JP2001226795A5 - - Google Patents
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- JP2001226795A5 JP2001226795A5 JP2000124637A JP2000124637A JP2001226795A5 JP 2001226795 A5 JP2001226795 A5 JP 2001226795A5 JP 2000124637 A JP2000124637 A JP 2000124637A JP 2000124637 A JP2000124637 A JP 2000124637A JP 2001226795 A5 JP2001226795 A5 JP 2001226795A5
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000124637A JP3949871B2 (ja) | 1999-12-10 | 2000-04-25 | 粗化処理銅箔及びその製造方法 |
| US09/838,228 US6497806B1 (en) | 2000-04-25 | 2001-04-20 | Method of producing a roughening-treated copper foil |
| TW90109580A TW499508B (en) | 1999-12-10 | 2001-04-20 | Roughening treated copper foil and producing method therefor |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35159299 | 1999-12-10 | ||
| JP11-351592 | 1999-12-10 | ||
| JP2000124637A JP3949871B2 (ja) | 1999-12-10 | 2000-04-25 | 粗化処理銅箔及びその製造方法 |
| US09/838,228 US6497806B1 (en) | 2000-04-25 | 2001-04-20 | Method of producing a roughening-treated copper foil |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001226795A JP2001226795A (ja) | 2001-08-21 |
| JP2001226795A5 true JP2001226795A5 (enExample) | 2005-11-04 |
| JP3949871B2 JP3949871B2 (ja) | 2007-07-25 |
Family
ID=27341387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000124637A Expired - Lifetime JP3949871B2 (ja) | 1999-12-10 | 2000-04-25 | 粗化処理銅箔及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3949871B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3429290B2 (ja) | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | 微細配線用銅箔の製造方法 |
| KR100579411B1 (ko) * | 2001-08-21 | 2006-05-12 | 주식회사 포스코 | 아연-니켈-텅스텐 합금전기도금용액 및 이 용액을 이용한 아연-니켈-텅스텐 합금 전기도금강판의 제조방법 |
| JP2003286596A (ja) * | 2002-03-29 | 2003-10-10 | Nippon Denkai Kk | レーザー穴明けに適した銅箔とその製造方法 |
| TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
| KR100622742B1 (ko) | 2005-04-26 | 2006-09-19 | 엘에스전선 주식회사 | 통전롤 표면에 대한 구리도금 현상을 방지할 수 있는전해동박 도금방법 및 이를 위한 도금장치 |
| JP4833692B2 (ja) * | 2006-03-06 | 2011-12-07 | 古河電気工業株式会社 | 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板 |
| WO2012039285A1 (ja) | 2010-09-24 | 2012-03-29 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔の製造方法及びプリント配線板用銅箔 |
| PH12014500716A1 (en) | 2011-09-30 | 2014-05-12 | Jx Nippon Mining & Metals Corp | Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil |
| JP6023366B1 (ja) * | 2015-06-17 | 2016-11-09 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6023367B1 (ja) * | 2015-06-17 | 2016-11-09 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| KR20170038969A (ko) * | 2015-09-30 | 2017-04-10 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
| JP6623941B2 (ja) | 2016-06-09 | 2019-12-25 | 株式会社デンソー | 多層基板の製造方法 |
| JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
| CN115261942A (zh) * | 2022-05-10 | 2022-11-01 | 九江德福科技股份有限公司 | 一种pcb用电解铜箔表面处理方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708130B2 (ja) * | 1989-06-19 | 1998-02-04 | 日本電解 株式会社 | プリント回路用銅箔の粗面形成方法 |
| JP2920083B2 (ja) * | 1995-02-23 | 1999-07-19 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
| JPH09148508A (ja) * | 1995-11-29 | 1997-06-06 | Nippon Denkai Kk | 半導体装置用リードフレーム及びこれを用いた樹脂封止型半導体装置 |
| JP3739929B2 (ja) * | 1998-03-09 | 2006-01-25 | 古河サーキットフォイル株式会社 | プリント配線板用銅箔及びその製造方法 |
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2000
- 2000-04-25 JP JP2000124637A patent/JP3949871B2/ja not_active Expired - Lifetime