JP2001257449A - 配線基板と配線基板の製造方法 - Google Patents

配線基板と配線基板の製造方法

Info

Publication number
JP2001257449A
JP2001257449A JP2000052686A JP2000052686A JP2001257449A JP 2001257449 A JP2001257449 A JP 2001257449A JP 2000052686 A JP2000052686 A JP 2000052686A JP 2000052686 A JP2000052686 A JP 2000052686A JP 2001257449 A JP2001257449 A JP 2001257449A
Authority
JP
Japan
Prior art keywords
layer
wiring
insulating layer
wiring board
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000052686A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001257449A5 (enExample
Inventor
Satoru Kuramochi
悟 倉持
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2000052686A priority Critical patent/JP2001257449A/ja
Publication of JP2001257449A publication Critical patent/JP2001257449A/ja
Publication of JP2001257449A5 publication Critical patent/JP2001257449A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2000052686A 2000-01-06 2000-02-29 配線基板と配線基板の製造方法 Pending JP2001257449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000052686A JP2001257449A (ja) 2000-01-06 2000-02-29 配線基板と配線基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000001141 2000-01-06
JP2000-1141 2000-01-06
JP2000052686A JP2001257449A (ja) 2000-01-06 2000-02-29 配線基板と配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2001257449A true JP2001257449A (ja) 2001-09-21
JP2001257449A5 JP2001257449A5 (enExample) 2007-03-01

Family

ID=26583208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000052686A Pending JP2001257449A (ja) 2000-01-06 2000-02-29 配線基板と配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP2001257449A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158249A (ja) * 2005-12-08 2007-06-21 Nitto Denko Corp 配線回路基板およびその製造方法
KR100761644B1 (ko) * 2005-07-27 2007-09-27 주식회사 엘지화학 금속적층판 및 이의 제조방법
JP2010015641A (ja) * 2008-07-04 2010-01-21 Nitto Denko Corp 回路付サスペンション基板およびその製造方法
US8351743B2 (en) 2008-07-07 2013-01-08 Nitto Denko Corporation Suspension board with circuit and producing method thereof
WO2020085136A1 (ja) * 2018-10-22 2020-04-30 Dic株式会社 積層体、及び、積層体の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100761644B1 (ko) * 2005-07-27 2007-09-27 주식회사 엘지화학 금속적층판 및 이의 제조방법
JP2007158249A (ja) * 2005-12-08 2007-06-21 Nitto Denko Corp 配線回路基板およびその製造方法
JP2010015641A (ja) * 2008-07-04 2010-01-21 Nitto Denko Corp 回路付サスペンション基板およびその製造方法
US8351743B2 (en) 2008-07-07 2013-01-08 Nitto Denko Corporation Suspension board with circuit and producing method thereof
WO2020085136A1 (ja) * 2018-10-22 2020-04-30 Dic株式会社 積層体、及び、積層体の製造方法

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