21 and the solder resist layer 24 side are heated while heating the electronic component mounting film carrier tape 20. Correction is made by applying a reverse warp in the direction in which the surface becomes convex. As heating temperature at this time, it is 80-200 degreeC, for example, Preferably it is 150-200 degreeC. The processing time is, for example, within 5 minutes, preferably within 2 minutes.
[0098]
The warping in the width direction of the electronic component mounting film carrier tape 20 was corrected in this way mainly because the conductor layer 11, the adhesive layer 13, and the like laminated on the insulating film 14 such as polyimide when the warp was removed. This is considered to be because it was softened by heating and solidified by applying a reverse warp in that state.
[0099]
In addition to this, for example, the correction can also be made by applying a reverse warp to the electronic component mounting film carrier tape 20 using a barrel-shaped roller. Further, as described above, the correction can also be made by transporting the electronic component mounting film carrier tape 20 in a meandering manner while heating between a plurality of upper and lower rollers without applying a reverse warp. Furthermore, it can be corrected by immediately cooling the electronic component mounting film carrier tape 20 to a predetermined temperature and then rapidly cooling it to near room temperature by applying a reverse warp.
[0100]
Thus, in this embodiment, since the reverse warp of the width direction was provided with respect to the electronic component mounting film carrier tape 20 on predetermined conditions, about the warp of the width direction is reduced significantly.
[0101]
However, when such a warp removal in the width direction of the electronic component mounting film carrier tape 20 is performed, the stress at the time of applying the reverse warp changes its direction, and in the longitudinal direction of the electronic component mounting film carrier tape 20. The film carrier tape 20 for mounting an electronic component is warped so that the conductor layer 11 side, that is, the surface on the wiring pattern 21 side or the like is concave along the longitudinal direction. Such a phenomenon becomes remarkable when the total thickness of the electronic component mounting film carrier tape 20 is 75 μm or less or the width is 48 mm or more.
[0102]
Therefore, in the present embodiment, the warp in the longitudinal direction of the electronic component mounting film carrier tape 20 is applied with a reverse warp while the electronic component mounting film carrier tape 20 is heated.
[0103]
Specifically, as shown in FIG. 8, the film carrier tape 20 for mounting an electronic component is wound around a take-up reel 40 and is corrected by being wound around the take-up reel 40 while being heated for a predetermined time. .
[0104]
At this time, it is desirable to wind the take-up reel 40 so that the surface on the wiring pattern 21 side of the electronic component mounting film carrier tape 20 faces outward.
[0105]
Moreover, it is desirable that the electronic component mounting film carrier tape 20 is wound around the take-up reel 40 via the spacer 50. In this way, by winding the electronic component mounting film carrier tape 20 via the spacer 50, the wiring pattern 21 and the solder resist layer 24 are directly contacted with the back surface of the next insulating film 14 on which the wiring pattern 21 and the solder resist layer 24 are wound. Can be prevented. Thereby, for example, heating is performed when the film is wound on the take-up reel 40, but the positional deviation of the insulating film 14 does not directly affect the solder resist layer 24 due to this heating, and it remains in the solder resist layer 24. It can prevent that the soldering resist layer 24 and the back surface of the insulating film 14 adhere | attach with the uncured resin to perform.
[0106]
Such a spacer 50 is preferably formed of a material having heat resistance to such an extent that it is not deformed by heating. For example, a polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyimide, In addition to flexible films formed from plastics (resins) such as polyamide, metal foils such as aluminum foil and copper foil can be used. The spacer 50 is preferably a flat spacer having a uniform thickness. Thereby, stable workability can be ensured. The thickness of the spacer 50 is not particularly limited, but is, for example, 25 to 125 μm, preferably 75 to 125 μm.
[0107]
In the warping process in the longitudinal direction of the film carrier tape 20 for mounting an electronic component described above, a method of winding on the take-up reel 40, preferably via the spacer 50, in the tape state is illustrated. In addition to the method, for example, as shown in FIGS. 9 and 10, the electronic component mounting film carrier tape 20 is cut into a strip shape, and is sandwiched with a jig having a predetermined curvature, and then a strip shape together with the jig. There is also a method in which the film carrier tape 20 for mounting electronic components is heated and pressurized.
[0108]
As shown in FIG. 10, the jig 60 used in such a method includes an upper die 61 having a predetermined radius of curvature and a lower die 62 having the same radius of curvature. A number of positioning pins 63 are implanted in the lower mold 62 at positions corresponding to the sprocket holes 22. The curvature radius R of such a jig 60, that is, the upper die 61 and the lower die 62 is 3 to 10 cm, preferably 3 to 6 cm.
[0109]
The film carrier tape 20 for mounting electronic components cut into a strip shape is sandwiched between the upper mold 61 and the lower mold 62 of the jig 60 having such a radius of curvature, and the upper mold 61 and the lower mold 62 are fastened. It is tightened with a tool (not shown) and held at a predetermined temperature for a certain time in a state where a stress opposite to the warp generated in the longitudinal direction, that is, the reverse warp is applied. Thereby, the curvature generate | occur | produced in the longitudinal direction of the strip-shaped electronic component mounting film carrier tape 20 can be reduced significantly.
[0110]
In addition, when performing warpage removal in the longitudinal direction using such a jig 60, it is a matter of course that the strip-shaped electronic component mounting film carrier tape 20 is attached so that the surface on the wiring pattern 21 side is a convex surface. It is. The jig 60 may be attached with a plurality of strip-shaped electronic component mounting film carrier tapes 20. In addition, in this case, it is preferable to interpose a spacer between the electronic component mounting film carrier tape 20. At this time, the spacer used may be at least a width in which the wiring pattern 21 is formed. Of course, the spacer may have the same width as that of the insulating film 14, and a sprocket hole may be formed in the spacer, or may be used without forming the sprocket hole with a width substantially the same as the width of the conductor layer 11.
[0111]
In addition, as described above, when correcting the warp in the longitudinal direction of the electronic component mounting film carrier tape 20, the temperature at which the electronic component mounting film carrier tape 20 is heated is 60 to 150 ° C., preferably 80-150 ° C. That is, by heating in this way, mainly, the solder resist layer 24 and the like are softened to some extent, and at the same time, the solder resist layer 24 and the like are solidified again in a state where reverse warping is applied, so that the film carrier tape 20 for mounting electronic components is obtained. It is considered that the warpage in the longitudinal direction is corrected. Furthermore, in this embodiment, the above-described film carrier tape 20 for mounting electronic components is heated as described above, and the warpage in the longitudinal direction is greatly reduced by holding for 1 to 20 hours, preferably 10 to 20 hours. Can do.
[0112]
Furthermore, in this embodiment, in order to effectively remove the warp in the longitudinal direction after removing the warp in the width direction of the film carrier tape 20 for mounting an electronic component, the thermal expansion coefficient in the longitudinal direction of the insulating film 14 is the conductor layer 11. It is preferable to make it larger than the thermal expansion coefficient in the longitudinal direction. And the film carrier tape 20 for electronic component mounting is manufactured using the flat laminated | multilayer film 10 manufactured by optimizing the thermal expansion coefficient of the longitudinal direction of the insulating film 14 based on the thermal expansion coefficient of the longitudinal direction of the conductor layer 11. By doing so, not only the effect of suppressing the warpage in the longitudinal direction of the film carrier tape 20 for mounting electronic components, but also the effect that the warping in the longitudinal direction after the warping in the width direction can be more effectively performed. Play.
[0113]
As described above, in the manufacturing method of the film carrier tape 20 for mounting electronic components according to the present embodiment, the laminated film 10 in which the thermal expansion coefficient of the insulating film 14 is optimized based on the thermal expansion coefficient of the conductor layer 11 is used. Further, since the warp in the longitudinal direction due to the warp removal in the width direction of the electronic component mounting film carrier tape 20 is performed, warping occurring in the width direction and the longitudinal direction of the film carrier tape 20 for mounting electronic components is performed. It can be greatly reduced. That is, a flat electronic component mounting film carrier tape 20 can be realized as a final product.
[0114]
In addition, as described above, since the flat electronic component mounting film carrier tape 20 cut into strips can be realized, problems such as poor conveyance and poor positioning in the process of mounting the electronic components do not occur, and the desired The electronic component can be reliably mounted at the position. Therefore, the yield can be improved.
[0115]
Moreover, according to the manufacturing method of this embodiment, even when manufacturing the electronic component mounting film carrier tape 20 having a relatively thin width of 75 μm or less and a comparatively large width of 48 mm or more, the electronic component mounting film carrier tape 20 Warpage occurring in the width direction and the longitudinal direction can be greatly reduced. Therefore, high-density mounting of electronic components and productivity improvement can be achieved.
[0116]
Hereinafter, although the Example of the film carrier tape 20 for electronic component mounting mentioned above is described, this invention is not limited to these.
[0117]
Example 1
First, the thermal expansion coefficient in the longitudinal direction is 15.8 ppm / ° C. and the thermal expansion coefficient in the width direction is 20 on a copper foil having a thermal expansion coefficient in the longitudinal direction and the width direction of 16.5 ppm / ° C. and a thickness of 25 μm. A laminated film was manufactured by thermocompression bonding a polyimide film having a thickness of 0.5 ppm / ° C. and a thickness of 50 μm through an adhesive layer 13 having a thickness of 12 μm made of a thermosetting polyamide-based resin.
[0118]
Next, after forming a wiring pattern by patterning the polyimide film by etching, a solder resist layer having a thickness of 5 to 15 μm is formed in a region excluding the device side connection terminal and the external connection terminal on the wiring pattern, and Then, nickel plating was formed on the device side connection terminals and the external connection terminals, and then gold plating was formed on the nickel plating to produce a film carrier tape for mounting electronic components.
[0119]
Next, while heating this film carrier tape for mounting electronic components to 200 ° C., a reverse warp was applied for 1 minute in a direction in which the wiring pattern and the solder resist layer side surface became convex. Thereafter, the electronic component mounting film carrier tape is cut into a strip having a length of 190 mm and a width of 48 mm, and further, a strip-shaped electronic component is formed between the upper mold and the lower mold by using the jig shown in FIG. The film carrier tape for mounting was sandwiched and held for 20 hours while being heated to 100 ° C. Thus, what carried out the width direction and the longitudinal direction curvature was used as the film carrier tape for electronic component mounting of Example 1. FIG.
[0120]
The thermal expansion coefficient of the polyimide film was measured by the following TMA tensile load method.
[0121]
Specifically, a polyimide film cut to 50 × 50 mm and placed in a thermostat set at 300 ± 5 ° C. for 30 minutes in a state allowing free shrinkage is attached to a thermomechanical analyzer (TMA device). While applying a load of 2 g, the temperature increase rate was set to 20 ° C./min, and the dimensional change of the polyimide film when heated to 200 ° C. was measured and calculated based on the following formula.
[0122]
[Expression 1]
Thermal expansion coefficient α (ppm / ° C.) = (L₁-L₀) / L₀(T₁-T₀)
L₀: T₀Length of polyimide film at (° C) (mm)
L₁: T₁Length of polyimide film at (° C) (mm)
T₀: Section start temperature (° C) for obtaining coefficient of thermal expansion
T₁: End temperature (° C) for obtaining coefficient of thermal expansion
On the other hand, the thermal expansion coefficient of the copper foil is obtained by cutting the copper foil into a width of 5.0 cm and a length of 25 cm using, for example, a commercially available thermal expansion measuring device (trade name: DILATRONIC I; manufactured by Tokyo Kogyo Co., Ltd.) It calculated by measuring the dimensional change of the copper foil when a temperature rising rate was 2-5 degreeC / min and hold | maintained for 5 to 60 minutes under nitrogen atmosphere.
[0123]
(Example 2)
For mounting electronic components of Example 2 by the same method as Example 1 except that a polyimide film having a thermal expansion coefficient of 16.6 ppm / ° C. in the longitudinal direction and a thermal expansion coefficient of 20.4 ppm / ° C. in the width direction was used. A film carrier tape was produced.
[0124]
(Example 3)
The electron of Example 3 using the same laminated film as Example 1 except that a polyimide film having a thermal expansion coefficient of 16.8 ppm / ° C. in the longitudinal direction and a thermal expansion coefficient of 20.0 ppm / ° C. in the width direction was used. A film carrier tape for component mounting was manufactured.
[0125]
Example 4
For mounting electronic components of Example 4 in the same manner as in Example 1 except that a polyimide film having a thermal expansion coefficient in the longitudinal direction of 17.2 ppm / ° C and a thermal expansion coefficient in the width direction of 21.3 ppm / ° C was used. A film carrier tape was produced.
[0126]
(Comparative Example 1)
For mounting electronic parts of Comparative Example 1 by the same method as Example 1 except that a polyimide film having a thermal expansion coefficient of 13.0 ppm / ° C. in the longitudinal direction and a thermal expansion coefficient of 19.0 ppm / ° C. in the width direction was used. A film carrier tape was produced.
[0127]
(Comparative Example 2)
For mounting electronic components of Comparative Example 2 in the same manner as in Example 1 except that a polyimide film having a thermal expansion coefficient of 13.7 ppm / ° C. in the longitudinal direction and a thermal expansion coefficient of 18.7 ppm / ° C. in the width direction was used. A film carrier tape was produced.
[0128]
(Comparative Example 3)
For mounting electronic components of Comparative Example 3 in the same manner as in Example 1 except that a polyimide film having a thermal expansion coefficient of 13.8 ppm / ° C. in the longitudinal direction and a thermal expansion coefficient of 19.7 ppm / ° C. in the width direction was used. A film carrier tape was produced.
[0129]
(Test example)
The amount of warpage (mm) in the width direction and the longitudinal direction of the film carrier tape for mounting electronic components of each Example and Comparative Example was measured as follows.
[0130]
Specifically, the amount of warpage (mm) in the width direction of the film carrier tape for mounting electronic components is such that one end side in the width direction of the film carrier tape for mounting electronic components is in the longitudinal direction with the copper foil surface facing upward. It was fixed with an adhesive tape over and expressed as a height (mm) from the base on the other end side in the width direction of the film carrier tape for mounting electronic components.
[0131]
On the other hand, the warpage amount (mm) in the longitudinal direction of the film carrier tape for mounting electronic components was expressed as the maximum height (mm) from the base surface (reference surface) in a state of being left on the base. In addition, the curvature amount (mm) of the film carrier tape for electronic component mounting adjusted what the polyimide film of the film carrier tape for electronic component mounting was saturated in the conditions of 23 degreeC and 55% RH (relative humidity). Each was measured.
[0132]
[Table 1]

[0133]
As shown in Table 1 above, it is clear that the warp amounts in the width direction and the longitudinal direction of the fill carrier tapes for mounting electronic components of Examples 1 to 4 are significantly reduced as compared with Comparative Examples 1 to 3. It is.
[0134]
Moreover, although the curvature of the width direction has comparatively reduced the film carrier tape for electronic component mounting of Comparative Examples 1-3, it turns out that the curvature of a longitudinal direction is not reducing. In particular, in Comparative Example 3, the amount of warpage in the longitudinal direction is very large despite the fact that warping has been performed. Therefore, in order to effectively remove the warp in the longitudinal direction after removing the warp in the width direction of the film carrier tape for mounting electronic components, the thermal expansion coefficient in the longitudinal direction of the insulating film is set to the thermal expansion coefficient in the longitudinal direction of the conductor layer. It is preferable to make it approximately equal to or larger than the coefficient.
[0135]
From the above, the film carrier tape for mounting electronic components of Examples 1 to 4 has a thermal expansion coefficient in the longitudinal direction of the polyimide film (insulating film) substantially equal to or larger than that of the copper foil (conductor layer), The thermal expansion coefficient in the width direction of the polyimide film is optimized to be substantially the same as or larger than that of the copper foil, and further, by performing the above-described warping process in the width direction and the longitudinal direction, the film carrier tape for mounting electronic components It has been found that the warpage occurring in the width direction and the longitudinal direction can be greatly reduced.
[0136]
【The invention's effect】
As described above, in the method for manufacturing a film carrier tape for mounting an electronic component according to the present invention, the thermal expansion coefficient in the longitudinal direction of the insulating film is optimized based on the thermal expansion coefficient in the longitudinal direction of the conductor layer, and the first The warping in the width direction and the longitudinal direction of the film carrier tape for mounting electronic components is greatly reduced by performing the warping in the longitudinal direction of the film carrier tape for mounting electronic components due to the warping process in the second warping process. Can be reduced. Accordingly, a flat film carrier tape for mounting electronic components can be realized.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a laminated film according to an embodiment of the present invention, wherein (a) is a partial perspective view, and (b) is a cross-sectional view.
FIG. 2 is a schematic side view showing an example of a method for producing a laminated film according to an embodiment of the present invention.
FIGS. 3A and 3B are schematic views showing an example of a film carrier tape for mounting electronic components according to an embodiment of the present invention, wherein FIG. 3A is a plan view and FIG. 3B is a partial cross-sectional view.
FIG. 4 is a partial cross-sectional view illustrating an example of a method for producing a film carrier tape for mounting electronic components according to an embodiment of the present invention.
5A and 5B are schematic views showing another example of a film carrier tape for mounting electronic components according to an embodiment of the present invention, wherein FIG. 5A is a plan view and FIG. 5B is a cross-sectional view.
FIG. 6 is a schematic plan view showing another example of a film carrier tape for mounting electronic components according to an embodiment of the present invention.
FIG. 7 is a schematic cross-sectional view showing another example of a film carrier tape for mounting electronic components according to an embodiment of the present invention.
FIG. 8 is a schematic perspective view of a take-up reel used for manufacturing a film carrier tape for mounting electronic components according to an embodiment of the present invention.
FIG. 9 is a schematic perspective view of a film carrier tape for mounting electronic components cut into strips according to an embodiment of the present invention.
FIG. 10 is a schematic perspective view of a jig used for manufacturing a film carrier tape for mounting electronic components according to an embodiment of the present invention.
[Explanation of symbols]
10 Laminated film
11 Conductor layer (conductor)
12 Insulation layer (insulator)
13 Adhesive layer
14 Insulation film
15 Unwinding roller
16, 17 Thermocompression roller
18 Winding roller
20 Film carrier tape for mounting electronic components
21 Wiring pattern

Claims (13)

In the method for manufacturing a film carrier tape for mounting electronic components in which a wiring pattern is formed on the conductor layer of the laminated film having a conductor layer on one side of the insulating film,
After the insulating film is a laminated film having a longitudinal thermal expansion coefficient substantially equal to or larger than the longitudinal thermal expansion coefficient of the conductor layer, and after forming the wiring pattern, the terminal portion of the wiring pattern is The surface of the wiring pattern side generated over the width direction of the film carrier tape for mounting an electronic component is concave before the electronic component is mounted on the wiring pattern by performing a step of applying and curing a solder resist. A first warp removing step in the width direction of the electronic component mounting film carrier tape for applying a stress for correcting the warping, and the wiring generated over the longitudinal direction of the electronic component mounting film carrier tape The longitudinal direction of the film carrier tape for mounting an electronic component, which applies stress for correcting warpage in which the surface on the pattern side is concave, is applied. Warp-up process and the film carrier tape manufacturing method which is characterized in that the. In the method for manufacturing a film carrier tape for mounting electronic components in which a wiring pattern is formed on the conductor layer of the laminated film having a conductor layer on one side of the insulating film,
  Using the laminated film having a longitudinal thermal expansion coefficient substantially equal to or greater than the longitudinal thermal expansion coefficient of the conductor layer, after forming the wiring pattern and before mounting electronic components, The first in the width direction of the film carrier tape for mounting electronic components, which applies stress for correcting the warp in which the surface on the side of the wiring pattern generated in the width direction of the film carrier tape for mounting electronic components becomes concave. The film carrier tape for mounting an electronic component, which applies a stress for correcting a warp removing step and a warp in which the surface of the wiring pattern side generated over the longitudinal direction of the film carrier tape for mounting an electronic component becomes a concave surface A second warping process in the longitudinal direction, and in the second warping process, the electronic component mounting film carrier tape The electronic component is wound around a take-up reel so that the surface on the conductor layer side faces outward, and the electronic component mounting film carrier tape is held at a temperature within a range of 80 to 150 ° C. for 10 hours or more. Manufacturing method of film carrier tape for mounting. 3. The method of manufacturing a film carrier tape for mounting electronic components according to claim 2 , wherein, in the second warping step, the film carrier tape for mounting electronic components is wound around the winding reel together with a spacer and heated. . 4. The method of manufacturing a film carrier tape for mounting electronic parts according to claim 3 , wherein the spacer is a flat spacer. In the method for manufacturing a film carrier tape for mounting electronic components in which a wiring pattern is formed on the conductor layer of the laminated film having a conductor layer on one side of the insulating film,
  Using the laminated film having a longitudinal thermal expansion coefficient substantially equal to or greater than the longitudinal thermal expansion coefficient of the conductor layer, after forming the wiring pattern and before mounting electronic components, The first in the width direction of the film carrier tape for mounting electronic components, which applies stress for correcting the warp in which the surface on the side of the wiring pattern generated in the width direction of the film carrier tape for mounting electronic components becomes concave. The film carrier tape for mounting an electronic component, which applies a stress for correcting a warp removing step and a warp in which the surface of the wiring pattern side generated over the longitudinal direction of the film carrier tape for mounting an electronic component becomes a concave surface A second warping process in the longitudinal direction, and in the second warping process, the electronic component mounting film carrier tape The film carrier tape manufacturing method, which comprises heating in a state of being sandwiched jig having a predetermined curvature after they are cut into strips. In any one of claims 1-5, wherein the insulating film carrier tape for mounting electronic components thermal expansion coefficient in the width direction is equal to or greater than the width direction of the thermal expansion coefficient substantially equal to or of the conductor layer of the film Manufacturing method. The method of manufacturing a film carrier tape for mounting electronic components according to any one of claims 1 to 6 , wherein the thermal expansion coefficient in the longitudinal direction of the insulating film is smaller than the thermal expansion coefficient in the width direction of the insulating film. 8. The electronic component mounting according to claim 7 , wherein a thermal expansion coefficient in the longitudinal direction of the insulating film is 14 to 28 ppm / ° C., and a thermal expansion coefficient in the width direction of the insulating film is 14 to 30 ppm / ° C. Film carrier tape manufacturing method. In any one of claims 1-8, the film carrier tape manufacturing method, wherein the conductive layer is a copper foil. The method for producing a film carrier tape for mounting electronic components according to any one of claims 1 to 9 , wherein a laminated film obtained by thermocompression bonding the insulating film and the conductor layer is used. 11. The method of manufacturing a film carrier tape for mounting electronic parts according to claim 10 , wherein a laminated film obtained by thermocompression bonding the conductor layer on the insulating film via a thermoplastic resin layer is used. 11. The method of manufacturing a film carrier tape for mounting electronic parts according to claim 10 , wherein a laminated film obtained by thermocompression bonding the conductor layer on the insulating film via a thermosetting resin layer is used. In any one of claims 1 to 12, wherein in the first warp-up step, heating while deflecting the film carrier tape in the opposite direction to the warp surface of the conductor layer side is a concave surface A method for producing a film carrier tape for mounting electronic components.

Images