JP2001274068A - 位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置 - Google Patents

位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置

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Publication number
JP2001274068A
JP2001274068A JP2000086867A JP2000086867A JP2001274068A JP 2001274068 A JP2001274068 A JP 2001274068A JP 2000086867 A JP2000086867 A JP 2000086867A JP 2000086867 A JP2000086867 A JP 2000086867A JP 2001274068 A JP2001274068 A JP 2001274068A
Authority
JP
Japan
Prior art keywords
shot
alignment
substrate
measurement
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000086867A
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English (en)
Japanese (ja)
Other versions
JP2001274068A5 (enExample
Inventor
Yuji Yasufuku
祐次 安福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000086867A priority Critical patent/JP2001274068A/ja
Publication of JP2001274068A publication Critical patent/JP2001274068A/ja
Publication of JP2001274068A5 publication Critical patent/JP2001274068A5/ja
Withdrawn legal-status Critical Current

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2000086867A 2000-03-27 2000-03-27 位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置 Withdrawn JP2001274068A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000086867A JP2001274068A (ja) 2000-03-27 2000-03-27 位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000086867A JP2001274068A (ja) 2000-03-27 2000-03-27 位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置

Publications (2)

Publication Number Publication Date
JP2001274068A true JP2001274068A (ja) 2001-10-05
JP2001274068A5 JP2001274068A5 (enExample) 2007-05-17

Family

ID=18602967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000086867A Withdrawn JP2001274068A (ja) 2000-03-27 2000-03-27 位置合せ方法、デバイス製造方法、位置合せ装置、および露光装置

Country Status (1)

Country Link
JP (1) JP2001274068A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007306024A (ja) * 2007-07-17 2007-11-22 Canon Inc 位置決め方法
KR100809955B1 (ko) * 2001-11-27 2008-03-06 삼성전자주식회사 포토리소그래피 공정의 얼라인 계측방법
US7373213B2 (en) 2002-04-30 2008-05-13 Canon Kabushiki Kaisha Management system and apparatus, method therefor, and device manufacturing method
US7385700B2 (en) 2002-04-30 2008-06-10 Canon Kabushiki Kaisha Management system, apparatus, and method, exposure apparatus, and control method therefor
CN114089606A (zh) * 2021-11-24 2022-02-25 深圳市尊绅投资有限公司 通过监控掩膜版补偿制程偏移量的方法和装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809955B1 (ko) * 2001-11-27 2008-03-06 삼성전자주식회사 포토리소그래피 공정의 얼라인 계측방법
US7373213B2 (en) 2002-04-30 2008-05-13 Canon Kabushiki Kaisha Management system and apparatus, method therefor, and device manufacturing method
US7385700B2 (en) 2002-04-30 2008-06-10 Canon Kabushiki Kaisha Management system, apparatus, and method, exposure apparatus, and control method therefor
JP2007306024A (ja) * 2007-07-17 2007-11-22 Canon Inc 位置決め方法
CN114089606A (zh) * 2021-11-24 2022-02-25 深圳市尊绅投资有限公司 通过监控掩膜版补偿制程偏移量的方法和装置

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