JP2001252859A - 研磨方法 - Google Patents

研磨方法

Info

Publication number
JP2001252859A
JP2001252859A JP2000065138A JP2000065138A JP2001252859A JP 2001252859 A JP2001252859 A JP 2001252859A JP 2000065138 A JP2000065138 A JP 2000065138A JP 2000065138 A JP2000065138 A JP 2000065138A JP 2001252859 A JP2001252859 A JP 2001252859A
Authority
JP
Japan
Prior art keywords
polishing
dresser
polished
platen
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000065138A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001252859A5 (https=
Inventor
Shigeru Sakuta
茂 佐久田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000065138A priority Critical patent/JP2001252859A/ja
Publication of JP2001252859A publication Critical patent/JP2001252859A/ja
Publication of JP2001252859A5 publication Critical patent/JP2001252859A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2000065138A 2000-03-09 2000-03-09 研磨方法 Withdrawn JP2001252859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000065138A JP2001252859A (ja) 2000-03-09 2000-03-09 研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000065138A JP2001252859A (ja) 2000-03-09 2000-03-09 研磨方法

Publications (2)

Publication Number Publication Date
JP2001252859A true JP2001252859A (ja) 2001-09-18
JP2001252859A5 JP2001252859A5 (https=) 2007-04-05

Family

ID=18584718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000065138A Withdrawn JP2001252859A (ja) 2000-03-09 2000-03-09 研磨方法

Country Status (1)

Country Link
JP (1) JP2001252859A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6905571B2 (en) 2002-10-28 2005-06-14 Elpida Memory, Inc. Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment
JP2009184057A (ja) * 2008-02-05 2009-08-20 Tokki Corp ポリシング装置
JP2023026413A (ja) * 2021-08-13 2023-02-24 エスケーシー ソルミックス カンパニー，リミテッド 研磨装置および半導体素子の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6905571B2 (en) 2002-10-28 2005-06-14 Elpida Memory, Inc. Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment
JP2009184057A (ja) * 2008-02-05 2009-08-20 Tokki Corp ポリシング装置
JP2023026413A (ja) * 2021-08-13 2023-02-24 エスケーシー ソルミックス カンパニー，リミテッド 研磨装置および半導体素子の製造方法
JP7473607B2 (ja) 2021-08-13 2024-04-23 エスケー エンパルス カンパニー リミテッド 研磨装置および半導体素子の製造方法

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