JP2001251033A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily select a main printed wiring face by visually confirming the layer structure and printed wiring faces of a multilayer printed wiring board. SOLUTION: In a printed wiring board 1 comprising a plurality of layers of material for printed wiring board and which has printed wiring faces between the surface of the layers, a pattern 12 for visual confirmation is provided on an edge of the printed wiring surface 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used for various electronic devices.

[0002]

2. Description of the Related Art As various electronic devices have been developed and provided with various advanced functions, and have been reduced in size and weight, electronic circuit boards used in these electronic devices have also become multifunctional. Layered materials for printed wiring boards are laminated, and a printed circuit board having a plurality of printed wiring surfaces is used.

A printed wiring board 1 having four printed wiring surfaces, which is an example of a conventional multilayer printed wiring board, will be described with reference to FIGS.

[0004] In the wiring board body 2, a material for a printed wiring board is laminated on three layers of an upper layer board 3, an intermediate layer board 4 and a lower layer board 5. As the material for the printed wiring board, an insulating synthetic resin substrate, a synthetic resin film or the like is used.

A product portion 6 is formed at the center of the wiring board main body 2, and a first printed wiring surface 7 is formed on the surface of the upper layer plate 3 in the product portion 6. 3 and the middle board 4, a second printed wiring surface is formed between the middle board 4 and the lower board 5, and a third printed wiring face is formed between the middle board 4 and the lower board 5. A printed wiring surface is formed. A required pattern is formed on these printed wiring surfaces by a conductive material such as a copper foil.

A production jig mounting portion 8 is formed around the product portion 6, and a periphery of the production jig mounting portion 8 is a discarded substrate portion 11.

After the discarded substrate portion 11 is removed by cutting and components are mounted on the production jig mounting portion 8, the product portion 6 is commercialized as a four-layer printed wiring board 1.

Since the electrical components are mounted on the main printed wiring surface, the main printed wiring surface of the four-layer printed wiring board 1 must be selected.

As shown in FIG. 6, when the upper plate 3 and the lower plate 5 are designed to have the same thickness by the same material for a printed wiring board, the electrical specifications of the upper plate 3 and the lower layer Since the electrical specifications of the board 5 are the same, the electrical specifications are satisfied no matter which of the first printed wiring surface 7 and the fourth printed wiring surface is the main printed wiring surface.

However, as shown in FIG. 7, when the upper layer plate 3 and the lower layer plate 5 are dimensioned to have different thicknesses, the first printed wiring surface 7 and the fourth printed wiring surface are different from each other. Since the electrical specifications are different, the thickness of the upper plate 3 and the thickness of the lower plate 5 must be determined.

For this reason, conventionally, a confirmation pattern 9 is provided in the production jig mounting portion 8 or a confirmation pattern (not shown) is provided in the product portion 6. The main printed wiring surface is confirmed by electrically measuring with a measuring jig such as.

[0012]

However, when the electrical components are mounted on the four-layer printed wiring board 1, the main printed wiring surface of the four-layer printed wiring board 1 is electrically checked by a measuring jig. It takes time and effort to do it.

In view of the above circumstances, the present invention makes it possible to visually confirm the layer structure and printed wiring surface of a multilayer printed wiring board such as the four-layer printed wiring board, thereby facilitating selection of the main printed wiring surface. Things.

[0014]

According to the present invention, there is provided a printed wiring board comprising a plurality of laminated materials for a printed wiring board, the printed wiring board having a surface of the layer and a printed wiring surface between the layers. The present invention relates to a printed wiring board provided with a visual check pattern at an end of a wiring surface.

Since the pattern for visual confirmation is provided at the end of the printed wiring surface, the layer structure and the printed wiring surface of the printed wiring board can be easily confirmed visually, and the printed wiring board has a predetermined electrical specification. It is possible to determine whether the printed wiring surface conforms to the specified electrical specifications accurately without using a measuring jig before the electrical components are mounted. Work time and labor.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

An embodiment of the present invention will be described with reference to FIGS.

In FIGS. 1 to 3, the same components as those in FIGS. 4 to 7 are denoted by the same reference numerals.

In the wiring board main body 2, the printed wiring board material is laminated on three layers of an upper board 3, a middle board 4 and a lower board 5. As the material for the printed wiring board, an insulating synthetic resin substrate, a synthetic resin film or the like is used. The thickness of the upper plate 3 is larger than the thickness of the lower plate 5.

The product section 6 is located at the center of the wiring board body 2.
A first printed wiring surface 7 is formed as a main printed wiring surface on the surface of the upper layer plate 3 in the product section 6, and a second printed wiring surface 7 is formed between the upper layer plate 3 and the middle layer plate 4.
A printed wiring surface 13 is formed, a third printed wiring surface 14 is formed between the middle layer plate 4 and the lower layer plate 5, and a fourth printed wiring surface 15 is formed on the surface of the lower layer plate 5. A required pattern is formed on these printed wiring surfaces by a conductive material such as a copper foil.

A production jig mounting portion 8 is formed around the product portion 6, and the surroundings of the production jig mounting portion 8 are discarded substrate portions 11.
It has become.

The production jig mounting portion 8 and the discarded substrate portion 1
The visual check pattern 12 is provided over the boundary with the reference numeral 1. The visual check pattern 12 is provided when forming a pattern of each layer.

The discarded substrate portion 11 is removed by cutting, and components are mounted on the first printed wiring surface 7. After the production jig mounting part 8 is cut off, the product part 6 is commercialized as the four-layer printed wiring board 1.

The operation will be described below.

In the four-layer printed wiring board 1, a cross section of the visual check pattern 12 is shown on one end surface of the production jig mounting portion 8, and the cross section is the first printed wiring surface 7, the second Printed wiring surface 13, the third printed wiring surface 14
A cross section of a copper foil is present as the fourth printed wiring surface 15, and the cross section of the copper foil is different in color from the cross sections of the upper layer plate 3, the middle layer plate 4, and the lower layer plate 5 made of the printed wiring board material. Therefore, the thicknesses of the upper layer plate 3, the middle layer plate 4, and the lower layer plate 5 between the printed wiring surfaces can be easily confirmed visually.

Therefore, at the stage before the electrical components are mounted on the four-layer printed wiring board 1, the first printed wiring surface 7 is easily visually identified as the main printed wiring surface having predetermined electrical specifications. It can be determined whether or not the layer configuration of the four-layer printed wiring board 1 meets predetermined electrical specifications.

The printed wiring board of the present invention is not limited to the above-described embodiment, and the printed wiring board may have a laminated structure of two or more layers. The lower layer board 5 may have the same thickness, and the position at which the visual check pattern 12 is provided may be any location as long as it is an end face of the printed wiring board. The printed wiring board may have one or more blocks of the product section 6. Needless to say,

[0028]

As described above, according to the present invention, since the pattern for visual confirmation is provided at the end of the printed wiring surface, the layer structure and the printed wiring surface of the printed wiring board can be easily confirmed visually. It is possible to determine whether the printed wiring board meets predetermined electrical specifications.

At the stage before mounting the electric parts, the main printed wiring surface can be visually determined without using a measuring jig, so that it is not troublesome and the working time is shortened. Demonstrates excellent effects.

[Brief description of the drawings]

FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention before a waste substrate portion is cut.

FIG. 2 is a perspective view of the printed wiring board according to the embodiment after a waste substrate portion is cut.

FIG. 3 is an enlarged perspective view of a portion B in FIG. 2;

FIG. 4 is a perspective view of a conventional printed circuit board before cutting a discarded board portion.

FIG. 5 is a perspective view of a conventional printed circuit board after a discarded board portion of the printed circuit board has been cut.

FIG. 6 is an enlarged perspective view of a part A in FIG. 5, showing an example of a layer structure of a printed circuit board in the conventional example.

FIG. 7 is a partially enlarged perspective view showing another example of the layer structure of the printed circuit board in the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 4-layer printed wiring board 2 Wiring board main body 6 Product part 7 First printed wiring surface 8 Production jig mounting part 11 Discarded substrate part 12 Visual check pattern 13 Second printed wiring surface 14 Third printed wiring surface 15 Fourth printed Wiring surface

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masuo Shiratori 3-14-20 Higashinakano, Nakano-ku, Tokyo Kokusai Electric Co., Ltd. F term in the company (reference) 5E338 AA03 CC01 DD11 DD32 DD36 EE32 EE44 5E346 AA22 AA60 BB01 BB20 CC01 CC31 GG28 GG31 HH33

Claims (1)

[Claims] 1. A printed wiring board comprising a plurality of laminated printed wiring board materials and having a printed wiring surface between the surfaces of the layers and between the layers, visually confirming the end of the printed wiring surface. A printed wiring board, characterized in that a printed pattern is provided.