JP2001202520A - Method for composing pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately compose master pattern. SOLUTION: When a pattern to be measured preliminarily decided as non- defective is divided into a plurality of photographing areas in accordance with the visual field of a camera and a master pattern is prepared from an image obtained by photographing each photographing area with the camera while changing the relative position of the camera and the pattern to be measured, imaging is performed so as to generate an overlapping area in adjacent imaging areas (step 101). The correlation value of each overlapping part is calculated in the images of two adjacent imaging areas, the positional deviation quantity between the images of the two imaging areas is calculated from a peak position having the highest correlation value and the two images are composed on the basis of the positional deviation quantity (step 104). Thus, a master pattern corresponding to the entire pattern to be measured is prepared.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern inspection method for inspecting a pattern formed on a green sheet, a tape carrier, or the like. The present invention relates to a synthesizing method for creating a master pattern to be created.

[0002]

2. Description of the Related Art Conventionally, PGA (Pin Grid Array) has been known as a mounting technique suitable for a demand for increasing the number of pins of ICs and LSIs. In PGA, a ceramic substrate is used as a base of a package for attaching a chip, and wiring is performed to a lead wire extraction position. To make this ceramic substrate, a so-called green sheet made by kneading alumina powder with a liquid binder is used, and a paste containing a high melting point metal is screen-printed on the green sheet. By firing such a sheet, so-called simultaneous firing, in which the green sheet is sintered and the paste is metallized, is performed.

[0003] As another mounting technique, TAB is used.
(Tape Automated Bonding) is known. In the TAB method, a copper foil pattern formed on a tape carrier (TAB tape) made of polyimide is bonded to electrodes of an IC chip to form external leads. The copper foil pattern is formed by attaching a copper foil to a tape carrier with an adhesive and etching this.

In such a green sheet or tape carrier, a pattern is visually inspected by a human using a microscope after the pattern is formed. However,
Inspection of a fine pattern by visual inspection requires skill and overworking the eyes. Therefore, as an alternative to the visual inspection, a technique has been proposed in which a pattern formed on a tape carrier or the like is imaged by a TV camera and automatically inspected (for example, Japanese Patent Application Laid-Open No. Hei 6-27313).
No. 2, JP-A-7-110863).

FIGS. 10 and 11 show Japanese Patent Application Laid-Open No. 6-273132.
FIG. 1 is a diagram for explaining a conventional inspection method for detecting a disconnection described in Japanese Patent Application Laid-Open Publication No. HEI 10-125, 1988. A master pattern created by imaging the pattern to be measured determined as a non-defective product is registered as a set of straight lines indicating pattern edges. The pattern to be measured is input as a set of edge data (edge coordinates) indicating a pattern edge extracted from a grayscale image obtained by capturing the pattern. Then, the extracted edge data n1, n2, n3.
.. and the line of the master pattern are associated. In order to perform this association, as shown in FIG. 10, continuous straight lines A1 and A2, A2 and A3,.
Bisecting lines A2 'and A that bisect each of the corners
Ask for 3 '.

The lines around the straight lines A1, A2, A3,... Of the master pattern are divided into areas respectively belonging to the straight lines A1, A2, A3,.
Thus, the edge data n1, n2, n3,... Of the pattern to be measured present in each area are respectively associated with the straight lines A1, A2, A3,. become. For example, in FIG. 10, the edge data n1 to n3 are associated with the straight line A1, and the data n4 to n6 are associated with the straight line A2.
Next, the edge data of the pattern to be measured is compared with the master pattern to check whether the pattern to be measured is disconnected. This inspection is realized by a labeling process of tracing the pattern edge by tracing the connected edge data n1 to n9 of the pattern to be measured, as shown in FIG. At this time, since the edge data is not connected at the disconnected portion due to the disconnection generated at the leading end of the pattern to be measured, there is no edge data corresponding to the straight lines A3 to A5 of the master pattern. Thus, the disconnection of the pattern to be measured can be detected.

FIG. 12 is a diagram for explaining a conventional inspection method for detecting a short circuit described in Japanese Patent Application Laid-Open No. 6-273132. In this inspection method, first, in an inspection area 20 in which a master pattern and a pattern to be measured are cut out to a predetermined size, edge data connected to the pattern to be measured is tracked. Thereby, each edge data of the pattern to be measured is sequentially labeled as n1 to n18. However, the edge data n8 and n17 are not registered in the master pattern Mb composed of two opposing straight lines similarly to the master pattern Ma composed of two opposing straight lines indicating a pattern edge. Thus, a short circuit of the pattern to be measured can be detected.

FIG. 13 is a view for explaining a conventional inspection method for detecting a defect or a projection described in Japanese Patent Application Laid-Open No. Hei 7-10863. In this inspection method, first, a perpendicular line perpendicular to the center line L is drawn, and the length between intersections at which the perpendicular line intersects the straight lines A1 and A2 indicating the edges of the master pattern is obtained in advance as the width W0 of the master pattern. Next, in the actual inspection, the edge data n of the pattern to be measured
Then, the distance between the facing edge data is obtained by lowering the perpendicular to the center line L of the master pattern. This distance is the width W of the pattern to be measured, and by comparing this with the width W0 of the master pattern, a defect or a protrusion in the pattern to be measured can be detected.

However, in the pattern inspection apparatus using such an inspection method, there is a problem that the pattern inspection takes a long time because a detailed inspection is performed by software on the whole of the pattern to be measured by comparison with the master pattern. . Therefore, a pattern inspection apparatus capable of performing inspection in a short time has been proposed (for example, Japanese Patent Laid-Open No. 10-1419).
No. 30). In the pattern inspection apparatus described in JP-A-10-141930, a defect candidate of a pattern to be measured is detected by hardware, and only a predetermined small area including the detected defect candidate is inspected by software. Defects can be inspected faster than before.

[0010]

In a pattern inspection apparatus using the above-described inspection method, as a method of creating a master pattern, a method of imaging an inspection work previously determined to be a non-defective product with a camera, and an inspection method. There is a method of creating from a CAD (Computer Aided Design) data which has become a master in the manufacture of a work. Among these methods, in the method of creating a master pattern from an inspection work determined to be non-defective, an image is taken by a camera a plurality of times to capture the entire area of the inspection work. Therefore,
In this method, a master pattern is created for each imaging range of the camera. On the other hand, in the method of creating a master pattern from CAD data, 1 corresponds to the entire inspection work.
One master pattern is created. Therefore, there is a problem that a master pattern created from an inspection work determined to be non-defective and a master pattern created from CAD data cannot be treated as the same one.

[0011] Usually, on the green sheet, FIG.
As shown in FIG. 4, Nx horizontal × Ny vertical (Nx and Ny are 1
The same patterns (these are called pieces) 30 arranged in a matrix of the above integers) are formed. In general,
One piece 30 corresponds to, for example, one IC. For this reason, when the green sheet is used as the inspection work, the method of creating a master pattern from the inspection work determined to be non-defective is one piece 3 on the green sheet to be inspected.
0 is set within the imaging range of the camera. But,
This method has a problem in that the allocation of the imaging range of the camera must be changed every time the number of pieces 30 on the green sheet changes.

In order to solve the above problems,
It is necessary to compose a master pattern corresponding to the entire inspection work by synthesizing a master pattern for each imaging range of the camera. As a method of synthesizing a master pattern, there is a method of aligning and synthesizing a position using a positioning mark. However, in such a method, there has been a problem that a master pattern having no positioning mark cannot be synthesized and cannot be accurately synthesized. SUMMARY An advantage of some aspects of the invention is to provide a synthesizing method capable of accurately synthesizing a master pattern even for a pattern having no positioning mark.

[0013]

According to a method of synthesizing a pattern according to the present invention, a pattern to be measured, which is determined in advance as a non-defective product, is divided into a plurality of image pickup areas in accordance with the field of view of a camera. When creating a master pattern from an image of each imaging region captured by the camera while changing the relative position, images are captured so that overlapping portions occur in adjacent imaging regions. Is calculated from the peak position having the highest correlation value, the amount of positional deviation between the images of the two imaging regions is obtained, and the two images are combined based on the amount of positional deviation for all the imaging regions. Thus, a master pattern corresponding to the entire pattern to be measured is created. One configuration example of the pattern synthesizing method of the present invention calculates a peak position by performing interpolation using a pixel position at which a correlation value is maximum and a pixel position around the pixel position, and calculates a position shift amount of a pixel or less. It is obtained with the precision of.

[0014]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a first embodiment of the invention.
And FIG. 2 is a block diagram of a pattern inspection apparatus used in this inspection method. 2, reference numeral 1 denotes an inspection work such as a green sheet, 2 denotes an XY table for mounting the inspection work 1, 3 denotes a line sensor camera for imaging the inspection work 1 on the XY table 2, and 4 denotes A primary inspection for detecting a defect candidate of the measured pattern is performed, and an error between the measured pattern and the master pattern is obtained for a predetermined area including the defect candidate based on the address information indicating the position of the defect candidate. Is a display device for displaying inspection results.

Hereinafter, a method of creating a master pattern serving as a reference for inspection will be described in detail. First, an image of the inspection work 1 previously determined to be good is taken by the camera 3. Then, the image processing device 4 digitizes the grayscale image output from the camera 3 and temporarily stores it in an internal image memory (not shown) (step 101). Camera 3 is X
Since the image sensor is a line sensor in which pixels are arranged in two directions, two-dimensional image data is stored in the image memory by moving the XY table 2 in the Y direction.

In the present invention, the inspection work 1 is divided into a plurality of imaging areas according to the field of view of the camera 3 and each imaging area is divided by the camera 3 while changing the relative position between the camera 3 and the inspection work 1.
A master pattern is created from the image captured in step. In addition,
Here, the field of view is a field of view when the XY table 2 is moved in the Y direction by a predetermined number of pixels.

FIG. 3 is an explanatory diagram showing a state of the divided imaging. As shown in FIG. 3, the inspection work 1 has an Nx
The image is divided into Ny imaging regions in the Y direction and imaged.
10 (10-1 to 10- (NxNy)) is the field of view of the camera 3. After moving the XY table 2 in the Y direction, the image processing device 4 takes an image of the imaging region of the visual field 10-1 (step 101), and then determines whether or not it is the first image capture (step 101). 102). here,
Since this is the first image capture, the process proceeds to step 103.

The image processing device 4 stores the XY table 2
Is moved in the direction by a predetermined amount (step 103), and the visual field 1
The imaging area of the visual field 10-2 overlapping with 0-1 is imaged (step 101). At this time, the amount of movement of the XY table 2 in the X direction in step 103 is set so that the width of the overlapping portion (hatched portion in FIG. 3) 11 occurring in two adjacent imaging regions is, for example, about several tens of pixels. Is done.

Next, the image processing apparatus 4 determines again whether or not it is the first image capture (step 102).
In this case, since the image is captured for the second time, step 10
Then, the process proceeds to step 4 to perform a master pattern synthesizing process. FIG. 4 is a flowchart showing a master pattern synthesizing process, and FIG.
FIG. 7 is an explanatory diagram for explaining a master pattern combining process.

FIG. 5 (a) shows a master pattern M-1 which is an image stored in the image memory in the previous image capture and a master pattern M-2 which is an image stored in the image memory in the current image capture. ), An overlapping area Rm corresponding to the overlapping portion 11 exists. The image processing device 4 calculates a correlation value f (xs, ys) between the grayscale data of the master pattern M-1 in the overlapping region Rm and the grayscale data of the master pattern M-2 in the overlapping region Rm by the following equation ( Step 201).

[0021]

(Equation 1)

In equation (1), master1 (xs
+ I, ys + j) is the density data of the master pattern M-1, and master2 (i, j) is the master pattern M-2.
, And AS and AE are constants for specifying the range of positional deviation in calculating the correlation value. Equation (1) is obtained by calculating the master pattern M− in the overlapping area Rm whose reference coordinates are xs and ys.
1, the overlapping area Rm of the master pattern M-2 is set to X
This means that the correlation is obtained while shifting the position by i in the direction and j in the Y direction.

Next, the image processing device 4 calculates the correlation value f (x
A position at which (s, ys) takes a maximum value (hereinafter, referred to as a peak position) is calculated with an accuracy of a pixel or less (step 202).
FIG. 6 is a diagram for explaining a method of calculating the peak position of the correlation value f (xs, ys). In the example of FIG. 6, the X coordinate is x
At the position of sm, the correlation value f (xs, ys) takes the maximum value,
Correlation values f (xsm, ys), f (xsm-1, ys),
It is assumed that f (xsm + 1, ys) is a quadratic expression. Thereby, the following equation is established.

[0024]

(Equation 2)

[0025]

(Equation 3)

[0026]

(Equation 4)

From the equations (2), (3) and (4), the coefficients a, b and c can be obtained as follows.

[0028]

(Equation 5)

[0029]

(Equation 6)

[0030]

(Equation 7)

On the other hand, the point where the slope obtained by differentiating ax ² + bx + c with respect to x becomes 0 is the peak position, so the following equation is established.

[0032]

(Equation 8)

From equations (5) to (8), X at the peak position
The coordinate x can be obtained as in the following equation.

[0034]

(Equation 9)

In FIG. 6, ys in equations (2) to (9) assumes an arbitrary value. Thus, equation (9)
As a result, the X coordinate x of the peak position can be obtained with an accuracy of a pixel or less. Further, the Y-coordinate y of the peak position can be obtained with a precision equal to or less than the pixel by the same method.

Next, the image processing device 4 determines the amount of displacement between the master patterns M-1 and M-2, that is, the overlapping area Rm.
Of the X coordinate and the X coordinate x of the peak position, and the difference between the Y coordinate of the overlapping area Rm and the Y coordinate y of the peak position (step 203). Then, the image processing device 4
Synthesizes the master pattern M-1 and the master pattern M-2 based on the calculated displacement (step 20).
4).

The size of the overlapping area Rm is determined in step 103
Can be obtained from the amount of movement of the XY table 2 at On the other hand, when the amount of misalignment between the master patterns M-1 and M-2 is calculated with an accuracy of less than a pixel, the size of the overlapping region Rm 'when the amount of misalignment is 0 is obtained with an accuracy of less than a pixel. be able to.

Therefore, the image processing apparatus 4 moves the position of the master pattern M-2 by the calculated amount of displacement, removes the overlapping area Rm 'from the master pattern M-1, and removes the remaining master pattern M-1. M-1 and the moved master pattern M-2 are linked, and the linked result is stored in the image memory as a new master pattern M-1 (FIG. 5B). In this way, the master pattern combining process ends.

Next, the image processing device 4 determines whether or not the image capturing of the entire imaging area has been completed (step 10).
5). Here, since the image capture has not been completed,
Proceed to step 103. The image processing device 4 moves the XY table 2 by a predetermined amount in the X direction (step 10).
3) Image the imaging area of the visual field 10-3 overlapping the visual field 10-2 (step 101).

Subsequently, similarly to the above, the image processing device 4 captures the image stored in the image memory as the master pattern M-1 (composite image of the visual fields 10-1 and 10-2) and the current image capture. A master pattern M-2 stored in the image memory is synthesized (step 104).

By repeating such processing, the field of view 10-N
After imaging to the imaging area of x, the image processing device 4
The Y table 2 is moved by a predetermined amount in the Y direction (step 103), and the field of view 10- overlapping the field of view 10-1.
Image the (Nx + 1) imaging area (Step 10)
1). At this time, the amount of movement of the XY table 2 in the Y direction is set so that the width of the overlapping portion generated in two adjacent imaging regions is, for example, about several tens of pixels.

The image processing device 4 has a master pattern M-1
(Field of view 10-1) stored in the image memory as
-10-Nx) and the master pattern M-2 stored in the image memory in the current image capture (step 104). By repeating the above processing, imaging is performed up to the imaging area of the last field of view 10- (NxNy), and the scanning of the inspection work 1 is completed. Thus, a master pattern corresponding to the entire inspection work is stored in the image memory of the image processing device 4.

Next, the image processing device 4 binarizes the grayscale image of the master pattern stored in the image memory (step 106). The grayscale image data stored in the image memory includes a copper foil pattern and the other background (a base material such as a green sheet). If a value between the density value of the foil pattern and the density value of the background is set as a threshold value, the copper foil pattern is converted to “1” and the background is converted to “0”. In this way, it is possible to obtain a master pattern in which the pattern edge and the inside thereof are filled with the pixel “1”. Less than,
This is called a first master pattern.

Subsequently, the image processing device 4 converts the first master pattern into a second master pattern for detecting a defect, a pinhole or a disconnection, and a third master pattern for detecting a protrusion, scattering or short circuit. (Step 107). FIG. 7 is a diagram for explaining a method of creating the second and third master patterns, and shows a part of the first master pattern. In FIG. 7, for the sake of simplicity, the first master pattern is represented only by a straight line representing a pattern edge, and the second and third lines are represented by a straight line representing a pattern edge and a diagonal line representing the inside thereof. Although the master pattern is shown, the actual first to third master patterns are pattern edges and the inside thereof are filled with a pixel “1”.

First, as shown in FIG. 7A, the first master pattern is contracted in a direction perpendicular to its center line,
A second master pattern M1 is created. This is because opposing straight lines A1 and A1 indicating both edges of the first master pattern
4 (center line is L1) and the distance between A2 and A3 (center line is L2) are narrowed to narrow the first master pattern.

The accuracy of defect detection using the second master pattern M1 is determined by how much the first master pattern is contracted. For example, when it is desired to recognize a defect when there is a defect exceeding 1/5 of the width of the first master pattern, the width of the second master pattern M1 is set to 3/5 of the width of the first master pattern. What is necessary is just to reduce it. It goes without saying that the detection accuracy may be determined in pixel units or actual dimensions. Thus, the second master pattern M1 for detecting a defect, a pinhole, or a disconnection is created.

Subsequently, as shown in FIG. 7B, the first master pattern is expanded in a direction perpendicular to the center line of the first master pattern to create a third master pattern M2. This corresponds to the opposite straight line A5 indicating both edges of the first master pattern.
And A8 (center line is L3), A6 and A7 (center line is L
4), A9 and A12 (center line is L5) and A10 and A1
1 (the center line is L6), and the first master pattern can be made thicker by widening the respective intervals. However, what actually becomes the third master pattern M2 is an area obtained by logically inverting the result of the expansion processing, that is, a first master pattern Ma composed of straight lines A5 to A8 and a first master pattern composed of straight lines A9 to A12. This is an area sandwiched between two patterns generated by expanding the pattern Mb.

The accuracy of defect detection by the third master pattern M2 is determined by how much the first master pattern is expanded. For example, when it is desired to recognize a defect when there is a defect exceeding 1/5 of the width of the first master pattern, the width of the third master pattern M2 is set to 7/5 of the width of the first master pattern. It should just be expanded as follows. The fact that the detection accuracy may be determined in pixel units or actual dimensions is the same as in the second master pattern. Thus, the third master pattern M2 for detecting protrusions, scattering, or short circuits is created.

Next, the inspection of the pattern to be measured will be described. First, the inspection work 1 to be inspected is imaged by the camera 3. Then, the image processing device 4 digitizes the grayscale image output from the camera 3 and temporarily stores it in an internal image memory (not shown) (step 10).
8). At this time, by moving the XY table 2 in the Y direction, two-dimensional image data is stored in the image memory in the same manner as in the case of the master pattern.

Subsequently, the image processing device 4 binarizes the grayscale image of the pattern to be measured stored in the image memory (step 109). In this way, it is possible to obtain a pattern to be measured in which the pattern edge and the inside thereof are filled with the pixel “1”. Next, the image processing device 4 aligns the position of the master pattern with the pattern to be measured by matching the position of the positioning mark provided in advance in the master pattern with the position of the corresponding positioning mark of the pattern to be measured (step 110). ). Since the positional relationship between the second master pattern created from the first master pattern and the third master pattern is known, the alignment between the master pattern and the pattern to be measured may be performed only once.

After the completion of the positioning process at step 110, the image processing apparatus 4 sets the pattern to be measured to the second and third positions.
The primary inspection is performed by comparing with the master pattern (steps 111 and 112). Step 11
Inspections 1 and 112 are simultaneously performed by the hardware of the image processing apparatus 4.

First, the inspection (step 111) by comparison with the second master pattern M1 will be described. FIG.
FIG. 3 is a diagram for explaining this inspection method. FIG.
In the example, the portion excluding the pattern NP indicated by the satin finish is the pattern to be measured P. The image processing device 4 compares the measured pattern P with the second master pattern M1, as shown in FIG. However, what is actually compared is the pattern NP obtained by logically inverting the pattern P to be measured and the second master pattern M1.

Pattern NP and second master pattern M1
The result of this logical product differs depending on whether the pattern P to be measured has a defect or a disconnection. For example, when the pattern to be measured P has “1” as its value and the master pattern M1 has “1”, if the pattern to be measured P has no loss or disconnection, the pattern NP and the master pattern M1 Since there is no overlap, the result of this logical product is “0”.

On the other hand, if there is a defect C in the pattern P to be measured as shown in FIG. 8, the pattern NP and the master pattern M1 overlap in this portion, and the result of the logical product is "1". This is the same when the pattern to be measured has a pinhole H or a disconnection. In this way, it is possible to detect a defect, a pinhole or a disconnection in the pattern to be measured.
Then, the image processing device 4 stores the position (the position of C and H in FIG. 8) at which the result of the logical product becomes “1” and is recognized as a defect candidate.

Next, the inspection (step 112) by comparison with the third master pattern M2 will be described. FIG.
FIG. 3 is a diagram for explaining this inspection method. As shown in FIG. 9, the image processing device 4 compares the measured pattern P with the third master pattern M2. Similarly to the above, when the logical product of the patterns to be measured Pa and Pb and the third master pattern M2 is obtained, the result of the logical product is the pattern to be measured P
It depends on whether there is a protrusion or a short circuit in a and Pb. That is, when there is no protrusion or short circuit in the patterns Pa and Pb to be measured, the result of the logical product is “0”.

On the other hand, if the pattern K to be measured has the projection K as shown in FIG.
And the master pattern M2 overlap, so that the result of the logical product is “1”. Similarly, if there is a short circuit S between the patterns Pa and Pb to be measured, the result of the logical product becomes “1”. The same applies to the case where a scattering exists in the pattern to be measured. In this way, it is possible to detect a protrusion, a scatter or a short circuit of the pattern to be measured. Then, the image processing apparatus 4 stores the position (the position of K and S in FIG. 9) at which the result of the logical product becomes “1” and is recognized as a defect candidate.

After performing the above-described primary inspection, the image processing apparatus 4 uses the stored position of the defect candidate as address information. Then, the image processing device 4 compares the measured pattern with the first master pattern for an area of a predetermined size centered on the defect candidate at the position indicated by the address information, thereby obtaining an error. A secondary inspection of the pattern to be measured is performed (step 113). The method of this inspection is
This is the same as the above-described conventional method shown in FIGS.

The comparison inspection between each of the second and third master patterns and the pattern to be measured can be realized by hardware.
Since only a predetermined area including the detected defect candidate is inspected by comparing the measured pattern requiring a long processing time with the first master pattern, the measured pattern can be inspected at high speed. In the present embodiment, the XY table 2 is moved at the time of the divided imaging, but it goes without saying that the camera 3 may be moved.

[0059]

According to the present invention, a pattern to be measured, which is determined as a non-defective product in advance, is divided into a plurality of image pickup areas in accordance with the field of view of the camera, and each image is picked up while changing the relative position between the camera and the pattern to be measured. When a master pattern is created from an image of a region captured by a camera, an image is captured such that an overlapping portion occurs in an adjacent imaging region, and a correlation value between each overlapping portion in images of two adjacent imaging regions is calculated. From the peak position having the highest correlation value, the amount of positional deviation between the images of the two imaging regions is obtained, and the two images are combined based on the amount of positional deviation for all the imaging regions, whereby the entire pattern to be measured is obtained. Can be created. As a result, the same treatment as the master pattern created from the CAD data can be performed. Further, even if the pattern has no positioning mark, the master pattern can be accurately synthesized.

Further, the peak position is calculated by performing interpolation using the pixel position where the correlation value is the maximum and the pixel positions in the vicinity thereof, and the amount of positional deviation is obtained with an accuracy equal to or less than the pixel. Can be synthesized with an accuracy of less than a pixel.

[Brief description of the drawings]

FIG. 1 is a flowchart of a pattern inspection method using a synthesis method according to a first embodiment of the present invention.

FIG. 2 is a block diagram of a pattern inspection apparatus.

FIG. 3 is an explanatory diagram illustrating a state of divided imaging.

FIG. 4 is a flowchart showing a master pattern combining process.

FIG. 5 is an explanatory diagram for explaining a master pattern combining process.

FIG. 6 is a diagram illustrating a method for calculating a peak position of a correlation value.

FIG. 7 is a diagram for explaining a method of creating second and third master patterns.

FIG. 8 is a diagram for explaining an inspection method based on comparison with a second master pattern.

FIG. 9 is a diagram for explaining an inspection method based on comparison with a third master pattern.

FIG. 10 is a diagram for explaining a conventional inspection method for detecting disconnection.

FIG. 11 is a diagram for explaining a conventional inspection method for detecting disconnection.

FIG. 12 is a diagram for explaining a conventional inspection method for detecting a short circuit.

FIG. 13 is a view for explaining a conventional inspection method for detecting a defect or a protrusion.

FIG. 14 is a plan view of a green sheet.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Inspection work, 2 ... XY table, 3 ... Line sensor camera, 4 ... Image processing device, 5 ... Display device, 10 ... Field of view, 11 ... Overlapping part.

Claims (2)

[Claims] 1. A pattern inspection method for inspecting a pattern to be measured by comparing an image of a pattern to be measured by a camera with an image of a pattern to be measured, which is taken as a reference. When dividing the image into a plurality of imaging regions according to the field of view of the camera and changing the relative position of the camera and the pattern to be measured to create the master pattern from images obtained by imaging the respective imaging regions with the camera, adjacent imaging regions , An image is formed so that an overlapped portion is generated, and a correlation value between each overlapped portion of images of two adjacent imaging regions is calculated, and a positional shift between the images of the two imaging regions from a peak position having the highest correlation value. By calculating the amounts and combining these two images based on the amount of displacement, for the entire imaging region, the master pattern corresponding to the entire pattern to be measured is obtained. Synthesis method of pattern, characterized in that to create. 2. The pattern synthesizing method according to claim 1, wherein the peak position is calculated by performing interpolation using a pixel position where the correlation value is maximum and a pixel position in the vicinity thereof. A method for synthesizing a pattern, characterized in that an amount is obtained with an accuracy of less than a pixel.