JP3871908B2 - Manufacturing method of film carrier tape for mounting electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is a method of manufacturing a film carrier tape for mounting electronic components such as CSP (Chip Size Package), BGA (Ball Grid Array), etc., which includes warp deformation that is deformation in the width direction and curl deformation that is deformation in the longitudinal direction. The present invention relates to a method for efficiently producing a film carrier tape for mounting electronic components in which any of the above is reduced.
[0002]
[Prior art]
A film carrier tape for mounting electronic components such as CSP and BGA generally forms a conductive metal layer made of a metal such as copper or aluminum on at least one surface of an insulating film made of a flexible insulating resin, The conductive metal layer is formed, for example, by exposing the conductive metal layer to a photoresist or the like developed in a desired pattern as a masking material to form a desired wiring pattern made of a conductive metal. The terminal portion of the wiring pattern thus formed needs to be exposed to be connected to a semiconductor chip or the like, but the other wiring pattern portion is often protected by applying a solder resist. Further, when forming a wiring pattern, a conductive metal foil such as a copper foil or an aluminum foil is disposed on the surface of the insulating film, and this conductive metal foil is etched to form a desired wiring pattern. The conductive metal foil is attached to the insulating film using a thermosetting adhesive.
[0003]
In such a film carrier tape for mounting electronic parts, the solder resist and the thermosetting adhesive have a property of shrinking with curing. Therefore, a film carrier tape for mounting electronic components in which such a thermosetting adhesive and a solder resist are applied to one surface of an insulating film has a surface coated with these (usually a surface on which a wiring pattern is formed). Warping deformation curved in the width direction with the inside facing.
[0004]
The warp deformation that occurs in the width direction of the film carrier tape for mounting electronic components can be corrected by various methods, for example, by applying a solder resist and curing, and then correcting it while applying reverse warp in the width direction under heating. It is known to be possible. Note that such warp deformation in the width direction tends to become larger as the insulating film becomes thinner and the finer pitch of the formed wiring pattern progresses as the electronic equipment becomes smaller and lighter.
[0005]
By the way, when a semiconductor chip (IC) or the like is mounted on the film carrier tape for mounting electronic parts as described above, about 5 to 10 semiconductor chips are cut in series to make the film carrier tape into a strip shape. It is often supplied to a chip mounting apparatus. In the film carrier tape cut into strips in this way, when the warp deformation in the width direction is corrected by applying reverse warp as described above, the stress changes the direction and the longitudinal direction of the film carrier tape cut into strips May develop as a curled deformation. If the strip-shaped film carrier tape is curled in the longitudinal direction in this way, not only will it adversely affect workability during transport, but it may also cause misalignment and damage of the semiconductor chip during mounting. There is.
[0006]
OBJECT OF THE INVENTION
The present invention manufactures an electronic component mounting film carrier tape in which both warp deformation in the width direction and curl deformation in the longitudinal direction are corrected in a film carrier tape for electronic component mounting that is used after being cut into strips. It aims to provide a method.
[0007]
SUMMARY OF THE INVENTION
The method for producing a film carrier tape for mounting electronic components according to the present invention includes a step of forming a wiring pattern made of a conductive metal on at least one surface of an insulating film, and a solder resist is applied leaving a terminal portion of the wiring pattern・ For electronic component mounting with a curing process
In the method for manufacturing a film carrier tape,
Before the electronic component is mounted on the terminal part exposed from the solder resist of the film carrier tape for mounting the electronic component, the warp deformation caused by the tape being bent in the width direction of the film carrier tape is corrected, and then the film Corrects curled deformation caused by bending in the longitudinal direction of carrier tape For this purpose, a film carrier tape for mounting electronic components is wound with a flat spacer on a take-up reel so that the surface on which the wiring pattern is formed is located outside, and heated and maintained at a temperature in the range of 80 to 150 ° C. for 10 hours or more. Do It is characterized by that.
[0008]
By eliminating the warp deformation that occurs in the width direction of the film carrier tape as described above, the stress that caused the warp deformation in the width direction curls the end in the longitudinal direction of the film carrier tape toward the wiring pattern formation side. Causing curled deformation. In particular, in CSP and BGA, the film carrier tape is often cut into strips to mount electronic components. In such a case, if a curled deformation occurs near the end in the longitudinal direction of the film carrier tape, the electronic components are accurately It becomes difficult to be mounted on.
[0009]
Therefore, in the present invention, after the warp deformation generated in the width direction of the film carrier tape is removed by applying a reverse warp, the curled deformation generated in the longitudinal direction of the film or the rear tape is removed.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, the manufacturing method of the film carrier tape for electronic component mounting of this invention is demonstrated concretely.
In the method for manufacturing a film carrier tape for mounting electronic components according to the present invention, a wiring pattern is formed on one surface of a flexible insulating film.
[0011]
Since the insulating film that can be used in the present invention comes into contact with an acid or the like during etching, it has chemical resistance that is not affected by such chemicals and heat resistance that does not change even when heated during bonding. ing. Examples of the material forming the insulating film include polyester, polyamide, and polyimide. In the present invention, it is particularly preferable to use a film made of polyimide. Such polyimide has excellent heat resistance and chemical resistance compared to other resins, and in these respects, it has superior properties that cannot be compared with other resins. ing. However, this polyimide resin has a characteristic that it absorbs moisture in an amount of 3% by weight or less, and has a characteristic that the dimension changes due to such water absorption.
[0012]
Examples of this polyimide resin include wholly aromatic polyimide synthesized from pyromellitic dianhydride and aromatic diamine, and wholly aromatic having biphenyl skeleton synthesized from biphenyltetracarboxylic dianhydride and aromatic diamine. Group polyimide can be mentioned. In particular, in the present invention, a wholly aromatic polyimide having a biphenyl skeleton (for example, trade name: Upilex S, manufactured by Ube Industries, Ltd.) is preferably used. The wholly aromatic polyimide having a biphenyl skeleton has a lower water absorption rate than other wholly aromatic polyimides. The thickness of the insulating film that can be used in the present invention is usually in the range of 25 to 125 μm, preferably 25 to 75 μm. In particular, in the present invention, the warp deformation in the width direction increases as the thickness of the insulating film decreases, and when the warp deformation is applied in the width direction of the film carrier tape in order to correct the warp deformation, the warp deformation in the width direction occurs. The stress that has formed the shape changes in the direction of curl in the longitudinal direction. Such a tendency becomes more prominent as the thickness of the insulating film becomes thinner, and it tends to be particularly noticeable when the thickness of the insulating film is 50 μm or less. Therefore, the method of the present invention is particularly useful when a thin polyimide film such as 25 to 50 μm is used as the insulating film.
[0013]
When manufacturing a film carrier tape for mounting an electronic component according to the method of the present invention, first, sprocket holes (perforations) are formed by punching on both edges of the insulating film as described above, and at the same time, if necessary, slits, Solder ball holes, positioning holes and the like can be formed by punching.
In the present invention, a conductive metal is adhered to at least one surface of the insulating film in which the necessary punched holes are formed as described above. Examples of the conductive metal used here include an aluminum foil and a copper foil. As such a conductive metal foil, a metal foil usually in the range of 3 to 35 μm, preferably 9 to 25 μm can be used. In particular, a conductive metal foil having a thickness of, for example, 25 μm or less, particularly recently 18 μm or less has been increasingly used, and as the thickness of the conductive metal foil becomes thinner as described above, for example. , Warpage deformation and curl deformation tend to increase.
[0014]
It is preferable to use a copper foil as the conductive metal foil used in the present invention. The copper foil usable here includes an electrolytic copper foil and a rolled copper foil. Considering it, it is preferable to use an electrolytic copper foil.
In addition, although the conductive metal foil that forms the wiring pattern is usually laminated on one surface of the insulating film, this conductive metal foil can also be laminated on the surface of the insulating film via an adhesive layer, It is also possible to laminate without using such an adhesive layer.
[0015]
Moreover, although the above has shown the aspect by which the adhesive bond layer is formed on the surface of an insulating film, the adhesive bond layer may be formed in one surface of electroconductive metal foil.
By laminating a conductive metal foil on one surface of the insulating film in this way, then applying a photoresist to the surface of the conductive metal foil, and exposing and developing the same pattern as the wiring pattern to be formed on this photoresist Then, the conductive metal foil is etched using the pattern formed by the photoresist as a masking material to form a desired wiring pattern.
[0016]
After the wiring pattern is formed in this way, the solder resist is applied while leaving the lead portion electrically connected to the electronic component, and the solder resist is cured by heating. This solder resist tends to cure and shrink when it is cured by heating.
After the solder resist is applied and cured in this way, the wiring pattern exposed from the solder resist is plated. For this plating process, gold plating, nickel gold plating, tin plating, etc. can be adopted, but in BGA and CSP, electronic components and gold wires are often used for electrical connection, so gold plating or nickel Gold plating is preferable. The thickness of such plating is usually 0.02 to 12 μm, preferably 0.02 to 3 μm.
[0017]
When the solder resist 16 is applied to the electronic component mounting film carrier tape 1 and then cured, as shown in FIG. 1, the electronic component mounting film carrier tape 1 is formed with a wiring pattern 14 for mounting the electronic components. The surface is deformed to be concave. Thus, the warp deformation in the width direction generated in the electronic component mounting film carrier tape 1 is such that the concavely deformed surface (surface on which the wiring pattern 14 is formed and the solder resist layer 16 is formed) becomes convex. The warp deformation generated in the width direction can be corrected by applying deformation to the film carrier tape 1 so that the warp deformation occurs in the direction opposite to the generated warp. In FIG. 1, 10 is an insulating film, 12 is an adhesive layer, and 18 is a sprocket hole. More specifically, in such a film carrier tape 1 for mounting electronic components, as shown in FIG. 8, for example, an adhesive layer 12 is formed on the surface of an insulating film 10 in which through holes such as via holes 17 are formed. A wiring pattern 14 formed by etching the conductive metal foil pasted via is formed. The wiring pattern 14 and the electronic component (chip) 35 are formed by connecting a bump electrode formed on the chip 35 and an end (lead) of the wiring pattern 14 with a conductor metal wire 36 such as a gold wire. The electronic component 35 can be mounted. The lead is a wiring pattern 14 extending outside the solder resist 16, and the surface thereof is plated for the purpose of ensuring appropriate bonding with the conductive metal wire 36 and protecting the surface of the conductive metal foil. A layer 37 is formed. A plating layer 37 is also formed on the surface of the wiring pattern 14 exposed in the via hole 17. The electronic component 35 can be mounted by electrically connecting the electronic component 35 and the lead (end portion of the wiring pattern 14) when mounting the electronic component 35 as described above by the conductive metal wire 36. it can. When such an electronic component is accurately mounted, the mountability on the jig and the transportability are very important. Therefore, the deformation of the electronic component mounting film carrier tape 1 needs to be corrected as much as possible before mounting the electronic component.
[0018]
The warp deformation generated in the width direction of the electronic component mounting film carrier tape 1 is, for example, by heating the film carrier tape in a reverse direction (giving reverse warp) to the generated warp deformation. Can be resolved. Furthermore, it can also be solved by giving the film carrier tape 1 a reverse warp using a barrel-shaped roller. Also, the warp caused in the width direction of the film carrier tape by passing the film carrier tape while meandering up and down while heating between a plurality of rollers arranged up and down without applying a reverse warp as described above. Deformation can be eliminated. Furthermore, immediately after the film carrier tape warped and deformed in the width direction is heated to a predetermined temperature, the warp deformation generated in the width direction of the film carrier tape is also eliminated by applying a reverse warp and rapidly cooling to near room temperature. It is possible.
[0019]
Here, in order to eliminate the warp deformation generated in the width direction of the film carrier tape for mounting electronic components, the film carrier tape is usually heated to about 80 to 200 ° C., preferably about 150 to 200 ° C. For a short time (usually within 5 minutes, preferably within 2 minutes), it is necessary to apply a stress that can resist warping deformation in the width direction, such as reverse warping of the film carrier tape. By applying stress against the stress that caused warping deformation in the width direction under heating in this way, the direction in which the warping deformation stress in the width direction is expressed changes, and the warping deformation in the width direction is almost eliminated. The The correction of the deformation generated in the width direction of the film carrier tape mainly softens the adhesive used for adhering the electrolytic copper foil to an insulating film such as polyimide at the time of warping and reverses the reverse. It is thought that this is due to solidification in the state of being applied.
[0020]
However, when the warp deformation in the width direction is eliminated in this way, the stress that has formed the warp deformation changes its direction and acts in the longitudinal direction of the film carrier tape, as shown in FIG. The vicinity of the end in the longitudinal direction of the tape 1 is deformed so as to curl with the side on which the wiring pattern 14 of the film carrier 15 is formed inside. Such deformation that occurs in the vicinity of the end of the film carrier tape 1 in the longitudinal direction is called curl deformation. Such curled deformation tends to increase as the insulating film becomes thinner. In particular, in CSP, BGA, etc., the film carrier tape may be cut into strips of about 200 mm (in the embodiment of the present invention, an example of being cut into 190 mm) to mount electronic components. In addition, when curled deformation occurs in the vicinity of the end in the longitudinal direction of the film carrier tape cut into strips, it becomes difficult to place the strip film carrier tape on a jig for mounting electronic components. Or trouble in transportation, which hinders the mounting of electronic components.
[0021]
Therefore, in the present invention, after the solder resist is applied and cured and the plating layer is formed, the warp deformation in the width direction is applied to the film carrier tape in which the surface on which the wiring pattern is formed is warped and deformed in a concave shape, for example, by applying a reverse warp. After eliminating the above, the curled deformation occurring in the vicinity of the end in the longitudinal direction occurring in the film carrier tape is corrected.
The curl-like deformation that occurs in the vicinity of the end of the film carrier tape in the longitudinal direction is particularly problematic when electronic components are mounted on CSPs, BGAs, etc. that cut the film carrier tape into strips to mount electronic components. .
[0022]
That is, the film carrier tape cut into strips as described above is fixed to a jig for mounting the electronic component, and the electronic component is mounted on the film carrier tape thus fixed, and the bump electrode formed on the electronic component. And the film carrier tape are arranged so that they are in place and are electrically connected to each other. (1) If the film carrier tape is warped or curled, the film carrier is cut into strips. (2) When the film carrier tape cut into a strip shape is deformed in a curl shape in the longitudinal direction, it becomes difficult to perform accurate alignment at the end of the strip tape. 3) When the tape with the electronic components mounted is removed from the bonding jig, the film carrier tape with the electronic components mounted is warped or deformed. Over the are Le deformation such that a metal wire that implement the electronic components may be damaged or bent malfunction occurs.
[0023]
Therefore, in the present invention, by correcting the warp deformation generated in the width direction of the film carrier tape, the curl deformation in the longitudinal direction inherent in the film carrier tape is corrected, for example, the warp deformation generated in the width direction, For example, as shown in FIG. 2, the film carrier tape 1 is wound around a reel 22, heated for a predetermined time, and the film carrier tape 1 is wound around the reel 22 to be solved. At this time, the film carrier tape is arranged and wound around the reel 22 so that the surface on which the wiring pattern 14 of the film carrier 15 is formed is located on the outside. The film carrier tape 1 is preferably wound around a reel 22 via a flat spacer 20. Thus, by winding the film carrier tape 1 through the flat spacer 20, the wiring pattern 14 of the film carrier 15 formed on the surface of the insulating film 10, or more precisely, the solder resist 16 is wound repeatedly. Since there is no direct contact with the back surface of the insulating film 10 of the next round, the positional deviation of the insulating film 10 due to heat shrinkage does not directly affect the solder resist 16, and the uncured resin remaining in the solder resist 16 Thus, it is possible to prevent the solder resist 16 and the insulating film 10 in the next round from adhering to each other.
[0024]
The flat spacer 20 used here is preferably formed of a material having heat resistance that does not cause thermal deformation by heating to correct the curled deformation that may occur in the longitudinal direction. PET (polyethylene terephthalate) ), Flexible films formed from polyester resins such as PEN (polyethylene naphthalate), plastics (resins) such as polyimide and polyamide, and metal foils such as aluminum foil and copper foil. When such a flat spacer 20 is used, the thickness of the flat spacer is not particularly limited, but stable workability is ensured by using a flat spacer having a thickness of 25 to 125 μm, preferably 75 to 125 μm. Is done.
[0025]
In the above example, the film carrier tape 1 for mounting an electronic component is directly wound on a reel 22, preferably by a method of winding the film carrier tape 1 through a flat spacer. In the present invention, a plurality of film-like carriers 15 are arranged in series as described above, in order to correct the curled deformation occurring near the end of the film carrier before cutting the film carrier tape 1 into a strip shape. A strip-shaped film carrier tape obtained by cutting the electronic component mounting film carrier tape 1 is sandwiched by a jig having a predetermined curvature, and the strip-shaped film carrier tape is pressed together with the jig under heating to form a strip. The curled deformation of the film carrier tape can be corrected. An example of a jig used in this method is shown in FIG. The jig 30 shown in FIG. 4 has a lower die 33 having a predetermined radius of curvature R and an upper die 34 having the same radius of curvature. A number of positioning pins 32 are implanted in the lower mold 33 at positions corresponding to the sprocket holes. The radius of curvature R of the jig 30 is usually 3 to 10 cm, preferably 3 to 6 cm. A film carrier tape cut in a strip shape is sandwiched between jigs having such a radius of curvature, and the upper die 34 is clamped. And the lower mold 33 are fastened with a fastener (not shown), and the film carrier tape is warped in the opposite direction to the curled deformation and fixed at a predetermined temperature for a certain period of time. The curled deformation can be corrected.
[0026]
In addition, when eliminating the curled deformation using the jig 30, it is a matter of course that the surface of the film carrier 15 on which the wiring pattern 14 is formed is arranged on the convex side. Further, when the jig 30 is used to eliminate the curled deformation, a plurality of strip-shaped film carrier tapes can be sandwiched between the jig 30 to eliminate the curled deformation. When multiple film carrier tapes are overlapped in this way, the film carrier tapes must be overlapped between the film carrier tapes via the flat spacers used to eliminate the curled deformation when the reel is used. You can also.
[0027]
In addition, the flat spacer used in the present invention only needs to have at least the width in which the wiring pattern is formed. Therefore, it is possible to form the same width as that of the insulating film, and to form a sprocket hole if necessary. It can also be used without forming a sprocket hole with a width substantially the same as the width of the metal foil.
In order to correct the curled deformation as described above, a film carrier tape for mounting electronic components wound on a reel, preferably with a flat spacer as described above, or a strip-shaped film sandwiched between jigs The carrier tape is usually heated to a temperature of 60 to 150 ° C, preferably 80 to 150 ° C. That is, when heated in this way, the solder resist is mainly softened to some extent to correct the curled deformation, and in this state, the solder resist is solidified again to correct the curled deformation. Further, in the method of the present invention, it is preferably maintained at a temperature of 80 to 150 ° C., particularly preferably 80 to 120 ° C. for correcting the curled deformation for 1 to 20 hours, preferably 10 to 20 hours.
[0028]
FIG. 5 (1) shows the amount of warping when the warp deformation generated in the width direction in various electronic component mounting film carrier tapes is taken back by reverse warping and then the curl generated in the longitudinal direction is taken. Showing change. On the other hand, FIG. 5B shows a change in the curl amount when the curl is removed after the warp removal as described above.
As is clear from (1) and (2) of FIG. 5, the curl-like deformation hardly occurs in the film carrier tape in which the warp deformation in the width direction occurs. However, when the warp is removed, the curl amount of the film carrier tape increases rapidly. Therefore, it is understood that when curling is performed to correct the curled deformation, the curled deformation is almost eliminated, and the amount of warp deformation in the width direction is hardly changed by the curling. In other words, in the film carrier tape for mounting electronic components, when the warp removal is performed to eliminate the warp deformation in the width direction, the curl deformation in the longitudinal direction increases, but an operation for eliminating the curl deformation is performed. However, the corrected warpage deformation is maintained almost as it is.
[0029]
FIG. 6 shows the relationship between the temperature and the amount of warpage when correcting the deformation. As shown in FIG. 6, the correction of the curled deformation has a particularly excellent effect at 100 to 120 ° C., and in the example shown here, the warping deformation and the curled deformation are best eliminated at 110 ° C.
FIG. 7 shows a graph showing the heating time at 100 ° C. and the state of elimination of the curled deformation when correcting the curled deformation. In the method of the present invention, when correction of curled deformation is performed at 100 ° C., the effect starts to appear by leaving it to stand for 10 hours or more, and the removal efficiency of the curled deformation is rapidly improved after 15 hours. Even if the treatment time is extended to 20 hours, 25 hours, and 30 hours, the effect of eliminating the curled deformation hardly changes. Therefore, in the method of the present invention, the time required to correct the curled deformation occurring near the end in the longitudinal direction of the film carrier tape for mounting electronic components is usually 10 hours or longer, preferably 15 hours or longer. For example, in the state where the film carrier tape for mounting electronic parts is wound with a flat spacer on a reel as described above, or after being cut into a strip shape after being cut into a strip shape, the film carrier tape is held in a jig for the above time. By holding, curl-like deformation generated in the vicinity of the end of the film carrier tape in the longitudinal direction can be efficiently eliminated.
[0030]
The film carrier tape for mounting electronic parts is warped in the width direction, and when trying to eliminate the warp deformation in the width direction, the stress that caused the warp deformation in the width direction changes its direction. The film carrier tape has a characteristic of causing a curled deformation in the vicinity of the end in the longitudinal direction. In the present invention, after correcting the warp deformation generated in the width direction of the tape, the curl-shaped deformation generated in the vicinity of the end portion in the longitudinal direction of the tape is wound on the reel and the film carrier tape is wound for a predetermined time under heating. Or the film carrier tape is cut to a predetermined length to form a strip, and the strip-shaped tape is clamped by being clamped by a jig having a specific radius of curvature, and left under heating for a predetermined time. Thus, the curled deformation that appears in the vicinity of the end portion in the longitudinal direction is selectively corrected while the corrected warping deformation in the width direction is left as it is.
[0031]
In the film carrier tape for mounting electronic components in which the warpage deformation in the width direction and the curl-shaped deformation occurring at the edge in the longitudinal direction are eliminated by the method of the present invention, problems during transportation occur. In addition, the electronic component can be reliably mounted on the film carrier without causing any inconvenience or damage in alignment of the semiconductor chip or the like even during mounting.
[0032]
【The invention's effect】
According to the method for manufacturing a film carrier tape for mounting an electronic component of the present invention, it is possible to eliminate both warp deformation in the width direction of the film carrier tape and curl deformation that occurs near the end in the longitudinal direction. Therefore, for example, when mounting electronic components by cutting into strips such as CSP, BGA, etc., the film carrier tape cut into strips can be transported without problems and when mounting electronic components. It can be easily mounted on a jig used for mounting electronic components.
It can be done well.
[0033]
【Example】
EXAMPLES Next, although an Example is shown about this invention and this invention is demonstrated still in detail, this invention is not limited by these.
[0034]
[Example 1]
Sprocket holes were formed at both edges in the width direction of a polyimide film having a length of 100 m, a width of 35 mm, and a thickness of 50 μm, and an electrolytic copper foil having a thickness of 18 μm was adhered between the sprocket holes using an adhesive.
A photosensitive resin was applied onto the adhered electrolytic copper foil, and the photosensitive resin was exposed and developed to form a predetermined pattern. Next, using the pattern made of the photosensitive resin as a masking material, the electrolytic copper foil was etched to form a wiring pattern made of the electrolytic copper foil.
[0035]
Next, a solder resist was applied to the surface of the wiring pattern except for the terminal portion, and it was wound on a reel together with an embossed spacer having an embossed edge and cured.
After forming the solder resist layer in this manner, a nickel gold plating layer having a thickness of 1 μm was formed on the surface of the wiring pattern exposed from the solder resist layer.
[0036]
The thus formed electronic component mounting film carrier tape was warped and curved in the width direction so that the surface on which the wiring pattern was formed became a recess in the width direction of the tape. The amount of warpage at this time was 12.7 mm. At this stage, the electronic component mounting film carrier tape was cut out to a length of 190 mm, but the curled deformation in the vicinity of the end of the strip-shaped electronic component mounting film carrier tape thus cut out was , Almost 0 mm, and almost no curl-like deformation occurs from the whole length.
[0037]
The film carrier tape for mounting electronic components manufactured as described above is inserted into the heating furnace heated to 190 to 200 ° C. so that the surface on which the wiring pattern is formed is curved in a convex shape. Using a heating furnace with a length of 3 m provided with a guide to be fed, the film carrier tape for mounting electronic components wound around a winding roll is fed into the heating furnace, and this is performed while applying a reverse warp under heating. It was passed through a heating furnace, warped, and taken up on a take-up roll. By removing the warp in this way, the amount of warp in the width direction of the tape was reduced to 5.8 mm.
[0038]
After removing the warp in the width direction, the film carrier tape for mounting electronic components was cut out to 190 mm in the same manner as described above, and this strip-shaped film carrier tape was curled and deformed near both ends. The amount of curled deformation was 24.0 mm.
Next, this film carrier tape for mounting electronic components was wound around an aluminum reel together with a flat spacer made of polyimide having a thickness of 75 μm. The aluminum reel was wound with a flat spacer so that the surface on which the wiring pattern of the film carrier tape for mounting electronic components was formed faced outward.
[0039]
The film carrier tape for mounting electronic components wound around the aluminum reel was placed in an oven whose internal temperature was adjusted to 120 ° C. and left for 20 hours.
After heating for 20 hours and returning to room temperature, the film carrier tape for mounting electronic components is cut into 190 mm strips, the amount of warpage in the width direction, and the vicinity of the edge in the longitudinal direction of the strip-shaped film carrier tape When the amount of curled deformation was measured, the amount of warpage in the width direction was 6.3 mm, and the amount of curled deformation was 6.1 mm.
[0040]
As is clear from the above results, when curving is performed to reduce the amount of warpage in the width direction, the amount of curl deformation near the end in the longitudinal direction increases. By processing so as to correct the shape change, the amount of curled deformation is significantly reduced. And the warp amount of the width direction once reduced does not increase by the process for reducing the curled deformation in this way.
[0041]
[Example 2]
In Example 1, a film carrier tape for mounting electronic components was manufactured in the same manner except that the heating temperature for correcting the curl deformation was changed from 120 ° C to 100 ° C.
The amount of warpage in the width direction of this film carrier tape was 9 mm, and the amount of warpage in the width direction after this warpage removal was 2 mm as in Example 1, but the amount of curled change increased to 10 mm. . Next, the curl-like deformation generated in the same manner as in Example 1 was corrected for this film cured tape.
[0042]
The obtained film carrier tape was cut into strips, and the amount of warpage in the width direction and the amount of curl change were measured. The amount of warp in the width direction was 1.8 mm and the amount of curl change in the longitudinal direction was 1. It was 3 mm.
[0043]
[Example 3]
A film carrier tape for mounting electronic components was manufactured in the same manner as in Example 1, except that the temperature for correcting the curled deformation was changed within the range of 100 to 120 ° C. However, the heating for correcting the curled deformation was corrected by holding a strip-shaped film carrier tape cut to a length of 190 mm between jigs. It has been found that the temperature for correcting the curled deformation is particularly effective at a temperature of 100 ° C to 120 ° C.
[0044]
[Example 4]
In Example 1, the curling temperature was set to 100 ° C., and the standing time was changed from 10 hours to 5 hours, and the amount of curled deformation was measured.
As a result, when it exceeds 10 hours, the curled deformation amount is remarkably corrected, and even when it exceeds 15 hours and exceeds 30 hours, the decrease in the curled deformation amount hardly changes. Therefore, it can be seen that in order to correct the curled deformation, the time required for removing the curled deformation is 10 hours or more, preferably 15 hours or more.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a cross section of a film carrier tape for mounting electronic components manufactured by the method of the present invention.
FIG. 2 is a diagram showing an example of a film carrier tape for mounting electronic components wound around a reel in order to take a curled deformation.
FIG. 3 is a diagram showing an example of a film carrier tape for mounting electronic components that has been cut into strips and has undergone curled deformation.
FIG. 4 is a view showing an example of a jig for taking a curl-like deformation generated in a strip-shaped electronic component mounting film carrier tape;
FIG. 5 is a graph showing a warpage change (1) and a curl change (2) in warping and curling deformation removal of a film carrier tape for mounting electronic components.
FIG. 6 is a graph showing the relationship between temperature and amount of change when correcting deformation in a film carrier tape for mounting electronic components.
FIG. 7 is a graph showing the relationship between the heating time and the amount of change in a film carrier tape for mounting electronic components.
FIG. 8 is a cross-sectional view schematically showing an example of mounting electronic components on a film carrier tape for mounting electronic components.
[Explanation of symbols]
1 ... Film carrier tape for mounting electronic components
10 ... Insulating film
12 ... Adhesive layer
14 ... Wiring pattern
15 ... Film carrier
16 ... Solder resist (layer)
17 ... Beer Hall
18 ... Sprocket hole
20 ... Flat spacer
22 ... reel
30 ... Jig
32 ... Positioning pin
33 ... Lower mold
34 ... Upper mold
35 ... Electronic components
36 ... Conductive metal wire
37 ... Plating layer

Claims (2)

Manufacture of a film carrier tape for mounting electronic components, comprising a step of forming a wiring pattern made of a conductive metal on at least one surface of an insulating film, and a step of applying and curing a solder resist leaving a terminal portion of the wiring pattern In the method
Before the electronic component is mounted on the terminal part exposed from the solder resist of the film carrier tape for mounting the electronic component, the warp deformation caused by the tape being bent in the width direction of the film carrier tape is corrected, and then the film In order to correct the curl-like deformation caused by curving in the longitudinal direction of the carrier tape, the film carrier tape for mounting electronic components is wound around the take-up reel with a flat spacer so that the surface on which the wiring pattern is formed is located outside. A method for producing a film carrier tape for mounting electronic components, characterized by heating and holding at a temperature in the range of 80 to 150 ° C. for 10 hours or more.   2. The film carrier tape for mounting electronic components according to claim 1, wherein the warp deformation occurring in the width direction of the tape is corrected by heating while warping the tape in a direction opposite to the warp deformation. Method.

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